HT1613C Timer with Dialer Interface Patent Number: 84545 (R.O.C.) Patent Pending: 08/214, 079 (U.S.A.) Features · Operating voltage: 1.2V~1.7V · Uses 32768Hz crystal · Low operating current: 3mA (typ.) · Two-button sequential operation for real time clock setting · Dialing number and conversation time display · Pad options · Conversation timer (59 mins and 59 secs max.) - Real time (RT) - Auto change to timer mode (ACT) - Extension phone number display (EPN) · 8 or 10-digit LCD display driver; 3V, 1/2 bias, 1/3 duty (8 digit hand-held calculator LCD used for 8-digit application) · Blinking cursor waits for dialing number · Real time clock with stopwatch · Last call time display · Built-in dialer interface · 12-hour or 24-hour format Applications · Timers, clocks and watches · Telephone display interface · LCD display drivers · Instrument display General Description The HT1613C is a CMOS chip designed for dialer interfaces driving 8 or 10 digit LCDs. Various functions, such as real time clock, dialing number and conversation time display are provided. taken. The HT1613C receives dialing data from the dialer and displays the phone number on the LCD from left to right each time a phone call is made. By adding a TIMER key, the HT1613C can provide the stopwatch and timer reset/hold functions. Refer to the functional description for details. The HT1613C can display the real time or be blank by default. When answering a telephone call, the timer is activated to tell users how long the conversation has Block Diagram IN T C O M 1 X 1 X 2 T 1 T im e B a s e C o m m o n C ir c u it C O M 2 C O M 3 T 2 V o lta g e D o u b le r T im e r D I S K S 2 S h ift R e g is te r S ta te C o n tro l V C S E G 1 S e g m e n t L a tc h & S e le c t T IM E R S 1 V B D e c o d e r & M U X R E S 1 2 /2 4 V A S c a n C K T C o n tro l C ir c u it S E G 3 0 H K A C T R T Rev. 1.10 E P N 1 August 17, 2001 HT1613C Pad Assignment S E G 2 1 S E G 2 0 S E G 1 9 S E G 1 8 S E G 1 7 S E G 1 6 S E G 1 5 C O M 2 S E G 2 2 3 S E G 2 3 S E G 3 0 S E G 2 4 2 S E G 2 5 S E G 2 9 S E G 2 6 1 S E G 2 7 S E G 2 8 5 4 5 3 5 2 5 1 5 0 4 9 4 8 4 7 4 6 4 5 4 4 4 3 4 2 4 H K 5 S 2 6 (0 ,0 ) 4 1 S E G 1 4 4 0 S E G 1 3 3 9 S E G 1 2 3 8 S E G 1 1 3 7 S E G 1 0 3 6 S E G 9 3 5 S E G 8 3 4 S E G 7 3 3 S E G 6 S E G 5 IN T 1 1 2 8 S E G 1 T IM E R 1 2 2 7 C O M 3 1 2 /2 4 1 3 2 6 C O M 1 S 1 1 4 2 5 R T 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4 V D D S E G 2 V C T 1 2 9 V B S E G 3 1 0 V A 3 0 R E S 9 E P N S E G 4 T 2 A C T 3 1 V S S 8 S K 7 X 1 D I X 2 3 2 Chip size: 128 ´ 141 (mil)2 * The IC substrate should be connected to VDD in the PCB layout artwork. Pad Coordinates Unit: mil Pad No. X Y Pad No. X Y Pad No. X Y 1 -57.91 45.52 19 -61.96 37 58.10 28.84 2 -57.91 38.59 20 -10.25 2.76 -61.96 38 58.10 36.19 3 -57.91 31.67 21 11.94 -62.50 39 58.10 43.53 4 -57.91 24.79 22 32.97 -62.50 40 58.10 50.87 5 -57.37 16.98 23 39.86 -62.50 41 58.10 58.22 6 -57.37 2.91 24 46.74 -62.50 42 37.26 63.04 63.04 7 -57.91 -8.60 25 58.10 -62.46 43 29.91 8 -57.91 -15.53 26 58.10 -55.04 44 22.57 63.04 9 -57.91 -22.49 27 58.10 -48.16 45 15.23 63.04 10 -57.91 -29.38 28 58.10 -36.30 46 7.88 63.04 11 -57.91 -36.26 29 58.10 -28.95 47 0.54 63.04 12 -57.91 -45.82 30 58.10 -21.61 48 -6.81 63.04 13 -57.91 -54.20 31 58.10 -15.22 49 -14.15 63.04 14 -57.91 -62.50 32 58.10 -7.88 50 -21.50 63.04 15 -47.20 -62.50 33 58.10 -28.84 63.04 -33.43 -62.50 34 58.10 -0.54 6.81 51 16 52 -36.18 63.04 -62.46 35 58.10 14.15 53 -43.53 63.04 -62.50 36 58.10 21.50 54 -50.87 63.04 17 18 Rev. 1.10 -22.80 -16.37 2 August 17, 2001 HT1613C Pad Description Pad Name I/O Internal Connection SEG1~SEG30 O CMOS OUT LCD segment signal output pads COM1~COM3 O CMOS OUT LCD common signal output pads I CMOS IN Pull-high HK Description Hook switch detector input Active low X1 I X2 O T1 I CMOS IN Pull-high Test pad (connected to VSS for production test) T2 I CMOS IN Pull-high Test pad (connected to VSS for production test) INT O NMOS OUT TIMER I CMOS IN Pull-low Timer reset and start/hold toggle control input pad 12/24 I CMOS IN Pull-low 12-hour or 24-hour format option pad, connected to VDD for 12-hour format S1 I CMOS IN Pull-low Clock setting switch Active high S2 I CMOS IN Pull-low Clock adjusting switch Active high DI I CMOS IN Pull-high Serial data input pad (connected to the dialer) Data should be valid at the falling edge of SK SK I CMOS IN Pull-high Clock input pad (connected to the dialer) RES I CMOS IN Pull-high System initialization pin (active low) The pull-high resistance is 200kW typ. RT I CMOS LATCH IN Pull-low Real time selection pin VDD: With real time mode Floating: Without real time mode EPN I CMOS LATCH IN Pull-high Extension phone number display selection pin VSS: Without extension phone number display Floating: With extension phone number display ACT I CMOS LATCH IN Pull-high In the dialing number display mode, auto change to timer mode selection VSS: Auto change to timer mode Floating: Manual change to timer mode VA O CMOS OUT Voltage doubler, connected to external capacitor VB O CMOS OUT Voltage doubler, connected to external capacitor VC O CMOS OUT Voltage doubler, connected to external capacitor VDD ¾ ¾ Positive power supply VSS ¾ ¾ Negative power supply, ground Rev. 1.10 OSCILLATOR 32768Hz crystal oscillator input 32768Hz crystal oscillator output Interrupt output, 8Hz or 16Hz by mask option 3 August 17, 2001 HT1613C Approximate internal connection circuits C M O S IN P u ll- lo w C M O S IN P u ll- h ig h V N M O S O U T C M O S O U T V D D D D C M O S L A T C H IN P u ll- h ig h P W R O N 1 5 k W C M O S L A T C H IN P u ll- lo w O S C IL L A T O R X 1 1 5 k W P W R O N 1 2 p F X 2 1 0 M W 1 5 p F Absolute Maximum Ratings Supply Voltage ............................................-0.3V to 5V Storage Temperature ............................-50°C to 125°C Input Voltage..............................VSS-0.3V to VDD+0.3V Operating Temperature...........................-20°C to 75°C Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Electrical Characteristics Symbol Parameter fOSC=32768Hz, Ta=25°C Test Conditions VDD Conditions Min. Typ. Max. Unit VDD Operating Voltage ¾ ¾ 1.2 1.5 1.7 V VIL Input Low Voltage 1.2V~1.7V ¾ VSS ¾ 0.2VDD V VIH Input High Voltage 1.2V~1.7V ¾ 0.8VDD ¾ VDD V ISTB Standby Current 1.5V VHK=Floating (or VDD) ¾ 0.1 1 mA IDD Operating Current 1.5V No load ¾ 3 10 mA IOL Output Sink Current of INT 1.5V VO=0.3V 500 1000 ¾ mA tA Data Setup Time 1.5V ¾ 1 ¾ ¾ ms tB Data Hold on Time 1.5V ¾ 2 ¾ ¾ ms tC Inter Digit Time 1.5V ¾ 5 ¾ ¾ ms tDB Debounce Time (HK, S1, S2, TIMER) 1.5V ¾ ¾ 31.25 ¾ ms RHI1 Pull-high Resistance (HK, DI, SK) 1.5V VIN=0V ¾ 1 ¾ MW RHI2 Pull-high Resistance (RES) 1.5V VIN=0V 100 200 400 kW RLO Pull-low Resistance (TIMER, S1, S2, 12/24) 1.5V VIN=1.5V ¾ 5 ¾ MW fOSC System Frequency 1.5V Crystal=32768Hz ¾ 