TI TPA2011D1

TPA2011D1
www.ti.com
SLOS626 – DECEMBER 2009
3.2W Mono Filter-Free Class-D Audio Power Amplifier
With Auto-Recovering Short-Circuit Protection
Check for Samples: TPA2011D1
FEATURES
1
•
•
•
•
•
•
•
•
Powerful Mono Class-D Amplifier
– 3.24 W (4 Ω, 5 V, 10% THDN)
– 2.57 W (4 Ω, 5 V, 1% THDN)
– 1.80 W (8 Ω, 5 V, 10% THDN)
– 1.46 W (8 Ω, 5 V, 1% THDN)
Integrated Feedback Resistor of 300 kΩ
Integrated Image Reject Filter for DAC Noise
Reduction
Low Output Noise of 20 μV
Low Quiescent Current of 1.5 mA
Auto Recovering Short-Circuit Protection
Thermal Overload Protection
9-Ball, 1,21mm x 1,16 mm 0,4 mm Pitch WCSP
DESCRIPTION
The TPA2011D1 is a 3.2-W high efficiency filter-free
class-D audio power amplifier (class-D amp) in a
1,21 mm × 1,16 mm wafer chip scale package
(WCSP) that requires only three external
components.
Features like 95% efficiency, 86-dB PSRR, 1.5 mA
quiescent current and improved RF immunity make
the TPA2011D1 class-D amp ideal for cellular
handsets. A fast start-up time of 4 ms with no audible
turn-on pop makes the TPA2011D1 ideal for PDA
and smart-phone applications. The TPA2011D1
allows independent gain while summing signals from
separate sources, and has a low 20 μV noise floor.
APPLICATIONS
•
•
•
Wireless or Cellular Handsets and PDAs
Portable Navigation Devices
General Portable Audio Devices
APPLICATION CIRCUIT
EN
IN+
GND
VO-
A1
A2
A3
VDD
PVDD
PGND
B1
B2
B3
IN-
EN
VO+
C1
C2
C3
TPA2011D1
1.160 mm
TPA2011D1
9-BALL 0.4mm PITCH
WAFER CHIP SCALE PACKAGE (YFF)
(TOP VIEW OF PCB)
1.214 mm
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
TPA2011D1
SLOS626 – DECEMBER 2009
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
PACKAGED DEVICES (1)
TA
—40°C to 85°C
(1)
(2)
PART NUMBER (2)
SYMBOL
TPA2011D1YFFR
OEW
TPA2011D1YFFT
OEW
9-ball WSCP
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com
The YFF package is only available taped and reeled. The suffix "R" indicates a reel of 3000, the suffix "T" indicates a reel of 250.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range, TA = 25°C (unless otherwise noted) (1)
In active mode
VDD, PVDD
Supply voltage
VI
Input voltage
RL
Minimum load resistance
In shutdown mode
EN, IN+, IN–
Output continuous total power dissipation
VALUE
UNIT
–0.3 to 6.0
V
–0.3 to 6.0
V
–0.3 to VDD + 0.3
V
3.2
Ω
See Dissipation Rating Table
TA
Operating free-air temperature range
–40 to 85
°C
TJ
Operating junction temperature range
–40 to 150
°C
Tstg
Storage temperature range
–65 to 85
°C
260
°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
(1)
PACKAGE
DERATING FACTOR (1)
TA < 25°C
TA = 70°C
TA = 85°C
YFF (WCSP)
4.2 mW/°C
525 mW
336 mW
273 mW
Derating factor measure with high K board.
