KINGBRIGHT APTC2012SECK

2.0x1.25mm SMD CHIP LED LAMP
APTC2012SYCK
SUPER BRIGHT YELLOW
Features
Description
!2.0mmx1.25mm SMT LED,0.75mm THICKNESS.
The Super Bright Yellow source color devices
!LOW
are made with DH InGaAlP on GaAs substrate
POWER CONSUMPTION.
! WIDE
VIEWING ANGLE.
Light Emitting Diode.
!IDEAL FOR BACKLIGHT AND INDICATOR.
! VARIOUS
COLORS AND LENS TYPES AVAILABLE.
!PACKAGE
: 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
SPEC NO: DSAD0958
APPROVED : J. Lu
REV NO: V.1
CHECKED :Allen Liu
DATE: MAR/22/2003
DRAWN: S.J.HOU
PAGE: 1 OF 4
Selection Guide
P ar t N o .
Dic e
APTC2012SYCK
Iv (m c d )
@ 20 m A
L en s Ty p e
SUPER BRIGHT YELLOW (InGaAlP)
WATER CLEAR
V i ew i n g
An g l e
Min .
Ty p .
2θ1/2
18
50
120°
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T)=25°°C
Sy m b o l
Par am et er
D ev i c e
λpeak
Peak Wavelength
Super Bright Yellow
λD
Dominate Wavelength
∆λ1/2
Ty p .
Max .
Un it s
Tes t Co n d it io n s
590
nm
I F =20mA
Super Bright Yellow
590
nm
I F =20mA
Spectral Line Half-width
Super Bright Yellow
20
nm
I F =20mA
C
Capacitance
Super Bright Yellow
20
pF
V F =0V;f =1MHz
VF
Forward Voltage
Super Bright Yellow
2.0
2.5
V
I F =20mA
IR
Reverse Current
Super Bright Yellow
10
uA
V R = 5V
Absolute Maximum Ratings at T)=25°°C
Par am et er
Su p er B r ig h t Yello w
Un it s
Power dissipation
125
mW
DC Forward Current
30
mA
Peak Forward Current [1]
17 5
mA
Reverse Voltage
5
V
Operating/Storage Temperature
-40°C To +85°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO: DSAD0958
APPROVED : J. Lu
REV NO: V.1
CHECKED :Allen Liu
DATE: MAR/22/2003
DRAWN: S.J.HOU
PAGE: 2 OF 4
Super Bright Yellow
SPEC NO: DSAD0958
APPROVED : J. Lu
APTC2012SYCK
REV NO: V.1
CHECKED :Allen Liu
DATE: MAR/22/2003
DRAWN: S.J.HOU
PAGE: 3 OF 4
APTC2012SYCK
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: DSAD0958
APPROVED : J. Lu
REV NO: V.1
CHECKED :Allen Liu
DATE: MAR/22/2003
DRAWN: S.J.HOU
PAGE: 4 OF 4