HMC129 v02.0802 MICROWAVE CORPORATION GaAs MMIC DOUBLE-BALANCED MIXER, 4 - 8 GHz Typical Applications Features The HMC129 is ideal for: Conversion Loss: 7 dB • Microwave & VSAT Radios LO to RF and IF Isolation: 40 dB • Test Equipment Input IP3: +17 dBm • Military EW, ECM, C3I Small Size, No DC Bias Required • Space Telecom Functional Diagram General Description The HMC129 chip is a miniature double-balanced mixer which can be used as an upconverter or downconverter in the 4 to 8 GHz band. The chip can be integrated directly into hybrid MICs without DC bias or external baluns to provide an extremely compact mixer. It is ideally suited for applications where small size, no DC bias, and consistent IC performance are required. This mixer can operate over a wide LO drive input of +9 to +15 dBm. It performs equally well as a Bi-Phase modulator or demodulator. See the HMC136 data sheet. MIXERS - CHIP 5 Electrical Specifications, TA = +25° C, LO Drive = +15 dBm Parameter Min. Typ. Max. Frequency Range, RF & LO 4.0 - 8.0 GHz Frequency Range, IF DC - 3.0 GHz Conversion Loss 7 9 dB Noise Figure (SSB) 7 9 dB LO to RF Isolation 30 40 dB LO to IF Isolation 35 42 dB IP3 (Input) 13 17 dBm IP2 (Input) 40 55 dBm 1 dB Gain Compression (Input) 6 10 dBm * Unless otherwise noted, all measurements performed as downconverter, IF = 100 MHz 5-8 Units For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com HMC129 v02.0802 MICROWAVE CORPORATION GaAs MMIC DOUBLE-BALANCED MIXER, 4 - 8 GHz Conversion Gain vs. Temperature LO = +15 dBm Isolation @ LO = +15 dBm 0 0 ISOLATION (dB) -10 + 25 C + 85 C - 55 C -15 -20 RF/IF LO/RF -30 LO/IF -40 -50 -20 -60 2 3 4 5 6 7 8 9 10 2 3 4 FREQUENCY (GHz) 5 6 7 FREQUENCY (GHz) 8 9 10 8 9 10 8 9 10 Return Loss @ LO = +15 dBm Conversion Gain vs. LO Drive 0 0 RETURN LOSS (dB) CONVERSION GAIN (dB) LO RETURN LOSS RF RETURN LOSS -5 -10 + 9 dBm + 11 dBm + 13 dBm + 15 dBm -15 -5 -10 -15 -20 -20 2 3 4 5 6 7 8 9 2 10 3 4 FREQUENCY (GHz) 0 -5 -5 CONVERSION GAIN (dB) 0 -10 IF RETURN LOSS IF BANDWIDTH -15 5 6 7 FREQUENCY (GHz) Unconverter Performance Conversion Gain vs. LO Drive IF Bandwidth @ LO = +15 dBm RESPONSE (dB) 5 MIXERS - CHIP CONVERSION GAIN (dB) -10 -5 -10 + 9 dBm + 11 dBm + 13 dBm + 15 dBm -15 -20 -20 0 0.5 1 1.5 2 2.5 FREQUENCY (GHz) 3 3.5 4 2 3 4 5 6 7 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 5-9 HMC129 v02.0802 MICROWAVE CORPORATION GaAs MMIC DOUBLE-BALANCED MIXER, 4 - 8 GHz Input IP3 vs. Temperature @ LO = +15 dBm Input IP3 vs. LO Drive 30 30 INPUT IP3 (dBM) INPUT IP3 (dBm) + 11 dBM + 13 dBm + 15 dBm 25 20 20 10 10 2 3 4 5 6 7 8 9 2 10 3 4 5 7 8 9 10 8 9 10 Input IP2 vs. Temperature @ LO = +15 dBm Input IP2 vs. LO Drive 80 70 70 INPUT IP2 (dBm) 80 60 50 40 60 50 40 + 25 C + 11 dBm + 13 dBm + 15 dBm 30 6 FREQUENCY (GHz) FREQUENCY (GHz) INPUT IP2 (dBm) MIXERS - CHIP + 85 C - 55 C 15 15 5 + 25 C 25 + 85 C 30 - 55 C 20 20 2 3 4 5 6 7 8 9 10 2 3 4 5 6 7 FREQUENCY (GHz) FREQUENCY (GHz) Input P1dB vs. Temperature @ LO = +15 dBm 15 INPUT P1dB (dBm) 14 + 25 C + 85 C - 55 C 13 12 11 10 9 8 2 3 4 5 6 7 8 9 10 FREQUENCY (GHz) 5 - 10 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com MICROWAVE CORPORATION HMC129 v02.0802 GaAs MMIC DOUBLE-BALANCED MIXER, 4 - 8 GHz MxN Spurious @ IF Port Harmonics of LO nLO nLO Spur @ RF Port mRF 0 1 2 3 4 LO Freq. (GHz) 1 2 3 4 0 xx 13.66 26.83 9.16 38.33 4 -30.7 -33.5 -32.7 -56.7 1 8.16 0 31.33 49.33 43.5 5 -29.2 -57.3 -64.8 -43.8 2 78.5 80.16 75.16 79.16 76.66 6 -24.7 -41.8 -35.0 -43.0 3 76.0 80.0 81.16 64.5 78.66 7 -19.7 -42.5 -20.5 -45.7 4 73.83 77.83 80.0 81.83 82.0 8 -23.3 -45.7 -22.5 -46.8 9 -17.2 -36.8 -26.7 -68.7 RF Freq. = 6.1 GHz @ -10 dBm LO Freq. = 6.0 GHz @ +13 dBm Measured as downconverter 5 Absolute Maximum Ratings LO Drive +27 dBm Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com MIXERS - CHIP LO = +13 dBm All values in dBc below input LO level measured at RF port 5 - 11 MICROWAVE CORPORATION HMC129 v02.0802 GaAs MMIC DOUBLE-BALANCED MIXER, 4 - 8 GHz Outline Drawing NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. BOND PADS ARE .004” SQUARE 3. TYPICAL BOND PAD SPACING CENTER TO CENTER IS .006” EXCEPT AS SHOWN 4. DIE THICKNESS = .004” [.100 MM] 5. BACKSIDE METALIZATION: GOLD 6. BACKSIDE METAL IS GROUND 7. BOND PAD METALIZATION: GOLD MIXERS - CHIP 5 5 - 12 Pad Descriptions Pad Number Function Description 1 IF This pin is DC coupled. For applications not requiring operation to DC, this port should be DC blocked externally using a series capacitor whose value has been chosen to pass the necessary IF frequency range. For operation to DC this pin must not source or sink more than 2mA of current or die nonfunction and possible die failure will result. 2 RF This pin is DC coupled and matched to 50 Ohm from 4 to 8 GHz. 3 LO This pin is DC coupled and matched to 50 Ohm from 4 to 8 GHz. GND The backside of the die must connect to RF ground. Interface Schematic For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com MICROWAVE CORPORATION v02.0802 HMC129 GaAs MMIC DOUBLE-BALANCED MIXER, 4 - 8 GHz Assembly Diagram Handling Precautions MIXERS - CHIP 5 Follow these precautions to avoid permanent damage. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils). For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 5 - 13