For assistance or to order, call (800) 531-5782 78ST300 Series 3 AMP POSITIVE STEP-DOWN INTEGRATED SWITCHING REGULATOR • • • • • • High Efficiency > 80% Wide Input Range Self-Contained Inductor Short-Circuit Protection Over-Temperature Protection Fast Transient Response Pin-Out Information Vin 1 78ST300 C1 2 The 78ST300 is a series of wide input voltage, 3 terminal Integrated Switching Regulators (ISRs). Employing a ceramic substrate, these ISRs have a maximum output current of 3A. The output voltage is laser trimmed for high accuracy. The 78ST300 series regulators have internal short-circuit and overtemperature protection and may be used in a wide variety of applications. Ordering Information 78ST3 XX Pin No. Function Standard Application Vout 3 GND Y C 1 Vin 2 GND Output Voltage Package Suffix 3 Vout 05 = 5.0 Volts V = Vertical Mount H = Horizontal Mount + C2 Revised 6/30/98 GND (For dimensions and PC board layout see Package Style 600.) C1 = Optional 1µF ceramic C2 = Required 100µF electrolytic Specifications 78ST300 SERIES Characteristics (Ta = 25°C unless noted) Symbols Conditions Min Typ Max Units Output Current Io Over Vin range 0.1* — 3.0 A Input Voltage Range Output Voltage Tolerance Vin ∆V o Io = 0.1 to 3.0A Over Vin range 8 — 20 V — ±1.0 ±2.0 %Vo %Vo Ta = 0°C to +60°C Line Regulation Regline Over Vin range — ±0.4 ±0.8 Load Regulation Regload 0.1 ≤ Io ≤ 3.0A — ±0.2 ±0.4 %Vo Ripple/Noise Vn Vin = Vin min, Io = 3.0A — 1 — %Vo Transient Response (with 100µF output cap) ttr 50% load change Vo over/undershoot — 100 5.0 — µSec %Vo Efficiency η Vin = 9V, Io = 3.0A — 80 — % Switching Frequency ƒo Over Vin and Io ranges 0.95 1.0 1.05 MHz Absolute Maximum Operating Temperature Range Ta — -40 — +70 °C Recommended Operating Temperature Range Ta Free Air Convection, (40-60LFM) Over Vin and Io ranges -40 — Thermal Resistance θ ja Free Air Convection, (40-60LFM) — 35 — °C/W Storage Temperature Ts — -40 — +125 °C +70** °C Mechanical Shock — Per Mil-STD-883D, Method 2002.3 — 500 — G’s Mechanical Vibration — Per Mil-STD-883D, Method 2007.2, 20-2000 Hz, soldered in a PC board — 10 — G’s Weight — — — 11 — Grams * ISR will operate down to no load with reduced specifications. ** See Thermal Derating chart. Note: The 78ST300 Series requires a 100µF electrolytic or tantalum output capacitor for proper operation in all applications. Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com For assistance or to order, call 78ST300 CHARACTERISTIC (800) 531-5782 Series DATA 78ST305_ 5.0 VDC (See Note 1) Efficiency vs Output Current 100 Efficiency (%) 90 Vin 80 7.5V 9.0V 12.0V 15.0V 20.0V 70 60 50 40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Iout (A) Ripple vs Output Current 40 35 Ripple (mV) 30 Vin 7.5V 9.0V 12.0V 15.0V 20.0V 25 20 15 10 5 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Iout (A) Thermal Derating (Ta) (See Note 2) 3.0 50°C 60°C 2.5 70°C Iout (A) 2.0 85°C 1.5 1.0 0.5 0.0 8 10 12 14 16 18 20 Vin (Volts) Power Dissipation vs Output Current 4.0 3.5 PD (Watts) 3.0 Vin 7.5V 9.0V 12.0V 15.0V 20.0V 2.5 2.0 1.5 1.0 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Iout (A) Note 1: All data listed in the above graphs, except for derating data, has been developed from actual products tested at 25°C. This data is considered typical data for the ISR. Note 2: Thermal derating graphs are developed in free air convection cooling of 40-60 LFM. (See Thermal Application Note) Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing 78ST305HC NRND SIP MOD ULE EFH 3 78ST305SC OBSOLETE SIP MOD ULE EFJ 78ST305SCT OBSOLETE SIP MOD ULE 78ST305VC NRND SIP MOD ULE Pins Package Eco Plan (2) Qty 20 Lead/Ball Finish MSL Peak Temp (3) Pb-Free (RoHS) Call TI N / A for Pkg Type 3 TBD Call TI Call TI EFJ 3 TBD Call TI Call TI EFF 3 Pb-Free (RoHS) Call TI N / A for Pkg Type 20 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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