PT7741—5V 32 Amp “Current Booster” for PT7775/PT7779 Regulators SLTS118 (Revised 8/31/2000) Description The booster adds a parallel output stage that is driven directly by the regulator. Both operate in perfect sychronization for a low noise solution. The PT7741 only operates with the PT7775 and PT7775 regulators. It is not a stand-alone product. Please refer to the appropriate data sheet for the performance specifications. The current booster has the same package options as the companion regulators. The PT7741 is a high-output 32 Amp “Current Booster” designed to operate with the PT7775 and PT7779 regulators. Up to two PT7741 boosters will operate in parallel with one regulator, boosting output current in increments of 32A. Combinations of one regulator and PT7741 current boosters can supply enough power for virtually any multiple mega-processor application. Ordering Information PT7741❏ Pin-Out Information Features Pin Function Pin Function • 32A Current Boost • Tracks Vo of either a PT7775 or PT7779 • High Efficiency • Input Voltage Range: 4.5V to 5.5V • Synchronized with Regulator • 27-pin SIP Package • Run up to 2 in Parallel (96A) 1 Do not connect 14 GND 2 Do not connect 15 GND (For dimensions and PC Board layout, see Package Styles 1020 and 1030.) 3 Do not connect 16 GND 4 Do not connect 17 GND 5 Do not connect 18 GND 6 Do not connect 19 GND 7 Vin 20 Vout 8 Vin 21 Vout Case/Pin Configuration PT Series Suffix (PT1234X) 9 Vin 22 Vout Vertical Through-Hole 10 Vin 23 Vout Horizontal Through-Hole 11 Vin 24 Vout Horizontal Surface Mount 12 Do not connect 25 Vout 13 GND 26 Do not connect 27 Master Sync In N A C Standard Application PROGRAMMING PINS VID0 VID1 VID2 VID3 VID4 REMOTE SENSE (+) 6 4 3 2 1 V IN 7 - 1 1 Vin PT7775/9 1µH + STBY 5 C IN 26 SNS(+) VID4 - VID0 L1 Synch Out 27 GND 13-19 Vo VOUT 20-25 SNS(-) + 12 LOAD COUT GND GND STBY* REMOTE SENSE (–) 27 Synch In L1 7 - 1 1 Vin 1µH + C IN PT7741 Vo 20-25 GND 13-19 + COUT External Capacitors: When used with a PT7779, the PT7741 requires a minimum ouput capacitance of 330µF. The maximum allowable output capacitance is 30,000µF. The PT7741 also requires a minimum input capacitance of 2400µF, which must be rated for a minimum of 2.0Arms of ripple current. For transient or dynamic load applications, additional capacitance may be required. For further information, see the accompanying application note on capacitor selection for this product. Input Filter: An input filter inductor is optional for most applications. The input inductor must be sized to handle 32ADC with a typical value of 1µH. For technical support and more information, see inside back cover or visit www.ti.com/powertrends PACKAGE OPTION ADDENDUM www.ti.com 20-Aug-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins PT7741A NRND SIP MODULE EJA 27 PT7741N NRND SIP MODULE EJD 27 Package Qty Eco Plan 8 (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TBD Call TI Call TI TBD Call TI Level-1-215C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. 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