DFM200PXM33-A000 Fast Recovery Diode Module Replaces DS5496-1.4 DS5496-2 December 2010 (LN27848) FEATURES KEY PARAMETERS VRRM VF IF IFM Low Reverse Recovery Charge High Switching Speed Low Forward Volt Drop Isolated AlSiC Base With AlN Substrates Lead Free Construction (typ) (max) (max) 3300V 2.5V 200A 400A APPLICATIONS Chopper Diodes Boost and Buck Converters Free-wheel Circuits Snubber Circuits Resonant Converters Induction Heating Multi-level Switch Inverters The DFM200PXM33-A000 is a series pair 3300V, fast recovery diode (FRD) module. Designed for low power loss, the module is suitable for a variety of high voltage applications in motor drives and power conversion. 2(K2) 1(A2/K1) 3(A1) Fig. 1 Circuit configuration Fast switching times and low reverse recovery losses allow high frequency operation, making the device suitable for the latest drive designs employing PWM and high frequency switching. The module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety. ORDERING INFORMATION Order As: DFM200PXM33-A000 Outline type code: P (See Fig. 7 for further information) Fig. 2 Package Note: When ordering, please use the complete part number 1 /6 www.dynexsemi.com DFM200PXM33-A000 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Tcase = 25°C unless stated otherwise Symbol VRRM Parameter Test Conditions Max. Units Repetitive peak reverse voltage Tj = 125°C 3300 V IF Forward current (per arm) DC, Tcase = 70°C 200 A IFM Max. forward current (per arm) Tcase = 105°C, tp = 1ms 400 A I t value fuse current rating VR = 0, tp = 10ms, Tj = 125°C 20 kA s Pmax Max. power dissipation Tcase = 25°C, Tj = 125°C 1040 W Visol Isolation voltage – per module Commoned terminals to base plate. AC RMS, 1 min, 50Hz 6000 V QPD Partial discharge – per module IEC1287, V1 = 3500V, V2 = 2600V, 50Hz RMS 10 pC 2 It 2 2 THERMAL AND MECHANICAL RATINGS Internal insulation material: AlN Baseplate material: AlSiC Creepage distance: 33mm Clearance: 20mm CTI (Comparative Tracking Index): 350 Symbol Parameter Min Typ. Max Units - - 96 °C/kW - - 16 °C/kW Junction temperature -40 - 125 °C Storage temperature range -40 - 125 °C Mounting – M6 - - 5 Nm Electrical connections – M5 - - 4 Nm Rth(j-c) Thermal resistance (per arm) Rth(c-h) Thermal resistance – case to heatsink (per module) Tj Tstg Screw Torque Test Conditions Continuous dissipation – junction to case Mounting torque 5Nm (with mounting grease) 2/6 www.dynexsemi.com DFM200PXM33-A000 STATIC ELECTRICAL CHARACTERISTICS – PER ARM Tcase = 25°C unless stated otherwise. Symbol Parameter IRM Peak reverse current VF Forward voltage LM Inductance Test Conditions Min Typ VR = 3300V, Tj = 125°C Max Units 15 mA IF = 200A 2.5 V IF = 200A, Tj = 125°C 2.5 V 30 nH - DYNAMIC ELECTRICAL CHARACTERISTICS – PER ARM Tcase = 25°C unless stated otherwise Symbol Parameter Qrr Reverse recovery charge Irr Peak reverse recovery current Erec Reverse recovery energy Test Conditions Min Typ. Max Units 115 μC VR = 1800V 165 A dIF/dt = 1100A/μs 130 mJ IF = 200A Tcase = 125°C unless stated otherwise Parameter Symbol Qrr Reverse recovery charge Irr Peak reverse recovery current Erec Reverse recovery energy Test Conditions Min Typ. Max Units 190 μC VR = 1800V 185 A dIF/dt = 1000A/μs 220 mJ IF = 200A 3 /6 www.dynexsemi.com DFM200PXM33-A000 Fig. 3 Diode typical forward characteristics Fig. 4 Transient thermal impedance Fig. 5 DC current rating vs case temperature Fig. 6 Reverse Bias Safe Operating Area (RBSOA) 4/6 www.dynexsemi.com DFM200PXM33-A000 PACKAGE DETAILS For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Nominal Weight: 500g Module Outline Type Code: P Fig. 7 Module outline drawing 5 /6 www.dynexsemi.com DFM200PXM33-A000 IMPORTANT INFORMATION: This publication is provided for information only and not for resale. The products and information in this publication are intended for use by appropriately trained technical personnel. Due to the diversity of product applications, the information contained herein is provided as a general guide only and does not constitute any guarantee of suitability for use in a specific application. The user must evaluate the suitability of the product and the completeness of the product data for the application. The user is responsible for product selection and ensuring all safety and any warning requirements are met. Should additional product information be needed please contact Customer Service. Although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or typographical errors. The information is provided without any warranty or guarantee of any kind. This publication is an uncontrolled document and is subject to change without notice. When referring to it please ensure that it is the most up to date version and has not been superseded. The products are not intended for use in applications where a failure or malfunction may cause loss of life, injury or damage to property. The user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failure or malfunction. The products must not be touched when operating because there is a danger of electrocution or severe burning. Always use protective safety equipment such as appropriate shields for the product and wear safety glasses. Even when disconnected any electric charge remaining in the product must be discharged and allowed to cool before safe handling using protective gloves. Extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. Use outside the product ratings is likely to cause permanent damage to the product. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or explosion. Appropriate application design and safety precautions should always be followed to protect persons and property. Product Status & Product Ordering: We annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully approved for production. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product design is complete and final characterisation for volume production is in progress. The datasheet represents the product as it is now understood but details may change. No Annotation: The product has been approved for production and unless otherwise notified by Dynex any product ordered will be supplied to the current version of the data sheet prevailing at the time of our order acknowledgement. All products and materials are sold and services provided subject to Dynex’s conditions of sale, which are available on request. Any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. HEADQUARTERS OPERATIONS CUSTOMER SERVICE DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln, Lincolnshire, LN6 3LF, United Kingdom Fax: +44(0)1522 500550 Tel: +44(0)1522 500500 Web: http://www.dynexsemi.com DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln, Lincolnshire, LN6 3LF, United Kingdom Fax: +44(0)1522 500020 Tel: +44(0)1522 502753 / 502901 Email: [email protected] Dynex Semiconductor Ltd. 2001. Technical Documentation – Not for resale. 6/6 www.dynexsemi.com