TS TSC2008 ® C2 007 www.ti.com ...................................................................................................................................................................................................... SBAS406 – JUNE 2008 1.2V to 3.6V, 12-Bit, Nanopower, 4-Wire Micro TOUCH SCREEN CONTROLLER with SPI™ FEATURES APPLICATIONS • • • • • • • • • 1 • • • • • • • • • • • • 4-Wire Touch Screen Interface Single 1.2V to 3.6V Supply/Reference Ratiometric Conversion Effective Throughput Rate: – Up to 20kHz (8 Bit) or 10kHz (12 Bit) Preprocessing to Reduce Bus Activity SPI Interface Simple, Command-Based User Interface: – TSC2046 Compatible – 8- or 12-Bit Resolution On-Chip Temperature Measurement Touch Pressure Measurement Digital Buffered PENIRQ On-Chip, Programmable PENIRQ Pullup Auto Power-Down Control Low Power: – 32.4µA at 1.2V, Fast Mode, 8.2kHz Eq Rate – 43.8µA at 1.8V, Fast Mode, 8.2kHz Eq Rate – 58.4µA at 2.7V, Fast Mode, 8.2kHz Eq Rate Software Reset Enhanced ESD Protection: – ±8kV HBM – ±1kV CDM – Target ±25kV Air Gap Discharge – Target ±15kV Contact Discharge 1.5 x 2 WCSP-12 and 4 x 4 QFN-16 Packages Cellular Phones PDA, GPS, and Media Players Portable Instruments Point-of-Sale Terminals Multiscreen Touch Control DESCRIPTION The TSC2008 is a very low-power touch screen controller designed to work with power-sensitive, handheld applications that are based on advanced low-voltage processors. It works with a supply voltage as low as 1.2V, which can be supplied by a single-cell battery. It contains a complete, ultra-low power, 12-bit, analog-to-digital (A/D) resistive touch screen converter, including drivers and the control logic to measure touch pressure. In addition to these standard features, the TSC2008 offers preprocessing of the touch screen measurements to reduce bus loading, thus reducing the consumption of host processor resources that can then be redirected to more critical functions. The TSC2008 supports an SPI serial bus and data transmission protocol in all three defined modes: standard, fast, and high-speed. It offers programmable resolution of 8 or 12 bits to accommodate different screen sizes and performance needs. The TSC2008 is available in a 12-lead, (1,555 ±0,055mm) x (2,055 ±0,055mm) 3 x 4 array, wafer chip-scale package (WCSP), and a 16-pin, 4 x 4 QFN package. The TSC2008 is characterized for the –40°C to +85°C industrial temperature range. U.S. Patent No. 6246394; other patents pending. VDD/REF X+ XY+ Y- Touch Screen Drivers Interface Mux SAR ADC TEMP AUX Internal Clock Preprocessing PENIRQ SPI Serial Interface and Control CS SCLK SDI SDO GND 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SPI is a trademark of Motorola Inc. All other trademarks are the property of their respective owners. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2008, Texas Instruments Incorporated PRODUCT PREVIEW 23 TSC2008 SBAS406 – JUNE 2008 ...................................................................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PRODUCT TYPICAL INTEGRAL LINEARITY (LSB) TSC2008I (1) ±1.5 TYPICAL GAIN ERROR (LSB) NO MISSING CODES RESOLUTION (BITS) –0.2/+4.4 PACKAGE TYPE PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING 16-Pin, 4x4 QFN RGV –40°C to +85°C TSC2008I 12-Pin, 3 x 4 Matrix, 1.5 x 2 WCSP YZG ORDERING NUMBER TSC2008RGVT Small Tape and Reel, 250 TSC2008RGVR Tape and Reel, 25000 TSC2008IYZGT Small Tape and Reel, 250 TSC2008IYZGR Tape and Reel, 3000 11 –40°C to +85°C TRANSPORT MEDIA, QUANTITY TSC2008I For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see the TI website at www.ti.com. PRODUCT PREVIEW ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). PARAMETER TSC2008 UNIT Analog input X+, Y+, AUX to GND –0.4 to VDD + 0.1 V Analog input X–, Y– to GND –0.4 to VDD + 0.1 V –0.3 to +5 V Digital input voltage to GND –0.3 to VDD + 0.3 V Digital output voltage to GND –0.3 to VDD + 0.3 V Power dissipation (TJ Max - TA)/θJA Voltage Voltage range VDD to GND QFN