ICS ICS8430CY-11T

PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS8432-11
700MHZ/350MHZ, LOW PHASE NOISE,
CRYSTAL-TO- 3.3V LVPECL FREQUENCY SYNTHESIZER
GENERAL DESCRIPTION
FEATURES
The ICS8432-11 is a general purpose, dual output
Crystal-to-3.3V Differential LVPECL High Frequency
HiPerClockS™
Synthesizer and a member of the HiPerClockS™
family of High Performance Clock Solutions from
ICS. The ICS8432-11 has a selectable TEST_CLK
or crystal inputs. The TEST_CLK input accepts LVCMOS or
LVTTL input levels and translates them to 3.3V LVPECL
levels. The VCO operates at a frequency range of 200MHz
to 700MHz. The VCO frequency is programmed in steps
equal to the value of the input reference or crystal frequency.
Output frequencies up to 700MHz for FOUT and 350MHz
for FOUT/2 can be programmed using the serial or parallel
interfaces to the configuration logic. The low phase noise
characteristics and the multiple frequency outputs of the
ICS8432-11 makes it an ideal clock source for Fiber Channel
1 and 2, and Infiniband applications.
• Dual differential 3.3V LVPECL outputs
ICS
• Selectable crystal oscillator interface or
LVCMOS/LVTTL TEST_CLK
• TEST_CLK can accept the following input levels:
LVCMOS or LVTTL
• Maximum FOUT frequency: 700MHz
• Maximum FOUT/2 frequency: 350MHz
• VCO range: 200MHz to 700MHz
• Parallel interface for programming counter and
VCO frequency multiplier and dividers
• Cycle-to-cycle jitter: 25ps (maximum)
• RMS period jitter: TBD
• 3.3V supply voltage
• 0°C to 70°C ambient operating temperature
BLOCK DIAGRAM
PIN ASSIGNMENT
XTAL_OUT
nP_LOAD
M0
M1
M2
M3
M4
TEST_CLK
VCO_SEL
VCO_SEL
XTAL_SEL
32 31 30 29 28 27 26 25
XTAL_IN
XTAL_OUT
MR
FOUT
nFOUT
M5
1
24
XTAL_IN
M6
2
23
TEST_CLK
M7
3
22
XTAL_SEL
M8
4
21
VCCA
N0
5
20
S_LOAD
N1
6
19
S_DATA
nc
7
18
S_CLOCK
VEE
8
17
MR
9 10 11 12 13 14 15 16
VEE
nFOUT
FOUT
VCCO
nFOUT/2
FOUT/2
VCC
TEST
FOUT/2
nFOUT/2
S_LOAD
S_DATA
S_CLOCK
nP_LOAD
ICS8432-11
TEST
32-Lead LQFP
7mm x 7mm x 1.4mm package body
Y Package
Top View
M0:M8
N0:N1
The Preliminary Information presented herein represents a product in prototyping or pre-production. The noted characteristics are based on initial
product characterization. Integrated Circuit Systems, Incorporated (ICS) reserves the right to change any circuitry or specifications without notice.
8432CY-11
www.icst.com/products/hiperclocks.html
1
REV. E MAY 20, 2005
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS8432-11
700MHZ/350MHZ, LOW PHASE NOISE,
CRYSTAL-TO- 3.3V LVPECL FREQUENCY SYNTHESIZER
FUNCTIONAL DESCRIPTION
NOTE: The functional description that follows describes
operation using a 25MHz clock input. Valid PLL loop divider
values for different input frequencies are defined in the Input
Frequency Characteristics, Table 5, NOTE 1.
nP_LOAD or until a serial event occurs. As a result, the M and
N bits can be hardwired to set the M divider and N output divider
to a specific default state that will automatically occur during
power-up. The TEST output is LOW when operating in the parallel input mode. The relationship between the VCO frequency,
the input frequency and the M divider is defined as follows:
The ICS8432-11 features a fully integrated PLL and therefore requires no external components for setting the loop
bandwidth. A differential clock input is used as the input to the
ICS8432-11. This input is fed into the phase detector. A 25MHz
clock input provides a 25MHz phase detector reference frequency. The VCO of the PLL operates over a range of 200MHz
to 700MHz. The output of the M divider is also applied to the
phase detector.
