ETC ATJ2085

ATJ2085
DATA SHEET
Actions
ATJ 2085
PRODUCT
DATA
SHEET
(Version 1.5 08/2004)
Actions Semiconductor Co., Ltd
Copyright © 2004 Actions Semiconductor Co., Ltd. All rights reserved.
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Declaration
All contents of this document are protected by copyright law and reproduction in whole or in part is
prohibited without the prior written consent of Actions Semiconductor Co., Ltd. Other product
names used in this publication are for identification purposes only and may be trademarks or
registered trademarks of their respective companies.
The information presented in this document does not form part of any quotation or contract, is
believed to be accurate and reliable. Actions Semiconductor Co., Ltd. reserves the right to make
changes to specifications and product descriptions at any time without notice, and to discontinue
or make changes to its products at any time without notice. Actions Semiconductor Co., Ltd.
specifically disclaims any and all liability for any consequence of the application or use of any
product or circuit. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
Actions Semiconductor Co., Ltd. is one of Licensee of Thomson Licensing S.A. and is approved
to distribute these semiconductor devices using MPEG Layer-3 (“mp3”) coding technology (“mp3
decoder chips”) by Thomson Licensing S.A. Supply of this product does not convey a license nor
imply any right to distribute content created with this product in revenue-generating broadcast
systems (terrestrial, satellite, cable and/or other distribution channels), streaming applications (via
Internet, intranets and/or other networks), other content distribution systems (pay-audio or
audio-on-demand applications and the like) or on physical media (compact discs, digital versatile
discs, semiconductor chips, hard drives, memory cards and the like). An independent license for
such use is required. For details, please visit http://mp3licensing.com.
Actions Semiconductor Co., Ltd. is one of Licensee of Microsoft Licensing, GP. Actions
Semiconductor Co., Ltd. is approved to distribute these semiconductor devices using Windows
Media Audio (“wma”) coding technology (“wma codec chips”) by Microsoft Licensing, GP. This
product includes technology owned by Microsoft Corporation and cannot be used or distributed
without a license from Microsoft Licensing, GP.
ADDITIONAL SUPPORT
Additional product and company information can be obtained by going to the Actions website at:
www.actions.com.cn.
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CONTENTS
Declaration ................................................................................................................................................1
CONTENTS...............................................................................................................................................2
1. Description ............................................................................................................................................4
2. Features ................................................................................................................................................4
3. Pin Description ......................................................................................................................................6
3.1 Pin Sort by Number .....................................................................................................................6
4. Function Description ...........................................................................................................................10
4.1 Functional Block Diagram..........................................................................................................10
4.2 MCU Core .................................................................................................................................. 11
4.3 DSP Core................................................................................................................................... 11
4.4 DMA Controller .......................................................................................................................... 11
4.5 General Purpose IO Ports ......................................................................................................... 11
4.6 RTC/CTC/Watch Dog Timer......................................................................................................13
4.7 Oscillator/PLL.............................................................................................................................13
4.8 Power Management Unit (PMU)................................................................................................14
4.9 ADC............................................................................................................................................15
4.10 DAC..........................................................................................................................................16
4.11 Headphone Driver ....................................................................................................................17
4.13 External Memory Interface ......................................................................................................17
4.14 I2C Interface ............................................................................................................................18
4.15 USB 2.0(FS) SIE......................................................................................................................19
4.15.1 Hard Core ......................................................................................................................20
4.15.2 Interrupts........................................................................................................................20
4.16 FM Interface.............................................................................................................................20
