2.0x1.25mm SMD CHIP LED LAMP APTC2012SYCK SUPER BRIGHT YELLOW Features Description !2.0mmx1.25mm SMT LED,0.75mm THICKNESS. The Super Bright Yellow source color devices !LOW are made with DH InGaAlP on GaAs substrate POWER CONSUMPTION. ! WIDE VIEWING ANGLE. Light Emitting Diode. !IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD0958 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE: MAR/22/2003 DRAWN: S.J.HOU PAGE: 1 OF 4 Selection Guide P ar t N o . Dic e APTC2012SYCK Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT YELLOW (InGaAlP) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 18 50 120° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er D ev i c e λpeak Peak Wavelength Super Bright Yellow λD Dominate Wavelength ∆λ1/2 Ty p . Max . Un it s Tes t Co n d it io n s 590 nm I F =20mA Super Bright Yellow 590 nm I F =20mA Spectral Line Half-width Super Bright Yellow 20 nm I F =20mA C Capacitance Super Bright Yellow 20 pF V F =0V;f =1MHz VF Forward Voltage Super Bright Yellow 2.0 2.5 V I F =20mA IR Reverse Current Super Bright Yellow 10 uA V R = 5V Absolute Maximum Ratings at T)=25°°C Par am et er Su p er B r ig h t Yello w Un it s Power dissipation 125 mW DC Forward Current 30 mA Peak Forward Current [1] 17 5 mA Reverse Voltage 5 V Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAD0958 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE: MAR/22/2003 DRAWN: S.J.HOU PAGE: 2 OF 4 Super Bright Yellow SPEC NO: DSAD0958 APPROVED : J. Lu APTC2012SYCK REV NO: V.1 CHECKED :Allen Liu DATE: MAR/22/2003 DRAWN: S.J.HOU PAGE: 3 OF 4 APTC2012SYCK SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD0958 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE: MAR/22/2003 DRAWN: S.J.HOU PAGE: 4 OF 4