HT1616C Timer with Dialer Interface Patent Number: 84545 (R.O.C.) Patent Pending: 08/214, 079 (U.S.A.) Features · Operating voltage: 1.2V~1.7V · Stop watch · Low operating current: 4mA typ. · Built-in dialer interface · Dialing number and conversation time display · 12-hour or 24-hour format · Conversation timer (59 mins and 59 secs max.) · Two-button sequential operation for real time clock setting · 12 or 16 digits LCD display driver; 3V, 1/2 bias, 1/3 · Uses 32768Hz crystal duty · Real time clock Applications · Timers, clocks and watches · Telephone display interface · LCD display drivers · Instrument display General Description shown for about 5 seconds and the real time is displayed again. When making a phone call, the HT1616C receives dialing data from the dialer and displays the phone number from left to right on the LCD. However, if there is no dialing action within 10 seconds, it restarts the timer again. By adding a TIMER key, the IC can provide stopwatch and timer reset/hold functions. Refer to the functional description for details. The HT1616C is a CMOS chip designed for dialer interfaces driving 12 or 16-digit LCDs. Various functions, such as real time clock, dialing number and conversation time display are provided. For HT1616C the real time is displayed by default. When answering a telephone call, the timer is activated to tell users how long the conversation has taken. After the telephone is hung up, the total conversation time is Block Diagram IN T X 1 X 2 T 1 T im e B a s e C O M 1 C o m m o n C ir c u it C O M 2 C O M 3 T 2 V o lta g e D o u b le r T im e r D I S K S 2 T IM E R 1 2 /2 4 S 1 S h ift R e g is te r V B V C D e c o d e r & M U X S E G 1 S ta te C o n tro l C o n tro l C ir c u it V A S e g m e n t L a tc h & S e le c t S c a n C K T S E G 4 8 H K R E S Rev. 1.10 1 September 13, 2001 HT1616C Pad Assignment S E G 1 0 S E G 1 1 S E G 1 2 S E G 1 3 S E G 1 4 S E G 1 5 S E G 1 6 S E G 1 7 S E G 1 8 S E G 1 9 S E G 2 0 S E G 2 1 S E G 2 2 S E G 2 3 S E G 2 4 S E G 2 5 S E G 2 6 7 0 6 9 6 8 6 7 6 6 6 5 6 4 6 3 6 2 6 1 6 0 5 9 5 8 5 7 5 6 5 5 5 4 5 3 5 2 5 1 2 3 S E G 4 4 S E G 3 S E G 2 S E G 9 S E G 5 S E G 8 1 S E G 7 S E G 6 5 S E G 1 6 C O M 3 7 C O M 1 8 (0 ,0 ) 5 0 S E G 2 7 4 9 S E G 2 8 4 8 S E G 2 9 4 7 S E G 3 0 4 6 S E G 3 1 4 5 S E G 3 2 4 4 S E G 3 3 4 3 S E G 3 4 H K 9 S 1 1 0 4 2 S E G 3 5 C L R 1 1 4 1 S E G 3 6 1 2 4 0 S E G 3 7 3 9 S E G 3 8 3 8 S E G 3 9 3 7 S E G 4 0 M O D E 1 2 /2 4 1 3 S 2 1 4 D I 1 5 C L K 1 6 3 2 3 3 3 4 3 5 3 6 S E G 4 1 3 1 S E G 4 2 3 0 S E G 4 3 2 9 S E G 4 4 2 8 S E G 4 5 2 7 S E G 4 6 R E S E T 2 6 S E G 4 7 X 2 2 5 S E G 4 8 X 1 2 4 C O M 2 T 2 2 3 V D D T 1 2 2 V C 2 1 V B 2 0 V A 1 9 V S S 1 8 IN T 1 7 Chip size: 140.1 ´ 137.2 (mil)2 * The IC substrate should be connected to VDD in the PCB layout artwork. Pad Coordinates Unit: mil Pad No. X Y Pad No. X Y Pad No. X Y 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 -64.47 -64.47 -64.47 -64.47 -64.47 -64.47 -64.47 -64.47 -64.47 -64.47 -64.47 -64.47 -64.47 -64.47 -64.47 -64.47 -58.69 -52.65 -46.53 -40.41 -33.79 -27.41 -18.80 -12.60 61.01 50.26 44.29 38.33 32.36 26.01 19.55 13.50 -2.03 -8.72 -15.99 -22.68 -29.99 -37.67 -43.99 -50.37 -61.01 -61.01 -61.01 -61.01 -61.01 -61.01 -61.01 -61.01 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 -4.11 4.03 10.00 16.01 22.59 28.63 34.63 40.60 46.57 52.54 58.50 64.47 64.47 64.47 64.47 64.47 64.47 64.47 64.47 64.47 64.47 64.47 64.47 64.47 -61.01 -61.01 -61.01 -61.01 -61.01 -61.01 -61.01 -61.01 -61.01 -61.01 -61.01 -61.01 -40.20 -34.08 -27.58 -21.46 -14.95 -8.84 -2.33 3.79 10.29 16.41 22.91 29.03 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 64.47 64.47 61.60 55.48 48.98 42.86 36.36 30.25 23.73 17.61 11.11 4.99 -1.51 -7.63 -14.13 -20.25 -26.75 -32.88 -39.38 -45.50 -52.00 -58.12 35.53 41.65 61.01 61.01 61.01 61.01 61.01 61.01 61.01 61.01 61.01 61.01 61.01 61.01 61.01 61.01 61.01 61.01 61.01 61.01 61.01 61.01 Rev. 1.10 2 September 13, 2001 HT1616C Pad Description Pad Name I/O Internal Connection SEG1~SEG48 O CMOS OUT LCD segment signal output pads COM1~COM3 O CMOS OUT LCD common signal output pads HK I CMOS IN Pull-high Hook switch detector input S1 I CMOS IN Pull-low Clock setting switch Hour or minute can be selected for S2 adjustment RES I CMOS IN Pull-high System initialization pin, active low The pull-high resistance is 200kW typ. MODE I CMOS IN Pull-low 4 or 5 bits pattern selection pad VDD: 5 bits pattern Floating: 4 bits pattern 12/24 I CMOS IN Pull-low 12-hour or 24-hour format option pad VDD: 12-hour format Floating: 24-hour format S2 I CMOS IN Pull-low Clock adjusting switch Hour or minute digits can be adjusted depending upon the S1 selection DI I CMOS IN Pull-high Serial data input pad Data should be valid at the falling edge of SK (connected to the dialer) SK I CMOS IN Pull-high Clock input pad (connected to the dialer), active low Input data is latched at the falling edge of SK T1 I CMOS IN Pull-high Test pad (connected to VSS for production test) T2 I CMOS IN Pull-high Test pad (connected to VSS for production test) X1 I X2 O OSCILLATOR Description 32768Hz crystal oscillator input 32768Hz crystal oscillator output TIMER I CMOS IN Pull-low INT O NMOS OUT Interrupt output, 16Hz (default) or 2Hz (by mask option) VA O CMOS OUT Voltage doubler, connected to the external capacitor VB O CMOS OUT Voltage doubler, connected to the external capacitor VC O CMOS OUT Voltage doubler, connected to the external capacitor Timer reset-and-start/hold toggle control input pad VDD ¾ ¾ Positive power supply VSS ¾ ¾ Negative power supply, ground Approximate internal connection circuits C M O S IN P u ll- lo w C M O S IN P u ll- h ig h V N M O S O U T V D D O S C IL L A T O R C M O S O U T D D 1 2 p F Rev. 1.10 3 X 2 X 1 1 0 M W 1 5 p F September 13, 2001 HT1616C Absolute Maximum Ratings Supply Voltage ...........................................-0.3V to 5V Storage Temperature ...........................-50°C to 125°C Input Voltage ............................ VSS-0.3V to VDD+0.3V Operating Temperature ..........................