5. Electrical Characteristics.....................................................................................................................20
5.1 Absolute Maximum Ratings .......................................................................................................20
5.2 Capacitance ...............................................................................................................................21
5.3 DC Characteristics.....................................................................................................................21
5.4 AC Characteristics .....................................................................................................................22
5.4.1 AC test input waveform ...................................................................................................22
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5.4.2 AC test output measuring points .....................................................................................22
5.4.3 Reset Parameter .............................................................................................................22
5.4.4 Initialization Parameter....................................................................................................22
5.4.5 GPIO Interface Parameter...............................................................................................23
5.4.6 Ordinary ROM Parameter ...............................................................................................23
5.4.7 External System Bus Parameter .....................................................................................24
5.4.8 Bus Operation..................................................................................................................25
5.4.9 A/D Converter Characteristics .........................................................................................27
5.4.10 Headphone Driver Characteristics Table.......................................................................27
5.4.11 LCM Driver Parameter...................................................................................................29
6. MCU/DSP Dissipation (IVDD VS. Frequency)....................................................................................30
6.1 MCU Dissipation ........................................................................................................................30
6.2 DSP Dissipation .........................................................................................................................30
7. Recommended Soldering Conditions .................................................................................................31
7.1 Soldering Conditions..................................................................................................................31
7.2 Precaution against ESD for Semiconductors ............................................................................31
7.3 Handling of Unused Input Pins for CMOS.................................................................................31
7.4 Status before Initialization of MOS Devices ..............................................................................32
8. Package Drawings ..............................................................................................................................33
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1. Description
ATJ2085 is a single-chip for flash-based digital music player. It includes an audio decoder with a
high performance DSP, ADPCM record capabilities and USB interface for downloading music and
uploading voice recordings. ATJ2085 also provides an interface to flash memory, LED, button and
switch inputs, headphone, and microphone, and FM radio input and control. ATJ2085’s
programmable architecture supports the MP3, WMA and other digital audio standards. For
devices like USB-Disk, ATJ2085 can act as a USB mass storage slave device to personal
computer system. Its low power consumption allows a long battery life, and an efficient flexible
on-chip DC-DC converter allows many different battery configurations, including 1xAA, 1xAAA,
2xAA, 2xAAA and Li-Ion. Built-in Sigma-Delta DAC & a headphone driver to directly drive low
impedance headphones. The ADC includes inputs for both Microphone and Analog Audio in to
support voice recording and FM radio integration features. Thus, the ATJ2085 provides a true
‘ALL-IN-ONE’ solution that is ideally suited for highly optimized digital audio players with mass
storage function.
2. Features
¾
MPEG1/2/2.5 Audio Layer 1, 2, 3 decoder
¾
Support WMA Decoder
¾
Digital Voice Recording with Actions Speech Algorithm
¾
24 bits DSP Core with memory and on-chip Debug Support Unit (DSU)
¾
Integrated 8-bit MCU with DSU
¾
External up to 2(cs) x 64M/128M/256M/512M/1G/2G bytes Nand type Flash accessed by MCU or
DMA
¾
Built-in DMA, CTC (Counter/Timer Controller) and interrupt controller for MCU
¾
Energy saving dynamic power management (PMU)
¾
Support USB 2.0(FS), Write speed(Max): 955k byte/s; Read speed(Max): 1033k byte/s
¾
Build in Stereo 18-bit Sigma-Delta DAC
¾
Build in Key Scan Circuit (3*3) and GPIO
¾
I²C interface supports Master/Slave mode, with changeable slave address
¾
Support external 8080 Interface LCM driver
¾
Support FM Radio input and 32 levels volume control
¾
Support
Stereo
16-bit
Sigma-Delta
ADC
for
Microphone/FM
Input,
sample
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at
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8/12/16/22/24/32/48KHz
¾
MCU run at 24.576MHz(TYP), up to 60MHz
¾
SNR: 90dB (DAC TYP)
¾
Headphone driver output 2x11mW @16 Ohm(TYP)
¾
Operating Voltage: IO: 3.0V(TYP), Core: 2.0V(TYP)
¾
Standby Leakage Current: VCC: [email protected](TYP) , VDD: [email protected](TYP)
¾
Low Power Consumption, designed for greater than 15 (TYP) hours of operation on a single
battery life. (<65mW at typical MP3 decoder solution; <90mW at typical WMA decoder solution)
¾
64-pin (10x10mm) LQFP package
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3. Pin Description
3.1 Pin Sort by Number
Pin
Pin Name
I/O Type
1
GPIO_G0
BI
2
RESET-
I
3
VCC
PWR
4
GND
5
No.