RECOMMENDED OPERATING CONDITIONS
VDD
Class-D supply voltage
VIH
High-level input voltage
EN
VIL
Low-level input voltage
EN
RI
Input resistor
Gain ≤ 20 V/V (26 dB)
VIC
Common mode input voltage range
VDD = 2.5V, 5.5V, CMRR ≥ 49 dB
TA
2
MIN
MAX
2.5
5.5
1.3
UNIT
V
V
0.35
15
V
kΩ
0.75 VDD-1.1
V
Operating free-air temperature
–40
°C
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
85
TPA2011D1
www.ti.com
SLOS626 – DECEMBER 2009
ELECTRICAL CHARACTERISTICS
TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
|VOS|
Output offset voltage (measured
differentially)
VI = 0 V, AV = 2 V/V, VDD = 2.5 V to 5.5 V
|IIH|
High-level input current
VDD = 5.5 V, VEN = 5.5 V
|IIL|
Low-level input current
VDD = 5.5 V, VEN = 0 V
TYP
MAX
1
5
mV
50
μA
1
μA
VDD = 5.5 V, no load
1.8
2.5
VDD = 3.6 V, no load
1.5
2.3
I(Q)
Quiescent current
VDD = 2.5 V, no load
1.3
2.1
I(SD)
Shutdown current
VEN = 0.35 V, VDD = 2.5 V to 5.5 V
0.1
2
RO,
Output impedance in shutdown mode
VEN = 0.35 V
f(SW)
Switching frequency
VDD = 2.5 V to 5.5 V
AV
Gain
VDD = 2.5 V to 5.5 V, RI in kΩ
REN
Resistance from EN to GND
SD
UNIT
mA
μA
2
250
kΩ
300
350
kHz
285/RI 300/RI
315/RI
V/V
300
kΩ
OPERATING CHARACTERISTICS
VDD = 3.6 V, TA = 25°C, AV = 2 V/V, RL = 8 Ω (unless otherwise noted)
PARAMETER
TEST CONDITIONS
THD + N = 10%, f = 1 kHz, RL = 4 Ω
THD + N = 1%, f = 1 kHz, RL = 4 Ω
PO
Output power
THD + N = 10%, f = 1 kHz, RL = 8 Ω
THD + N = 1%, f = 1 kHz, RL = 8 Ω
Vn
THD+N
Noise output voltage
Total harmonic distortion plus
noise
VDD = 3.6 V, Inputs AC grounded
with CI = 2μF, f = 20 Hz to 20 kHz
MIN
TYP
VDD = 5 V
3.24
VDD = 3.6 V
1.62
VDD = 2.5 V
0.70
VDD = 5 V
2.57
VDD = 3.6 V
1.32
VDD = 2.5 V
0.57
VDD = 5 V
1.80
VDD = 3.6 V
0.91
VDD = 2.5 V
0.42
VDD = 5 V
1.46
VDD = 3.6 V
0.74
VDD = 2.5 V
0.33
A-weighting
20
No weighting
25
VDD = 5.0 V, PO = 1.0 W, f = 1 kHz, RL = 8 Ω
0.11%
VDD = 3.6 V, PO = 0.5 W, f = 1 kHz, RL = 8 Ω
0.05%
VDD = 2.5 V, PO = 0.2 W, f = 1 kHz, RL = 8 Ω
0.05%
VDD = 5.0 V, PO = 2.0 W, f = 1 kHz, RL = 4 Ω
0.23%
VDD = 3.6 V, PO = 1.0 W, f = 1 kHz, RL = 4 Ω
0.07%
VDD = 2.5 V, PO = 0.4 W, f = 1 kHz, RL = 4 Ω
0.06%
MAX
UNIT
W
W
W
W
μVRMS
PSRR
AC power supply rejection ratio
VDD = 3.6 V, Inputs AC grounded with CI = 2 μF,
200 mVpp ripple, f = 217 Hz
CMRR
Common mode rejection ratio
VDD = 3.6 V, VIC = 1 VPP, f = 217 Hz
79
dB
TSU
Startup time from shutdown
VDD = 3.6 V
4
ms
VDD = 3.6 V, VO+ shorted to VDD
2
VDD = 3.6 V, VO– shorted to VDD
2
VDD = 3.6 V, VO+ shorted to GND
2
VDD = 3.6 V, VO– shorted to GND
2
VDD = 3.6 V, VO+ shorted to VO–
2
IOC
Overcurrent protection
threshold
86
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
dB
A
3
TPA2011D1
SLOS626 – DECEMBER 2009
www.ti.com
OPERATING CHARACTERISTICS (continued)
VDD = 3.6 V, TA = 25°C, AV = 2 V/V, RL = 8 Ω (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Time for which output is
disabled after a short-circuit
event, after which
auto-recovery trials are
continuously made
TSD
MIN
VDD = 2.5 V to 5.5 V
TYP
100
MAX
UNIT
ms
Terminal Functions
TERMINAL
NAME
WCSP BALL
IN–
C1
IN+
VO-
I/O
DESCRIPTION
I
Negative differential audio input
A1
I
Positive differential audio input
A3
O
Negative BTL audio output
VO+
C3
O
Positive BTL audio output
GND
A2
I
Analog ground terminal. Must be connected to same potential as PGND using a direct connection
to a single point ground.
PGND
B3
I
High-current Analog ground terminal. Must be connected to same potential as GND using a direct
connection to a single point ground.
VDD
B1
I
Power supply terminal. Must be connected to same power supply as PVDD using a direct
connection. Voltage must be within values listed in Recommended Operating Conditions table.
PVDD
B2
I
High-current Power supply terminal. Must be connected to same power supply as VDD using a
direct connection. Voltage must be within values listed in Recommended Operating Conditions
table.
EN
C2
I
Shutdown terminal. When terminal is low the device is put into Shutdown mode.
