ICS ICS8430I-61

ICS8430I-61
Integrated
Circuit
Systems, Inc.
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
GENERAL DESCRIPTION
FEATURES
The ICS8430I-61 is a general purpose, dual output
Crystal-to-3.3V Differential LVPECL High FreHiPerClockS™
quency Synthesizer and a member of the
HiPerClockS™ family of High Performance Clock
Solutions from ICS. The ICS8430I-61 has a selectable TEST_CLK or crystal inputs. The VCO operates at a frequency range of 250MHz to 500MHz. The VCO frequency is
programmed in steps equal to the value of the input reference
or crystal frequency. The VCO and output frequency can be
programmed using the serial or parallel interfaces to the configuration logic. Frequency steps as small as 1MHz can be
achieved using a 16MHz crystal or TEST_CLK.
• Dual differential 3.3V LVPECL outputs
ICS
• Selectable crystal oscillator interface
or LVCMOS/LVTTL TEST_CLK
• Output frequency range: 20.83MHz to 500MHz
• Crystal input frequency range: 14MHz to 27MHz
• VCO range: 250MHz to 500MHz
• Parallel or serial interface for programming counter
and output dividers
• RMS period jitter: 6ps (maximum)
• Cycle-to-cycle jitter: 30ps (maximum)
• Supply voltage modes:
3.3/3.3/3.3
3.3/3.3/2.5
• -40°C to 85°C ambient operating temperature
BLOCK DIAGRAM
PIN ASSIGNMENT
XTAL_OUT
nP_LOAD
M0
M1
32 31 30 29 28 27 26 25
OSC
1
XTAL_OUT
÷ 16
PLL
PHASE DETECTOR
VCO
MR
÷M
0
1
÷1
÷1.5
÷2
÷3
÷4
÷6
÷8
÷12
1
24
XTAL_IN
M6
2
23
TEST_CLK
M7
3
22
XTAL_SEL
M8
4
21
VCCA
N0
5
20
S_LOAD
N1
6
19
S_DATA
N2
7
18
S_CLOCK
VEE
8
17
MR
ICS8430I-61
9 10 11 12 13 14 15 16
VEE
nFOUT0
FOUT0
VCCO
nFOUT1
FOUT1
TEST
VCC
CONFIGURATION
INTERFACE
LOGIC
M5
TEST
FOUT0
nFOUT0
FOUT1
nFOUT1
32-Lead LQFP
7mm x 7mm x 1.4mm package body
Y Package
Top View
M0:M8
N0:N2
8430AYI-61
M2
0
XTAL_IN
S_LOAD
S_DATA
S_CLOCK
nP_LOAD
M3
M4
XTAL_SEL
TEST_CLK
VCO_SEL
VCO_SEL
www.icst.com/products/hiperclocks.html
1
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
Circuit
Systems, Inc.
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
FUNCTIONAL DESCRIPTION
NOTE: The functional description that follows describes operation using a 16MHz crystal. Valid PLL loop divider values
for different crystal or input frequencies are defined in the Input Frequency Characteristics, Table 5, NOTE 1.
specific default state that will automatically occur during
power-up. The TEST output is LOW when operating in the
parallel input mode. The relationship between the VCO frequency, the crystal frequency and the M divider is defined as
follows: fVCO = fxtal x M
16
The M value and the required values of M0 through M8 are
shown in Table 3B, Programmable VCO Frequency Function
Table. Valid M values for which the PLL will achieve lock for a
16MHz reference are defined as 250 ≤ M ≤ 500. The frequency
out is defined as follows: fout = fVCO = fxtal x M
N
N
16
Serial operation occurs when nP_LOAD is HIGH and S_LOAD
is LOW. The shift register is loaded by sampling the S_DATA
bits with the rising edge of S_CLOCK. The contents of the
shift register are loaded into the M divider and N output divider when S_LOAD transitions from LOW-to-HIGH. The M
divide and N output divide values are latched on the HIGH-toLOW transition of S_LOAD. If S_LOAD is held HIGH, data at
the S_DATA input is passed directly to the M divider and N
output divider on each rising edge of S_CLOCK. The serial
mode can be used to program the M and N bits and test bits
T1 and T0. The internal registers T0 and T1 determine the state
of the TEST output as follows:
The ICS8430I-61 features a fully integrated PLL and therefore requires no external components for setting the loop bandwidth. A parallel-resonant, fundamental crystal is used as the
input to the on-chip oscillator. The output of the oscillator is
divided by 16 prior to the phase detector. With a 16MHz crystal, this provides a 1MHz reference frequency. The VCO of
the PLL operates over a range of 250MHz to 500MHz. The
output of the M divider is also applied to the phase detector.
