55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-1104R-O Description Features !3.0mmx1.0mm SMT LED, 2.0mm THICKNESS. !LOW The Super Bright Orange source color devices are made POWER CONSUMPTION. !WIDE VIEWING ANGLE. !IDEAL FOR BACK LIGHT AND INDICATOR. !VARIOUS with DH InGaAlP on GaAs substrate Light Emitting Diode. 3.0x1.0 mm SMD CHIP LED LAMP COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.15(0.006") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.2 DATE:DEC/11/2002 PAGE: 1 OF 4 Selection Guide P Pa a art rt N No No. o.. D iic ce S UPER BRIGHT ORANGE (InGaAlP) GHB-1104R-O IIv ((mcd m c dd) v (mcd) @ 20 mA L Lens e ens nss T Typ Typ Tyy pe WATER CLEAR V Viewin Viiewing i ew i n g Angle Miin n. in. T Typ Tyyyp pp.. 70 300 120° Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C S Sy yymbo ymbol mb o l P Pa a aramete r am et er De evic ev ic e TTyyyp pp.. Ma ax xx.. Un nit its T Test e est ss t C Conditio o n d it io nss peak P eak Wavelength S uper Bright Orange 610 nm I F =20mA D D ominate Wavelength S uper Bright Orange 601 nm I F =20mA 29 nm I F =20mA pF VF =0V;f=1MHz 2.5 V I F =20mA 10 uA VR = 5V 1/2 S pectral Line Half-width S uper Bright Orange C C apacitance S uper Bright Orange 30 VF Forward Voltage S uper Bright Orange 2.0 IR Reverse Current S uper Bright Orange Absolute Maximum Ratings at TA=25 C P Paramet Pa a arameter r am e t er S Su up u uper p er er Bri B Br Bright Br igh g h t Orang O Orang r an g e U Unit n nit its Power dissipation 75 mW DC Forward Current 30 mA Peak Forward Current [1] 1 95 mA Reverse Voltage 5 V Operating/Storage Temperature -40 C To +85 C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. REV NO: V.2 DATE:DEC/11/2002 PAGE: 2 OF 4 REV NO: V.2 DATE:DEC/11/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.2 DATE:DEC/11/2002 PAGE: 4 OF 4