FUNCTIONAL BLOCK DIAGRAM
EN
Input
Buffer
SC
300 KΩ
4
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
TPA2011D1
www.ti.com
SLOS626 – DECEMBER 2009
TEST SETUP FOR GRAPHS
CI
RI
Measurement
Output
OUT+
IN+
+
CI
+
TPA2011D1
RI
-
IN-
Load
30 kHz
Low Pass
Filter
Measurement
Input
-
OUTVDD
GND
CS1
CS2
+
VDD
-
1. Input resistor RI = 150kΩ gives a gain of 6 dB which is used for all the graphs
2. CI was shorted for any common-mode input voltage measurement. All other measurements were taken with CI = 0.1-μF
(unless otherwise noted).
3. CS1 = 0.1μF is placed very close to the device. The optional CS2 = 10μF is used for datasheet graphs.
4. The 30-kHz low-pass filter is required even if the analyzer has an internal low-pass filter. An RC low-pass filter (1kΩ,
4700pF) is used on each output for the data sheet graphs.
TYPICAL CHARACTERISTICS
VDD = 3.6 V, CI = 0.1 μF, CS1 = 0.1 μF, CS2 = 10 μF, TA = 25°C, RL = 8 Ω (unless otherwise noted)
EFFICIENCY vs
OUTPUT POWER
100
100
90
90
80
80
70
70
60
50
40
RL = 8 Ω + 33 µH
Gain = 6 dB
30
20
0.4
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
60
50
40
RL = 4 Ω + 33 µH
Gain = 6 dB
30
20
VDD = 2.5 V
VDD = 3.6 V
VDD = 5.0 V
10
0
0.0
η − Efficiency − %
η − Efficiency − %
EFFICIENCY vs
OUTPUT POWER
VDD = 2.5 V
VDD = 3.6 V
VDD = 5.0 V
10
0
0.0
2.0
0.4
0.8
1.2
1.6
2.0
2.4
PO − Output Power − W
PO − Output Power − W
Figure 1.
Figure 2.
POWER DISSIPATION vs
OUTPUT POWER
POWER DISSIPATION vs
OUTPUT POWER
0.6
RL = 8 Ω + 33 µH
RL = 4 Ω + 33 µH
RL = 8 Ω + 33 µH
RL = 4 Ω + 33 µH
VDD = 3.6 V
Gain = 6 dB
2.8
3.2
3.6
VDD = 5.0 V
Gain = 6 dB
PD − Power Dissipation − W
PD − Power Dissipation − W
0.5
0.3
0.2
0.1
0.4
0.3
0.2
0.1
0.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.0
0.0
0.4
0.8
1.2
1.6
2.0
2.4
PO − Output Power − W
PO − Output Power − W
Figure 3.
Figure 4.
2.8
3.2
3.6
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
4.0
5
TPA2011D1
SLOS626 – DECEMBER 2009
www.ti.com
TYPICAL CHARACTERISTICS (continued)
VDD = 3.6 V, CI = 0.1 μF, CS1 = 0.1 μF, CS2 = 10 μF, TA = 25°C, RL = 8 Ω (unless otherwise noted)
SUPPLY CURRENT vs
OUTPUT POWER
SUPPLY CURRENT vs
OUTPUT POWER
1.0
0.9
0.7
0.6
0.5
0.4
0.3
0.2
RL = 8 Ω + 33 µH
Gain = 6 dB
VDD = 2.5 V
VDD = 3.6 V
VDD = 5.0 V
0.4
IDD − Supply Current − A
IDD − Supply Current − A
0.8
0.5
RL = 4 Ω + 33 µH
Gain = 6 dB
VDD = 2.5 V
VDD = 3.6 V
VDD = 5.0 V
0.3
0.2
0.1
0.1
0.0
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
0.0
0.0
4.0
0.4
0.6
1.2
Figure 6.
SUPPLY CURRENT vs
SUPPLY VOLTAGE
SUPPLY CURRENT vs
EN VOLTAGE
1.4
1.6
1.8
2.0
200
VDD = 2.5 V
VDD = 3.6 V
VDD = 5.0 V
Gain = 6 dB
IDD − Supply Current − nA
1.75
1.50
1.25
1.00
2.5
3.0
3.5
4.0
4.5
5.0
100
50
0
0.0
5.5
Gain = 6 dB
150
0.1
0.2
VDD − Supply Voltage − V
0.3
0.4
0.5
VEN − EN Voltage − V
Figure 7.
Figure 8.
OUTPUT POWER vs
LOAD RESISTANCE
OUTPUT POWER vs
LOAD RESISTANCE
5
4
VDD = 2.5 V
VDD = 3.6 V
VDD = 5.0 V
THD+N = 10 %
Frequency = 1 kHz
Gain = 6 dB
3
2
1
0
VDD = 2.5 V
VDD = 3.6 V
VDD = 5.0 V
THD+N = 1 %
Frequency = 1 kHz
Gain = 6 dB
PO − Output Power − W
4
PO − Output Power − W
1.0
Figure 5.
