TI SN65EPT21DGK

SN65EPT21
www.ti.com
SLLS970 – NOVEMBER 2009
3.3-V Differential PECL/LVDS to TTL Translator
Check for Samples: SN65EPT21
FEATURES
1
•
•
•
•
•
•
1 ns Propagation Delay
Fmax > 300MHz
Operating Range: VCC = 3.0 V to 3.6 V with
GND = 0 V
24-mA TTL Output
Built-In Temperature Compensation
Drop-In Compatible to the MC10EPT21,
MC100EPT21
PIN ASSIGNMENT(Add pullup on BOTH
inputs)
D or DGK PACKAGE
(TOP VIEW)
+
NC
1
2
7
Q
6
NC
5
GND
+
Data and Clock Transmission Over Backplane
Signaling Level Conversion for Clock or Data
D
VBB
The SN65EPT21 is a differential PECL-to-TTL
translator. It operates on +3.3 V supply and ground
only. The device includes circuitry to maintain inputs
at Vcc/2 when left open.
The VBB pin is a reference voltage output for the
device. When the device is used in single-ended
mode, the unused input should be tied to VBB. This
reference voltage can also be used to bias the input
when it is ac coupled. When it is used, place a
0.01μF decoupling capacitor between VCC and VBB.
Also limit the sink/source current to < 0.5 mA to VBB.
Leave VBB open when it is not used.
3
LVPECL
DESCRIPTION
4
Table 1. Pin Descriptions
PIN
FUNCTION
Q
LVTTL/LVCMOS Output
D, D
Differential LVPECL/LVDS/CML Input
VCC
Positive Supply
VBB
Output Reference Voltage
GND
Ground
NC
No Connect
EP
(DFN8 only) Thermal exposed pad must be
connected to a sufficient thermal conduit.
Electrically connect to the most negative supply
(GND) or leave unconnected, floating open.
The SN65EPT21 is housed in an industry standard
SOIC-8 package and is also available in an optional
TSSOP-8 package.
ORDERING INFORMATION (1)
(1)
VCC
LVTTL
D
APPLICATIONS
•
•
8
+
PART NUMBER
PART MARKING
PACKAGE
LEAD FINISH
SN65EPT21D/DR
SN65EPT21DGK/DGKR
EPT21
SOIC
NiPdAu
SSSI
MSOP
NiPdAu
Leaded device options are not initially available; contact a sales representative for further details.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
SN65EPT21
SLLS970 – NOVEMBER 2009
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS (1)
PARAMETER
CONDITIONS
Absolute PECL mode supply voltage
VALUE
UNIT
3.8
V
±0.5
mA
VCC (GND = 0 V)
Sink/source current, VBB
GND = 0 V, VI ≤ VCC
PECL input voltage
0 to 3.8
V
Operating temperature range
–40 to 85
°C
Storage temperature range
–65 to 150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
PACKAGE
CIRCUIT BOARD
MODEL
POWER RATING
TA < 25°C
(mW)
THERMAL RESISTANCE,
JUNCTION-TO-AMBIENT
NO AIRFLOW
DERATING FACTOR
TA > 25°C
(mW/°C)
POWER RATING
TA = 85°C
(mW)
SOIC
MSOP
Low-K
719
139
7
288
High-K
840
119
8
336
Low-K
469
213
5
188
High-K
527
189
5
211
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
θJB
Junction-to-board thermal resistance
θJC
Junction-to-case thermal resistance
MIN
TYP
SOIC
79
MSOP
120
SOIC
98
MSOP
74
MAX
UNIT
°C/W
°C/W
KEY ATTRIBUTES
CHARACTERISTICS
VALUE
Internal input pull-down resistor
50 kΩ
Internal input pull-up resistor
50 kΩ
Moisture sensitivity level
Level 1
Flammability rating (oxygen index: 28 to 34)
Electrostatic discharge
UL 94 V-0 at 0.125 in
Human body model
Charged-device model
Machine mode
2 kV
2 kV
200 V
Meets or exceeds JEDEC Spec EIA/JESD78 latchup test
2
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): SN65EPT21
SN65EPT21
www.ti.com
SLLS970 – NOVEMBER 2009
PECL DC CHARACTERISTICS
At VCC = 3.3 V, GND = 0.0 V (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
(2)
TA = –40°C
MIN
TA = 25°C
TYP MAX
MIN
TA = 85°C
TYP MAX
MIN
TYP
MAX
UNIT
VIH
High-level input voltage,
single-ended
2075
2420 2075
2420 2075
2420
mV
VIL
Low-leveI input voltage,
single-ended
1355
1675 1355
1675 1355
1675
mV
VBB
Output reference voltage
2160
mV
VIHCM
R
High-level input voltage,
common-mode range,
differential
IIH
High-level input current
IIL
Low-level input current
(1)
(2)
(3)
1910
See
(3)
2009 2160 1910 2034 2160 1910
1.2
3.3
1.2
3.3
150
-150
2026
1.2
150
-150
3.3
V
150
μA
μA
-150
The device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board
with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously.