-20°C to 75°C Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Electrical Characteristics Symbol Parameter fOSC=32768Hz, Ta=25°C Test Conditions VDD Conditions Min. Typ. Max. Unit V VDD Operating Voltage ¾ ¾ 1.2 1.5 1.7 VIL Input Low Voltage ¾ ¾ VSS ¾ 0.2VDD VIH Input High Voltage ¾ ¾ 0.8VDD ¾ VDD ISTB Standby Current 1.5V VHK=Floating (or VDD) ¾ 0.1 1 mA IDD Operating Current 1.5V No load ¾ 4 10 mA IOL Output Sink Current of INT 1.5V VO=0.3V 500 1000 ¾ mA tA Data Setup Time 1.5V ¾ 1 ¾ ¾ ms tB Data Hold On Time 1.5V ¾ 2 ¾ ¾ ms tC Inter Digit Time 1.5V ¾ 5 ¾ ¾ ms tDB Input Debounce Time (S1, S2, TIMER) 1.5V ¾ 31.25 ¾ ms RHI Pull-high Resistance (HK, DI, SK) 1.5V VIN=0V ¾ 1 ¾ MW RLO Pull-low Resistance (TIMER) 1.5V VTIMER=1.5V ¾ 5 ¾ MW fOSC System Frequency 1.5V Crystal=32768Hz ¾ 32768 ¾ Hz Rev. 1.10 ¾ 4 V September 13, 2001 HT1616C Functional Description Operational flow chart P o w e r-o n R e s e t to 0 0 0 0 H T 1 6 1 6 /H T 1 6 1 6 C : D is p la y r e a l tim e , H T 1 6 1 7 : B L A N K Y T r ig . T IM E R k e y ? R e s e t to 0 0 0 0 & s ta r t tim e r N N H K = "0 " ? K e e p c o u n tin g N N Y T r ig . T IM E R k e y ? R e s e t to 0 0 0 0 & s ta r t tim e r Y H K = "0 " ? T im e r h o ld Y T r ig . T IM E R k e y ? T im e r k e e p s c o u n tin g , d is p la y s tim e r v a lu e Y N N Y D ia lin g d a ta in p u t ? > 5 s e c s ? D is p la y d ia lin g n u m b e r N Y Y R e s e t to 0 0 0 0 & s ta r t tim e r N o d a ta in > 1 0 s ? T r ig . T IM E R k e y ? N N K e e p c o u n tin g Y Y Y T r ig . T IM E R k e y ? H K = "0 " ? N N T r ig . T IM E R N k e y ? Y T im e r s to p s , d is p la y s to ta l c o n v e r s a tio n tim e Y H K = "0 " ? N T im e r h o ld Y O v e r 5 s e c s ? H K = 0 ? T r ig . T IM E R k e y ? N N N Y Y H K = 1 > 5 s e c ? N Y H K = "0 " ? N Y N "H K = 1 " > 5 s e c s ? Y Rev. 1.10 5 September 13, 2001 HT1616C On-hook & Off-hook R e a l T im e 1 0 2 5 T im e r M o d e O ff-h o o k 3 7 S 2 H o u r > 5 s e c s S 1 1 1 S 2 M in u te < 5 s e c s a n d O ff-h o o k S 1 2 6 O n -h o o k D is p la y T im e r 5 - s e c d u r a tio n 0 0 0 0 0 0 0 1 0 0 0 2 S 2 B lo c k A B lo c k B N o D a ta E n try > 1 0 s e c s R e c e iv e D ig it( s ) 7 O n -h o o k R e c e iv e D a ta 7 8 7 8 0 B lo c k Note: C Block A shows the switches S1 and S2 that are used for setting and selecting. Block B illustrates a timer mode when Off-hook; timer resets and starts to count the conversation time. Block C displays blinking ²¾². After Off-hook, dialing data is received and displayed on the LCD from left to right. When the entry interval is over 10 seconds, the timer resets and starts to count. TIMER key function The TIMER key is used to start/stop the timer (toggle). In real time mode, it can perform a stop- watch function. 1 0 1 1 0 0 T r ig . T IM E R 0 0 0 0 0 0 1 2 0 0 T r ig . T IM E R T im e r r e s e t a n d c o u n t L C D d is p la y r e a l tim e T r ig . T IM E R 0 1 2 4 1 2 T r ig . T IM E R T im e r h o ld N o a c tio n fo r o v e r 5 s e c s 0 0 1 2 ( w ith in 5 s e c s ) 0 0 0 0 0 1 2 4 T im e r r e s e t a n d c o u n t 3 6 R e tu rn to re a l tim e c lo c k T im e r h o ld In the conversation timer mode, it can reset or hold the timer. 