SN65ELT20 www.ti.com............................................................................................................................................................................................ SLLS922 – DECEMBER 2008 5-V TTL-to-Differential PECL Translator FEATURES 1 • • • • • 1.25-ns Maximum Propagation Delay Operating Range: VCC = 4.2 V to 5.7 V With GND = 0 V Flow-Through Pinout Enables Easy Layout Built-In Temperature Compensation Drop-In Compatible With MC10ELT20, MC100ELT20 PINOUT ASSIGNMENT D-8, DGK-8 Package (Top View) NC 1 Q 2 8 VCC 7 D TTL APPLICATIONS • • Data and Clock Transmission Over Backplane Signaling Level Conversion for Clock or Data PECL Q 3 6 NC NC 4 5 GND DESCRIPTION The SN65ELT20 is a TTL-to-differential PECL translator. It operates on a 5-V supply and ground only. The output is undetermined when the inputs are left floating. The low output skew makes the device an ideal solution for clock or data signal translation. P0065-04 The SN65ELT20 is housed in an industry-standard SOIC-8 package and is also available in a TSSOP-8 package. Table 1. Pin Description PIN FUNCTION D TTL input Q,Q PECL outputs VCC Positive supply GND Ground ORDERING INFORMATION (1) (1) PART NUMBER PART MARKING PACKAGE LEAD FINISH SN65ELT206D SN65ELT20DGK SN65ELT20 SOIC NiPdAu SN65ELT20 SOIC-TSSOP NiPdAu Leaded device options not initially available; contact a sales representative for further details. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated SN65ELT20 SLLS922 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT Absolute PECL-mode supply voltage PARAMETER VCC (GND = 0 V) CONDITIONS 6 V VIN input voltage GND = 0 V; VI ≤ VCC 6 V Continuous 50 mA Surge 100 mA Operating temperature range –40 to 85 °C Storage temperature range –65 to 150 °C Output current (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. POWER DISSIPATION RATINGS PACKAGE CIRCUIT-BOARD MODEL POWER RATING TA < 25°C (mW) THERMAL RESISTANCE, JUNCTION-TO-AMBIENT, NO AIRFLOW DERATING FACTOR TA > 25°C (mW/°C) POWER RATING TA = 85°C (mW) Low-K 719 139 7 288 High-K 840 119 8 336 Low-K 469 213 5 188 High-K 527 189 5 211 SOIC SOIC-TSSOP THERMAL CHARACTERISTICS PARAMETER θJB Junction-to-board thermal resistance θJC Junction-to-case thermal resistance PACKAGE VALUE SOIC 79 SOIC-TSSOP 120 SOIC 98 SOIC-TSSOP 74 UNIT °C/W °C/W KEY ATTRIBUTES CHARACTERISTIC VALUE SO-8: Level 1 Moisture sensitivity level TSSOP-8: Level 3 Flammability rating (oxygen index: 28 to 34) UL 94 V-0 at 0.125 in ESD—human body model >4 kV ESD—machine model 200 V ESD—charged-device model 2 kV Meets or exceeds JEDEC Spec EIA/JESD78 latchup test 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65ELT20 SN65ELT20 www.ti.com............................................................................................................................................................................................ SLLS922 – DECEMBER 2008 PECL DC CHARACTERISTICS (1) (VCC = 5 V; GND = 0 V) (2) –40°C PARAMETER MIN 25°C TYP MAX 16 TYP MAX 10.7 UNIT Power-supply current 16 mA Output HIGH voltage (3) 3915 3958 4120 3915 3963 4120 3915 3967 4120 mV VOL (3) 3170 3247 3380 3170 3244 3380 3170 3244 3380 mV (2) (3) 10.1 MIN VOH (1) 16 TYP MAX ICC Output LOW voltage 9.6 MIN 85°C The device meets these specifications after thermal equilibrium has been established when mounted in a test socket or printed-circuit board with maintained transverse airflow greater than 500 lfpm (2.54 m/s). Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and are not valid simultaneously. Output parameters vary 1:1 with Vcc. Outputs are terminated through a 50-Ω resistor to VCC – 2 V. TTL INPUT DC CHARACTERISTICS (1) (VCC = 4.2 V to 5.7 V; TA = –40°C to 85°C) PARAMETER IIH TEST CONDITIONS Input HIGH current IIH MIN TYP MAX VIN = 2.7 V 20 VIN = VCC 20 UNIT µA IIL Input LOW current VIN = 0.5 V –0.6 mA VIK Input clamp diode voltage IIN = –18 mA –1.2 V VIH Input HIGH voltage VIL Input LOW voltage (1) 2 V 0.8 V The device meets these specifications after thermal equilibrium has been established when mounted in a test socket or printed-circuit board with maintained transverse airflow greater than 500 lfpm (2.54 m/s). Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and are not valid simultaneously. AC CHARACTERISTICS (1) (VCC = 4.2 V to 5.7 V; GND = 0 V) –40°C PARAMETER MIN fMAX Maximum switching frequency (2) (See Figure 4.) tPLH Propagation delay, 1.5 V to 50% (see Figure 2) 0.9 tPHL Propagation delay, 1.5 V to 50% (see Figure 2) 0.7 tJITTER Random clock jitter (RMS) tr/tf Q-output rise/fall times (20%–80%) (see Figure 3) (1) (2) 25°C TYP MAX MIN 400 MIN 430 1.25 0.9 1.2 0.7 0.5 1 85°C TYP MAX 1 MAX 430 1.25 0.9 1.2 0.7 0.5 1.5 TYP MHz 1.25 ns 1.2 ns 0.5 1.5 1 UNIT ps 1.5 ns The device meets these specifications after thermal equilibrium has been established when mounted in a test socket or printed-circuit board with maintained transverse airflow greater than 500 lfpm (2.54 m/s). Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and are not valid simultaneously. Maximum switching frequency is measured at an output amplitude of 300 mVPP. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65ELT20 3 SN65ELT20 SLLS922 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com Typical Termination for Output Driver ZO = 50 W P P Driver Receiver ZO = 50 W N N 50 W 50 W VTT VTT = VCC – 2 V S0078-02 Figure 1. Typical Termination for Output Driver 1.5 V 1.5 V IN OUT OUT tPLH tPHL T0405-01 Figure 2. Output Propagation Delay 80% 20% tr tf T0402-01 Figure 3. Output Rise and Fall Times 4 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65ELT20 SN65ELT20 www.ti.com............................................................................................................................................................................................ SLLS922 – DECEMBER 2008 OUTPUT AMPLITUDE vs FREQUENCY 1000 900 Output Amplitude − mV 800 700 TA = 25°C 600 TA = 85°C 500 400 300 TA = −40°C 200 VCC = 4.2 V GND = 0 V Vswing = 0.8 V−2 V 100 0 0 100 200 300 400 500 f − Frequency − MHz G001 Figure 4. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65ELT20 5 PACKAGE OPTION ADDENDUM www.ti.com 2-Jan-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65ELT20D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65ELT20DGK ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65ELT20DGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65ELT20DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Dec-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN65ELT20DR Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 6.4 5.2 2.1 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Dec-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN65ELT20DR SOIC D 8 2500 346.0 346.0 29.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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