fVCO = fxtal x M
The M value and the required values of M0 through M8 are
shown in Table 3B, Programmable VCO Frequency Function
Table. Valid M values for which the PLL will achieve lock are
defined as 8 ≤ M ≤ 28. The frequency out is defined as follows:
fOUT = fVCO = fxtal x M
N
N
Serial operation occurs when nP_LOAD is HIGH and S_LOAD
is LOW. The shift register is loaded by sampling the S_DATA
bits with the rising edge of S_CLOCK. The contents of the
shift register are loaded into the M divider and N output
divider when S_LOAD transitions from LOW-to-HIGH. The
M divide and N output divide values are latched on the HIGHto-LOW transition of S_LOAD. If S_LOAD is held HIGH, data
at the S_DATA input is passed directly to the M divider and
N output divider on each rising edge of S_CLOCK. The serial
mode can be used to program the M and N bits and test bits
T1 and T0. The internal registers T0 and T1 determine the state
of the TEST output as follows:
The phase detector and the M divider force the VCO output
frequency to be M times the reference frequency by adjusting the VCO control voltage. Note, that for some values of M
(either too high or too low), the PLL will not achieve lock. The
output of the VCO is scaled by a divider prior to being sent
to each of the LVPECL output buffers. The divider provides
a 50% output duty cycle.
The programmable features of the ICS8432-11 support two
input modes to program the PLL M divider and N output
divider. The two input operational modes are parallel and
serial. Figure1 shows the timing diagram for each mode. In
parallel mode, the nP_LOAD input is initially LOW. The data
on inputs M0 through M8 and N0 and N1 is passed directly
to the M divider and N output divider. On the LOW-to-HIGH
transition of the nP_LOAD input, the data is latched and the
M divider remains loaded until the next LOW transition on
T1
T0
TEST Output
0
0
LOW
0
1
S_Data, Shift Register Input
1
0
Output of M divider
1
1
CMOS Fout/2
SERIAL LOADING
S_CLOCK
S_DATA
T1
T0
* NULL
N1
N0
M8
M7
M6
M5
M4
M3
M2
M1
M0
S_LOAD
nP_LOAD
PARALLEL LOADING
M, N
M0:M8, N0:N1
nP_LOAD
S_LOAD
Time
FIGURE 1. PARALLEL & SERIAL LOAD OPERATIONS
*NOTE:
8432CY-11
The NULL timing slot must be observed.
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2
REV. E MAY 20, 2005
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS8432-11
700MHZ/350MHZ, LOW PHASE NOISE,
CRYSTAL-TO- 3.3V LVPECL FREQUENCY SYNTHESIZER
TABLE 1. PIN DESCRIPTIONS
Number
Name
Type
Description
1
M5
Input
2, 3, 4,
28, 29,
30, 31, 32
M6, M7, M8,
M0, M1,
M2, M3, M4
Input
M divider inputs. Data latched on LOW-to-HIGH transistion of
Pulldown nP_LOAD input. LVCMOS / LVTTL interface levels.
5, 6
N0, N1
Input
Pulldown
Pullup
7
nc
Unused
8, 1 6
VEE
Power
9
TEST
Output
10
VCC
Power
11, 12
FOUT/2, nFOUT/2
Output
13
VCCO
Power
14, 15
FOUT, nFOUT
Output
17
MR
Input
Pulldown
18
S_CLOCK
Input
Pulldown
19
S_DATA
Input
Pulldown
20
S_LOAD
Input
Pulldown
21
VCCA
Power
22
XTAL_SEL
Input
Pullup
23
24,
25
TEST_CLK
XTAL_IN,
XTAL_OUT
Input
Pulldown
26
nP_LOAD
Input
Pulldown
27
VCO_SEL
Input
Pullup
Input
Determines N output divider value as defined in Table 3C
Function Table. LVCMOS / LVTTL interface levels.
No connect.
Negative supply pins.
Test output which is ACTIVE in the serial mode of operation.
Output driven LOW in parallel mode. LVCMOS interface levels.
Core supply pin.
Half frequency differential output for the synthesizer.
3.3V LVPECL interface levels.
Output supply pin.
Differential output for the synthesizer.
3.3V LVPECL interface levels.
Active High Master Reset. When logic HIGH, the internal dividers
are rset causing the true outputs (FOUTx) to go low and the
inver ted outputs (nFOUTx) to go high. When logic LOW, the
internal dividers and the outputs are enabled. Asser tion of MR
does not affect loaded M, N, and T values.
LVCMOS / LVTTL interface levels.