RL = No Load
RL = 8 Ω + 33 µH
RL = 4 Ω + 33 µH
3
2
1
0
4
8
12
16
20
24
28
32
4
RL − Load Resistance − Ω
8
12
16
20
24
28
32
RL − Load Resistance − Ω
Figure 9.
6
0.8
PO − Output Power − W
2.00
IDD − Supply Current − mA
0.2
PO − Output Power − W
Figure 10.
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
TPA2011D1
www.ti.com
SLOS626 – DECEMBER 2009
TYPICAL CHARACTERISTICS (continued)
VDD = 3.6 V, CI = 0.1 μF, CS1 = 0.1 μF, CS2 = 10 μF, TA = 25°C, RL = 8 Ω (unless otherwise noted)
OUTPUT POWER vs
SUPPLY VOLTAGE
PO − Output Power − W
4
3
THD + NOISE vs
OUTPUT POWER
RL = 4 Ω, THD+N = 1 %
RL = 4 Ω, THD+N = 10 %
RL = 8 Ω, THD+N = 1 %
RL = 8 Ω, THD+N = 10 %
2
1
Frequency = 1 kHz
Gain = 6 dB
0
2.5
3.0
3.5
4.0
4.5
5.0
VDD − Supply Voltage − V
Figure 12.
THD + NOISE vs
OUTPUT POWER
THD + NOISE vs
FREQUENCY
THD+N − Total Harmonic Distortion + Noise − %
Figure 11.
10
1
0.1
0.01
0.001
1k
f − Frequency − Hz
Figure 14.
THD + NOISE vs
FREQUENCY
THD + NOISE vs
FREQUENCY
10
PO = 25 mW
PO = 125 mW
PO = 500 mW
VDD = 3.6 V
RL = 8 Ω + 33 µH
Gain = 6 dB
1
0.1
0.01
0.001
100
100
Figure 13.
1k
f − Frequency − Hz
10k
20k
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
20
20
PO = 50 mW
PO = 250 mW
PO = 1 W
VDD = 5.0 V
RL = 8 Ω + 33 µH
Gain = 6 dB
10k
20k
10
PO = 15 mW
PO = 75 mW
PO = 200 mW
VDD = 2.5 V
RL = 8 Ω + 33 µH
Gain = 6 dB
1
0.1
0.01
0.001
20
Figure 15.
100
1k
f − Frequency − Hz
10k
20k
Figure 16.
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
7
TPA2011D1
SLOS626 – DECEMBER 2009
www.ti.com
TYPICAL CHARACTERISTICS (continued)
VDD = 3.6 V, CI = 0.1 μF, CS1 = 0.1 μF, CS2 = 10 μF, TA = 25°C, RL = 8 Ω (unless otherwise noted)
PO = 100 mW
PO = 500 mW
PO = 2 W
VDD = 5.0 V
RL = 4 Ω + 33 µH
Gain = 6 dB
1
0.1
0.01
0.001
100
1k
f − Frequency − Hz
10k
1
0.1
0.01
0.001
100
1k
f − Frequency − Hz
10k
Figure 17.
Figure 18.
THD + NOISE vs
FREQUENCY
THD + NOISE vs
COMMON MODE INPUT VOLTAGE
PO = 30 mW
PO = 150 mW
PO = 400 mW
VDD = 2.5 V
RL = 4 Ω + 33 µH
Gain = 6 dB
1
0.1
0.01
0.001
100
1k
f − Frequency − Hz
10k
20k
10
RL = 8 Ω + 33 µH
Frequency = 1 kHz
PO = 200 mW
Gain = 6 dB
20k
VDD = 2.5 V
VDD = 3.6 V
VDD = 5.0 V
1
0.1
0.01
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VIC − Common Mode Input Voltage − V
Figure 19.
Figure 20.
POWER SUPPLY REJECTION RATIO
vs FREQUENCY
POWER SUPPLY REJECTION RATIO
vs FREQUENCY
−20
−30
VDD = 2.5 V
VDD = 3.6 V
VDD = 5.0 V
−40
−50
−60
−70
−80
−90
−100
−110
PSRR − Power Supply Rejection Ratio − dB
0
Inputs AC−Grounded
CI = 2 µF
RL = 8 Ω + 33 µH
Gain = 6 dB
−10
−120
Inputs AC−Grounded
CI = 2 µF
RL = 4 Ω + 33 µH
Gain = 6 dB
−10
−20
−30
VDD = 2.5 V
VDD = 3.6 V
VDD = 5.0 V
−40
−50
−60
−70
−80
−90
−100
−110
−120
20
100
1k
f − Frequency − Hz
10k
20k
20
Figure 21.