Driver
1.9mA
Reset
Short Description
Default
Z
Bit0 of General purpose I/O port G
H
System reset input (active low)
/
/
Digital power
PWR
/
/
Digital ground
USBD-
A
/
H
USB data minus
6
USBD+
A
/
H
USB data plus
7
PAVCC
PWR
/
/
Power supply for power amplifier(two bypass
Driver
SCU
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capacitors are 47uF and 0.1uF)
8
AOUTR
AO
/
/
Int. DAC right channel analog output
9
AOUTL
AO
/
/
Int. DAC left channel analog output
10
PAGND
PWR
/
/
Power amplifier ground
11
VRDA
AO
/
/
Bypass capacitor (typ 0.47uF)
12
MICIN
AI
/
/
Microphone pre-amplifier input (0.8V-2.2V)
13
VMIC
AO
/
/
Power supply for microphone, 2.2V output
14
FMINL
AI
/
/
Left channel of FM line input
15
FMINR
AI
/
/
Right channel of FM line input
16
AGND
PWR
/
/
Analog ground
17
AVCC
PWR
/
/
Analog power
18
VREFI
AI
/
/
Voltage reference input (1.5V)
19
AVDD
PWR
/
/
Analog power
20
VDDIO
PWR
/
/
21
VP
PWR
/
/
22
LRADC
AI
/
/
Low resolution ADC input, 0.8--2.2V, 8Bit ADC
23
HOSCI
AI
/
/
High frequency crystal OSC input
24
HOSCO
AO
/
/
High frequency crystal OSC output
25
BATSEL
I
/
/
26
DCDIS
I
/
L
GPIO_B0
BI
1.9mA
Z
Bit0 of General purpose I/O port B
KEYI0
I
Driver
/
Bit0 of key scan circuit input
GPIO_C2
BI
L
Bit2 of General purpose I/O port C
GPIO_B1
BI
1.9mA
Z
Bit1 of General purpose I/O port B
KEYI1
I
Driver
/
Bit1 of key scan circuit input
30
GND
PWR
/
/
Ground
31
BAT
AI
/
/
Battery monitor pin
32
LXVDD
AO
/
/
VDD DC-DC pin
27
28
29
1.9mA
Driver
Power output (connect to VDD through a 4.7
Ohm (typ) resistance)
Power pin (When 2 Batteries mode, connect to
BAT. Others mode Connect to VCC)
Battery select. L:One Battery
H:Two Batteries
Int. DC-DC control pin. H: Disable DC-DC. L:
Enable DC-DC.
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33
NGND
PWR
/
/
NMOS ground
34
LXVCC
AO
/
/
VCC DC-DC pin
GPIO_B2
BI
1.9mA
Z
Bit2 of General purpose I/O port B
KEYI2
I
Driver
/
Bit2 of key scan circuit input
36
CE3-
O
/
H
8080 interface LCM chip enable
37
CE2-
O
/
H
Nand Flash chip enable (optional)
38
CE1-
O
/
H
39
VDD
PWR
/
/
Digital power
GPIO_B4
BI
1.9mA
Z
Bit4 of General purpose I/O port B
KEYO0
O
Driver
/
Bit0 of key scan circuit output
GPIO_B5
BI
1.9mA
Z
Bit5 of General purpose I/O port B
KEYO1
O
Driver
/
Bit1 of key scan circuit output
GPIO_B6
BI
1.9mA
Z
Bit6 of General purpose I/O port B
KEYO2
O
Driver
/
Bit2 of key scan circuit output
GPO_A1
O
3.5mA
L
Bit1 of General purpose output port A
ICECK
I
Driver
/
Clock input to DSU for debug
GPO_A2
O
3.5mA
Z
Bit2 of General purpose output port A
ICEDO
O
Driver
/
Data output from DSU for debug
GPO_A0
O
3.5mA
H
Bit0 of General purpose output port A
ICEDI
I
Driver
/
Data input to DSU for debug
46
ICEEN-
I
SCU
H
DSU enable (active low)
47
ICERST-
I
SCU
H
DSU reset (active low)
48
VCC
PWR
/
/
Digital power
49
GND
PWR
/
/
Ground
50
D7
BI
/
L
Bit7 of ext. memory data bus
51
D6
BI
/
L
Bit6 of ext. memory data bus
52
D5
BI
/
L
Bit5 of ext. memory data bus
53
D4
BI
/
L
Bit4 of ext. memory data bus
54
D3
BI
/
L
Bit3 of ext. memory data bus
55
D2
BI
/
L
Bit2 of ext. memory data bus
56
D1
BI
/
L
Bit1 of ext. memory data bus
57
D0
BI
/
L
Bit0 of ext. memory data bus
35
40
41
42
43
44
45
Boot up Nand Flash chip enable (must be
connected to Nand Flash)
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58
MWR-
O
/
H
Ext. memory write strobe
59
MRD-
O
/
H
Ext. memory read strobe
60
CLE
O
/
L
Command latch enable for NAND type flash
61
ALE
O
/
L
Address latch enable for NAND type flash
GPIO_C1
BI
H
Bit1 of General purpose I/O port C
I²C_SDA
BI
/
I²C Serial data (Open drain)
SIRQ-
I
/
Ext. interrupt request input
GPIO_C0
BI
1.9mA
H
Bit0 of General purpose I/O port C
I²C_SCL
BI
Driver
/
I²C serial clock (Open drain)
VDD
PWR
/
/
Digital power
62
63
64
1.9mA
Driver
Notes:
1: PWR----Power Supply
2: AI----Analog Input
3: AO----Analog Output
4: O----Output
5: I----Input
6: BI----Bi-direction
7. SCU----SCHIMITCU
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4. Function Description
4.1 Functional Block Diagram
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4.2 MCU Core
ATJ2085 integrates 8-bit MCU with on-chip ICE support. Instruction set is compatible with Z80.
