HD74HCT564/HD74HCT574 Octal D-type Flip-Flops (with 3-state outputs) ADE-205-560 (Z) 1st. Edition Sep. 2000 Description These devices are positive edge triggered flip-flops. The difference between HD74HCT564 and HD74HCT574 is only that the former has inverting outputs and the latter has non-inverting outputs. Data at the D inputs, meeting the set-up and hold time requirements, are transferred to the Q or Q outputs on positive going transitions of the clock (CK) input. When a high logic level is applied to the output control (OC) input, all outputs go to a high impedance state, regardless of what signals are present at the other inputs and the state of the storage elements. Features • • • • • • LSTTL Output Logic Level Compatibility as well as CMOS Output Compatibility High Speed Operation: tpd (D to Q, Q) = 15 ns typ (CL = 50 pF) High Output Current: Fanout of 15 LSTTL Loads Wide Operating Voltage: VCC = 4.5 to 5.5 V Low Input Current: 1 µA max Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C) Function Table Outputs Output Control Clock Data HD74HCT564 HD74HCT574 L H L H L L H L L L X Q0 Q0 H X X Z Z HD74HCT564/HD74HCT574 Pin Arrangement HD74HCT564 Output Control 1 20 VCC OE 1D 2 2D 3 OE OE OE OE OE OE D OE D Q 13 7Q 12 8Q Q 11 Clock GND 10 (Top view) 2 15 5Q 14 6Q Q 7D 8 8D 9 Q D D 17 3Q 16 4Q Q 5D 6 6D 7 Q D D 19 1Q 18 2Q Q D 3D 4 4D 5 Q D HD74HCT564/HD74HCT574 HD74HCT574 Output Control 1 20 VCC OE 1D 2 2D 3 D OE D OE D OE D OE D OE D 15 5Q 14 6Q Q 7D 8 8D 9 Q OE D 17 3Q 16 4Q Q 5D 6 6D 7 Q OE D 19 1Q 18 2Q Q 3D 4 4D 5 Q Q 13 7Q 12 8Q Q 11 Clock GND 10 (Top view) 3 HD74HCT564/HD74HCT574 Block Diagram HD74HCT564 CLK OC 4 1D D C Q C 1Q 2D D C Q C 2Q 3D D C Q C 3Q 4D D C Q C 4Q 5D D C Q C 5Q 6D D C Q C 6Q 7D D C Q C 7Q 8D D C Q C 8Q HD74HCT564/HD74HCT574 HD74HCT574 1D D C Q C 1Q 2D D C Q C 2Q 3D D C Q C 3Q 4D D C Q C 4Q 5D D C Q C 5Q 6D D C Q C 6Q 7D D C Q C 7Q 8D D C Q C 8Q CLK OC Absolute Maximum Ratings Item Symbol Rating Unit Supply voltage range VCC –0.5 to +7.0 V Input voltage VIN –0.5 to VCC + 0.5 V Output voltage VOUT –0.5 to VCC + 0.5 V DC current drain per pin I OUT ±35 mA DC current drain per VCC, GND I CC, I GND ±75 mA DC input diode current I IK ±20 mA DC output diode current I OK ±20 mA Power dissipation per package PT 500 mW Storage temperature Tstg –65 to +150 °C 5 HD74HCT564/HD74HCT574 DC Characteristics Ta = –40 to +85°C Ta = 25°C Test Conditions Item Symbol Min Typ Max Min Max Unit VCC (V) Input voltage VIH 2.0 — — — V 4.5 to 5.5 VIL — — 0.8 — 0.8 V 4.5 to 5.5 VOH 4.4 — — 4.4 — V 4.5 Vin = VIH or VIL I OH = –20 µA 4.18 — — 4.13 — 4.5 I OH = –6 mA — — 0.1 — 0.1 — — 0.26 — 0.33 Output voltage VOL 2.0 V 4.5 Vin = VIH or VIL I OL = 20 µA 4.5 I OL = 6 mA Off-state output current I OZ — — ±0.5 — ±5.0 µA 5.5 Vin = VIH or VIL, Vout = VCC or GND Input current Iin — — ±0.1 — ±1.0 µA 5.5 Vin = VCC or GND Quiescent current I CC — — 4.0 — 40 µA 5.5 Vin = VCC or GND, Iout = 0 µA AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = –40 to +85°C Ta = 25°C Test Conditions Item Symbol Min Typ Max Min Max Unit VCC (V) Maximum clock frequency f max — — 30 — 24 ns 4.5 Propagation delay t PLH — 14 31 — 39 ns 4.5 time t PHL — 15 31 — 39 Output enable t ZL — 16 30 — 38 time t ZH — 16 30 — 38 Output disable t LZ — 15 30 — 38 time t HZ — 18 30 — 38 Setup time t su 20 3 — 25 — ns 4.5 Hold time th 5 –2 — 5 — ns 4.5 Pulse width tw 16 7 — 20 — ns 4.5 Output rise/fall t TLH — 4 12 — 15 ns 4.5 time t THL — 4 12 — 15 Input capacitance Cin — 5 10 — 10 6 4.5 ns 4.5 4.5 ns 4.5 4.5 4.5 pF — HD74HCT564/HD74HCT574 Package Dimensions Unit: mm 24.50 25.40 Max 1 7.00 Max 11 6.30 20 10 1.30 2.54 ± 0.25 0.48 ± 0.10 0.51 Min 1.27 Max 7.62 2.54 Min 5.08 Max 0.89 + 0.11 0.25 – 0.05 0° – 15° Hitachi Code JEDEC EIAJ Mass (reference value) DP-20N — Conforms 1.26 g Unit: mm 12.6 13 Max 11 1 10 1.27 *0.42 ± 0.08 0.40 ± 0.06 0.10 ± 0.10 0.80 Max *0.22 ± 0.05 0.20 ± 0.04 2.20 Max 5.5 20 0.20 7.80 +– 0.30 1.15 0° – 8° 0.70 ± 0.20 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Mass (reference value) FP-20DA — Conforms 0.31 g 7 HD74HCT564/HD74HCT574 Unit: mm 12.8 13.2 Max 11 1 10 0.20 ± 0.10 0.935 Max *0.27 ± 0.05 0.25 ± 0.04 2.65 Max 7.50 20 1.27 *0.42 ± 0.08 0.40 ± 0.06 0.25 10.40 +– 0.40 1.45 0° – 8° 0.57 0.70 +– 0.30 0.15 0.12 M Hitachi Code JEDEC EIAJ Mass (reference value) *Dimension including the plating thickness Base material dimension FP-20DB Conforms — 0.52 g Unit: mm 6.50 6.80 Max 11 1 10 4.40 20 0.65 *0.22+0.08 –0.07 0.20 ± 0.06 1.0 0.13 M 6.40 ± 0.20 *Dimension including the plating thickness Base material dimension 8 0.07 +0.03 –0.04 0.10 *0.17 ± 0.05 0.15 ± 0.04 1.10 Max 0.65 Max 0° – 8° 0.50 ± 0.10 Hitachi Code JEDEC EIAJ Mass (reference value) TTP-20DA — — 0.07 g HD74HCT564/HD74HCT574 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. 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