The phase detector and the M divider force the VCO output
frequency to be M times the reference frequency by adjusting
the VCO control voltage. Note that for some values of M (either too high or too low), the PLL will not achieve lock. The
output of the VCO is scaled by a divider prior to being sent to
each of the LVPECL output buffers. The divider provides a
50% output duty cycle.
The programmable features of the ICS8430I-61 support two
input modes and to program the M divider and N output divider. The two input operational modes are parallel and serial.
Figure 1 shows the timing diagram for each mode. In parallel
mode, the nP_LOAD input is initially LOW. The data on inputs
M0 through M8 and N0 through N2 is passed directly to the M
divider and N output divider. On the LOW-to-HIGH transition
of the nP_LOAD input, the data is latched and the M divider
remains loaded until the next LOW transition on nP_LOAD or
until a serial event occurs. As a result, the M and N bits can
be hard-wired to set the M divider and N output divider to a
T1
T0
TEST Output
0
0
LOW
0
1
S_Data, Shift Register Input
1
0
Output of M divider
1
1
CMOS Fout
SERIAL LOADING
S_CLOCK
S_DATA
T1
t
S
S_LOAD
t
T0
N2
N1
N0
M8
M7
M6
M5
M4
M3
M2
M1
M0
H
nP_LOAD
t
S
PARALLEL LOADING
M0:M8, N0:N2
M, N
nP_LOAD
t
S
t
H
Time
FIGURE 1. PARALLEL & SERIAL LOAD OPERATIONS
8430AYI-61
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2
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
Circuit
Systems, Inc.
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
TABLE 1. PIN DESCRIPTIONS
Number
28, 29, 30
31, 32, 1, 2
Name
M0, M1, M2
M3, M4, M5, M6
Type
3, 4
M7, M8
5, 7
N0, N2
Input
6
N1
Input
8, 16
V EE
Power
9
TEST
Output
10
VCC
Power
Negative supply pins.
Test output which is ACTIVE in the serial mode of operation.
Output driven LOW in parallel mode. LVCMOS interface levels.
Core supply pin.
11, 12
FOUT1, nFOUT1
Output
Differential output for the synthesizer. 3.3V LVPECL interface levels.
13
VCCO
Power
Output supply pin.
14, 15
FOUT0, nFOUT0
Output
Differential output for the synthesizer. 3.3V LVPECL interface levels.
Input
Input
Description
Pulldown M divider inputs. Data latched on LOW-to-HIGH transition of
nP_LOAD input. LVCMOS / LVTTL interface levels.
Pullup
Pulldown Determines output divider value as defined in Table 3C,
Function Table. LVCMOS / LVTTL interface levels.
Pullup
17
MR
Input
Pulldown
18
S_CLOCK
Input
Pulldown
19
S_DATA
Input
Pulldown
20
S_LOAD
Input
Pulldown
21
VCCA
Power
22
XTAL_SEL
Input
Pullup
23
24,
25
TEST_CLK
XTAL_IN,
XTAL_OUT
Input
Pulldown
26
nP_LOAD
Input
Pulldown
27
VCO_SEL
Input
Pullup
Input
Active High Master Reset. When logic HIGH, the internal dividers
are reset causing the true outputs FOUTx to go low and the inver ted
outputs nFOUTx to go high. When Logic LOW, the internal dividers
and the outputs are enabled. Asser tion of MR does not affect loaded
M, N, and T values. LVCMOS / LVTTL interface levels.
