TXB0106 www.ti.com ......................................................................................................................................................................................... SCES709 – SEPTEMBER 2008 6-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO-DIRECTION SENSING AND ±15-kV ESD PROTECTION FEATURES 1 • A2 A3 A4 A5 A6 OE 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 B1 VCCB B2 B3 B4 B5 B6 GND RGY PACKAGE (TOP VIEW) VCCA 2 B1 • A1 VCCA 1 16 15 VCCB 14 B2 13 B3 12 B4 A2 3 A3 4 A4 5 A5 6 11 B5 A6 7 10 B6 Exposed Center Pad 8 9 GND • • • PW PACKAGE (TOP VIEW) A1 • 1.2 V to 3.6 V on A Port and 1.65 to 5.5 V on B Port (VCCA≤ VCCB) VCC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State OE Input Circuit Referenced to VCCA Low Power Consumption, 4-µA Max ICC Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – A Port – 2500-V Human-Body Model (A114-B) – 150-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) – B Port – ±15-kV Human-Body Model (A114-B) – 150-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) OE • The exposed center pad, if used, must be connected as a secondary ground or left electrically open. DESCRIPTION/ORDERING INFORMATION This 6-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. The TXB0106 is designed so that the OE input circuit is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated TXB0106 SCES709 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING QFN – RGY Reel of 1000 TXB0106RGYR YE06 TSSOP – PW Reel of 2000 TXB0106PWR YE06 Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. PIN DESCRIPTION NO. NAME 1 A1 FUNCTION 2 VCCA 3 A2 Input/output 2. Referenced to VCCA. 4 A3 Input/output 3. Referenced to VCCA. 5 A4 Input/output 4. Referenced to VCCA. 6 A5 Input/output 5. Referenced to VCCA. 7 A6 Input/output 6. Referenced to VCCA. 8 OE Output enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA. Input/output 1. Referenced to VCCA. A-port supply voltage. 1.2 V ≤ VCCA≤ 3.6 V, VCCA≤ VCCB. 9 GND 10 B6 Ground Input/output 6. Referenced to VCCB. 11 B5 Input/output 5. Referenced to VCCB. 12 B4 Input/output 4. Referenced to VCCB. 13 B3 Input/output 3. Referenced to VCCB. 14 B2 Input/output 2. Referenced to VCCB. 15 VCCB 16 B1 B-port supply voltage. 1.65 V ≤ VCCB ≤ 5.5 V. Input/output 1. Referenced to VCCB. TYPICAL OPERATING CIRCUIT 1.8 V 3.3 V VCCA VCCB OE TXB0106 2 1.8 -V System Controller A1 A2 B1 B2 3.3-V System Data A3 A4 A5 A6 B3 B4 B5 B6 Data Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0106 TXB0106 www.ti.com ......................................................................................................................................................................................... SCES709 – SEPTEMBER 2008 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCCA Supply voltage range –0.5 4.6 V VCCB Supply voltage range –0.5 6.5 V (2) –0.5 6.5 V –0.5 6.5 V VI Input voltage range VO Voltage range applied to any output in the high-impedance or power-off state (2) A inputs –0.5 VCCA + 0.5 B inputs –0.5 VCCB + 0.5 UNIT VO Voltage range applied to any output in the high or low state (2) (3) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCCA, VCCB, or GND JA Package thermal impedance Tstg Storage temperature range (1) (2) (3) (4) (5) PW package (4) 83 RGY package (5) 37 –65 V °C/W 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCCA and VCCB are provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. RECOMMENDED OPERATING CONDITIONS (1) (2) VCCA VCCA VCCB Supply voltage VIH High-level input voltage VIL Low-level input voltage Δt/Δv Input transition rise or fall rate TA Operating free-air temperature (1) (2) (3) VCCB Data inputs OE 1.2 V to 3.6 V Data inputs 1.2 V to 5.5 V OE 1.2 V to 3.6 V A-port inputs 1.2 V to 3.6 V B-port inputs 1.2 V to 3.6 V 1.65 V to 5.5 V 1.65 V to 5.5 V MIN MAX 1.2 3.6 1.65 5.5 VCCI× 0.65 (3) VCCI VCCA× 0.65 5.5 0 VCCI× 0.35 (3) 0 VCCA× 0.35 1.65 V to 5.5 V 40 1.65 V to 3.6 V 40 4.5 V to 5.5 V UNIT V V V ns/V 30 –40 85 °C The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND. VCCA must be less than or equal to VCCB and must not exceed 3.6 V. VCCI is the supply voltage associated with the input port. