ETC SFH4289

GaAlAs-IR-Lumineszenzdiode in SMT-Gehäuse mit Linse
GaAlAs Infrared Emitter in SMT Package with lens
SFH 4289
Wesentliche Merkmale
Features
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TOPLED mit Linse
GaAIAs-LED mit sehr hohem Wirkungsgrad
Gute Linearität (Ie = f [IF]) bei hohen Strömen
Gleichstrom- (mit Modulation) oder
Impulsbetrieb möglich
Hohe Zuverlässigkeit
Hohe Impulsbelastbarkeit
Oberflächenmontage geeignet
Gegurtet lieferbar
SFH 4289 Gehäusegleich mit SFH 3219
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TOPLED with lens
Very highly efficient GaAIAs-LED
Good Linearity (Ie = f [IF]) at high currents
DC (with modulation) or pulsed operations are
possible
High reliability
High pulse handling capability
Suitable for surface mounting (SMT)
Available on tape and reel
SFH 4289 same package as SFH 3219
Anwendungen
Applications
• Miniaturlichtschranken für Gleich- und
Wechsellichtbetrieb, Lochstreifenleser
• Industrieelektronik
• „Messen/Steuern/Regeln“
• Automobiltechnik
• Sensorik
• Alarm- und Sicherungssysteme
• IR-Freiraumübertragung
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Typ
Type
SFH 4289
2001-10-09
Miniature photointerrupters
Industrial electronics
For drive and control circuits
Automotive technology
Sensor technology
Alarm and safety equipment
IR free air transmission
Bestellnummer
Ordering Code
Gehäuse
Package
on request
Kathodenkennzeichnung: abgesetzte Ecke
cathode marking: bevelled edge
TOPLED with lens
1
SFH 4289
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
Top; Tstg
– 40 … + 100
°C
Sperrspannung
Reverse voltage
VR
5
V
Durchlaßstrom
Forward current
IF
100
mA
Stoßstrom, τ = 10 µs, D = 0
Surge current
IFSM
2.5
A
Verlustleistung
Power dissipation
Ptot
180
mW
450
K/W
≈ 200
K/W
Wärmewiderstand Sperrschicht - Umgebung bei RthJA
Montage auf FR4 Platine, Padgröße je 16 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 16 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
RthJS
Montage auf Metall-Block
Thermal resistance junction - soldering point,
mounted on metal block
2001-10-09
2
SFH 4289
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA, tp = 20 ms
λpeak
880
nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 m A
∆λ
80
nm
Abstrahlwinkel
Half angle
ϕ
± 25
Grad
deg.
Aktive Chipfläche
Active chip area
A
0.09
mm2
Abmessungen der aktiven Chipfläche
Dimensions of the active chip area
L×B
L×W
0.3 × 0.3
mm
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 100 mA, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from
90% to10%, IF = 100 mA, RL = 50 Ω
tr, tf
0.5
µs
Kapazität,
Capacitance
VR = 0 V, f = 1 MHz
Co
15
pF
VF
VF
1.5 (≤ 1.8)
3.0 (≤ 3.8)
V
V
Sperrstrom,
Reverse current
VR = 5 V
IR
0.01 (≤ 1)
µA
Gesamtstrahlungsfluß,
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe
23
mW
Temperaturkoeffizient von Ie bzw. Φe,
TCI
– 0.5
%/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA
TCV
–2
mV/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA
TCλ
+ 0.25
nm/K
Durchlaßspannung,
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
IF = 100 mA
Temperature coefficient of Ie or Φe, IF = 100 mA
2001-10-09
3
SFH 4289
Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol
Werte
Values
Einheit
Unit
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Iemin
Ietyp
6.3
17
mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 µs
Ie typ
140
mW/sr
2001-10-09
4
SFH 4289
Relative Spectral Emission
Irel = f (λ)
Ι rel
Single pulse, tp = 20 µs
OHR00877
100
Ιe
= f (IF )
Ιe 100 mA
Radiant Intensity
OHR00878
10 2
Ιe
Ι e (100mA)
%
Max. Permissible Forward Current
IF = f (T A )
OHR00883
120
Ι F mA
80
10 1
60
10 0
100
80
R thjA = 450 K/W
60
10 -1
40
40
10 -2
20
10 -3
0
750
800
850
900
950 nm 1000
λ
ΙF
10 1
10 2
10 3 mA 10 4
ΙF
ΙF
D = 0.005
0.01
0.02
0.05
0
10 3 0.1
0.2
10 -1
0.5
DC
10 -2
D=
tp
T
tp
ΙF
T
10 -3
0
1
2
3
4
5
6
V
VF
10 1 -5
10 10 -4 10 -3 10 -2 10 -1 10 0
8
Radiation Characteristics Irel = f (ϕ)
40˚
30˚
20˚
10˚
ϕ
0˚
10 1 s 10 2
tp
OHL00732
1.0
50˚
0.8
60˚
0.6
70˚
0.4
80˚
0.2
0
90˚
100˚
1.0
2001-10-09
0.8
0.6
0.4
0˚
20˚
0
20
40
60
80
100 ˚C 120
TA
Zusätzliche
Informationen
über
allgemeine
Lötbedingungen
erhalten Sie auf Anfrage.
For additional information on general
soldering
conditions
please
contact us.
mA
10 2
0
OHR00886
10 4
OHR00881
A
10
10 0
Permissible Pulse Handling
Capability IF = f (tp), TA = 25 °C
duty cycle D = parameter
Forward Current
IF = f (VF) single pulse, tp = 20 µs
10 1
20
40˚
60˚
80˚
5
100˚
120˚
SFH 4289
Maßzeichnung
Package Outlines
3.5 (0.138) max.
2.1 (0.083)
1.7 (0.067)
3.0 (0.118)
2.6 (0.102)
2.3 (0.091)
0.9 (0.035)
ø2.55 (0.100)
ø2.60 (0.102)
0.5 (0.020)
1.1 (0.043)
2
Package
marking
0.7 (0.028)
3.7 (0.146)
3.3 (0.130)
3.4 (0.134)
3.0 (0.118)
2.1 (0.083)
1
0.6 (0.024)
0.4 (0.016)
0.1 (0.004) (typ.)
0.18 (0.007)
0.13 (0.005)
GEOY6956
Maße in mm, wenn nicht anders angegeben / Dimensions in mm, unless otherwise specified.
Published by OSRAM Opto Semiconductors GmbH & Co. OHG
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1
A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2001-10-09
6