8
PO = 50 mW
PO = 250 mW
PO = 1 W
VDD = 3.6 V
RL = 4 Ω + 33 µH
Gain = 6 dB
20
0
PSRR − Power Supply Rejection Ratio − dB
10
20k
10
20
THD+N − Total Harmonic Distortion + Noise − %
10
20
THD+N − Total Harmonic Distortion + Noise − %
THD + NOISE vs
FREQUENCY
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
THD + NOISE vs
FREQUENCY
100
1k
f − Frequency − Hz
10k
20k
Figure 22.
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
TPA2011D1
www.ti.com
SLOS626 – DECEMBER 2009
TYPICAL CHARACTERISTICS (continued)
VDD = 3.6 V, CI = 0.1 μF, CS1 = 0.1 μF, CS2 = 10 μF, TA = 25°C, RL = 8 Ω (unless otherwise noted)
PSRR − Power Supply Rejection Ratio − dB
0
−10
−20
RL = 8 Ω + 33 µH
Frequency = 217 Hz
Gain = 6 dB
COMMON MODE REJECTION RATIO
vs FREQUENCY
CMRR − Common Mode Rejection Ratio − dB
POWER SUPPLY REJECTION RATIO vs
COMMON MODE INPUT VOLTAGE
VDD = 2.5 V
VDD = 3.6 V
VDD = 5.0 V
−30
−40
−50
−60
−70
−80
−90
−100
0.0
−30
VIC = 1 VPP
RL = 8 Ω + 33 µH
Gain = 6 dB
−40
VDD = 2.5 V
VDD = 3.6 V
VDD = 5.0 V
−50
−60
−70
−80
−90
−100
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
20
100
1k
f − Frequency − Hz
VIC − Common Mode Input Voltage − V
Figure 23.
10k
20k
Figure 24.
CMRR − Common Mode Rejection Ratio − dB
COMMON MODE REJECTION RATIO vs
COMMON MODE INPUT VOLTAGE
0
−10
RL = 8 Ω + 33 µH
Frequency = 217 Hz
Gain = 6 dB
VDD = 2.5 V
VDD = 3.6 V
VDD = 5.0 V
−20
−30
−40
−50
−60
−70
−80
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VIC − Common Mode Input Voltage − V
Figure 25.
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
9
TPA2011D1
SLOS626 – DECEMBER 2009
www.ti.com
TYPICAL CHARACTERISTICS (continued)
VDD = 3.6 V, CI = 0.1 μF, CS1 = 0.1 μF, CS2 = 10 μF, TA = 25°C, RL = 8 Ω (unless otherwise noted)
GSM POWER SUPPLY REJECTION
vs TIME
Figure 26.
GSM POWER SUPPLY REJECTION
vs FREQUENCY
Figure 27.
10
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
TPA2011D1
www.ti.com
SLOS626 – DECEMBER 2009
APPLICATION INFORMATION
SHORT CIRCUIT AUTO-RECOVERY
When a short-circuit event occurs, the TPA2011D1 goes to shutdown mode and activates the integrated
auto-recovery process whose aim is to return the device to normal operation once the short-circuit is removed.
This process repeatedly examines (once every 100ms) whether the short-circuit condition persists, and returns
the device to normal operation immediately after the short-circuit condition is removed. This feature helps protect
the device from large currents and maintain a good long-term reliability.
INTEGRATED IMAGE REJECT FILTER FOR DAC NOISE REJECTION
In applications which use a DAC to drive Class-D amplifiers, out-of-band noise energy present at the DAC's
image frequencies fold back into the audio-band at the output of the Class-D amplifier. An external low-pass filter
is often placed between the DAC and the Class-D amplifier in order to attenuate this noise.
The TPA2011D1 has an integrated Image Reject Filter with a low-pass cutoff frequency of 130 kHz, which
significantly attenuates this noise. Depending on the system noise specification, the integrated Image Reject
Filter may help eliminate external filtering, thereby saving board space and component cost.
COMPONENT SELECTION
Figure 28 shows the TPA2011D1 typical schematic with differential inputs and Figure 29 shows the TPA2011D1
with differential inputs and input capacitors, and Figure 30 shows the TPA2011D1 with single-ended inputs.
Differential inputs should be used whenever possible because the single-ended inputs are much more
susceptible to noise.
Table 1. Typical Component Values
REF DES
VALUE
EIA SIZE
MANUFACTURER
RI
150 kΩ (±0.5%)
0402
Panasonic
ERJ2RHD154V
CS
1 μF (+22%, –80%)
0402
Murata
GRP155F50J105Z
3.3 nF (±10%)
0201
Murata
GRP033B10J332K
CI
(1)
(1)
PART NUMBER
CI is only needed for single-ended input or if VICM is not between 0.5 V and VDD – 0.8 V. CI = 3.3 nF
(with RI = 150 kΩ) gives a high-pass corner frequency of 321 Hz.