32768 ¾ Hz Rev. 1.10 4 August 17, 2001 HT1613C Functional Description Operational flow chart Power-on N Y RT="1" ? Blank N Real time clock HK="0" ? Y Blinking" TIMER input? N N HK="0" ? Y N Display last timer value HK="0" ? Y N Y N N N Y ACT="0" ? Y TIMER input? Y Display no. Display no. HK="0" ? HK="0" ? Y N Y N Dialing? Dialing? Y N Over 9 secs? " N Y Y TIMER input? TIMER input? Y N N Over 10 secs? Y Reset timer & start counting Display last timer value Keep counting HK="0" ? Y Y N EPN="0" ? Y N N Y Dialing? N TIMER input? HK="0" ? Y Y Dialing? N TIMER input? Y Y Rev. 1.10 EPN="0" ? 5 Y N Display no. N HK="0" ? Y Y TIMER input? N N N Y Hold timer TIMER input? Over 10 secs? N Y N Display no. HK="0" ? Over 9 secs? N N Y N Over 10 secs? Y August 17, 2001 HT1613C On-hook & Off-hook T im e r M o d e R e a l T im e o r B la n k 1 0 2 5 > 9 s e c s 3 7 S 2 D is p la y th e L a s t T im e H o u r O n -h o o k S 1 1 1 S 2 M in u te S 1 2 6 O ff-h o o k < 9 s e c s a n d O ff-h o o k 0 0 0 0 0 0 0 1 0 0 0 2 S 2 B lo c k A (1 ) N o D a ta E n try > 1 0 s e c s (A C T = V S S ) B lo c k B ( 2 ) T IM E R in p u t ( A C T = flo a tin g ) R e c e iv e D ig it( s ) 7 O n -h o o k 7 8 R e c e iv e D a ta ( E P N = flo a tin g ) 7 8 0 B lo c k Note: C Block A shows the switches S1 and S2 that are used for setting and selecting when RT=VDD (Real time mode). S1 and S2 are disabled when RT= floating (Blank mode). Block B illustrates a timer mode when TIMER input ACT= floating or when there¢s no data entry>10 secs (ACT=VSS). Once in the timer mode, the timer resets and starts to count the conversation time (ACT= floating). Block C displays blinking ²¾², after Off-hook, dialing data is received and displayed on the LCD from left to right. Rev. 1.10 6 August 17, 2001 HT1613C Data & Timing · For instrument or mC application · For telephone application The HT1613C is also capable of displaying BCD data generated from instrument or a mC system. The corresponding data and timing is shown in the Data latch timing diagram. Before the data is transmitted to the HT1613C, the HK pin should be pulled-low or continuously kept low. The HT1613C is then ready to receive the data. At the falling edge of the clock the data is shifted in to the IC. After all the data is sent to the HT1613C, the SK pin is set low to avoid switching to the timer mode. The HT1613C is designed to display telephone numbers derived from the HT93XXX series telephone dialers. The corresponding data is illustrated in the following table. D a ta C o d e K e y -In b 3 b 2 b 1 b 0 B la n k 0 0 0 0 1 0 0 0 1 2 0 0 1 0 3 0 0 1 1 4 0 1 0 0 5 0 1 0 1 6 0 1 1 0 7 0 1 1 1 8 1 0 0 0 9 1 0 0 1 0 1 0 1 0 1 1 0 1 1 1 0 0 F 1 0 1 1 P 1 1 1 0 1 1 1 1 * # D is p la y B la n k · Data latch timing tB S K tA D I b 3 b 2 b 1 b 0 b 3 b 2 b 1 b 0 b 1 b 0 tC D ig it 1 Rev. 1.10 D ig it 2 7 D ig it N August 17, 2001 HT1613C Application Circuits For telephone interfacing (with batteries) 8 /1 0 -D ig it L C D C O M 1 C O M S E G 3 1 S E G 3 0 5 4 5 3 5 2 5 1 5 0 4 9 4 8 4 7 4 6 4 5 4 4 4 3 4 1 4 2 4 0 1 3 9 2 3 8 3 3 7 4 H K 3 6 5 S 2 3 5 6 3 2 7 6 8 H z 3 4 H T 1 6 1 3 C 3 3 7 3 2 8 3 1 9 3 0 1 0 2 9 2 8 1 1 T IM E R 1 2 1 2 /2 4 1 3 S 1 C O M 2 1 4 2 7 1 7 1 8 1 6 1 5 1 9 2 0 2 1 2 2 2 3 2 6 2 4 2 5 R T V D D E P N A C T S K D I 0 .1 m F 0 .1 m F + 1 .5 V 4 7 k W 8 0 5 0 3 3 0 k W H F O 3 .5 8 M H z D O C L O C K H F I H D I X 2 H T 9 3 X X X D ia le r H K S 2 7 0 k W X 1 V S S V D D H D I P O 1 N 4 1 4 8 ´ 3 1 0 0 k W 1 0 M W T ip O ff-h o o k O n -h o o k A 9 2 2 2 0 k W 8 0 5 0 1 0 0 k W H F I 0 .0 2 m F 1 A b r id g e 2 .7 k W 4 7 k W 3 3 k W 3 3 0 m F 1 0 V R in g 4 7 k W A 4 2 5 .1 V V S S * The IC substrate should be connected to VDD in the PCB layout artwork. Rev. 1.10 8 August 17, 2001 HT1613C For telephone interfacing (without batteries) 8 /1 0 -D ig it L C D C O M 1 C O M S E G 3 1 S E G 3 0 5 4 5 3 5 2 5 1 5 0 4 9 4 8 4 7 4 6 4 5 4 4 4 3 4 1 4 2 4 0 1 3 9 2 3 8 3 3 7 4 H K 3 6 5 3 5 6 3 2 7 6 8 H z 3 4 H T 1 6 1 3 C 3 3 7 3 2 8 3 1 9 3 0 1 0 2 9 2 8 1 1 T IM E R C O M 2 1 2 1 3 1 4 2 7 1 7 1 8 1 6 1 5 1 9 2 0 2 1 2 2 2 3 2 4 2 6 2 5 V D D E P N A C T S K D I 0 .1 m F 0 .1 m F 4 7 k W 8 0 5 0 3 .5 8 M H z 3 3 0 k W H F O D O H D I 1 0 0 k W V S S V D D H D I 1 N 4 1 4 8 ´ 6 P O 1 0 0 k W 1 0 M W T ip O ff-h o o k O n -h o o k A 9 2 2 2 0 k W 8 0 5 0 X 2 H T 9 3 X X X D ia le r H F I 2 7 0 k W X 1 C L O C K H K S 2 0 k W H F I 1 m F 0 .0 2 m F 1 A b r id g e 2 .7 k W 4 7 k W 3 3 0 m F 1 0 V 3 3 k W 5 .1 V R in g 4 7 k W A 4 2 V S S * The IC substrate should be connected to VDD in the PCB layout artwork. Rev. 1.10 9 August 17, 2001 HT1613C For instrument or mC use 8 /1 0 -D ig it L C D C O M 1 C O M S E G 3 1 S E G 3 0 5 4 5 3 5 2 5 1 5 0 4 9 4 8 4 7 4 6 4 5 4 4 4 3 4 1 4 2 4 0 1 3 9 2 3 8 3 3 7 4 H K 3 6 5 S 2 3 5 6 3 2 7 6 8 H z 3 4 H T 1 6 1 3 C 3 3 7 3 2 8 3 1 9 3 0 1 0 2 9 2 8 1 1 T IM E R 1 2 1 2 /2 4 S 1 C O M 2 1 3 1 4 2 7 1 5 1 9 1 7 1 8 1 6 2 0 2 1 2 2 2 3 2 6 2 4 2 5 R T V D D E P N A C T S K D I 0 .1 m F 0 .1 m F + R 5 V R 1 R H K V D D R 1 R 1 D O 1 .5 V R C L O C K In s tru m e n t o r m C S y s te m V S S * The IC substrate should be connected to VDD in the PCB layout artwork. Note: To drive SK, DI, and HK pin, an open drain NMOS output structure is recommended. To drive SK, DI and HK pin with a CMOS output structure, a voltage divider is needed (R=4.3kW, R1=10kW). Rev. 1.10 10 August 17, 2001 HT1613C LCD Configurations For 8-digit application · Segment electrode side COM COM SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG COM 1 3 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 2 LCD driving system 1/2 bias, 1/3 duty, 3V · Common electrode side COM2 COM1 COM3 · LCD connection SEG Rev. 1.10 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 11 22 23 24 25 26 27 28 29 30 August 17, 2001 HT1613C For 10-digit application · Segment electrode side COM COM SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG SEG COM 29 30 3 3 4 5 6 1 1 7 8 9 10 13 14 15 21 26 27 2 11 12 16 17 18 19 20 22 23 24 25 28 2 LCD driving system 1/2 bias, 1/3 duty, 3V · Common electrode side COM2 COM3 COM1 · LCD connection SEG 1 Rev. 1.10 2 3 4 5 6 7 8 9 10 11 12 13 14 15 12 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 August 17, 2001 HT1613C Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233 Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 43F, SEG Plaza, Shen Nan Zhong Road, Shenzhen, China 518031 Tel: 0755-8346-5589 Fax: 0755-8346-5590 ISDN: 0755-8346-5591 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 010-6641-0030, 6641-7751, 6641-7752 Fax: 010-6641-0125 Holmate Semiconductor, Inc. (North America Sales Office) 46712 Fremont Blvd., Fremont, CA 94538 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com Copyright Ó 2001 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.10 13 August 17, 2001