1 0 1 1 0 0 O ff-h o o k L C D d is p la y r e a l tim e (H K = 0 ) T r ig . T IM E R Rev. 1.10 0 0 0 0 0 0 1 2 1 2 3 4 5 6 7 D ia lin g o u t S h o w d ia lin g n u m b e rs T im e r r e s e t a n d c o u n t 0 0 0 1 0 0 0 1 2 4 T im e r r e s e t a n d c o u n t D ia l fin is h e d 2 4 T r ig . T IM E R 0 0 0 1 2 4 T im e r r e s e t a n d c o u n t 0 0 O n -h o o k fo r T im e r h o ld 6 (a fte r 1 0 s e c s ) 0 0 o v e r 5 s e c s 2 4 3 6 H T 1 6 1 6 C R e tu rn to re a l tim e c lo c k September 13, 2001 HT1616C Data & Timing · For instrument or mc application The HT1616C is also capable of displaying BCD data generated from instrument or a mC system. The corresponding data and timing is shown in the Data Latch Timing diagram. Before the data is transmitted to the HT1616C, the HK pin should be pulled-low or continuously kept low. The HT1616C is then ready to receive the data. At the falling edge of the clock the data is shifted in to the IC. After all the data is sent to the HT1616C, the SK pin is set low to avoid switching to the timer mode. When the MODE pad is connected to ²Low², the data code and display patterns are shown in the following table: · For telephone application The HT1616C is designed to display telephone numbers derived from the HT93XXX series telephone dialer ICs. When the MODE pad is connected to VSS, the corresponding data is illustrated in the following table (MODE=0). D a ta C o d e K e y -In D is p la y b 3 b 2 b 1 b 0 B la n k 0 0 0 0 1 0 0 0 1 2 0 0 1 0 3 0 0 1 1 b 3 b 2 b 1 b 0 4 0 1 0 0 0 0 0 0 5 0 1 0 1 0 0 0 1 6 0 1 1 0 0 0 1 0 7 0 1 1 1 0 0 1 1 8 1 0 0 0 0 1 0 0 9 1 0 0 1 0 1 0 1 0 1 0 1 0 0 1 1 0 1 1 0 1 0 1 1 1 1 1 0 0 1 0 0 0 F 1 0 1 1 1 0 0 1 P 1 1 1 0 1 0 1 0 1 1 1 1 1 1 0 1 1 1 0 0 1 0 1 1 1 1 1 0 1 1 1 1 * # Rev. 1.10 B la n k D a ta C o d e 7 D is p la y B la n k September 13, 2001 HT1616C On the other hand, when MODE pad is connected to ²High² the data code and display patterns are shown in the following table: (MODE=1) (MODE=1) D a ta C o d e b 4 b 3 b 2 b 1 b 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 D a ta C o d e D is p la y b 4 b 3 b 2 b 1 b 0 1 0 0 0 0 1 1 0 0 0 1 1 0 1 0 0 1 0 0 1 1 1 0 0 1 1 0 1 0 0 1 0 1 0 0 0 0 1 0 1 1 0 1 0 1 0 0 1 1 0 1 0 1 1 0 0 0 1 1 1 1 0 1 1 1 0 1 0 0 0 1 1 0 0 0 0 1 0 0 1 1 1 0 0 1 0 1 0 1 0 1 1 0 1 0 0 1 1 0 1 1 1 1 0 1 0 1 1 0 0 1 1 1 0 0 0 1 0 1 1 1 1 0 1 1 0 1 1 1 0 1 1 1 1 0 0 1 1 1 1 1 1 1 1 1 B la n k D is p la y · Data latch timing for 4-bit pattern (MODE=0) tB C L K tA b 3 b 2 b 1 b 0 b 3 b 2 b 1 b 0 b 1 b 0 D I tC D ig it 1 D ig it N D ig it 2 · Data latch timing for 5-bit pattern (MODE=1) tB C L K tA b 4 b 3 b 2 b 1 b 0 b 4 b 3 b 2 b 1 b 0 b 1 b 0 D I tC D ig it 1 Rev. 1.10 D ig it 2 8 D ig it N September 13, 2001 HT1616C Application Circuits For telephone interfacing (with batteries) 1 2 /1 6 -D ig it L C D C O M 1 C O M S E G 3 1 S E G 3 0 1 7 0 6 9 6 8 6 7 6 6 6 5 6 4 6 3 6 2 6 1 6 0 5 9 5 8 5 7 5 6 5 5 5 4 5 3 5 2 2 4 9 4 4 8 5 4 7 6 4 6 7 4 5 8 1 2 /2 4 S 2 D I 4 3 4 2 1 0 4 1 1 1 4 0 1 2 3 9 1 3 3 8 1 4 3 7 1 5 1 9 2 0 2 1 2 2 2 3 T IM E R S K 3 2 7 6 8 H z 2 4 2 5 2 6 2 7 2 8 2 9 3 0 H F O D O X 1 1 N 4 1 4 8 ´ 3 1 0 0 k W 1 0 M W T ip O ff-h o o k O n -h o o k A 9 2 8 0 5 0 1 0 0 k W H F I 4 7 k W 0 .0 2 m F 3 3 0 m F 1 0 V 3 6 P O 2 7 0 k W 2 2 0 k W 3 5 V S S V D D H D I 3 4 X 2 H T 9 3 X X X D ia le r H F I 3 2 3 3 3 .5 8 M H z C L O C K H K S H D I 3 1 0 .1 m F 0 .1 m F 1 .5 V 4 7 k W 3 3 0 k W 4 4 H T 1 6 1 6 C 9 1 6 1 7 1 8 8 0 5 0 5 1 5 0 3 H K S 1 C O M 2 1 A b r id g e