Input Resistors (RI)
The input resistors (RI) set the gain of the amplifier according to Equation 1.
Gain + 2 x 150 kW
R
I
ǒVVǓ
(1)
Resistor matching is very important in fully differential amplifiers. The balance of the output on the reference
voltage depends on matched ratios of the resistors. CMRR, PSRR, and cancellation of the second harmonic
distortion diminish if resistor mismatch occurs. Therefore, it is recommended to use 1% tolerance resistors or
better to keep the performance optimized. Matching is more important than overall tolerance. Resistor arrays with
1% matching can be used with a tolerance greater than 1%.
Place the input resistors very close to the TPA2011D1 to limit noise injection on the high-impedance nodes.
For optimal performance the gain should be set to 2 V/V or lower. Lower gain allows the TPA2011D1 to operate
at its best, and keeps a high voltage at the input making the inputs less susceptible to noise.
Decoupling Capacitors (CS1, CS2)
The TPA2011D1 is a high-performance class-D audio amplifier that requires adequate power supply decoupling
to ensure the efficiency is high and total harmonic distortion (THD) is low. For higher frequency transients,
spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) ceramic capacitor CS1 = 0.1μF ,
placed as close as possible to the device VDD lead works best. Placing CS1 close to the TPA2011D1 is important
for the efficiency of the class-D amplifier, because any resistance or inductance in the trace between the device
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
11
TPA2011D1
SLOS626 – DECEMBER 2009
www.ti.com
and the capacitor can cause a loss in efficiency. For filtering lower-frequency noise signals, a 10 μF or greater
capacitor (CS2) placed near the audio power amplifier would also help, but it is not required in most applications
because of the high PSRR of this device. Typically, the smaller the capacitor's case size, the lower the
inductance and the closer it can be placed to the TPA2011D1. X5R and X7R dielectric capacitors are
recommended for both CS1 and CS2.
Input Capacitors (CI)
The TPA2011D1 does not require input coupling capacitors if the design uses a differential source that is biased
from 0.5 V to VDD –0.8 V (shown in Figure 28). If the input signal is not biased within the recommended
common-mode input range, if needing to use the input as a high pass filter (shown in Figure 29), or if using a
single-ended source (shown in Figure 30), input coupling capacitors are required.
The input capacitors and input resistors form a high-pass filter with the corner frequency, fc, determined in
Equation 2.
1
fc +
2p R C
I I
(2)
ǒ
Ǔ
The value of the input capacitor is important to consider as it directly affects the bass (low frequency)
performance of the circuit. Speakers in wireless phones cannot usually respond well to low frequencies, so the
corner frequency can be set to block low frequencies in this application.
Equation 3 is reconfigured to solve for the input coupling capacitance.
1
C +
I
2p R f c
I
ǒ
Ǔ
(3)
If the corner frequency is within the audio band, the capacitors should have a tolerance of ±10% or better,
because any mismatch in capacitance causes an impedance mismatch at the corner frequency and below.
For a flat low-frequency response, use large input coupling capacitors (1 μF). However, in a GSM phone the
ground signal is fluctuating at 217 Hz, but the signal from the codec does not have the same 217 Hz fluctuation.
The difference between the two signals is amplified, sent to the speaker, and heard as a 217 Hz hum.
To Battery
Internal
Oscillator
RI
+
RI
−
EN
CS
IN−
_
Differential
Input
VDD
PWM
H−
Bridge
VO+
VO−
+
IN+
GND
Bias
Circuitry
TPA2011D1
Filter-Free Class D
Figure 28. Typical TPA2011D1 Application Schematic With Differential Input for a Wireless Phone
12
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
TPA2011D1
www.ti.com
SLOS626 – DECEMBER 2009
To Battery
CI
RI
Internal
Oscillator
CI
CS
IN−
PWM
_
Differential
Input
VDD
H−
Bridge
VO −
+
RI
VO+
IN+
GND
Bias
Circuitry
EN
TPA2011D1
Filter-Free Class D
Figure 29. TPA2011D1 Application Schematic With Differential Input and Input Capacitors
CI
To Battery
Internal
Oscillator
RI
Single-ended
Input
VDD
IN−
_
PWM
H−
Bridge
VO+
VO−
+
RI
CS
IN+
CI
GND
Bias
Circuitry
EN
TPA2011D1
Filter-Free Class D
Figure 30. TPA2011D1 Application Schematic With Single-Ended Input
SUMMING INPUT SIGNALS WITH THE TPA2011D1
Most wireless phones or PDAs need to sum signals at the audio power amplifier or just have two signal sources
that need separate gain. The TPA2011D1 makes it easy to sum signals or use separate signal sources with
different gains. Many phones now use the same speaker for the earpiece and ringer, where the wireless phone
would require a much lower gain for the phone earpiece than for the ringer. PDAs and phones that have stereo
headphones require summing of the right and left channels to output the stereo signal to the mono speaker.
