GILWAY GHB-SOT23D-DR

55 Commerce Way
Woburn, MA 01801
(781) 935 - 4442
(781) 938 - 5867
www.gilway.com
GHB-SOT23D-DR
Features
Description
!SOT-23
The Super Bright Red source color devices are made
!LOW
PACKAGE SURFACE MOUNT LED LAMP.
with Gallium Aluminum Arsenide Red Light Emitting
POWER CONSUMPTION.
!LONG
LIFE - SOLID STATE RELIABILITY.
!PACKAGE: 2000PCS
Diode.
SOT-23 SURFACE MOUNT LED LAMP
/ REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is 0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
REV NO: V.3
DATE:DEC/16/2002
PAGE: 1 OF 4
Selection Guide
P
Pa
a
art
rt N
No.
No
o..
S UPER BRIGHT RED (GaAlAs )
GHB-SOT23D-DR
m c dd)
v ((mcd)
IIv
(mc
@ 20 mA
Lens
Typ
L
e
ens
nss T
Tyy p e
Diic
ce
RED DIFFUSED
ng
ew iin
V
Viewin
Viiiew
Angle
Miin
n.
in.
T
Typ
Tyyyp
pp..
36
70
140°
Note:
1 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
F
Electrical / Optical Characteristics at TA=25 C
S
Sy
yymbo
ymbol
mb o l
P
Pa
a
aramete
r a m e t er
De
evic
ev ic e
peak
Peak Wavelength
Super Bright Red
D
Dominate Wavelength
1/2
TTyyyp
pp..
Ma
ax
xx..
Un
nit
its
T
Test
e
est
ss t C
Cond
o n d iition
t io nss
660
nm
IF =20mA
Super Bright Red
640
nm
IF =20mA
Spectral Line Half-width
Super Bright Red
20
nm
IF =20mA
C
C apacitance
Super Bright Red
45
pF
V F =0V;f=1MHz
VF
Forward Voltage
Super Bright Red
1.85
2.5
V
IF =20mA
IR
Reverse Current
Super Bright Red
10
uA
VR = 5V
Absolute Maximum Ratings at TA=25 C
P
Paramete
Pa
a
arameter
r a m e t er
S
Su
u
uper
uper
p er Br
Bright
Bright
Red
Re
B
Br ig h t R
ed
U
Unit
nit
n
its
Power dissipation
100
mW
DC Forward Current
30
mA
Peak Forward Current [1]
155
mA
Reverse Voltage
5
V
Operating/Storage Temperature
-40 C To +85 C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
REV NO: V.3
DATE:DEC/16/2002
PAGE: 2 OF 4
REV NO: V.3
DATE:DEC/16/2002
PAGE: 3 OF 4
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
REV NO: V.3
DATE:DEC/16/2002
PAGE: 4 OF 4