HITACHI HL6738MG

HL6738MG
Visible High Power Laser Diode
ADE-208-601B (Z)
3rd Edition
May 1998
Description
The HL6738MG is a 0.68 µm band AlGaInP laser diode (LD) with a multi-quantum well (MQW) structure.
It is suitable as a light source for large capacity optical disc memories and various other types of optical
equipment.
Hermetic sealing of the small package (φ 5.6 mm) assures high reliability.
Application
• Optical disc memories
• Optical equipment
Features
•
•
•
•
High output power
Visible light output
Small package
Low astigmatism
: 35 mW (CW)
: λp = 680 to 695 nm
: φ 5.6 mm
: 6 µm Typ (PO = 5 mW)
Package Type
• HL6738MG: MG
Internal Circuit
1
3
PD
LD
2
HL6738MG
Absolute Maximum Ratings (TC = 25°C)
Item
Symbol
Value
Unit
Optical output power
PO
35
mW
Pulse optical output power
PO (pulse)
50 *
mW
Laser diode reverse voltage
VR
2
V
Photo diode reverse voltage
VR (PD)
30
V
Operating temperature
Topr
–10 to +70
°C
Storage temperature
Tstg
–40 to +85
°C
(LD)
Note: Pulse condition : Pulse width = 100 ns, duty = 50%
Optical and Electrical Characteristics (TC = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Optical output power
PO
35
—
—
mW
Kink free *
Pluse optical output power
PO(pulse)
50
—
—
mW
Kink free *
Threshold current
Ith
30
45
70
mA
—
Operating voltage
VOP
2.1
2.5
2.8
V
PO = 30 mW
Slope efficiency
ηs
0.5
0.7
0.9
mW/mA
18(mW) / (I(24mW) – I (6mW))
Lasing wavelength
λp
680
690
695
nm
PO = 30 mW
Beam divergence parallel
θ//
7
8.5
10.5
deg.
PO = 30 mW
Beam divergence
parpendicular to the junction
θ⊥
17
19
23
deg.
PO = 30 mW
Monitor current
IS
0.02
0.1
0.45
mA
PO = 30 mW, VR (PD) = 5 V
Asitgmatism
AS
—
6
—
µm
PO = 5 mW, NA = 0.55
to the junction
Note: Kink free is confirmed at the temperature of 25°C.
2
HL6738FM
Curve Characteristics
Monitor Current IS (mA)
Optical Output Power PO (mW)
Optical Output Power vs. Forward Current
50
TC = 25°C
TC = 60°C
TC = 0°C
TC = 70°C
40
30
20
10
0
0
40
80
120
160
Monitor Current vs. Optical Output Power
0.5
VR (PD) = 5V
TC = 25°C
0.4
0.3
0.2
0.1
0
200
0
30
40
50
Threshold Current vs. Case Temperature
100
Slope Efficiency vs. Case Temperature
Threshold Current Ith (mA)
1.0
Slope Efficiency ηS (mW/mA)
20
Optical Output Power PO (mW)
Forward Current IF (mA)
0.8
0.6
0.4
0.2
0
10
0
10
20
30
40
50
60
70
Case Temperature TC (°C)
80
10
0
10
20
30
40 50
60
70
80
Case Temperature TC (°C)
3
HL6738MG
Lasing Wavelength vs. Case Temperature
Monitor Current vs. Case Temperature
705
PO = 30mW
VR (PD) = 5V
0.8
0.6
0.4
0.2
0
0
PO = 30mW
Lasing Wavelength λp (nm)
Monitor Current IS (mA)
1.0
10 20 30 40 50 60
700
695
690
685
680
70 80
0
Case Temperature TC (°C)
Polarization Ratio vs. Optical Output Power
1000
TC = 25°C
NA = 0.55
800
PO = 30mW
Polarization Ratio
Relative Intensity
80
Case Temperature TC (°C)
Lasing Spectrum
TC = 25°C
10 20 30 40 50 60 70
PO = 20mW
PO = 10mW
600
400
200
PO = 5mW
0
685
690
Lasing Wavelength λp (nm)
4
695
0
10
20
30
40