Clocks in serial data present at S_DATA input into the shift register
on the rising edge of S_CLOCK.
LVCMOS / LVTTL interface levels.
Shift register serial input. Data sampled on the rising edge of
S_CLOCK. LVCMOS / LVTTL interface levels.
Controls transition of data from shift register into the dividers.
LVCMOS / LVTTL interface levels.
Analog supply pin.
Selects between crystal or test inputs as the PLL reference
source. LVCMOS / LVTTL interface levels. Selects XTAL inputs
when HIGH. Selects TEST_CLK when LOW.
Test clock input. LVCMOS / LVTTL interface levels.
Crystal oscillator inputs. XTAL_IN is the input.
XTAL_OUT is the output.
Parallel load input. Determines when data present at M8:M0 is
loaded into M divider, and when data present at N1:N0 sets the
N output divider value. LVCMOS / LVTTL interface levels.
Determines whether synthesizer is in PLL or bypass mode.
LVCMOS / LVTTL interface levels.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
CIN
Input Capacitance
4
pF
RPULLUP
Input Pullup Resistor
51
kΩ
RPULLDOWN
Input Pulldown Resistor
51
kΩ
8432CY-11
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REV. E MAY 20, 2005
PRELIMINARY
Integrated
Circuit
Systems, Inc.
TABLE 3A. PARALLEL
AND
ICS8432-11
700MHZ/350MHZ, LOW PHASE NOISE,
CRYSTAL-TO- 3.3V LVPECL FREQUENCY SYNTHESIZER
SERIAL MODES FUNCTION TABLE
Inputs
MR
nP_LOAD
M
N
S_LOAD
S_CLOCK
S_DATA
H
X
X
X
X
X
X
L
L
Data
Data
X
X
X
L
↑
Data
Data
L
X
X
L
H
X
X
L
↑
Data
L
H
X
X
↑
L
Data
L
H
X
X
↓
L
Data
L
H
X
X
L
X
X
L
H
X
X
H
↑
Data
Conditions
Reset. M and N counters reset.
Data on M and N inputs passed directly to the
M divider. TEST output forced LOW.
Data is latched into input registers and remains
loaded until next LOW transition or until a serial
event occurs.
Serial input mode. Shift register is loaded with
data on S_DATA on each rising edge of
S_CLOCK.
Contents of the shift register are passed to the
M divider.
M divider and N output divider values are latched.
Parallel or serial input do not affect shift registers.
S_DATA passed directly to M divider as it is
clocked.
NOTE: L = LOW
H = HIGH
X = Don't care
↑ = Rising edge transition
↓ = Falling edge transition
TABLE 3B. PROGRAMMABLE VCO FREQUENCY FUNCTION TABLE
VCO Frequency
(MHz)
M Divide
200
8
256
128
64
32
16
8
4
2
1
M8
M7
M6
M5
M4
M3
M2
M1
M0
0
0
0
0
0
1
0
0
0
225
9
0
0
0
0
0
1
0
0
1
250
10
0
0
0
0
0
1
0
1
0
275
11
0
0
0
0
0
1
0
1
1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
650
26
0
0
0
0
1
1
0
1
0
675
27
0
0
0
0
1
1
0
1
1
700
28
0
0
0
0
1
1
1
0
NOTE 1: These M divide values and the resulting frequencies correspond to cr ystal or TEST_CLK input frequency of
25MHz.
