HITACHI 2SC3322

2SC3322
Silicon NPN Tirple Diffused
Application
High voltage, high speed and high power switching
Outline
TO-3P
1. Base
2. Collector
(Flange)
3. Emitter
1
2
3
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
Collector to base voltage
VCBO
900
V
Collector to emitter voltage
VCEO
800
V
Emitter to base voltage
VEBO
7
V
Collector current
IC
5
A
Collector peak current
IC(peak)
10
A
Base current
IB
2.5
A
80
W
1
Collector power dissipation
PC*
Junction temperature
Tj
150
°C
Storage temperature
Tstg
–55 to +150
°C
Note:
1. Value at TC = 25°C.
2SC3322
Electrical Characteristics (Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Collector to emitter sustain
voltage
VCEO(sus)
800
—
—
V
IC = 0.2 A, RBE = ∞, L = 100
mH
VCEX(sus)
800
—
—
V
IC = 4 A, IB1 = 1.5 A, IB2 = –0.8
A, VBE = –5.0 V, L = 180 µH,
Clamped
Emitter to base breakdown
voltage
V(BR)EBO
7
—
—
V
IE = 10 mA, IC = 0
Collector cutoff current
ICBO
—
—
100
µA
VCB = 750 V, IE = 0
ICEO
—
—
100
µA
VCE = 650 V, RBE = ∞
hFE1
15
—
—
DC current transfer ratio
VCE = 5 V, IC = 0.5 A*
hFE2
7
—
—
Collector to emitter saturation
voltage
VCE(sat)
—
—
1.0
V
Base to emitter saturation
voltage
VBE(sat)
—
—
1.5
V
Turn on time
ton
—
—
1.0
µs
Storage time
tstg
—
—
3.0
µs
Fall time
tf
—
—
1.0
µs
Note:
2
1. Pulse test
VCE = 5 V, IC = 3 A*
1
1
IC = 1.5 A, IB = 0.3 A*
1
IC = 3 A, IB1 = 0.6 A,
IB2 = –1.5 A, VCC ≅ 250 V
2SC3322
Maximum Collector Dissipation Curve
Collector power dissipation Pc (W)
120
80
40
0
50
100
Case Temperature TC (°C)
150
Area of Safe Operation
Collector Current IC (A)
µs
25 0 µs s
µ
s
5
0
m
s
25
10
m
1
=
on
ati
PW
er )
Op 5°C
DC = 2
(T C
10 i
C (peak)
IC (max)
1.0
0.1
0.01
Ta = 25°C, 1 Shot Pulse
0.001
1
3
10
30
100 300 1,000
Collector to emitter Voltage VCE (V)
Collector Current Derating Rate
Collector Current derating rate (%)
100
IS
/B
80
Lim
it A
re
a
60
40
20
0
50
100
Case temperature TC (°C)
150
Transient Thermal Resistance
Thermal resistance θj-c (°C/W)
10
3
1.0
s–10
10 m
s
0.3
0.1
10
10
µs–
ms
0.03
0.01
0.01
0.1
0.01
0.1
1.0
10 (s)
1.0
10 (ms)
Time t
3
2SC3322
Reverse Bias Area of Safe Operation
10
600 V, 10 A
Collector Current IC (A)
8
6
4
800 V, 4 A
2
850 V, 1.5 A
IB2 = –0.8 A
0
0
200
400
600
800 1,000
Collector to emitter Voltage VCE (V)
Collector to emitter voltage V (BR)CER (V)
Collector to Emitter Voltage
vs. Base to Emitter Resistance
1.000
IC = 1 mA
900
800
700
100
1k
10 k
100 k
1M
Base to emitter resistance RBE (Ω)
Typical Output Characteristics
Collector Current IC (A)
5
4
3
2
1.0 A
0.8 A
0.6 A
0.4 A
0.2 A
0.1 A
1
0.05 A
IB = 0
0
TC = 25°C
1
2
3
4
5
Collector to emitter Voltage VCE (V)
Typical Transfer Characteristics
5
Collector Current IC (A)
TC = 25°C
VCE = 5 V
4
3
2
1
0
4
0.4
0.8
1.2
1.6
2.0
Base to emitter voltage VBE (V)
2SC3322
DC Current Transfer Ratio vs.
Collector Current
DC current transfer ratio hFE
100
50
75°C
25°C
20
C
T C = –25°
10
5
2
VCE = 5 V
1
0.01 0.03 0.1 0.3
1.0
3
Collector current IC (A)
10
Collector to emitter saturation voltage
VCE (V)
Collector to Emitter Saturation
Voltage vs. Base Current
10
TC = 25°C
3
2.5 A
1.0
1.5 A
0.3
0.1
IC = 0.5 A
0.03
0.01
0.01 0.03
0.1 0.3
1.0
3
Base current IB (A)
10
Collector to emitter saturation voltage
VCE (sat) (V)
Base to emitter saturation voltage
VBE (sat) (V)
Saturation Voltage vs. Collector Current
10
3
1.0
VBE (sat)
0.3
0.1
0.03
VCE (sat)
TC = 25°C
l C = 5 lB
0.01
0.01 0.03 0.1 0.3
1.0
3
10
Collector current IC (A)
5
2SC3322
Switching Time vs. Collector Current
10
tstg
Switching time t (µs)
3
1.0
tf
0.3
ton
0.1
0.03
IC = 5 IB1 = –2 IB2
~ 250 V
VCC =
0.01
0.01 0.03 0.1 0.3
1.0
3
10
Collector current IC (A)
Switching Time vs. Case Temperature
5
Switching time t (µs)
tstg
2
1.0
tf
0.5
ton
0.2
IC = 3 A
IB1 = 0.6 A, IB2 = –1.5 A
~ 250 V
VCC =
0.1
0.05
0
6
25
50
75
100
Case temperature TC (°C)
125
2SC3322
When using this document, keep the following in mind:
1. This document may, wholly or partially, be subject to change without notice.
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part
of this document without Hitachi’s permission.
3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any
other reasons during operation of the user’s unit according to this document.
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and
performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any
intellectual property claims or other problems that may result from applications based on the
examples described herein.
5. No license is granted by implication or otherwise under any patents or other rights of any third party
or Hitachi, Ltd.
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company.
Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are
requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL
APPLICATIONS.
Hitachi, Ltd.
Semiconductor & IC Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan
Tel: Tokyo (03) 3270-2111
Fax: (03) 3270-5109
For further information write to:
Hitachi America, Ltd.
Semiconductor & IC Div.
2000 Sierra Point Parkway
Brisbane, CA. 94005-1835
USA
Tel: 415-589-8300
Fax: 415-583-4207
Hitachi Europe GmbH
Electronic Components Group
Continental Europe
Dornacher Straße 3
D-85622 Feldkirchen
München
Tel: 089-9 91 80-0
Fax: 089-9 29 30 00
Hitachi Europe Ltd.
Electronic Components Div.
Northern Europe Headquarters
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA
United Kingdom
Tel: 0628-585000
Fax: 0628-778322
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 0104
Tel: 535-2100
Fax: 535-1533
Hitachi Asia (Hong Kong) Ltd.
Unit 706, North Tower,
World Finance Centre,
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon
Hong Kong
Tel: 27359218
Fax: 27306071
7