TI SN74LVC07AMPWREP

SN74LVC07A-EP
www.ti.com .................................................................................................................................................. SCAS738D – DECEMBER 2003 – REVISED JUNE 2008
HEX BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
FEATURES
1
•
•
•
•
Operates From 1.65 V to 5 V
Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V
Max tpd of 3.6 ns at 5 V
Latch-Up Performance Exceeds 250 mA Per
JESD 17
PW PACKAGE
(TOP VIEW)
1A
1Y
2A
2Y
3A
3Y
GND
SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
•
•
•
•
•
•
•
(1)
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Available in Military (–55°C/125°C), Industrial
(–40°C/85°C) Temperature Ranges (1)
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
1
14
2
13
3
12
4
11
5
10
6
7
9
8
VCC
6A
6Y
5A
5Y
4A
4Y
Custom Temperature Ranges Available
DESCRIPTION/ORDERING INFORMATION
This hex buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
The outputs of the SN74LVC07A device are open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 24 mA.
Inputs can be driven from 1.8-V, 2.5-V, 3.3-V (LVTTL), or 5-V (CMOS) devices. This feature allows the use of
this device as a translator in a mixed-system environment.
ORDERING INFORMATION
PACKAGE (1)
TA
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 85°C
TSSOP – PW
Reel of 2000
SN74LVC07AIPWREP
C07AEP
–55°C to 125°C
TSSOP – PW
Reel of 2000
SN74LVC07AMPWREP
C07AMEP
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(each buffer/driver)
INPUT
A
OUTPUT
Y
H
H
L
L
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2008, Texas Instruments Incorporated
SN74LVC07A-EP
SCAS738D – DECEMBER 2003 – REVISED JUNE 2008 .................................................................................................................................................. www.ti.com
LOGIC DIAGRAM, EACH BUFFER/DRIVER (POSITIVE LOGIC)
A
Y
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
–0.5
6.5
V
VO
Output voltage range
–0.5
6.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
113
°C/W
150
°C
Continuous current through each VCC or GND
θJA
Package thermal impedance
Tstg
Storage temperature range
(1)
(2)
(3)
(3)
–65
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
VCC
Supply voltage
VCC = 1.65 V to 1.95 V
VIH
High-level input voltage
MIN
MAX
1.65
5.5
Low-level input voltage
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
VCC =2.7 V to 3.6 V
2
VCC = 4.5 V to 5.5 V
0.7 × VCC
VCC = 1.65 V to 1.95 V
VIL
UNIT
V
0.35 × VCC
VCC = 2.3 V to 2.7 V
0.7
VCC = 2.7 V to 3.6 V
0.8
VCC = 4.5 V to 5.5 V
0.3 × VCC
V
VI
Input voltage
0
5.5
V
VO
Output voltage
0
5.5
V
IOL
Low-level output current
VCC = 1.65 V
4
VCC = 2.3 V
12
VCC = 2.7 V
12
VCC = 3 V
24
VCC = 4.5 V
TA
(1)
2
Operating free-air temperature
mA
24
SN74LVC07AIPWREP
–40
85
SN74LVC07AMPWREP
–55
125
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC07A-EP
SN74LVC07A-EP
www.ti.com .................................................................................................................................................. SCAS738D – DECEMBER 2003 – REVISED JUNE 2008
Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOL = 100 µA
0.2
1.65 V
0.45
2.3 V
0.7
2.7 V
0.4
3V
0.55
IOL = 12 mA
IOL = 24 mA
II
VI = 5.5 V or GND
ICC
VI = VCC or GND,
ΔICC
CI
(1)
UNIT
V
3.6 V
±5
µA
3.6 V
10
µA
2.7 V to 3.6 V
500
µA
IO = 0
One input at VCC – 0.6 V, Other inputs at VCC or GND
MAX
1.65 V to 5.5 V
IOL = 4 mA
VOL
TYP (1)
MIN
VI = VCC or GND
3.3 V
5
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through 4)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
MIN MAX
1
6.6
MIN
MAX
1
4.4
VCC = 3.3 V
±0.3 V
VCC = 2.7 V
MIN
VCC = 5 V
±0.5 V
MAX
MIN
MAX
MIN
MAX
4.3
1
4.6
1
3.6
UNIT
ns
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST
CONDITIONS
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TYP
TYP
TYP
f = 10 MHz
1.8
2
2.5
3.78
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Product Folder Link(s): SN74LVC07A-EP
UNIT
pF
3
SN74LVC07A-EP
SCAS738D – DECEMBER 2003 – REVISED JUNE 2008 .................................................................................................................................................. www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC = 1.8 V ± 0.15 V
2 × VCC
S1
1 kΩ
From Output
Under Test
Open
TEST
S1
tPZL (see Note F)
2 × VCC
tPLZ (see Note G)
2 × VCC
tPHZ/tPZH
2 × VCC
GND
CL = 30 pF
(see Note A)
1 kΩ
LOAD CIRCUIT
tw
VCC
Timing
Input
VCC/2
VCC/2
VCC/2
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC/2
VCC/2
0V
tPLH
Output
Control
(low-level
enabling)
tPLZ
VCC
VCC/2
tPZH
VCC
VCC/2
VOL
Output
Waveform 2
S1 at 2 × VCC
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VCC/2
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPHL
VCC/2
VCC
VCC/2
tPZL
VCC
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VCC
Data
Input
VCC/2
0V
0V
tsu
Output
VCC
VCC/2
Input
VOL + 0.15 V
VOL
tPHZ
VCC/2
VCC
VCC − 0.15 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VCC/2.