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0106 3 TXB0106 SCES709 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS (1) (2) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCCA TA = 25°C VCCB MIN 1.2 V IOH = –20 µA VOLA IOL = 20 µA VOHB IOH = –20 µA 1.65 V to 5.5 V VOLB IOL = 20 µA 1.65 V to 5.5 V IOZ 1.4 V to 3.6 V 0.4 VCCB– 0.4 V V µA ±2 A port 0V 0 V to 5.5 V ±1 ±2 B port 0 V to 3.6 V 0V ±1 ±2 1.2 V to 3.6 V 1.65 V to 5.5 V ±1 ±2 OE = GND VI = VCCI or GND, IO = 0 1.4 V to 3.6 V 0V 5.5 V 2 ICCA + ICCB VI = VCCI or GND, IO = 0 1.2 V ICCZA VI = VCCI or GND, IO = 0, OE = GND ICCZB VI = VCCI or GND, IO = 0, OE = GND 0V 0V 5.5 V 1.4 V to 3.6 V 1.4 V to 3.6 V µA µA 2 3.5 1.65 V to 5.5 V 10 0.05 1.65 V to 5.5 V 5 1.2 V 1.2 V to 3.6 V B port 5 –2 1.2 V 1.4 V to 3.6 V µA 3.4 1.65 V to 5.5 V 3.6 V 1.2 V to 3.6 V A port 5 2 ICCB OE 1.65 V to 5.5 V 0V 1.2 V µA 0.06 3.6 V 1.4 V to 3.6 V V 0.4 ±1 VI = VCCI or GND, IO = 0 (1) (2) 0.9 1.65 V to 5.5 V A or B port UNIT V 1.2 V to 3.6 V ICCA Cio MAX VCCA– 0.4 1.2 V 1.2 V CI MIN 1.4 V to 3.6 V OE Ioff –40°C to 85°C MAX 1.1 VOHA II TYP 3.3 1.65 V to 5.5 V 5 1.65 V to 5.5 V 1.65 V to 5.5 V 5 5.5 5 6.5 8 10 µA µA µA pF pF VCCI is the supply voltage associated with the input port. VCCO is the supply voltage associated with the output port. TIMING REQUIREMENTS TA = 25°C, VCCA = 1.2 V Data rate tw Pulse duration Data inputs VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V TYP TYP TYP TYP 20 20 20 20 Mbps 50 50 50 50 ns UNIT TIMING REQUIREMENTS over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted) VCCB = 1.8 V ± 0.15 V MIN Data rate tw 4 Pulse duration MAX VCCB = 2.5 V ± 0.2 V MIN 50 Data inputs 20 Submit Documentation Feedback VCCB = 3.3 V ± 0.3 V MAX MIN 50 20 MAX VCCB = 5 V ± 0.5 V MIN 50 20 50 20 UNIT MAX Mbps ns Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0106 TXB0106 www.ti.com ......................................................................................................................................................................................... SCES709 – SEPTEMBER 2008 TIMING REQUIREMENTS over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) VCCB = 1.8 V ± 0.15 V MIN MAX Data rate tw VCCB = 2.5 V ± 0.2 V MIN MAX 52 Pulse duration Data inputs VCCB = 3.3 V ± 0.3 V MIN MAX 60 19 VCCB = 5 V ± 0.5 V MIN 60 17 60 17 UNIT MAX 17 Mbps ns TIMING REQUIREMENTS over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) VCCB = 2.5 V ± 0.2 V MIN MAX Data rate tw VCCB = 3.3 V ± 0.3 V MIN MAX 70 Pulse duration Data inputs VCCB = 5 V ± 0.5 V MIN 100 14 100 10 UNIT MAX 10 Mbps ns TIMING REQUIREMENTS over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) VCCB = 3.3 V ± 0.3 V MIN Data rate tw VCCB = 5 V ± 0.5 V MAX MIN 100 Pulse duration Data inputs 10 UNIT MAX 100 10 Mbps ns SWITCHING CHARACTERISTICS TA = 25°C, VCCA = 1.2 V PARAMETER tpd FROM (INPUT) TO (OUTPUT) VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V TYP TYP TYP TYP A B 9.5 7.9 7.6 8.5 B A 9.2 8.8 8.4 8 A 1 1 1 1 B 1 1 1 1 A 20 17 17 18 B 20 16 15 15 A-port rise and fall times 4.1 4.4 4.1 3.9 ns ns ten OE tdis OE trA, tfA UNIT ns µs ns trB, tfB B-port rise and fall times 5 5 5.1 5.1 tSK(O) Channel-to-channel skew 2.4 1.7 1.9 7 ns 20 20 20 20 Mbps Max data rate Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0106 5 TXB0106 SCES709 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.8 