Summing Two Differential Input Signals
Two extra resistors are needed for summing differential signals (a total of 5 components). The gain for each input
source can be set independently (see Equation 4 and Equation 5, and Figure 31).
V
V
Gain 1 + O + 2 x 150 kW
V
R
V
I1
I1
(4)
V
V
Gain 2 + O + 2 x 150 kW
V
R
V
I2
I2
(5)
ǒǓ
ǒǓ
If summing left and right inputs with a gain of 1 V/V, use RI1 = RI2 = 300 kΩ.
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
13
TPA2011D1
SLOS626 – DECEMBER 2009
www.ti.com
If summing a ring tone and a phone signal, set the ring-tone gain to Gain 2 = 2 V/V, and the phone gain to gain 1
= 0.1 V/V. The resistor values would be. . .
RI1 = 3 MΩ, and = RI2 = 150 kΩ.
Differential
Input 1
+
RI1
-
RI1
+
RI2
To Battery
Internal
Oscillator
Differential
Input 2
RI2
CS
IN_
-
VDD
PWM
HBridge
VO+
VO-
+
IN+
GND
SHUTDOWN
Bias
Circuitry
Filter-Free Class D
Figure 31. Application Schematic With TPA2011D1 Summing Two Differential Inputs
Summing a Differential Input Signal and a Single-Ended Input Signal
Figure 32 shows how to sum a differential input signal and a single-ended input signal. Ground noise can couple
in through IN+ with this method. It is better to use differential inputs. The corner frequency of the single-ended
input is set by CI2, shown in Equation 8. To assure that each input is balanced, the single-ended input must be
driven by a low-impedance source even if the input is not in use
V
V
Gain 1 + O + 2 x 150 kW
V
R
V
I1
I1
(6)
V
V
Gain 2 + O + 2 x 150 kW
V
R
V
I2
I2
(7)
1
C +
I2
2p R f
I2 c2
(8)
ǒǓ
ǒǓ
ǒ
Ǔ
If summing a ring tone and a phone signal, the phone signal should use a differential input signal while the ring
tone might be limited to a single-ended signal. Phone gain is set at gain 1 = 0.1 V/V, and the ring-tone gain is set
to gain 2 = 2 V/V, the resistor values would be…
RI1 = 3 MΩ, and = RI2 = 150 kΩ.
The high pass corner frequency of the single-ended input is set by CI2. If the desired corner frequency is less
than 20 Hz...
14
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
TPA2011D1
www.ti.com
C
I2
C
I2
SLOS626 – DECEMBER 2009
u
1
ǒ2p 150kW 20HzǓ
(9)
u 53 nF
(10)
RI1
Differential
Input 1
Single-Ended
Input 2
RI1
CI2 R
I2
To Battery
Internal
Oscillator
CS
IN_
RI2
VDD
PWM
HBridge
VO+
VO-
+
IN+
CI2
GND
Bias
Circuitry
SHUTDOWN
Filter-Free Class D
Figure 32. Application Schematic With TPA2011D1 Summing Differential Input and Single-Ended Input
Signals
Summing Two Single-Ended Input Signals
Four resistors and three capacitors are needed for summing single-ended input signals. The gain and corner
frequencies (fc1 and fc2) for each input source can be set independently (see Equation 11 through Equation 14,
and Figure 33). Resistor, RP, and capacitor, CP, are needed on the IN+ terminal to match the impedance on the
IN– terminal. The single-ended inputs must be driven by low impedance sources even if one of the inputs is not
outputting an ac signal.
V
V
Gain 1 + O + 2 x 150 kW
V
R
V
I1
I1
(11)
V
V
Gain 2 + O + 2 x 150 kW
V
R
V
I2
I2
(12)
1
C +
I1
2p R f
I1 c1
(13)
1
C +
I2
2p R f
I2 c2
(14)
C +C ) C
P
I1
I2
(15)
R
R
I2
R + I1
P
R ) R
I1
I2
(16)
ǒǓ
ǒǓ
ǒ
Ǔ
ǒ
Ǔ
ǒ
Ǔ
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
15
TPA2011D1
SLOS626 – DECEMBER 2009
www.ti.com
Single-Ended
Input 1
Single-Ended
Input 2
CI1 R
I1
To Battery
CI2 R
I2
Internal
Oscillator
CS
IN_
RP
VDD
PWM
HBridge
VO+
VO-
+
IN+
CP
GND
SHUTDOWN
Bias
Circuitry
Filter-Free Class D
Figure 33. Application Schematic With TPA2011D1 Summing Two Single-Ended Inputs
WHEN TO USE AN OUTPUT FILTER
Design the TPA2011D1 without an Inductor / Capacitor (LC) output filter if the traces from the amplifier to the
speaker are short. Wireless handsets and PDAs are great applications for this class-D amplifier to be used
without an output filter.