0
TABLE 3C. PROGRAMMABLE OUTPUT DIVIDER FUNCTION TABLE
Output Frequency (MHz)
Inputs
N Divider Value
FOUT
FOUT/2
Minimum
Maximum
N1
N0
Minimum
Maximum
0
0
1
200
70 0
125
350
0
1
2
100
350
62.5
175
1
0
4
50
175
31.25
87.5
1
1
8
25
87.5
15.625
43.75
8432CY-11
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4
REV. E MAY 20, 2005
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS8432-11
700MHZ/350MHZ, LOW PHASE NOISE,
CRYSTAL-TO- 3.3V LVPECL FREQUENCY SYNTHESIZER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VCC
4.6V
Inputs, VI
-0.5V to VCC + 0.5 V
Outputs, IO
Continuous Current
Surge Current
50mA
100mA
Package Thermal Impedance, θJA
47.9°C/W (0 lfpm)
Storage Temperature, TSTG
-65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
VCC
VCCA
Test Conditions
Minimum
Typical
Maximum
Units
Positive Supply Voltage
3.135
3.3
3.465
V
Analog Supply Voltage
3.135
3.3
3.465
V
3.135
3.3
VCCO
Output Supply Voltage
3.465
V
IEE
Power Supply Current
110
mA
ICCA
Analog Supply Current
15
mA
Maximum
Units
2
VCC + 0.3
V
-0.3
0.8
V
VCC = VIN = 3.465V
150
µA
VCC = VIN = 3.465V
5
µA
TABLE 4B. LVCMOS / LVTTL DC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
VIH
Input High Voltage
VIL
Input Low Voltage
M0-M4, M6-M8, N0, N1, MR,
S_CLOCK, TEST_CLK,
Input
S_DATA, S_LOAD, nP_LOAD
High Current
M5, XTAL_SEL, VCO_SEL
IIH
IIL
Input
Low Current
Test Conditions
Minimum
Typical
M0-M4, M6-M8, N0, N1, MR,
S_CLOCK, TEST_CLK,
S_DATA, S_LOAD, nP_LOAD
VCC = 3.465V,
VIN = 0V
-5
µA
M5, XTAL_SEL, VCO_SEL
VCC = 3.465V,
VIN = 0V
-150
µA
2. 6
V
VOH
Output
High Voltage
TEST; NOTE 1
VOL
Output
Low Voltage
TEST; NOTE 1
0.5
V
NOTE 1: Outputs terminated with 50Ω to VCCO/2. See “Parameter Measurement Information” section,
“3.3V Output Load Test Circuit” figure.
8432CY-11
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5
REV. E MAY 20, 2005
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS8432-11
700MHZ/350MHZ, LOW PHASE NOISE,
CRYSTAL-TO- 3.3V LVPECL FREQUENCY SYNTHESIZER
TABLE 4C. LVPECL DC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
Maximum
Units
VOH
Output High Voltage; NOTE 1
Test Conditions
Minimum
VCCO - 1.4
Typical
VCCO - 0.9
V
VOL
Output Low Voltage; NOTE 1
VCCO - 2.0
VCCO - 1.7
V
VSWING
Peak-to-Peak Output Voltage Swing
0.6
1. 0
V
Maximum
Units
NOTE 1: Outputs terminated with 50 Ω to VCCO - 2V.
TABLE 5. INPUT FREQUENCY CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
Test Conditions
Minimum
Typical
TEST_CLK; NOTE 1
12
25
MHz
XTAL_IN, XTAL_OUT;
Input Frequency
12
25
MHz
fIN
NOTE 1
S_CLOCK
TBD
MHz
NOTE 1: For the input crystal and TEST_CLK frequency range, the M value must be set for the VCO to operate within the
200MHz to 700MHz range. Using the minimum input frequency of 12MHz, valid values of M are 17 ≤ M ≤ 58. Using the
maximum frequency of 25MHz, valid values of M are 8 ≤ M ≤ 28.
TABLE 6. CRYSTAL CHARACTERISTICS
Parameter
Test Conditions
Minimum Typical
Mode of Oscillation
Maximum
Units
Fundamental
Frequency
12
25
MHz
Equivalent Series Resistance (ESR)
70
Ω
Shunt Capacitance
7
pF
Drive Level
1
mW
TABLE 7. AC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
FOUT
Output Frequency
Test Conditions
tjit(cc)
Cycle-to-Cycle Jitter; NOTE 1, 3
Minimum
Typical
25
Maximum
Units
700
MHz
25
ps
tjit(per)
Period Jitter, RMS; NOTE 1, 3
TBD
ps
tsk(o)
Output Skew; NOTE 2, 3
TBD
ps
tR
Output Rise Time
20% to 80% @ 50MHz
30 0
700
ps
tF
Output Fall Time
20% to 80% @ 50MHz
30 0
700
ps
M, N to nP_LOAD
tS
tH
odc
Setup Time
Hold Time
5
ns
S_DATA to S_CLOCK
5
ns
S_CLOCK to S_LOAD
5
ns
M, N to nP_LOAD
5
ns
S_DATA to S_CLOCK
5
ns
S_CLOCK to S_LOAD
5
ns
Output Duty Cycle
47
PLL Lock Time
tLOCK
All parameters measured at 500MHz unless noted otherwise.
NOTE 1: Jitter performance using XTAL inputs.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differential cross points.