G. tPLZ is measured at VOL + 0.15 V.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
4
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Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC07A-EP
SN74LVC07A-EP
www.ti.com .................................................................................................................................................. SCAS738D – DECEMBER 2003 – REVISED JUNE 2008
PARAMETER MEASUREMENT INFORMATION
VCC = 2.5 V ± 0.2 V
2 × VCC
S1
500 Ω
From Output
Under Test
Open
TEST
S1
tPZL (see Note F)
2 × VCC
tPLZ (see Note G)
2 × VCC
tPHZ/tPZH
2 × VCC
GND
CL = 30 pF
(see Note A)
500 Ω
LOAD CIRCUIT
tw
VCC
Timing
Input
VCC/2
VCC/2
VCC/2
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC/2
VCC/2
0V
tPLH
Output
Control
(low-level
enabling)
tPLZ
VCC
VCC/2
tPZH
VCC
VCC/2
VOL
VOL + 0.15 V
VOL
tPHZ
Output
Waveform 2
S1 at 2 × VCC
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VCC/2
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPHL
VCC/2
VCC
VCC/2
tPZL
VCC
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VCC
Data
Input
VCC/2
0V
0V
tsu
Output
VCC
VCC/2
Input
VCC/2
VCC
VCC − 0.15 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VCC/2.
G. tPLZ is measured at VOL + 0.15 V.
H. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
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Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC07A-EP
5
SN74LVC07A-EP
SCAS738D – DECEMBER 2003 – REVISED JUNE 2008 .................................................................................................................................................. www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC = 2.7 V AND 3.3 V ± 0.3 V
6V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPZL (see Note F)
6V
tPLZ (see Note G)
6V
tPHZ/tPZH
6V
LOAD CIRCUIT
tw
2.7 V
2.7 V
Timing
Input
0V
0V
2.7 V
1.5 V
1.5 V
0V
1.5 V
1.5 V
0V
tPLH
Output
Control
(low-level
enabling)
tPLZ
3V
1.5 V
tPZH
3V
1.5 V
VOL
1.5 V
0V
Output
Waveform 1
S1 at 6 V
(see Note B)
tPHL
1.5 V
2.7 V
1.5 V
tPZL
2.7 V
Output
VOLTAGE WAVEFORMS
PULSE DURATION
th
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Input
1.5 V
1.5 V
tsu
Data
Input
1.5 V
Input
Output
Waveform 2
S1 at 6 V
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOL + 0.3 V
VOL
tPHZ
3V
1.5 V
2.7 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at 1.5 V.
G. tPLZ is measured at VOL + 0.3 V.
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuit and Voltage Waveforms
6
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Copyright © 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC07A-EP
SN74LVC07A-EP
www.ti.com .................................................................................................................................................. SCAS738D – DECEMBER 2003 – REVISED JUNE 2008
PARAMETER MEASUREMENT INFORMATION
VCC = 5 V ± 0.5 V
2 × VCC
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPZL (see Note F)
2 × VCC
tPLZ (see Note G)
2 × VCC
tPHZ/tPZH
7V
LOAD CIRCUIT
tw
3V
3V
Timing
Input
0V
0V
3V
1.5 V
1.5 V
0V
1.5 V
1.5 V
0V
tPLH
Output
Control
(low-level
enabling)
tPLZ
VCC
VCC/2
tPZH
3.5 V
1.5 V
VOL
VCC/2
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPHL
1.5 V
VCC
VCC/2
tPZL
3V
Output
VOLTAGE WAVEFORMS
PULSE DURATION
th
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Input
1.5 V
1.5 V
tsu
Data
Input
1.5 V
Input
VOL
tPHZ
Output
Waveform 2
S1 at 7 V
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOL + 0.3 V
3.5 V
1.5 V
3.2 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VCC/2.
G. tPLZ is measured at VOL + 0.3 V.
H. All parameters and waveforms are not applicable to all devices.
Figure 4. Load Circuit and Voltage Waveforms
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Product Folder Link(s): SN74LVC07A-EP
7
PACKAGE OPTION ADDENDUM
www.ti.com
21-Jul-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LVC07AIPWREP
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC07AMPWREP
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/04654-01XE
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/04654-02XE
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74LVC07AIPWREP
Package Package Pins
Type Drawing
TSSOP
PW
14
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2000
330.0
12.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
7.0
5.6
1.6
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVC07AIPWREP
TSSOP
PW
14
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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