PS2915-1 HIGH CTR, AC INPUT RESPONSE TYPE 4 PIN ULTRA SMALL PACKAGE FLAT LEAD OPTOCOUPLER FEATURES DESCRIPTION • HIGH CURRENT TRANSFER RATIO: CTR = 200% TYP @ IF = ±1 mA, VCE = 5 V The PS2915-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon phototransistor in one package for high density mounting applications. An ultra small flat lead package has been provided which realizes a reduction in mounting area of about 30% compared with the PS28XX series. • ULTRA SMALL FLAT-LEAD PACKAGE: 4.6 (L) x 2.5 (W) x 2.1 (H) mm • HIGH ISOLATION VOLTAGE BV: 2500 Vr.m.s. • TAPE AND REEL AVAILABLE: PS2915-F3, F4: 3500 pcs/reel APPLICATIONS • DC/DC CONVERTER • MODEM/PC CARD ELECTRICAL CHARACTERISTICS SYMBOLS Transistor Diode (TA = 25°C) PART NUMBER PS2915-1 PARAMETERS UNITS MIN TYP MAX 0.9 1.1 1.3 VF Forward Voltage, IF = ±1 mA V CT Terminal Capacitance, V = 0, f = 1.0 MHz pF Collector to Emitter Dark Current, IF = 0 mA, VCE = 40 V nA ICEO 30 100 CTR Current Transfer Ratio (IC/IF)1, IF = ±1 mA, VCE = 5 V % VCE(sat) Collector Saturation Voltage, IF = ±1 mA, IC = 0.2 mA V Coupled 100 200 400 0.13 0.3 RI-O Isolation Resistance, VI-O = 1.0 kVDC Ω CI-O Isolation Capacitance, V = 0 V, f = 1.0 MHz pF 0.4 tr Rise Time2, VCC = 5 V, IC = 2 mA, RL = 1 kΩ µs 5 10 Fall Time2, 1011 tf VCC = 5 V, IC = 2 mA, RL = 1 kΩ µs ton On Time, VCC = 5 V, IF = ±1 mA, RL = 5 kΩ µs 40 ts Storage Time2, VCC = 5 V, IF = ±1 mA, RL = 5 kΩ µs 10 toff Off Time2, VCC = 5 V, IF = ±1 mA, RL = 5 kΩ µs 120 Notes: 1. CTR RANK: N: 100 to 400 (%) 2. Test Circuit for Switching Time PS2915-1 VCC PULSE INPUT 4 3 1 2 PW = 100 µs Duty Cycle = 1/10 In monitor IF 50 Ω Date Published: August 4, 2005 VOUT RL = 1 kΩ or 5 kΩ PS2915-1 ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) OPTOCOUPLER CONSTRUCTION SYMBOLS Diode IF ∆IF/˚C IF (Peak) PD Transistor VCEO VECO IC ∆PC/˚C PC Coupled BV PT TA TSTG PARAMETER UNITS (MIN) Air Distance 4 mm Creepage Distance 4 mm Isolation Distance 0.4 mm ±50 0.5 ±0.5 60 Collector to Emitter Voltage Emitter to Collector Voltage Collector Current Power Dissipation Derating Power Dissipation V V mA mW/˚C mW 40 5 40 1.2 120 Vr.m.s. mW °C °C 2500 160 -55 to +100 -55 to +150 Isolation Voltage3 Total Power Dissipation Operating Ambient Temp. Storage Temperature Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. PW = 100 µs, Duty Cycle = 1%. 3. AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output. CAUTIONS REGARDING NOISE: Be aware that when voltage is applied suddenly between the optocoupler's input and outout or between collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute maximum ratings. OUTLINE DIMENSIONS (Units in mm) 2.5±0.3 4 N 1 PART NUMBER PACKING STYLE PS2915-1-F3 Embossed Tape 3500 pcs/reel PS2915-1-F4 2 5.0±0.2 0.4±0.1 0.2±0.1 1.27 TOP VIEW ORDERING INFORMATION (Solder Contains Lead) 3 4.1 MIN mA mW/°C A mW +0.1 Forward Current Forward Current Derating Peak Forward Current2 Power Dissipation 0.15 -0.05 RATINGS 4.6±0.2 UNITS 2.1 MAX PARAMETERS 1. Anode, Cathode 2. Cathode, Anode 3. Emitter 4. Collector ORDERING INFORMATION (Pb-Free) PART NUMBER PACKING STYLE PS2915-1-F3-A Embossed Tape 3500 pcs/reel PS2915-1-F4-A RECOMMENDED MOUNT PAD DIMENSIONS (Units in mm) 0.8 0.6 1.27 (0.35) –An initial of "NEC" N 111 No. 1 pin mark (nicked corner) 4.14 –Last number of Type No: 15 5.7 15 4.7 MARKING –Assembly lot 1 11 Week assembled Year assembled 24-R0.1 ( ): Reference value PS2915-1 TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) MAXIMUM FORWARD CURRENT vs. ambient temperature 140 Transistor Power Dissipation, PC (mW) Maximum Forward Current, IF (mA) 80 60 40 0.5 mA/°C 20 25 0 50 75 TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE 120 100 80 60 40 20 0 100 25 20 100 Collector Current, IC (mA) TA = +100°C +60°C +25°C 0°C -25°C -50°C 0.1 IF = 5 mA 16 14 12 10 8 6 2 mA 4 1 mA 2 0.01 0.0 0.5 1.0 1.5 0.5 mA 0 2.0 2 10 10000 Collector Current, IC (mA) Collector to Emitter Dark Current, ICEO (nA) COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE 1000 VCE = 20 V 40 V 10 1 -25 0 25 50 4 6 8 10 Collector to Emitter Voltage, VCE (V) Forward Voltage, VF (V) 100 125 CTR = 200 % 18 Forward Current, IF (mA) 100 COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE FORWARD CURRENTvs. FORWARD VOLTAGE 1 75 Ambient Temperature, TA (°C) Ambient Temperature, TA (°C) 10 50 75 Ambient Temperature, TA (°C) 100 COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE CTR = 200% 5 mA 2 mA 1 mA 1 IF = 0.5 mA 0.1 0.0 0.2 0.4 0.6 0.8 1.0 Collector Saturation Voltage, VCE(sat) (V) PS2915-1 TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) 500 1.4 Current Transfer Ratio, CTR (%) Normalized Current Transfer Ratio, CTR NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE 1.2 1.0 0.8 0.6 0.4 Normalized to 1.0 at TA = 25°C, IF = 1 mA, VCE = 5 V 0.2 0.0 -50 -25 0 25 50 75 CURRENT TRANSFER RATIO vs. FORWARD CURRENT VCE = 5 V, n=3 400 B 200 100 0 0.1 100 Normalized Gain, GV Switching Time, t (µs) ts ton 10 10k 100k 1000k LONG TERM CTR DEGRADATION 1.2 IF = 1 mA TA = 25°C CTR (relative Value) 0.8 60°C 0.6 0.4 0.2 0.0 10 10 2 10 3 10 4 -5 100 Ω RL = 1 kΩ -10 300 Ω -15 -20 -25 0.1 1 10 100 Frequency, f (kHz) Load Resistance, RL (Ω) 1.0 100 0 toff 1 1k 10 FREQUENCY RESPONSE IF = 1 mA, VCC = 5 V, CTR = 200 % 100 1 Forward Current, IF (mA) SWITCHING TIME vs. LOAD RESISTANCE 1000 C 300 Ambient Temperature, TA (°C) 10000 Sample A 10 5 Time (Hr) Remark: The graphs indicate nominal characteristics. 10 6 1000 PS2915-1 TAPING SPECIFICATIONS (Units in mm) +0.1 5.3 ± 0.1 1.55 -0 1.55 ± 0.05 2.9 MAX 12.0 ± 0.2 2.0 ± 0.5 4.0 ± 0.1 1.75 ± 0.1 Tape Outline and Dimensions 5.3 ± 0.1 2.4±0.1 2.9 ± 0.1 4.0 ± 0.1 Tape Direction N N N N N N N PS2915-1-F4 N PS2915-1-F3 Reel Outline and Dimensions 2.0±0.5 2.0 ± 0.5 R1.0 Packing: 3500 pcs/reel φ21.0 ± 0.8 φ100 ± 1.0 φ330±2.0 φ13.0 ± 0.2 13.5±1.0 11.9 to 15.4 Outer edge of flange PS2915-1 Recommended Soldering Conditions (1) Infrared reflow soldering • Peak reflow temperature 260 ˚C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220 ˚C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended). Package Surface Temperature T (˚C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260 ˚C (peak temperature) 220 ˚C to 60 s 180 ˚C 120˚C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature 260 ˚C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120°C or below (package surface temperature) • Number of times One (Allowed to be dipped in solder including plastic mold portion.) • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended). (3) Cautions • Fluxes Avoid removing the residual flux with chlorine-based cleaning solvent after a reflow process. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. A Business Partner of NEC Compound Semiconductor Devices, Ltd. 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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