NOTE 3: This parameter is defined in accordance with JEDEC Standard 65.
8432CY-11
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6
53
%
10
ms
REV. E MAY 20, 2005
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS8432-11
700MHZ/350MHZ, LOW PHASE NOISE,
CRYSTAL-TO- 3.3V LVPECL FREQUENCY SYNTHESIZER
PARAMETER MEASUREMENT INFORMATION
2V
VOH
V CC ,
VCCA, VCCO
Qx
SCOPE
VREF
LVPECL
nQx
VEE
VOL
1σ contains 68.26% of all measurements
2σ contains 95.4% of all measurements
3σ contains 99.73% of all measurements
4σ contains 99.99366% of all measurements
6σ contains (100-1.973x10-7)% of all measurements
Histogram
Reference Point
Mean Period
(Trigger Edge)
-1.3V ± 0.165V
(First edge after trigger)
3.3V OUTPUT LOAD AC TEST CIRCUIT
PERIOD JITTER
nFOUT
nFOUT,
nFOUT/2
FOUT,
FOUT/2
➤
nFOUT/2
tcycle
n
➤
FOUT
➤
tcycle n+1
➤
FOUT/2
t jit(cc) = tcycle n –tcycle n+1
tsk(o)
1000 Cycles
OUTPUT SKEW
CYCLE-TO-CYCLE JITTER
nFOUT,
nFOUT/2
80%
FOUT,
FOUT/2
80%
VSW I N G
t PW
t
odc =
Clock
Outputs
PERIOD
t PW
20%
20%
tR
tF
x 100%
t PERIOD
OUPUT DUTY CYCLE/OUTPUT PULSE WIDTH/PERIOD
8432CY-11
OUTPUT RISE/FALL TIME
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REV. E MAY 20, 2005
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS8432-11
700MHZ/350MHZ, LOW PHASE NOISE,
CRYSTAL-TO- 3.3V LVPECL FREQUENCY SYNTHESIZER
APPLICATIONS
STORAGE AREA NETWORKS
application frequencies as well as the ICS8432-11 configurations used to generate the appropriate frequency.
A variety of technologies are used for interconnection of the
elements within a SAN. The tables below list the common
Table 8. COMMON SANS APPLICATIONS FREQUENCIES
Interconnect Technology
Clock Rate
Reference Frequency to SERDES (MHz)
Crystal Frequency (MHz)
Gigabit Ethernet
Fibre Channel
1.25 GHz
125, 250, 156.25
25, 19.53125
FC1 1.0625 GHz
FC2 2.1250 GHz
106.25, 53.125, 132.8125
16.6015625, 25
2.5 GHz
125, 250
25
Infiniband
Table 9. CONFIGURATION DETAILS
Interconnect
Technology
FOR
SANS APPLICATIONS
Crystal Frequency
(MHz)
ICS8432-11
Output Frequency
to SERDES
(MHz)
25
125
0
0
0
0
1
0
1
0
25
250
0
0
0
0
1
0
1
25
156.25
0
0
0
0
1
1
19.53125
156.25
0
0
0
1
0
25
53.125
0
0
0
0
25
106.25
0
0
0
16.6015625
132.8125
0
0
25
125
0
25
250
0
ICS8432-11
M & N Settings
M8 M7 M6 M5 M4 M3 M2
M1 M0
N1
N0
0
1
0
0
0
0
1
0
0
1
1
0
0
0
0
0
1
0
1
0
0
0
1
1
1
0
1
0
0
0
1
1
0
0
1
0
0
0
0
0
1
0
0
0
0
1
0
1
0
0
1
0
0
0
0
1
0
1
0
0
0
1
Gigabit Ethernet
Fiber Channel 1
Fiber Channel 2
Infiniband
8432CY-11
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8
REV. E MAY 20, 2005
PRELIMINARY
Integrated
Circuit
Systems, Inc.
ICS8432-11
700MHZ/350MHZ, LOW PHASE NOISE,
CRYSTAL-TO- 3.3V LVPECL FREQUENCY SYNTHESIZER
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry, the power supply pins
are vulnerable to random noise. The ICS8432-11 provides
separate power supplies to isolate any high switching
noise from the outputs to the internal PLL. VCC, VCCA, and VCCO
should be individually connected to the power supply
plane through vias, and bypass capacitors should be
used for each pin. To achieve optimum jitter performance,
power supply isolation is required. Figure 2 illustrates how
a 10Ω resistor along with a 10μF and a .01μF bypass
capacitor should be connected to each VCCA pin.