Optical Output Power PO (mW)
50
HL6738FM
Astigmatism vs. Optical Output Power
Far Field Pattern
10
1.0
TC = 25°C
NA = 0.55
Relative Intensity
0.8
Perpendicular
0.6
0.4
Parallel
Astigmatism AS (µm)
PO = 30mW
TC = 25°C
0.2
0
−40 −30 −20 −10 0
8
6
4
2
0
10 20 30 40
0
10
20
30
Angle θ (deg)
Frequency Response
Forward
N = 10pcs
judgement
∆IO ≤ 10%
Gain (dB)
Survival Rate (%)
80
10M
100M
Frequency (Hz)
50
Electrostatic Destruction (MILstandard)
100
3dB/div PO = 3mW
1M
40
Optical Output Power PO (mW)
1G 3G
60
40
20
0
0
1
2
3
4
Applied Voltage (kV)
5
HL6738MG
Characteristics Distribution
1000
1000
Min : 40.2
Max: 57.9
Typ : 45.8
N : 1400pcs
800
800
N (pcs)
N (pcs)
600
400
600
400
200
200
0
30
40
50
60
70
0
70
80
1000
800
Min : 0.560
Max : 0.848
Typ : 0.712
N : 1400pcs
100
110
120
600
400
Po=30mW
VR(PD)=5V
800
N (pcs)
N (pcs)
90
1000
18mW
I(24mW)−I(6mW)
Min : 0.049
Max : 0.178
Typ : 0.118
N : 1400pcs
600
400
200
200
0.6
0.7
0.8
0.9
Slope Efficiency ηs (mW/mA)
6
80
Operating Current IOP (mA)
Threshold Current Ith (mA)
0
0.5
Min : 80.1
Max: 105.0
Typ : 88.0
N : 1400pcs
PO = 30mW
1.0
0
0
0.1
0.2
0.3
0.4
Monitor Current IS (mA)
0.5
HL6738FM
1000
1000
PO = 30mW
PO = 30mW
800
Min : 7.6
Max : 9.9
Typ : 8.4
N : 1400pcs
600
400
400
200
200
0
Min : 18.0
Max : 21.7
Typ : 18.8
N : 1400pcs
600
N (pcs)
N (pcs)
800
7
8
9
10
11
0
16
12
18
Parallel θ// (deg)
24
26
1000
PO = 30mW
800
Min : 2.36
Max : 2.74
Typ : 2.50
N : 1400pcs
600
PO = 30mW
800
N (pcs)
N (pcs)
22
Perpendicular θ⊥ (deg)
1000
400
200
0
20
600
Min : 684.8
Max: 694.0
Typ : 691.5
N : 1400pcs
400
200
2
2.2
2.4
2.6
2.8
Operating Voltage VOP (V)
3
0
680
690
700
Lasing Wavelength λp (nm)
7
HL6738MG
Package Dimensions
Unit: mm
0.4 +0.1
−0
φ 5.6 +0
−0.025
1.0 ± 0.1
(90°)
(0.4)
0.25
φ 4.1 ± 0.3
φ 3.55 ± 0.1
Glass
2.3 ± 0.2
φ 1.6 ± 0.2
1.27
6.5 ± 1.0
1.2 ± 0.1
Emitting Point
3 − φ 0.45 ± 0.1
1
1
2
3
3
2
φ 2.0 ± 0.2
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
8
LD/MG


0.3 g
HL6738FM
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & IC Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111
Fax: (03) 3270-5109
For further information write to:
Hitachi Semiconductor
(America) Inc.
2000 Sierra Point Parkway
Brisbane, CA. 94005-1897
USA
Tel: 800-285-1601
Fax:303-297-0447
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Continental Europe
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D-85622 Feldkirchen
München
Tel: 089-9 91 80-0
Fax: 089-9 29 30-00
Hitachi Asia (Hong Kong) Ltd.
Hitachi Asia Pte. Ltd.
Hitachi Europe Ltd.
16 Collyer Quay #20-00 Unit 706, North Tower,
Electronic Components Div.
World Finance Centre,
Northern Europe Headquarters Hitachi Tower
Harbour City, Canton Road
Singapore 049318
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Tel: 01628-585000
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Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan.
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