Input parameters vary 1:1 with VCC.
VIHCMR(min) varies 1:1 with GND, VIHCMR(max) varies 1:1 with VCC. VIHCMR range is referenced to the most positive side of the differential
input signal
TTL DC CHARACTERISTICS
At VCC = 3.3 V, GND = 0.0, TA = –40°C to 85°C (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
ICCH
Power supply current
Output is HIGH
ICCL
Power supply current
Output is LOW
VOH
High-level output voltage
IOH = –3.0 mA
VOL
Low-level output voltage
IOL = 24 mA
IOS
Output short circuit current
(1)
MIN
TYP
MAX
5
9
20
mA
8
7.5
26
mA
2.4
3.05
–180
UNIT
V
0.32
0.5
V
–100
–80
mA
The device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board
with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously.
AC CHARACTERISTICS
At VCC = 3.0 V to 3.6 V, GND = 0.0 V (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
(2)
TA = –40°C
MIN
TA = 25°C
TYP MAX
300
MIN
TA = 85°C
TYP MAX
TYP MAX
Maximum switching
frequency
(Figure 1–Figure 3)
tPLH
Propagation delay
At 1.5 V
1000
1394 1800
1000 1444 1800 1000
1481 1800
ps
tPHL
Propagation delay
At 1.5 V
1000
1140 1900
1000 1280 1900 1000
1421 1900
ps
tJITTER
Random clock jitter (RMS)
tSKEW
Duty Cycle Skew (3)
Part-to-Part Skew
VPP
Input swing
See
tr/tf
Output rise/fall times
Q, Q (0.8V - 2.0V))
(2)
(3)
(4)
5
3.2
5
3.4
5
ps
94
250
78
250
62
250
ps
500
(4)
150
250
MHz
2.25
(3)
tSKPP
300
UNIT
fMAX
(1)
300
MIN
500
500
1200
150
900
250
500
1200
150
900
250
500
500
ps
1200
mV
900
ps
The device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating
temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are
applied individually under normal operating conditions and not valid simultaneously.
RL = 500 Ω to GND and CL = 20 pF to GND. See Figure 4. Measured with 750mV, 50% duty cycle clock source
Skews are measured between outputs under identical transitions
VPP(min) is minimum input swing for which ac parameters are assured.
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Product Folder Link(s): SN65EPT21
3
SN65EPT21
SLLS970 – NOVEMBER 2009
www.ti.com
5
VCC = 3 V
Voltage - V
4
VOH @ -40°C
VOH @ 25°C
3
2
VOH @ 85°C
VOL @ -40°C
1
VOL @ 25°C
VOL @ 85°C
0
0
50
100 150 200 250 300 350 400 450 500
f - Frequency - MHz
Figure 1. Maximum Switching Frequency VCC= 3.0 V
5
VCC = 3.3 V
4
Voltage - V
VOH @ 85°C
VOH @ 25°C
3
VOH @ -40°C
2
VOL @ -40°C
1
VOL @ 25°C
VOL @ 85°C
0
0
50
100 150 200 250 300 350 400 450 500
f - Frequency - MHz
Figure 2. Maximum Switching Frequency VCC= 3.3 V
4
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Product Folder Link(s): SN65EPT21
SN65EPT21
www.ti.com
SLLS970 – NOVEMBER 2009
5
VCC = 3.6 V
4
Voltage - V
VOH @ -40°C
VOH @ 85°C
VOH @ 25°C
3
2
VOL @ 25°C
VOL @ 85°C
1
VOL @ -40°C
0
0
50
100 150 200 250 300 350 400 450 500
f - Frequency - MHz
Figure 3. Maximum Switching Frequency VCC= 3.6 V
TTL Output
CL Includes Test
Fixture Capacitance
CL
RL
AC Test Load
GND
Figure 4. TTL Output AC Test Loading Condition
IN
IN
1.5 V
1.5 V
OUT
tPLH
tPHL
Figure 5. Output Propagation Delay
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): SN65EPT21
5
SN65EPT21
SLLS970 – NOVEMBER 2009
www.ti.com
90%
10%
tr
tf
Figure 6. Output Rise and Fall Times
6
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): SN65EPT21
PACKAGE OPTION ADDENDUM
www.ti.com
16-Apr-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65EPT21D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65EPT21DGK
ACTIVE
MSOP
DGK
8
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65EPT21DGKR
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65EPT21DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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