TERMINATION
FOR
3.3V
VCC
.01μF
10Ω
V CCA
.01μF
10μF
FIGURE 2. POWER SUPPLY FILTERING
LVPECL OUTPUTS
50Ω transmission lines. Matched impedance techniques should
be used to maximize operating frequency and minimize signal
distortion. Figures 3A and 3B show two different layouts which
are recommended only as guidelines. Other suitable clock layouts may exist and it would be recommended that the board
designers simulate to guarantee compatibility across all printed
circuit and clock component process variations.
The clock layout topology shown below is a typical termination for LVPECL outputs. The two different layouts mentioned
are recommended only as guidelines.
FOUT and nFOUT are low impedance follower outputs that generate ECL/LVPECL compatible outputs. Therefore, terminating
resistors (DC current path to ground) or current sources must
be used for functionality. These outputs are designed to drive
3.3V
Zo = 50Ω
125Ω
FOUT
FIN
Zo = 50Ω
Zo = 50Ω
FOUT
50Ω
RTT =
1
Z
((VOH + VOL) / (VCC – 2)) – 2 o
FIN
50Ω
Zo = 50Ω
VCC - 2V
RTT
84Ω
FIGURE 3A. LVPECL OUTPUT TERMINATION
8432CY-11
125Ω
84Ω
FIGURE 3B. LVPECL OUTPUT TERMINATION
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LAYOUT GUIDELINE
The schematic of the ICS8432-11 layout example used in this
layout guideline is shown in Figure 4A. The ICS8432-11 recommended PCB board layout for this example is shown in Figure
4B. This layout example is used as a general guideline. The lay-
out in the actual system will depend on the selected component
types, the density of the components, the density of the traces,
and the stacking of the P.C. board.
C1
C2
M5
M6
M7
M8
N0
N1
nc
VEE
VCC
ICS8432-11
X_IN
T_CLK
XTAL_SEL
VCCA
S_LOAD
S_DATA
S_CLOCK
MR
TEST
VCC
FOUT/2
nFOUT/2
VCCO
FOUT
nFOUT
VEE
1
2
3
4
5
6
7
8
9
10
11
12
VCC
13
FOUT
14
FOUTN 15
16
U1
M4
M3
M2
M1
M0
VCO_SEL
nP_LOAD
X_OUT
32
31
30
29
28
27
26
25
X1
VCC
24
23
22
21
20
19
18
17
R7
10
REF_IN
XTAL_SEL
VCCA
S_LOAD
S_DATA
S_CLOCK
C11
0.01u
C16
10u
VCC
R1
125
R3
125
Zo = 50 Ohm
IN+
C14
0.1u
TL1
C15
0.1u
+
Zo = 50 Ohm
IN-
TL2
VCC=3.3V
R2
84
FIGURE 4A. SCHEMATIC
8432CY-11
OF
RECOMMENDED LAYOUT
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The following component footprints are used in this layout
example:
• The differential 50Ω output traces should have same
length.
All the resistors and capacitors are size 0603.
• Avoid sharp angles on the clock trace. Sharp angle
turns cause the characteristic impedance to change on
the transmission lines.
POWER
AND
GROUNDING
Place the decoupling capacitors C14 and C15, as close as possible to the power pins. If space allows, placement of the
decoupling capacitor on the component side is preferred. This
can reduce unwanted inductance between the decoupling capacitor and the power pin caused by the via.
• Keep the clock traces on the same layer. Whenever possible, avoid placing vias on the clock traces. Placement
of vias on the traces can affect the trace characteristic
impedance and hence degrade signal integrity.
Maximize the power and ground pad sizes and number of vias
capacitors. This can reduce the inductance between the power
and ground planes and the component power and ground pins.
• To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow a spearation of at least three trace
widths between the differential clock trace and the other
signal trace.
The RC filter consisting of R7, C11, and C16 should be placed
as close to the VCCA pin as possible.
• Make sure no other signal traces are routed between the
clock trace pair.
CLOCK TRACES
• The matching termination resistors should be located as
close to the receiver input pins as possible.
AND
TERMINATION
Poor signal integrity can degrade the system performance or
cause system failure. In synchronous high-speed digital systems,
the clock signal is less tolerant to poor signal integrity than other
signals. Any ringing on the rising or falling edge or excessive ring
back can cause system failure. The shape of the trace and the
trace delay might be restricted by the available space on the board
and the component location. While routing the traces, the clock
signal traces should be routed first and should be locked prior to
routing other signal traces.
