2SK2586 Silicon N-Channel MOS FET ADE-208-358 C 4th. Edition Application High speed power switching Features • • • • Low on-resistance R DS(on) = 7 m typ. High speed switching 4 V gate drive device can be driven from 5 V source Outline TO-3P D 1 G 2 S 3 1. Gate 2. Drain (Flange) 3. Source 2SK2586 Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Drain to source voltage VDSS 60 V Gate to source voltage VGSS ±20 V 60 A 240 A 60 A 45 A 174 mJ Drain current Drain peak current Body to drain diode reverse drain current Avalanche current Avalanche energy ID* 2 I D(pulse)* I DR* 2 I AP * 3 EAR* 3 2 1 Channel dissipation Pch* 125 W Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1 % 2. Value at Tc = 25°C 3. Value at Tch = 25°C, Rg ≥ 50 Ω 2 2SK2586 Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test Conditions Drain to source breakdown voltage V(BR)DSS 60 — — V I D = 10 mA, VGS = 0 Gate to source breakdown voltage V(BR)GSS ±20 — — V I G = ±100 µA, VDS = 0 Gate to source leak current I GSS — — ±10 µA VGS = ±16 V, VDS = 0 Zero gate voltage drain current I DSS — — 100 µA VDS = 60 V, VGS = 0 Gate to source cutoff voltage VGS(off) 1.0 — 2.0 V I D = 1 mA, VDS = 10 V Static drain to source on state resistance RDS(on) — 7 10 mΩ I D = 30 A VGS = 10 V*1 — 10 16 mΩ I D = 30 A VGS = 4 V*1 Forward transfer admittance |yfs| 35 60 — S I D = 30 A VDS = 10 V*1 Input capacitance Ciss — 3550 — pF VDS = 10 V Output capacitance Coss — 1760 — pF VGS = 0 Reverse transfer capacitance Crss — 500 — pF f = 1 MHz Turn-on delay time t d(on) — 35 — ns I D = 30 A Rise time tr — 260 — ns VGS = 10 V Turn-off delay time t d(off) — 480 — ns RL = 1.0 Ω Fall time tf — 370 — ns Body to drain diode forward voltage VDF — 0.94 — V I F = 60 A, VGS = 0 Body to drain diode reverse recovery time t rr — 140 — ns I F = 60 A, VGS = 0 diF / dt = 50 A / µs Note: 1. Pulse Test See characteristic curves of 2SK2529. 3 2SK2586 Power vs. Temperature Derating I D (A) 500 100 PW 50 20 10 µs m m s (1 sh ot ) c (T = ) °C 25 Operation in this area is limited by R DS(on) µs s n 5 = tio ra 10 1 pe 50 0 O 100 10 10 200 Drain Current 150 Maximum Safe Operation Area C D Channel Dissipation Pch (W) 200 2 1 0 50 100 Case Temperature 150 Ta = 25 °C 0.5 3 30 0.1 0.3 1 10 100 Drain to Source Voltage V DS (V) 200 Tc (°C) Normalized Transient Thermal Impedance vs. Pulse Width Normalized Transient Thermal Impedance γ s (t) 3 Tc = 25°C 1 D=1 0.5 0.3 0.1 0.03 0.01 10 µ 0.2 θ ch – c(t) = γ s (t) • θ ch – c θ ch – c = 1.0 °C/W, Tc = 25 °C 0.1 0.05 PDM 0.02 1 lse 0.0 t pu ho 1s 100 µ PW T PW T 1m 10 m Pulse Width 4 D= 100 m PW (S) 1 10 15.6 ± 0.3 1.5 0.3 19.9 ± 0.2 2.0 14.9 ± 0.2 0.5 1.0 φ3.2 ± 0.2 5.0 ± 0.3 Unit: mm 4.8 ± 0.2 1.6 2.0 1.4 Max 18.0 ± 0.5 2.8 1.0 ± 0.2 3.6 5.45 ± 0.5 0.6 ± 0.2 0.9 1.0 5.45 ± 0.5 Hitachi Code JEDEC EIAJ Weight (reference value) TO-3P — Conforms 5.0 g Cautions 1. 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