KINGBRIGHT AM23SRD-F

SOT-23 SURFACE MOUNT LED LAMPS
Features
!SOT-23
!LOW
SUPER BRIGHT RED
AM23SRC-F
SUPER BRIGHT RED
Description
PACKAGE SURFACE MOUNT LED LAMP.
POWER CONSUMPTION.
!LONG
AM23SRD-F
LIFE - SOLID STATE RELIABILITY.
The Super Bright Red source color devices are made
with Gallium Aluminum Arsenide Red Light Emitting Diode.
!PACKAGE: 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
SPEC NO: CDA0445
APPROVED : J. Lu
REV NO: V.1
CHECKED :
DATE: OCT/27/2001
DRAWN: M.F.CAI
PAGE: 1 OF4
Selection Guide
Par t No .
Dic e
Iv (mc d )
@ 20 mA
L en s Ty p e
AM23SRD-F
Viewin g
An g le
Mi n .
Ty p .
2θ1/2
RED DIFFUSED
40
70
140°
WATER CLEAR
40
70
140°
SUPER BRIGHT RED(InGaAlP)
AM23SRC-F
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25°°C
+Sy mb o l
Par amet er
Dev ic e
λpeak
Peak Wavelength
Super Bright Red
λD
Dominate Wavelength
∆λ1/2
Ty p .
Max .
Un it s
Tes t Co n d it io n s
660
nm
IF=20mA
Super Bright Red
640
nm
IF=20mA
Spectral Line Halfwidth
Super Bright Red
20
nm
IF=20mA
C
Capacitance
Super Bright Red
45
pF
VF=0V;f=1MHz
VF
Forward Voltage
Super Bright Red
1.85
2.5
V
IF=20mA
IR
Reverse Current
Super Bright Red
10
uA
VR = 5V
Absolute Maximum Ratings at TA=25°°C
Par amet er
Su p er B r ig h t Yello w
Un it s
Power dissipation
100
mW
DC Forward Current
30
mA
Peak Forward Current [1]
155
mA
Reverse Voltage
5
V
Operating Temperature
-40°C To +85°C
Storage Temperature
-40°C To +85°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO: CDA0445
APPROVED : J. Lu
REV NO: V.1
CHECKED :
DATE: OCT/27/2001
DRAWN: M.F.CAI
PAGE: 2 OF4
Super Bright Red AM23SRD-F,AM23SRC-F
SPEC NO: CDA0445
APPROVED : J. Lu
REV NO: V.1
CHECKED :
DATE: OCT/27/2001
DRAWN: M.F.CAI
PAGE: 3 OF4
AM23SRx-F
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: CDA0445
APPROVED : J. Lu
REV NO: V.1
CHECKED :
DATE: OCT/27/2001
DRAWN: M.F.CAI
PAGE: 4 OF4