DFM600FXM12-A000 DFM600FXM12-A000 Fast Recovery Diode Module Preliminary Information DS5478-1.2 July 2001 FEATURES ■ Low Reverse Recovery Charge ■ High Switching Speed ■ Low Forward Voltage Drop KEY PARAMETERS VRRM VF (typ) (max) IF (max) IFM 1200V 1.9V 600A 1200A ■ Isolated Base ■ Dual Diodes Can Be Paralleled for 1200A Rating ■ MMC Baseplate With AlN Substrates External connection 1(C1) 2(C2) 3(A1) 4(A2) APPLICATIONS ■ Chopper Diodes ■ Boost and Buck Converters ■ Free-wheel Circuits ■ Snubber Circuits ■ Resonant Converters ■ Induction Heating ■ Multi-level Switch Inverters External connection External connection for single 1200A diode application Fig. 1 Circuit diagram The DFM600FXM12-A000 is a dual 1200 volt, fast recovery diode (FRD) module. Designed for low power loss, the module is suitable for a variety of high voltage applications in motor drives and power conversion. Fast switching times and low reverse recovery losses allow high frequency operation making the device suitable for the latest drive designs employing pwm and high frequency switching. These modules incorporate electrically isolated base plates and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety. 3 1 4 2 ORDERING INFORMATION Order As: DFM600FXM12-A000 Note: When ordering, please use the complete part number. Outline type code: F (See package details for further information) Fig. 2 Electrical connections - (not to scale) 1/7 www.dynexsemi.com DFM600FXM12-A000 ABSOLUTE MAXIMUM RATINGS - PER ARM Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Tcase = 25˚C unless stated otherwise Symbol Test Conditions Parameter Max. Units Repetitive peak reverse voltage Tvj = 125˚C 1200 V IF Forward current (per arm) DC, Tcase = 75˚C, Tvj = 125˚C 600 A IFM Max. forward current Tcase = 110˚C, tp = 1ms 1200 A I2t I2t value fuse current rating VR = 0, tp = 10ms, Tvj = 125˚C 100 kA2s Pmax Maximum power dissipation Tcase = 25˚C, Tvj = 125˚C 2500 W Visol Isolation voltage Commoned terminals to base plate. AC RMS, 1 min, 50Hz 4 kV Qpd Partial discharge IEC1287. V1 = 1200V, V2 = 900V, 50Hz RMS 10 pC VRRM THERMAL AND MECHANICAL RATINGS Internal insulation: Baseplate material: Creepage distance: Clearance: CTI (Critical Tracking Index): Parameter Symbol Rth(j-c) AlN AlSiC 20mm 10mm 175 Thermal resistance - diode (per arm) Test Conditions Continuous dissipation - Min. Typ. Max. Units - - 40 ˚C/kW - - 8 ˚C/kW junction to case Rth(c-h) Tj Tstg - Thermal resistance - case to heatsink Mounting torque 5Nm (per module) (with mounting grease) Junction temperature - - - 125 ˚C Storage temperature range - –40 - 125 ˚C Mounting - M6 - - 5 Nm Electrical connections - M8 - - 10 Nm Screw torque 2/7 www.dynexsemi.com DFM600FXM12-A000 STATIC ELECTRICAL CHARACTERISTICS - PER ARM Tvj = 25˚C unless stated otherwise. Test Conditions Parameter Symbol Min. Typ. Max. Units IRM Peak reverse current VR = 1200V, Tvj = 125˚C - - 10 mA VF Forward voltage IF = 600A - 1.9 2.2 V IF = 600A, Tvj = 125˚C - 2.1 2.4 V - 20 - nH Min. Typ. Max. Units - 15 - nH Test Conditions Min. Typ. Max. Units IF = 600A, - 400 - A L Inductance - STATIC ELECTRICAL CHARACTERISTICS Tvj = 25˚C unless stated otherwise. Parameter Symbol LM Test Conditions Module inductance - (externally connected in parallel) DYNAMIC ELECTRICAL CHARACTERISTICS - PER ARM Tvj = 25˚C unless stated otherwise. Parameter Symbol Irr Reverse recovery current Qrr Reverse recovery charge dIF/dt = 4500/µs, - 100 - µC Erec Reverse recovery energy VR = 600V - 40 - mJ Test Conditions Min. Typ. Max. Units IF = 600A, - 475 - A Tvj = 125˚C unless stated otherwise. Symbol Parameter Irr Reverse recovery current Qrr Reverse recovery charge dIF/dt = 4200/µs, - 150 - µC Erec Reverse recovery energy VR = 600V - 70 - mJ 3/7 www.dynexsemi.com DFM600FXM12-A000 TYPICAL CHARACTERISTICS 1600 Transient thermal impedance, Zth (j-c) - (°C/kW ) 100 1400 Forward current, IF - (A) 1200 Tj = 25˚C Tj = 125˚C 1000 800 600 400 200 0.5 1 1.5 2 2.5 Forward voltage, VF - (V) 3 1 2 3 4 Ri (˚C/KW) 1.5612 5.7426 6.999 25.6068 τi (ms) 0.0063516 1.4746 13.9664 111.7517 1 0.001 0 0 10 3.5 0.01 0.1 Pulse width, tp - (s) 10 1 Fig. 4 Transient thermal impedance Fig. 2 Diode typical forward characteristics 1000 3000 900 DC forward current, IF - (A) Power dissipation, Ptot - (W) 800 2000 1000 700 600 500 400 300 200 100 0 0 20 40 60 80 100 120 Case temperature, Tcase - (˚C) Fig. 5 Power dissipation 140 160 0 0 20 40 60 80 100 120 Case temperature, Tcase - (˚C) 140 160 Fig. 6DC current rating vs case temperature 4/7 www.dynexsemi.com DFM600FXM12-A000 800 Reverse recovery current, Irr - (A) 700 600 500 400 300 200 100 Tj = 125˚C 0 0 200 600 400 800 Reverse voltage, VR - (V) 1000 1200 Fig. 7 RBSOA 5/7 www.dynexsemi.com DFM600FXM12-A000 PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 62 62 15 1 4 2 43.3 57 65 18 57 3 65 15 20 6x Ø7 38 31.5 4x M8 5 140 Main Terminal screw plastic hole depth (M8) = 16.8 ± 0.3 Copper terminal thickness, main terminal pins = 1.5 ± 0.1 Nominal weight: 1050g Module outline type code: F 6/7 www.dynexsemi.com DFM600FXM12-A000 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2001 Publication No. DS5478-1 Issue No. 1.2 July 2001 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 7/7 www.dynexsemi.com