V ± 0.15 V VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V MIN MAX MIN MAX MIN B 1.4 12.9 1.2 10.1 A 0.9 14.2 0.7 12 VCCB = 5 V ± 0.5 V UNIT MAX MIN MAX 1.1 10 0.8 9.9 0.4 11.7 0.3 13.7 A 1 1 1 1 B 1 1 1 1 ns µs A 6.6 33 6.4 25.3 6.1 23.1 5.9 24.6 B 6.6 35.6 5.8 25.6 5.5 22.1 5.6 20.6 A-port rise and fall times 0.8 6.5 0.8 6.3 0.8 6.3 0.8 6.3 ns trB, tfB B-port rise and fall times 1 7.3 0.7 4.9 0.7 4.6 0.6 4.6 ns tSK(O) Channel-to-channel skew trA, tfA Max data rate 2.6 1.9 50 50 1.6 50 1.3 50 ns ns Mbps SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V VCCB = 5 V ± 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX B 1.6 11 1.4 7.7 1.3 6.8 1.2 6.5 A 1.5 12 1.2 8.4 0.8 7.6 0.5 7.1 A 1 1 1 1 B 1 1 1 1 ns µs A 5.9 26.7 5.6 21.6 5.4 18.9 4.8 18.7 B 6.1 33.9 5.2 23.7 5 19.9 5 17.6 A-port rise and fall times 0.7 5.1 0.7 5 1 5 0.7 5 ns trB, tfB B-port rise and fall times 1 7.3 0.7 5 0.7 3.9 0.6 3.8 ns tSK(O) Channel-to-channel skew trA, tfA Max data rate 6 VCCB = 1.8 V ± 0.15 V 0.8 52 Submit Documentation Feedback 0.7 60 0.6 60 0.6 60 ns ns Mbps Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0106 TXB0106 www.ti.com ......................................................................................................................................................................................... SCES709 – SEPTEMBER 2008 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V MIN MAX B 1.1 A 1 VCCB = 5 V ± 0.5 V UNIT MIN MAX MIN MAX 6.4 1 5.3 0.9 4.7 7 0.6 5.6 0.3 4.4 A 1 1 1 B 1 1 1 ns µs A 5 16.9 4.9 15 4.5 13.8 B 4.8 21.8 4.5 17.9 4.4 15.2 A-port rise and fall times 0.8 3.6 0.6 3.6 0.5 3.5 ns trB, tfB B-port rise and fall times 0.6 4.9 0.7 3.9 0.6 3.2 ns tSK(O) Channel-to-channel skew trA, tfA 0.4 Max data rate 0.3 70 0.3 100 100 ns ns Mbps SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 3.3 V ± 0.3 V VCCB = 5 V ± 0.5 V UNIT MIN MAX MIN MAX B 0.9 4.9 0.8 4 A 0.5 5.4 0.2 4 A 1 1 B 1 1 ns µs A 4.5 13.9 4.1 12.4 B 4.1 17.3 4 14.4 A-port rise and fall times 0.5 3 0.5 3 ns trB, tfB B-port rise and fall times 0.7 3.9 0.6 3.2 ns tSK(O) Channel-to-channel skew trA, tfA Max data rate 0.4 100 0.3 100 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0106 ns ns Mbps 7 TXB0106 SCES709 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com OPERATING CHARACTERISTICS TA = 25°C VCCA 1.2 V 1.2 V 1.5 V 1.8 V 2.5 V 2.5 V 3.3 V 2.5 V 5V 3.3 V to 5V VCCB PARAMETER TEST CONDITIONS 5V CpdA CpdB CpdA CpdB 8 A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output A-port input, B-port output B-port input, A-port output CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = VCCA (outputs enabled) CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = GND (outputs disabled) 1.8 V 1.8 V 1.8 V UNIT TYP TYP TYP TYP TYP TYP 9 8 7 7 7 7 TYP 8 12 11 11 11 11 11 11 35 26 27 27 27 27 28 26 19 18 18 18 20 21 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.03 0.01 0.01 0.01 0.01 0.01 0.01 0.03 Submit Documentation Feedback pF pF Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0106 TXB0106 www.ti.com ......................................................................................................................................................................................... SCES709 – SEPTEMBER 2008 PRINCIPLES OF OPERATION Applications The TXB0106 can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. Architecture The TXB0106 architecture (see Figure 1) does not require a direction-control signal to control the direction of data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0106 can maintain a high or low, but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts flowing the opposite direction. The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly, during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up the high-to-low transition. The typical output impedance during output transition is 70 Ω at VCCO = 1.2 V to 1.8 V, 50 Ω at VCCO = 1.8 V to 3.3 V and 40 Ω at VCCO = 3.3 V to 5 V. VCCA VCCB One Shot T1 4k One Shot T2 A B One Shot T3 4k T4 One Shot Figure 1. Architecture of TXB0106 I/O Cell Input Driver Requirements Typical IIN vs VIN characteristics of the TXB0106 are shown in Figure 2. For proper operation, the device driving the data I/Os of the TXB0106 must have drive strength of at least ±2 mA. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0106 9 TXB0106 SCES709 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com IIN VT/4 k VIN –(VD – VT)/4 k A. VT is the input threshold voltage of the TXB0106 (typically VCCI/ 2). B. VD is the supply voltage of the external driver. Figure 2. Typical IIN vs VIN Curve Power Up During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not damage the device, so any power supply can be ramped up first. The TXB0106 has circuitry that disables all output ports when either VCC is switched off (VCCA/B = 0 V). Enable and Disable The TXB0106 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the outputs actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the one-shot circuitry to become operational after OE is taken high. Pullup or Pulldown Resistors on I/O Lines The TXB0106 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0106 have low dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be kept higher than 50 kΩ to ensure that they do not contend with the output drivers of the TXB0106. For the same reason, the TXB0106 should not be used in applications such as I2C or 1-Wire where an open-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS01xx series of level translators. 10 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0106 TXB0106 www.ti.com ......................................................................................................................................................................................... SCES709 – SEPTEMBER 2008 PARAMETER MEASUREMENT INFORMATION 2 × VCCO From Output Under Test 15 pF 1 MW Open 50 kW 15 pF TEST tPZL/tPLZ tPHZ/tPZH LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT LOAD CIRCUIT FOR MAX DATA RATE, PULSE DURATION PROPAGATION DELAY OUTPUT RISE AND FALL TIME MEASUREMENT S1 50 kW From Output Under Test S1 2 × VCCO Open VCCI Input VCCI/2 VCCI/2 0V tPLH tPHL tw Output VCCO/2 0.9 y VCCO 0.1 y VCCO VOH tf tr VCCI VCCO/2 VOL Input VCCI/2 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES A. B. C. D. E. F. G. VCCI/2 CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns. The outputs are measured one at a time, with one transition per measurement. tPLH and tPHL are the same as tpd. VCCI is the VCC associated with the input port. VCCO is the VCC associated with the output port. All parameters and waveforms are not applicable to all devices. Figure 3. Load Circuits and Voltage Waveforms Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TXB0106 11 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TXB0106PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0106PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXB0106RGYR ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TXB0106RGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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OTHER QUALIFIED VERSIONS OF TXB0106 : • Automotive: TXB0106-Q1 NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TXB0106PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TXB0106RGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXB0106PWR TXB0106RGYR TSSOP PW 16 2000 346.0 346.0 29.0 VQFN RGY 16 3000 346.0 346.0 29.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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