R in g 2 .7 k W 3 3 k W 4 7 k W A 4 2 5 .1 V V S S * The IC substrate should be connected to VDD in the PCB layout artwork. Rev. 1.10 9 September 13, 2001 HT1616C For telephone interfacing (without batteries) 1 2 /1 6 -D ig it L C D C O M 1 C O M S E G 3 1 S E G 3 0 1 7 0 6 9 6 8 6 7 6 6 6 5 6 4 6 3 6 2 6 1 6 0 5 9 5 8 5 7 5 6 5 5 5 4 5 3 2 4 9 4 4 8 5 4 7 6 4 6 7 4 5 8 4 4 H T 1 6 1 6 C 4 3 9 4 2 1 0 4 1 1 1 4 0 1 2 3 9 3 8 1 3 3 7 1 4 D I 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 H F O D O C L O C K H D I 3 4 3 5 3 6 X 2 2 2 0 k W P O 1 0 0 k W 2 .7 k W 2 0 k W H F I 4 7 k W 1 m F 0 .0 2 m F V S S V D D 1 N 4 1 4 8 ´ 6 H D I 1 0 0 k W X 1 H T 9 3 X X X D ia le r H F I 8 0 5 0 3 3 3 .5 8 M H z H K S 2 7 0 k W 3 2 0 .1 m F 0 .1 m F 4 7 k W 3 3 0 k W 3 1 T IM E R S K 3 2 7 6 8 H z 8 0 5 0 5 1 5 0 3 H K 5 2 C O M 2 O ff-h o o k 1 0 M W O n -h o o k A 9 2 5 .1 V 1 A b r id g e R in g 4 7 k W 3 3 k W 3 3 0 m F 1 0 V T ip A 4 2 V S S * The IC substrate should be connected to VDD in the PCB layout artwork. Rev. 1.10 10 September 13, 2001 HT1616C For instrument or mC use 1 2 /1 6 -D ig it L C D C O M 1 C O M S E G 3 1 S E G 3 0 1 7 0 6 9 6 8 6 7 6 6 6 5 6 4 6 3 6 2 6 1 6 0 5 9 5 8 5 7 5 6 5 5 5 4 5 3 5 2 2 4 9 4 4 8 5 4 7 6 4 6 7 4 5 8 1 2 /2 4 S 2 D I 5 1 5 0 3 H K S 1 C O M 2 4 4 H T 1 6 1 6 C 4 3 9 4 2 1 0 4 1 1 1 4 0 1 2 3 9 1 3 3 8 1 4 3 7 1 5 1 6 1 7 1 8 1 9 2 0 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 2 3 3 3 4 3 5 3 6 T IM E R S K 3 2 7 6 8 H z 2 1 2 2 0 .1 m F 0 .1 m F + 1 .5 V R 5 V R 1 R H K V D D R 1 R 1 D O R C L O C K In s tru m e n t o r m C S y s te m V S S * The IC substrate should be connected to VDD in the PCB layout artwork. Note: Rev. 1.10 To drive SK, DI and HK , an open drain NMOS output structure is recommended. To drive SK, DI and HK with a CMOS output structure, a voltage divider is needed (R=4.3kW, R1=10kW). 11 September 13, 2001 HT1616C LCD Configurations For 12-digit application · Segment electrode side S E G 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8 LCD driving system 1/2 bias, 1/3 duty, 3V · Common electrode side C O M 2 C O M 1 C O M 3 · LCD connection C O M C O M S E G S E G S E G 1 3 1 3 1 4 1 5 S E G 1 6 S E G S E G C O M 4 7 4 8 2 For 16-digit application · Segment electrode side S E G 1 2 3 4 5 6 7 8 9 1 0 1 1 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8 LCD driving system 1/2 bias, 1/3 duty, 3V · Common electrode side C O M 2 C O M 1 C O M 3 · LCD connection C O M C O M 3 1 S E G 1 Rev. 1.10 S E G S E G 3 2 S E G 4 S E G 5 S E G 4 5 S E G 6 12 S E G S E G 4 7 4 6 S E G 4 8 C O M 2 September 13, 2001 HT1616C Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233 Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 43F, SEG Plaza, Shen Nan Zhong Road, Shenzhen, China 518031 Tel: 0755-8346-5589 Fax: 0755-8346-5590 ISDN: 0755-8346-5591 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 010-6641-0030, 6641-7751, 6641-7752 Fax: 010-6641-0125 Holmate Semiconductor, Inc. (North America Sales Office) 46712 Fremont Blvd., Fremont, CA 94538 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com Copyright Ó 2001 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.10 13 September 13, 2001