package Thermal impedance, θJA WCSP Low-K High-K 47 °C/W 113 °C/W 62 °C/W Operating free-air temperature range, TA –40 to +85 °C Storage temperature range, TSTG –65 to +150 °C Junction temperature, TJ Max Lead temperature (1) 2 +150 °C Vapor phase (60 sec) +215 °C Infrared (15 sec) +220 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TSC2008 TSC2008 www.ti.com ...................................................................................................................................................................................................... SBAS406 – JUNE 2008 ELECTRICAL CHARACTERISTICS At TA = –40°C to +85°C, VDD = +1.2V to +3.6V, unless otherwise noted. TSC2008 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT AUXILIARY ANALOG INPUT Input voltage range 0 Input capacitance VDD 12 Input leakage current –1 V pF +1 µA 12 Bits A/D CONVERTER Resolution Programmable: 8 or 12 bits No missing codes 12-bit resolution 11 Integral linearity Bits LSB (1) ±1.5 Offset error Gain error VDD = 1.8V –0.8 to +0.3 LSB VDD = 3.0V +3.2 to +8.9 LSB VDD = 1.8V –0.2 to 0 LSB VDD = 3.0V +3.8 to +4.4 LSB TA = +25°C, VDD = 1.8V, command '1011' set '0000' 51 kΩ TA = +25°C, VDD = 1.8V, command '1011' set '0001' 90 kΩ Y+, X+ 6 Ω Y–, X– 5 Ω PENIRQ pull-up resistor, RIRQ Switch on-resistance Switch drivers drive current (2) 100ms duration 50 PRODUCT PREVIEW TOUCH SENSORS mA INTERNAL TEMPERATURE SENSOR Temperature range –40 +85 °C VDD = 3V 1.6 °C/LSB VDD = 1.6V 1.6 °C/LSB VDD = 3V 0.3 °C/LSB VDD = 1.6V 0.3 °C/LSB VDD = 3V ±2 °C/LSB VDD = 1.6V ±2 °C/LSB VDD = 3V ±3 °C/LSB VDD = 1.6V ±3 °C/LSB VDD = 1.2V 3.19 MHz VDD = 1.8V 3.66 MHz VDD = 2.7V 3.78 MHz VDD = 3.6V 3.82 MHz VDD = 1.2V 1.6 MHz VDD = 1.8V 1.83 MHz VDD = 2.7V 1.88 MHz VDD = 3.6V 1.91 MHz VDD = 1.6V 0.0056 %/°C VDD = 3.0V 0.012 %/°C Differential method (3) Resolution TEMP1 (4) Differential method (3) Accuracy TEMP1 (4) INTERNAL OSCILLATOR 8-Bit Internal clock frequency, fCCLK 12-Bit Frequency drift (1) (2) (3) (4) LSB means least significant bit. With VDD (REF) = +2.5V, 1LSB is 610µV. Assured by design, but not production tested. Exceeding 50mA source current may result in device degradation. Difference between TEMP1 and TEMP2 measurement; no calibration necessary. Temperature drift is –2.1mV/°C. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TSC2008 3 TSC2008 SBAS406 – JUNE 2008 ...................................................................................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS (continued) At TA = –40°C to +85°C, VDD = +1.2V to +3.6V, unless otherwise noted. TSC2008 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DIGITAL INPUT/OUTPUT Logic family CMOS VIH VIL Logic level 1.2V ≤ VDD < 1.6V 0.7 × VDD VDD + 0.3 V 1.6V ≤ VDD ≤ 3.6V 0.7 × VDD VDD + 0.3 V 1.2V ≤ VDD < 1.6V –0.3 0.2 × VDD V 1.6V ≤ VDD ≤ 3.6V –0.3 0.3 × VDD V –1 1 µA IIL CS, SCLK, and SDI pins CIN CS, SCLK, and SDI pins 10 pF VOH IOH = 2 TTL loads VDD – 0.2 VDD V VOL IOL = 2 TTL loads 0 0.2 V ILEAK Floating output –1 1 µA COUT Floating output 10 pF Data format Straight Binary POWER SUPPLY REQUIREMENTS Power-supply voltage PRODUCT PREVIEW VDD Specified performance VDD = 1.2V Quiescent supply current (VDD with sensor off) 12-bit fSCLK = 10MHz, fADC = 1MHz, PD[1:0] = 0,0 VDD = 1.8V VDD = 2.7V Power-down supply current 4 1.2 3.6 V 190 µA 32.4 48 µA 165 240 µA 8.2k eq rate 43.8 60 µA 36.4k eq rate 226.2 335 µA 8.2k eq rate 63.4 84 µA 0 0.8 µA 36.4k eq rate 128 8.2k eq rate 36.4k eq rate CS = 1, SDI = SCLK = 1, PD[1:0] = 0,0 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TSC2008 PACKAGE OPTION ADDENDUM www.ti.com 23-Jun-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TSC2008IRGVR PREVIEW QFN RGV 16 2500 TBD Call TI Call TI TSC2008IRGVT PREVIEW QFN RGV 16 250 TBD Call TI Call TI TSC2008IYZGR PREVIEW DSBGA YZG 12 3000 TBD Call TI Call TI TSC2008IYZGT PREVIEW DSBGA YZG 12 250 TBD Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 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