DFM300BXS12-A000 DFM300BXS12-A000 Fast Recovery Diode Module Replaces DFM300LXS12-A000 FEATURES ■ Low Reverse Recovery Charge ■ High Switching Speed ■ Low Forward Voltage Drop ■ Isolated Base PDS5724-1.2 July 2004 KEY PARAMETERS VRRM VF (typ) (max) IF (max) IFM 1200V 2.0V 300A 600A APPLICATIONS ■ Chopper Diodes ■ Boost and Buck Converters ■ Free-wheel Circuits ■ Snubber Circuits 2 1 ■ Resonant Converters ■ Multi-level Switch Inverters The DFM300BXS12-A000 is a single 1200 volt, fast recovery diode (FRD) module. Designed for low power loss, the module is suitable for a variety of high voltage applications in motor drives and power conversion. Fig. 1 Circuit diagram Fast switching times and low reverse recovery losses allow high frequency operation making the device suitable for the latest drive designs employing pwm and high frequency switching. These modules incorporate electrically isolated base plates and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety. ORDERING INFORMATION Order As: DFM300BXS12-A000 Note: When ordering, please use the complete part number. Outline type code: B (See package details for further information) Fig. 2 Electrical connections - (not to scale) 1/7 www.dynexsemi.com DFM300BXS12-A000 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Tcase = 25˚C unless stated otherwise Parameter Symbol Test Conditions Max. Units Repetitive peak reverse voltage Tvj = 125˚C 1200 V IF Forward current (per arm) DC, Tcase = 70˚C, Tvj = 125˚C 300 A IFM Max. forward current Tcase = 110˚C, tp = 1ms 600 A IFSM Surge (non-repetitive) forward current 2236 A VRRM I2t I2t value fuse current rating VR = 0, tp = 10ms, Tvj = 125˚C 25 kA2s Pmax Maximum power dissipation Tcase = 25˚C, Tvj = 125˚C 1.0 kW Visol Isolation voltage Commoned terminals to base plate. AC RMS, 1 min, 50Hz 2.5 kV Qpd Partial discharge IEC1287. V1 = 1200V, V2 = 900V, 50Hz RMS 10 pC THERMAL AND MECHANICAL RATINGS Internal insulation: Baseplate material: Creepage distance: Al2O3 Cu 20mm Parameter Symbol Rth(j-c) Clearance: 11mm CTI (Critical Tracking Index): Thermal resistance - diode (per arm) 425 Test Conditions Continuous dissipation - Min. Typ. Max. Units - - 100 ˚C/kW - - 15 ˚C/kW junction to case Rth(c-h) Tj Tstg - Thermal resistance - case to heatsink Mounting torque 5Nm (per module) (with mounting grease) Junction temperature - - - 125 ˚C Storage temperature range - –40 - 125 ˚C 3 - 5 Nm 2.5 - 5 Nm Screw torque Mounting - M6 Electrical connections - M6 2/7 www.dynexsemi.com DFM300BXS12-A000 STATIC ELECTRICAL CHARACTERISTICS Tvj = 25˚C unless stated otherwise. Test Conditions Parameter Symbol Min. Typ. Max. Units IRM Peak reverse current VR = 1200V, Tvj = 125˚C - - 8 mA VF Forward voltage IF = 300A - 2.0 2.5 V IF = 300A, Tvj = 125˚C - 2.05 2.55 V - 16 - nH Test Conditions Min. Typ. Max. Units IF = 300A, - 0.4 - µs L Inductance (module) - DYNAMIC ELECTRICAL CHARACTERISTICS Tvj = 25˚C unless stated otherwise. Parameter Symbol trr Reverse recovery time Irr Reverse recovery current dIF/dt = 2250A/µs, - 300 - A Qrr Reverse recovery charge VR = 600V - 55 - µC Erec Reverse recovery energy - 17 - mJ Test Conditions Min. Typ. Max. Units IF = 300A, - 0.5 - µs Tvj = 125˚C unless stated otherwise. Parameter Symbol trr Reverse recovery time Irr Reverse recovery current dIF/dt = 2250A/µs, - 320 - A Qrr Reverse recovery charge VR = 600V - 85 - µC Erec Reverse recovery energy - 32 - mJ 3/7 www.dynexsemi.com DFM300BXS12-A000 TYPICAL CHARACTERISTICS 800 100 Tj = 25˚C Tj = 125˚C VF is measured at power busbars and not the auxiliary terminals Transient thermal impedance, Zth (j-c) - (°C/kW ) 700 Forward current, IF - (A) 600 500 400 300 200 100 10 1 Diode 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.1 0.001 4.0 2 12.64 3.21 3 37.12 38.58 0.1 Pulse width, tp - (s) 1 Ri (˚C/KW) τi (ms) 0.01 Forward voltage, VF - (V) 1 2.24 0.10 4 45.02 113.97 10 Fig.4 Transient thermal impedance Fig.3 Diode typical forward characteristics 500 1200 1000 800 Fowrad current, IF - (A) Power dissipation - (W) 400 600 400 300 200 100 200 0 0 25 50 75 Case temperature, Tc - °C Fig.5 Power dissipation 100 125 0 0 25 50 75 Case temperature, Tc - (°C) 100 125 Fig.6 DC current rating vs case temperature 4/7 www.dynexsemi.com DFM300BXS12-A000 600 Tcase =125˚C Reverse recovery current, Irr - (A) 500 400 300 200 100 0 0 200 400 600 800 1000 1200 1400 Reverse voltage, VR - (V) Fig.7 RBSOA 5/7 www.dynexsemi.com DFM300BXS12-A000 PACKAGE DETAILS For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 2 1 Nominal weight: 475g Module outline type code: B Fig. 8 Package details 6/7 www.dynexsemi.com POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: +44-(0)1522-500500 Fax: +44-(0)1522-500550 CUSTOMER SERVICE Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 SALES OFFICES Benelux, Italy & Switzerland: Tel: +33 (0)1 60 69 32 36. Fax: +33 (0)1 60 69 31 97. France: Tel: +33 (0)2 47 55 75 53. Fax: +33 (0)2 47 55 75 59. Tel: +33 (0)1 60 69 32 36. Fax: +33 (0)1 60 69 31 97 Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 North America: Tel: (440) 259-2060. Fax: (440) 259-2059. Tel: (949) 733-3005. Fax: (949) 733-2986. These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN UNITED KINGDOM This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. www.dynexsemi.com