Process capability is controlled by software Up to 60 MHz.
ATJ2085 includes 116 Kbytes of on-chip SRAM and 29Kbytes on-chip ROM. See the following
flag for on chip memory mapping.
4.3 DSP Core
24-bit Harvard architecture DSP with on-chip ICE support is built in. It works with a memory word
length of 24 bits. ATJ2085 has 16KB*24bit Program Memory (PM) and (16KB-256)*24bit Data
Memory (DM). Memory-Mapped Register includes DAC interface. Process capability is controlled
by software Up to 72 MIPS.
4.4 DMA Controller
ATJ2085 supports 3 kinds of DMA channels. DMA1/2 support Data exchange in Memory or IO.
The last DMA is USB DMA.
4.5 General Purpose IO Ports
ATJ2085 has GPOA, GPIOB, GPIOC, and GPIOG. They have different functions in different modes.
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Function
GPIO
0
GPOA
1
2
Actions
F1
F2
(Default)
(Function 2)
When ICE is used, GPO_A[2~0] Pins are ICEDO, ICECK and ICEDI; Otherwise
GPO_A[2~0] is used for output function.
0
GPIOB
1
When choosing Keyboard function, GPIOB[2~0] Pins are KEYI[2~0], and
2
GPIOB[6~4]
4
GPIOB[6-4:2-0];When keyboard function enables, while some Key in [2~0] is used
5
as GPIOB, the relative Key in should be masked.
are
KEYO[2~0];
when
not
choosing
Keyboard
function,
as
6
When I2C function enables, it is used as I2C_SCL. When as
0
IO, it is GPIO_C0, then I2C can not be enabled
simultaneously
GPIOC
1
Only used as GPIOC
When I2C function enables, it is used as I2C_SDA. When
[3~0]
external interrupt enables, it is SIRQ-; and when as IO, it is
GPIO_C,
multiple
functions
can
not
be
enabled
simultaneously.
when as IO, it is GPIO_C2
2
GPIOG
0
GPIOG[0]
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4.6 RTC/CTC/Watch Dog Timer
RTC is a 24-bit counter with the following function:
¾
Time
¾
Alarm
¾
Timer
CTC is a counter whose clock source is different with RTC’s.
Watchdog can be set from 176-milisecond to 180-second with different step.
4.7 Oscillator/PLL
ATJ2085 supports 24.576MHz crystal, which is the system clock source.
A low jitter PLL referenced to 24.576MHz is used to generate clock for DSP and for serial
communication protocols such as USB, UART, etc. The clock used in serial communications is
48MHz so the PLL generates frequency at multiple of 48MHz to support DSP and serial
communication simultaneously. Another PLL referenced to 24.576MHz is used to generate
22.5792MHz for sample rate 44.1K/22.05KHz/11.025KHz.
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4.8 Power Management Unit (PMU)
PMU consists of DC-DC converter, regulator and battery monitor.
In ATJ2085, there are two DC/DC converters and one liner regulator. One DC/DC converter is for
VCC power supply and another is for VDD. The liner regulator is for VDD power supply when two
battery mode or other conditions where need less external components.
In ATJ2085, the default value of VCC is 3.0V and VDD is 2.0V. The regulator’s default output is
2.0V; all three values can be controlled by Registers. The VCC is from 2.8V to 3.3V; VDD is from
1.6V to 2.3V; the regulator is the same as VDD.