CRYSTAL
The crystal X1 should be located as close as possible to the pins
24 (XTAL_IN) and 25 (XTAL_OUT). The trace length between the
X1 and U1 should be kept to a minimum to avoid unwanted parasitic inductance and capacitance. Other signal traces should not
be routed near the crystal traces.
X1
GND
VCC
VIA
U1
PIN 1
C11
C16
VCCA
R7
Close to the input
pins of the
receiver
R4
R3
TL1N
TL1N
C15
C14
TL1
TL1
R2
TL1, TL2 are 50 Ohm traces and
equal length
FIGURE 4B. PCB BOARD LAYOUT
8432CY-11
FOR
ICS8432-11
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POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8432-11.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8432-11 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 110mA = 381.2mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 30mW = 60mW
Total Power_MAX (3.465V, with all outputs switching) = 381.2mW + 60.4mW = 441.2mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 10 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.441W * 42.1°C/W = 88.6°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 10. THERMAL RESISTANCE
ΘJA FOR
32-PIN LQFP, FORCED CONVECTION
θJA by Velocity (Linear Feet per Minute)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
67.8°C/W
47.9°C/W
55.9°C/W
42.1°C/W
50.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
8432CY-11
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3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 5.
VCCO
Q1
VOUT
RL
50
VCCO - 2V
FIGURE 5. LVPECL DRIVER CIRCUIT
AND
TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination
voltage of V - 2V.
CCO
•
For logic high, VOUT = V
OH_MAX
=V
CCO_MAX
– 1.0V
(VCCO_MAX - VOH_MAX) = 1.0V
•
For logic low, VOUT = V
=V
OL_MAX
(V
CCO_MAX
-V
OL_MAX
CCO_MAX
– 1.7V
) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(V
OH_MAX
– (V
CCO_MAX
- 2V))/R ] * (V
CCO_MAX
L
-V
OH_MAX
) = [(2V - (V
CCO_MAX
))/R ] * (V
-V
OH_MAX
CCO_MAX
L
-V
)=
OH_MAX
[(2V - 1V)/50Ω) * 1V = 20.0mW
Pd_L = [(V
OL_MAX
– (V
CCO_MAX
- 2V))/R ] * (V
L
CCO_MAX
-V
OL_MAX
) = [(2V - (V
CCO_MAX
-V
OL_MAX
))/R ] * (V
L
CCO_MAX
-V
OL_MAX
)=
[(2V - 1.7V)/50Ω) * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30.2mW
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RELIABILITY INFORMATION
TABLE 11. θJAVS. AIR FLOW TABLE
FOR
32 LEAD LQFP
θJA by Velocity (Linear Feet per Minute)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
67.8°C/W
47.9°C/W
55.9°C/W
42.1°C/W
50.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS8432-11 is: 3765
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PACKAGE OUTLINE - Y SUFFIX
ICS8432-11
700MHZ/350MHZ, LOW PHASE NOISE,
CRYSTAL-TO- 3.3V LVPECL FREQUENCY SYNTHESIZER
FOR
32 LEAD LQFP
TABLE 12. PACKAGE DIMENSIONS
JEDEC VARIATION
ALL DIMENSIONS IN MILLIMETERS
BBA
SYMBOL
MINIMUM
NOMINAL
MAXIMUM
32
N
A
--
--
1.60
A1
0.05
--
0.15
A2
1.35
1.40
1.45
b
0.30
0.37
0.45
c
0.09
--
0.20
D
9.00 BASIC
D1
7.00 BASIC
D2
5.60 Ref.
E
9.00 BASIC
E1
7.00 BASIC
E2
5.60 Ref.
e
0.80 BASIC
0.60
0.75
L
0.45
θ
0°
--
7°
ccc
--
--
0.10
Reference Document: JEDEC Publication 95, MS-026
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TABLE 13. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
ICS8432CY-11
ICS8432CY-11
32 Lead LQFP
tray
0°C to 70°C
ICS8430CY-11T
ICS8432CY-11
32 Lead LQFP
1000 tape & reel
0°C to 70°C
The aforementioned trademark, HiPerClockS™ is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are
not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS
product for use in life support devices or critical medical instruments.
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