Clocks in serial data present at S_DATA input into the shift register
on the rising edge of S_CLOCK. LVCMOS / LVTTL interface levels.
Shift register serial input. Data sampled on the rising edge
of S_CLOCK. LVCMOS / LVTTL interface levels.
Controls transition of data from shift register into the dividers.
LVCMOS / LVTTL interface levels.
Analog supply pin.
Selects between cr ystal oscillator or test inputs as the PLL
reference source. Selects XTAL inputs when HIGH. Selects
TEST_CLK when LOW. LVCMOS / LVTTL interface levels.
Test clock input. LVCMOS / LVTTL interface levels.
Cr ystal oscillator interface. XTAL_IN is the input.
XTAL_OUT is the output.
Parallel load input. Determines when data present at M8:M0 is
loaded into M divider, and when data present at N2:N0 sets the
N output divider value. LVCMOS / LVTTL interface levels.
Determines whether synthesizer is in PLL or bypass mode.
LVCMOS / LVTTL interface levels.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
CIN
Input Capacitance
4
pF
RPULLUP
Input Pullup Resistor
51
KΩ
RPULLDOWN
Input Pulldown Resistor
51
KΩ
8430AYI-61
Test Conditions
www.icst.com/products/hiperclocks.html
3
Minimum
Typical
Maximum
Units
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
Circuit
Systems, Inc.
TABLE 3A. PARALLEL
AND
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
SERIAL MODE FUNCTION TABLE
Inputs
Conditions
MR
nP_LOAD
M
N
S_LOAD
S_CLOCK
S_DATA
H
X
X
X
X
X
X
Reset. Forces outputs LOW.
L
L
Data
Data
X
X
X
Data on M and N inputs passed directly to the M
divider and N output divider. TEST output forced LOW.
L
↑
Data
Data
L
X
X
L
H
X
X
L
↑
Data
L
H
X
X
↑
L
Data
L
H
X
X
↓
L
Data
L
H
X
X
L
X
X
H
↑
Data
L
H
X
X
NOTE: L = LOW
H = HIGH
X = Don't care
↑ = Rising edge transition
↓ = Falling edge transition
Data is latched into input registers and remains loaded
until next LOW transition or until a serial event occurs.
Serial input mode. Shift register is loaded with data on
S_DATA on each rising edge of S_CLOCK.
Contents of the shift register are passed to the
M divider and N output divider.
M divider and N output divider values are latched.
Parallel or serial input do not affect shift registers.
S_DATA passed directly to M divider as it is clocked.
TABLE 3B. PROGRAMMABLE VCO FREQUENCY FUNCTION TABLE (NOTE 1)
VCO Frequency
(MHz)
M Divide
250
250
251
251
256
128
64
32
16
8
4
2
1
M8
M7
M6
M5
M4
M3
M2
M1
M0
0
1
1
1
1
1
0
1
0
0
1
1
1
1
1
0
1
1
252
252
0
1
1
1
1
1
1
0
0
253
253
0
1
1
1
1
1
1
0
1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
498
498
1
1
1
1
1
0
0
1
0
499
499
1
1
1
1
1
0
0
1
1
500
500
1
1
1
1
1
0
1
0
0
NOTE 1: These M divide values and the resulting frequencies correspond to a TEST_CLK or crystal frequency of 16MHz.
TABLE 3C. PROGRAMMABLE OUTPUT DIVIDER FUNCTION TABLE
Inputs
8430AYI-61
N Divider Value
Output Frequency (MHz)
N2
N1
N0
Minimum
Maximum
0
0
0
1
250
500
0
0
1
1.5
166.66
333.33
0
1
0
2
125
250
0
1
1
3
83.33
166.66
1
0
0
4
62.5
125
1
0
1
6
41.66
83.33
1
1
0
8
31.25
62.5
1
1
1
12
20.83
41.66
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4
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
Circuit
Systems, Inc.