ATJ2085 supports one-battery mode, two-battery mode, USB power supply or DC power line-in.
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There are two pins for mode configurations. One is “DCDIS”; the other is “BATSEL”, the truth
table as follow:
DCDIS
BATSEL
DC/DC1(VDD)
DC/DC2(VCC)
Regulator
0
0
Yes
Yes
No
0
1
No
Yes
Yes
1
0
No
Yes
Yes
1
1
No
No
Yes
Mode descriptions
One
battery
with
more
external
components, but more efficiency
Two battery
One
battery
with
less
external
components, but less efficiency
USB power or DC power line-in
The pin of “DCDIS” has an on-chip pull down resistor. There is a built-in super low speed and low
resolution ADC for battery monitor in ATJ2085. The level of minimum battery voltage warning can
be configured by registers; the range is from 0.98V to 1.22V. The voltage level of resetting system
can be controlled by register; the range is from 0.9V to 1.14V.
DF_7 ~ 6
DF _ 5 ~ 4
4.9 ADC
There are 3 Analog-to-Digital Converters integrated in ATJ2085: 16-bit Σ-∆ ADC is for MIC/FM
Input/Line Input, 8-bit SAR ADC for Line Controller, and 4-bit ADC for Battery Monitor
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The internal microphone amplifier has gain for recording. The VMIC pin is the power supply (2.2V)
for microphone.
The audio ADC is an 18 bits sigma delta Analog-to-Digital Converter. Its input source can be
selected from MIC amplifier or external FM or line-in, and it has two FIFO.
ATJ2085 has an 8-bit switched-capacitor SAR Analog-to-Digital Converter (SARADC). Its input
source is LRADC pin(for remote control), input range is 0.8-2.2V, and its FS can be 8K, 4K, 2K,
1K. In remote control,only the most significant 8 bits are used。
4.10 DAC
ATJ2085’s DAC3 is an on-chip Sigma-Delta Modulator, composed by a high performance DAC.
And the DAC analog block refers to the following diagram. The DAC interface supports 4-level
play back FIFO (8 x 20-bit PCM data for L/R channel) and variable sample rates, such as 48K/
44.1K / 32K/ 24K/ 22.05K/ 16K/ 12K/ 11.025K/ 8KHz. An on-chip PLL2 is used to generate
22.5792MHz from 24.576MHz to support 44.1K/2 2.05 K/ 11.025KHz with 256xFS clock for
over-sampling, while 24.576MHz supports 48K/ 32K/ 24K/ 16K/ 12K/ 8KHz with 256XFS for
over-sampling.
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4.11 Headphone Driver
The output power of ATJ2085’s amplifier is 13mW(each channel).
4.12 Key Scan Interface
When key scan circuit is enabled, ATJ2085 will scan the keyboard periodically. It drives pin Key
out N scan pulse in turn. When any key is pressed, the corresponding Key out N will send out the
scan pulse. When a key is pressed, pin Key in N connecting the key will be found low level.
There are 12 internal 8-bit registers for key value latch per scan. But only another one register
(Key Scan Data Register) for MCU may access key value. Those 12 internal registers are
mapped into this register, and an internal pointer is used to point to the current register to return
scan data when read. Any IO write to this register will clear the internal register, and the pointer
will increase by 1 and point to the next register after read is performed.
4.13 External Memory Interface
ATJ2085 can support NAND type flash from 32M to 1G bytes.
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See the following for NAND flash Read/Write timing.
Read:
Write:
4.14 I2C Interface
ATJ2085’s I2C can be configured as either a master or slave device. In master mode it generates
the clock (I2C_SCL) and initiates transactions on the data line (I2C_SDA). Data on the I2C bus is
byte oriented. Multi-Master mode, 10-bit address and Hi-speed mode are not supported. See the
I2C_Bus_Specification_1995 for detailed information.
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Parameter
Symbol
SCL period
Actions
Typical
Unit
fSCL
100
KHZ
Clock low time
tLOW
5
us
Clock high time
tHIGH
4.5
us
Clock rise time
tr
500
ns
Clock fall time
tf
20
ns
data setup time
tSU:DAT
4.5
us
data hold time
tHD:DAT
50
ns
4.15 USB 2.0(FS) SIE
Communications with the host can be made via speed-programmable USB interface (compliant
with USB SPEC 2.0(FS)). Such communications, including file downloading or uploading,
audio/video data transferring, etc., depend on different implementations to meet different
requirements. 4 endpoints are provided. Endpoint 1 and endpoint 2 are capable of isochronous
transfer mode, and in this case, the maximum packet size can be 1023, according to USB SPEC.