The TPA2011D1 does not require an LC output filter for short speaker connections (approximately 100 mm long
or less). A ferrite bead can often be used in the design if failing radiated emissions testing without an LC filter;
and, the frequency-sensitive circuit is greater than 1 MHz. If choosing a ferrite bead, choose one with high
impedance at high frequencies, but very low impedance at low frequencies. The selection must also take into
account the currents flowing through the ferrite bead. Ferrites can begin to loose effectiveness at much lower
than rated current values. See the TPA2011D1 EVM User's Guide for components used successfully by TI.
Figure 34 shows a typical ferrite-bead output filter.
Ferrite
Chip Bead
VO−
1 nF
Ferrite
Chip Bead
VO+
1 nF
Figure 34. Typical Ferrite Chip Bead Filter
EFFICIENCY AND THERMAL INFORMATION
The maximum ambient operating temperature of the TPA2011D1 depends on the load resistance, power supply
voltage and heat-sinking ability of the PCB system. The derating factor for the YFF package is shown in the
dissipation rating table. Converting this to θJA:
16
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
TPA2011D1
www.ti.com
q
JA
SLOS626 – DECEMBER 2009
+
1
Derating Factor
(17)
Given θJA (from the Package Dissipation ratings table), the maximum allowable junction temperature (from the
Absolute Maximum ratings table), and the maximum internal dissipation (from Power Dissipation vs Output
Power figures) the maximum ambient temperature can be calculated with the following equation. Note that the
units on these figures are Watts RMS. Because of crest factor (ratio of peak power to RMS power) from 9–15
dB, thermal limitations are not usually encountered.
T Max + T Max * q P
A
J
JA Dmax
(18)
The TPA2011D1 is designed with thermal protection that turns the device off when the junction temperature
surpasses 150°C to prevent damage to the IC. Note that the use of speakers less resistive than 4-Ω (typ) is not
advisable. Below 4-Ω (typ) the thermal performance of the device dramatically reduces because of increased
output current and reduced amplifier efficiency. The Absolute Maximum rating of 3.2-Ω covers the manufacturing
tolerance of a 4-Ω speaker and speaker impedance decrease due to frequency. θJA is a gross approximation of
the complex thermal transfer mechanisms between the device and its ambient environment. If the θJA calculation
reveals a potential problem, a more accurate estimate should be made.
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
17
TPA2011D1
SLOS626 – DECEMBER 2009
www.ti.com
PRINTED CIRCUIT BOARD LAYOUT
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 35 shows the appropriate diameters for a WCSP layout.
Figure 35. Land Pattern Image and Dimensions
SOLDER PAD
DEFINITIONS
COPPER PAD
SOLDER MASK
OPENING(5)
COPPER
THICKNESS
STENCIL OPENING(6) (7)
STENCIL
THICKNESS
Nonsolder mask
defined (NSMD)
0.23 mm
0.310 mm
1 oz max
(0.032 mm)
0.275 mm x 0.275 mm Sq.
(rounded corners)
0.1 mm thick
1. Circuit traces from NSMD defined PWB lands should be 75 μm to 100 μm wide in the exposed area inside
the solder mask opening. Wider trace widths reduce device stand off and impact reliability.
2. Best reliability results are achieved when the PWB laminate glass transition temperature is above the
operating the range of the intended application.
3. Recommend solder paste is Type 3 or Type 4.
4. For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in
thermal fatigue performance.
5. Solder mask thickness should be less than 20 μm on top of the copper circuit pattern
6. Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically
etched stencils give inferior solder paste volume control.
7. Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional
component movement due to solder wetting forces.
Figure 36. Layout Snapshot
An on-pad via is not required to route the middle ball B2 (PVDD) of the TPA2011D1. Just short ball B2 (PVDD) to
ball B1 (VDD) and connect both to the supply trace as shown in Figure 36. This simplifies board routing and
saves manufacturing cost.
18
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
TPA2011D1
www.ti.com
SLOS626 – DECEMBER 2009
Package Dimensions
D
E
Max = 1244µm
Max = 1190µm
Min = 1184µm
Min = 1130µm
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA2011D1
19
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPA2011D1YFFR
ACTIVE
DSBGA
YFF
9
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPA2011D1YFFT
ACTIVE
DSBGA
YFF
9
250
SNAGCU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated