3.0x1.5mm SMD CHIP LED LAMP APL3015SYC Features SUPER BRIGHT YELLOW Description ! 3.0mmx1.5mm SMT LED, 1.4mm THICKNESS. The Super Bright Yellow source color devices are !LOW POWER CONSUMPTION. made with DH InGaAlP on GaAs substrate Light ! WIDE Emitting Diode. VIEWING ANGLE. ! IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS !INNER COLORS AND LENS TYPES AVAILABLE. LENS TYPE. ! PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAA8949 APPROVED: J.Lu REV NO: V.3 CHECKED: Allen Liu DATE: MAR/18/2003 DRAWN: X.T.HU PAGE: 1 OF 4 Selection Guide Dic e Par t No . APL3015SYC Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT YELLOW ( InGaAlP ) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 36 150 70 ° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er D ev i c e λpeak Peak Wavelength Super Bright Yellow λD Dominate Wavelength ∆λ1/2 Ty p . Max . Un it s Tes t Co n d it io n s 590 nm I F =20mA Super Bright Yellow 588 nm I F =20mA Spectral Line Half-width Super Bright Yellow 28 nm I F =20mA C Capacitance Super Bright Yellow 25 pF V F =0V;f =1MHz VF Forward Voltage Super Bright Yellow 2.0 2.5 V I F =20mA IR Reverse Current Super Bright Yellow 10 uA V R = 5V Absolute Maximum Ratings at T)=25°°C P ar am e t e r Su p er B r ig h t Yello w Un it s Power dissipation 125 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAA8949 APPROVED: J.Lu REV NO: V.3 CHECKED: Allen Liu DATE: MAR/18/2003 DRAWN: X.T.HU PAGE: 2 OF 4 Super Bright Yellow SPEC NO: DSAA8949 APPROVED: J.Lu APL3015SYC REV NO: V.3 CHECKED: Allen Liu DATE: MAR/18/2003 DRAWN: X.T.HU PAGE: 3 OF 4 APL3015SYC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAA8949 APPROVED: J.Lu REV NO: V.3 CHECKED: Allen Liu DATE: MAR/18/2003 DRAWN: X.T.HU PAGE: 4 OF 4