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These two endpoints employ two independent FIFO for bulk or isochronous transfers. Endpoint 0
and endpoint 3 have 8 bytes maximum packet size. There are 4 interrupt requests for each
endpoint respectively. Generally, this setting should be satisfying for most practical needs.
4.15.1 Hard Core
The USB block includes a USB function with one upstream port. The USB port interfaces to the
micro-controller through a programmable-speed serial interface engine (SIE). The SIE allows the
micro-controller to communicate with the USB host.
4.15.2 Interrupts
Two groups of interrupt requests are used to notify the micro-controller that there is some USB
event pending to be handled. One is Global Interrupt group, and the other is Endpoint Interrupt
group. Whenever an interrupt is generated, the SIE will send a low pulse to the micro-controller.
The IRQ will not be invalidated until all the pending interrupts are cleared.
4.16 FM Interface
ATJ2085 can be used as a controller with Philips FM5767 module. 2-wire or 3-wire also can be
used to control the module.
5. Electrical Characteristics
5.1 Absolute Maximum Ratings
Parameter
Supply voltage
Input voltage
Storage
temperature
Symbol
Typical
Rating
Unit
VDD
2.0V
-0.5 to +2.7
V
VCC
3.0V
-0.5 to +3.6
V
VCC >= 3.3
-0.5 to +3.9
V
VCC < 3.3
-0.5 to VCC+0.6
V
-65 to +150
℃
Vi
Tstg
Note:
1. TO = 25℃ (Operating Temperature)
2. Do not short-circuit two or more output pins simultaneously.
3. If even one of the above parameters exceeds the absolute maximum ratings even momentarily,
the quality of the product may be degraded. The absolute maximum ratings, therefore, specify
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the value exceeding which the product may be physically damaged. Use the product well within
these ratings.
4. The specifications and conditions shown in DC Characteristics and AC characteristics are the
ranges for normal operation and quality assurance of the product.
5.2 Capacitance
Parameter
Symbol
Condition
Input capacitance
CI
fC = 1 MHz
I/O capacitance
CIO
MIN.
Unmeasured pins returned to 0 V
MAX.
Unit
15
pF
15
pF
Note: TO = 25℃, VCC = 0 V.
5.3 DC Characteristics
Parameter
Symbol
Condition
MIN.
TYP.
MAX
Unit
VOH
IOH = -2 mA
2.4
/
/
V
VOL
IOL = 2 mA
/
/
0.4
V
High-level input voltage
VIH
/
0.7*VCC
/
VCC + 0.6
V
Low-level input voltage
VIL
/
-0.3
/
0.4VCC
V
Input leakage current
ILI
VCC = 3.6 V, VI = VCC, 0 V
/
/
±10
uA
Output leakage current
ILO
VCC = 3.6 V, VI = VCC, 0 V
/
/
±5
uA
Idrive1
GPOA0,GPOA1,GPOA2
/
2.60
/
mA
Idrive2
Other GPIO
/
1.25
/
mA
/
40
60
mA
50
110
350
uA
9
16
40
mA
25
35
70
uA
High-level output
voltage
Low-level output
voltage
GPIO Drive
In Full speed mode (MCU
IVDD
run 24.576MHz in internal
SRAM, DSP run 36MIPS)
Supply Current
In Standby mode
(Two battery mode)
In Full speed mode (MCU
Ivcc
run 24.576MHz in internal
SRAM, DSP run 36MIPS)
In Standby mode
Notes:
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1. TA = -10℃ to +70℃, VDD = 2.0 V, VCC = 3.0 V
2. IVDD is the total power supply current for 2.0 V power supply. IVDD is applied to the LOGIC, PLL and
OSC blocks.
3. IVCC is the total power supply current for 3.0 V power supply. IVCC is applied to the USB, IO, TP and
AD blocks.
5.4 AC Characteristics (TA = -10℃to +70℃, VDD = 1.8 to 2.7 V, VCC = 2.7 to 3.6 V)
5.4.1 AC test input waveform
5.4.2 AC test output measuring points
5.4.3 Reset Parameter
Parameter
Symbol
Condition
MIN.
Reset input low-level width
tWRSL
RESET# pin
160
MAX.
Unit
us
5.4.4 Initialization Parameter
Parameter
Symbol
Data sampling time (from RESET#)
tSS
Output delay time (from RESET# )
tOD
Condition
MIN.
61.04
MAX.
Unit
61.04
us
us
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5.4.5 GPIO Interface Parameter
Parameter
Symbol
Condition
MIN.
MAX.
Unit
Input level width
tGPIN
Normal operation
11/ fMCUCLK
GPIO input rise time
tGPRISE
200
ns
GPIO input fall time
tGPFALL
200
ns
Output level width
tGPOUT
s
11/ fMCUCLK
s
Notes: fMCUclk is the frequency that MCU is running upon.
Input level width
Input rise/fall time
Output level width
5.4.6 Ordinary ROM Parameter
Parameter
Symbol
Note
Condition
MIN.
MAX.
Unit
tACC
HOSC=24.576MHz
102
ns
Data access time (from CEx# )
tCE
HOSC=24.576MHz
82
ns
Data input setup time
tDS
HOSC=24.576MHz
0
ns
Data input hold time
tDH
HOSC=24.576MHz
0
ns
Data access time (from address)
Note
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5.4.7 External System Bus Parameter
Parameter
Address setup time (to command signal)Note 1, 2
Symbol
Condition
MIN.
MAX.
Unit
tXAS
Memory Read
0.5T
ns
tXAS
Memory Write
1.5T
ns
0.5T
ns
Address hold time (from command signal)Note 1, 2
tXAH
Data output setup time (to command signal)Note 1
tWXDS
0
T
ns
Data output hold time(from command signal)Note 1
tWXDH
3
0.5T
ns
Data input setup time (to command signal)Note 1
tRXDS
0
2T
ns
Data input hold time(from command signal)Note 1
tRXDH
0
ns
Notes: 1. MRD#, MWR# are called the command signals for the External System Bus Interface.
2. T (ns) = 1 / fMCUCLK
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5.4.8 Bus Operation
Instruction Fetch Timing
Memory Read Timing
Memory Write Timing
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IO Read Timing
IO Write Timing
DMA1/2 Timing
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DSP Read/Write Timing
5.4.9 A/D Converter Characteristics
(TA = -10 - +70℃, VDD = 2.0 V, VCC = 3.0V, Sample Rate=32KHz)
Characteristics
Min
Typ.
Dynamic range
Max
60
Total Harmonic Distortion + Noise
50
dB
53
Frequency Response (20-13KHz)
Full Scale Input Voltage(Gain=0dB)
Unit
55
dB
±1
dB
800
mVpp
Note: 1. TA = -10℃ to +70℃, VDD = 2.0 V, VCC = 3.0V.
2. Sample Rate=32 KHz
5.4.10 Headphone Driver Characteristics Table
Characteristics
Min
Dynamic Range –60 dBFS Input
Typ
Max
87
Total Harmonic Distortion + Noise
70
73
Frequency Response 20-20KHz
Unit
dB
75
dB
±0.6
dB
Output Common Mode Voltage
1.5
V
Full Scale Output Voltage
1.6
Inter channel Isolation (1KHz)
91
dB
Inter channel Gain Mismatch(1KHz)
0.025
dB
2.4
Vpp
Note:1. TA =-10 - +70℃, VDD = 2.0 V, VCC = 3.0 V.
2. Sample Rate=32 KHz.
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3. Bias Current=26uA.
4. Volume Level=0x1F.
Frequency Response Diagram of Headphone Driver
Actions Semiconductor
PAFrequencyResponse(linein->PA)@1Vpp
02/09/04 14:24:58
+4
+2
+0
d
B
r
-2
-4
-6
-8
-10
20
50
100
200
500
1k
2k
5k
10k
20k
50k 80k
Hz
Sweep Trace Color
1
2
1
1
LineStyle Thick Data
Magenta Solid
Blue
Solid
1
1
Axis Comment
Anlr.Ampl Left Load=100uF*100Kohm
Anlr.Ampl Left Load=100uF*32ohm
Untitled1
THD + N Amplitude Diagram of Headphone Driver
Actions Semiconductor
PA THD+N vs Amplitude (linein->PA)@1KHz Load=32ohm
02/09/04 10:19:46
+0
-10
-20
-30
-40
d
B
-50
-60
-70
-80
-90
-100
200m
400m
600m
800m
1
1.2
1.4
1.6
1.8
2
2.2
Vpp
Sweep Trace Color
1
2
1
1
Line Style Thick Data
Magenta Solid
Blue
Solid
1
1
Axis Comment
Anlr.THD+N Ratio Left
Anlr.THD+N Ratio Left
Right Channel
Left Channel
Untitled1
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5.4.11 LCM Driver Parameter
Parameter
Symbol
Condition
Typ
Unit
Data access time(write)
tPW80(W)
HOSC=24.576mHZ
29
ns
Data access time (Read)
tPW80(R)
HOSC=24.576mHZ
67
ns
Write cycle time
tCY80(W)
HOSC=24.576mHZ
407
ns
Read cycle time
tCY80(R)
HOSC=24.576mHZ
284
ns
Data setup time
tDS80
HOSC=24.576mHZ
79
ns
Data hold time
tDH80
HOSC=24.576mHZ
8
ns
Address setup time
tAS80
HOSC=24.576mHZ
11
ns
Address hold time
tAH80
HOSC=24.576mHZ
11
ns
Read access time
tACC80
HOSC=24.576mHZ
13
ns
Data input hold time
tOD80
HOSC=24.576mHZ
8
ns
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6. MCU/DSP Dissipation (IVDD VS. Frequency)
6.1 MCU Dissipation
(VBAT=1.5V, DSP under reset, VDD=2.0V, MCU runs in internal SRAM)
Clock Source
32.768KHZ
24.576MHz
Divisor factor
IVDD(Max)
/(1—1024)
350uA
/1
5.9mA
/2
3.3mA
/4
1.9mA
/8
1.2mA
/16
1.9mA
/32
0.7mA
/64
0.6mA
/128
0.58mA
/256
0.56mA
/512
0.55mA
/1024
0.54mA
6.2 DSP Dissipation (VBAT=1.5V, MCU run LOSC, VDD=2.0V, Vcc =3.0V)
DSP Speed (MIPS)
IVDD (Max)
6
3.49mA @ VDD=2.0V
12
6.52mA @ VDD=2.0V
24
11.24mA @ VDD=2.0V
36
16.24mA @ VDD=2.0V
48
21.08mA @ VDD=2.0V
60
28.5mA @ VDD=2.3V
72
33.6mA @ VDD=2.3V
84
38.7mA @ VDD=2.3V
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7. Recommended Soldering Conditions
7.1 Soldering Conditions
Soldering Conditions for Surface-Mount Devices
Soldering Process
Soldering Conditions
Peak package’s surface temperature: 235℃
Infrared ray reflow
Reflow time: 30 seconds or less (210℃or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 3 days (10 hours of pre-baking is required at 125℃ afterward).
Partial heating method
Terminal temperature: 300℃ or less
Heat time: 3 seconds or less (for one side of a device)
Note: Maximum number of days during which the product can be stored at the temperature of 25℃ and
relative humidity of 65% or less after dry-pack package is opened.
Caution: Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
7.2 Precaution against ESD for Semiconductors
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must
be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators
that easily build static electricity. Semiconductor devices must be stored and transported in an
anti-static container, static shielding bag or conductive material. All test and measurement tools
including work bench and floor should be grounded. The operator should be grounded using wrist
strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be
taken for PW boards with semiconductor devices on it.
7.3 Handling of Unused Input Pins for CMOS
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to
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the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of
CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin
should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being
an output pin. All handling related to the unused pins must be judged device by device and related
specifications governing the devices.
7.4 Status before Initialization of MOS Devices
Power-on does not necessarily define initial status of MOS device. Production process of MOS does
not define the initial operation status of the device. Immediately after the power source is turned ON,
the devices with reset function have not yet been initialized. Hence, power-on does not guarantee
out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is
received. Reset operation must be executed immediately after power-on for devices having reset
function.
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8. Package Drawings
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Actions Semiconductor Co., Ltd.
Address: 15-1, NO.1, HIT Road, Tangjia, Zhuhai, Guangdong, China
Tel: +86-756-3392353
Fax: +86-756-3392251, 3392252, 3392253
Post code: 519085
http:// www.actions.com.cn
Business Email: [email protected]
Technical Service Email: [email protected]
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