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VCC
4.6V
Inputs, VI
-0.5V to VCC + 0.5V
Outputs, IO
Continuous Current
Surge Current
50mA
100mA
Package Thermal Impedance, θJA
47.9°C/W (0 lfpm)
Storage Temperature, TSTG
-65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = -40°C TO 85°C
Symbol
Parameter
Minimum
Typical
Maximum
Units
VCC
Core Supply Voltage
Test Conditions
3.135
3.3
3.465
V
VCCA
Analog Supply Voltage
3.135
3.3
3.465
V
VCCO
Output Supply Voltage
3.135
3.3
3.465
V
I EE
Power Supply Current
155
mA
ICCA
Analog Supply Current
55
mA
Maximum
Units
2
VCC + 0.3
V
2
VCC + 0.3
V
-0.3
0.8
V
-0.3
1.3
V
VCC = VIN = 3.465V
150
µA
VCC = VIN = 3.465V
5
µA
TABLE 4B. LVCMOS / LVTTL DC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = -40°C TO 85°C
Symbol
VIH
VIL
IIH
IIL
Parameter
Input
High Voltage
Input
Low Voltage
Input
High Current
Input
Low Current
Test Conditions
M0:M8, N0:N2, MR,
S_LOAD, S_DATA,
S_CLOCK, nP_LOAD,
VCO_SEL, XTAL_SEL
TEST_CLK
M0:M8, N0:N2, MR,
S_LOAD, S_DATA,
S_CLOCK, nP_LOAD,
VCO_SEL, XTAL_SEL
TEST_CLK
M0-M4, M6-M8, N0, N1, MR,
S_CLOCK, TEST_CLK,
S_DATA, S_LOAD, nP_LOAD
M5, XTAL_SEL, VCO_SEL
M0-M4, M6-M8, N0, N1, MR,
S_CLOCK, TEST_CLK,
S_DATA, S_LOAD, nP_LOAD
M5, XTAL_SEL, VCO_SEL
VOH
Output
High Voltage
TEST; NOTE 1
VOL
Output
Low Voltage
TEST; NOTE 1
Minimum
Typical
VCC = 3.465V,
VIN = 0V
-5
µA
VCC = 3.465V,
VIN = 0V
-150
µA
2.6
V
0.5
V
NOTE 1: Outputs terminated with 50Ω to VCCO/2.
8430AYI-61
www.icst.com/products/hiperclocks.html
5
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
Circuit
Systems, Inc.
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
TABLE 4C. LVPECL DC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VOH
Output High Voltage; NOTE 1
VCCO - 1.4
VCCO - 0.9
V
V OL
Output Low Voltage; NOTE 1
VCCO - 2.0
VCCO - 1.7
V
1.0
V
Peak-to-Peak Output Voltage Swing
0.6
VSWING
NOTE 1: Outputs terminated with 50Ω to VCCO - 2V. See "Parameter Measurement Information" section,
"3.3V Output Load Test Circuit" figure.
TABLE 5. INPUT FREQUENCY CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = -40°C TO 85°C
Symbol Parameter
fIN
Input
Frequency
Maximum
Units
TEST_CLK; NOTE 1
Test Conditions
Minimum
14
Typical
27
MHz
XTAL_IN XTAL_OUT NOTE 1
14
27
MHz
S_CLOCK
50
MHz
NOTE 1: For the input cr ystal and TEST_CLK frequency range, the M value must be set for the VCO to operate within
the 250MHz to 500MHz range. Using the minimum input frequency of 14MHz, valid values of M are 286 ≤ M ≤ 511.
Using the maximum input frequency of 27MHz, valid values of M are 149 ≤ M ≤ 296.
TABLE 6. CRYSTAL CHARACTERISTICS
Parameter
Test Conditions
Minimum
Mode of Oscillation
Typical Maximum
Units
Fundamental
27
MHz
Equivalent Series Resistance (ESR)
Frequency
14
50
Ω
Shunt Capacitance
7
pF
TABLE 7. AC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = -40°C TO 85°C
Symbol
Parameter
FOUT
Output Frequency
Test Conditions
Minimum
Typical
20.83
Maximum
Units
500
MHz
N ≠ 1.5
30
ps
N = 1.5
tjit(cc)
Cycle-to-Cycle Jitter ; NOTE 1, 4
100
ps
tjit(per)
Period Jitter, RMS; NOTE 1, 3
6
ps
tsk(o)
Output Skew; NOTE 2, 4
15
ps
tR / tF
Output Rise/Fall Time
700
ps
20% to 80%
M, N to nP_LOAD
tS
tH
Setup Time
Hold Time
odc
Output Duty Cycle
tLOCK
PLL Lock Time
200
5
ns
S_DATA to S_CLOCK
5
ns
S_CLOCK to S_LOAD
5
ns
M, N to nP_LOAD
5
ns
S_DATA to S_CLOCK
5
ns
S_CLOCK to S_LOAD
5
ns
Even N divides
48
52
%
Odd N divides
45
55
%
1
ms
All AC parameters guaranteed for VCC=VCCA=VCCO=3.3V ±5%.
NOTE 1: Jitter performance using XTAL inputs.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differential cross points.
NOTE 3: N divide = 1.5 characterized using the Wavecrest tailfit algorithm.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
8430AYI-61
www.icst.com/products/hiperclocks.html
6
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
Circuit
Systems, Inc.
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
PARAMETER MEASUREMENT INFORMATION
2V
V CC,
VCCA, VCCO
Qx
SCOPE
nFOUTx
FOUTx
LVPECL
nFOUTy
nQx
VEE
FOUTy
t sk(o)
-1.3V ± 0.165V
OUTPUT SKEW
VOH
nFOUTx
VREF
FOUTx
➤
VOL
1σ contains 68.26% of all measurements
2σ contains 95.4% of all measurements
3σ contains 99.73% of all measurements
4σ contains 99.99366% of all measurements
6σ contains (100-1.973x10-7)% of all measurements
tcycle
➤
n
tcycle n+1
➤
t jit(cc) = tcycle n –tcycle n+1
1000 Cycles
Histogram
Reference Point
➤
3.3V OUTPUT LOAD AC TEST CIRCUIT
Mean Period
(Trigger Edge)
(First edge after trigger)
PERIOD JITTER
CYCLE-TO-CYCLE JITTER
nFOUTx
80%
80%
FOUTx
VSW I N G
Clock
Outputs
Pulse Width
20%
20%
tR
t
PERIOD
tF
odc =
t PW
t PERIOD
OUTPUT RISE/FALL TIME
8430AYI-61
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
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7
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
Circuit
Systems, Inc.
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
APPLICATION INFORMATION
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry, the power supply pins
are vulnerable to random noise. The ICS8430I-61 provides
separate power supplies to isolate any high switching
noise from the outputs to the internal PLL. VCC, VCCA, and VCCO
should be individually connected to the power supply
plane through vias, and bypass capacitors should be
used for each pin. To achieve optimum jitter performance,
power supply isolation is required. Figure 2 illustrates how
a 10Ω resistor along with a 10µF and a .01µF bypass
capacitor should be connected to each VCCA pin.
3.3V
VCC
.01µF
10Ω
VCCA
.01µF
10 µF
FIGURE 2. POWER SUPPLY FILTERING
TERMINATION FOR LVPECL OUTPUTS
drive 50Ω transmission lines. Matched impedance techniques
should be used to maximize operating frequency and minimize signal distortion. There are a few simple termination
schemes. Figures 3A and 3B show two different layouts which
are recommended only as guidelines. Other suitable clock layouts may exist and it would be recommended that the board
designers simulate to guarantee compatibility across all printed
circuit and clock component process variations.
The clock layout topology shown below is a typical termination for LVPECL outputs. The two different layouts mentioned
are recommended only as guidelines.
FOUT and nFOUT are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, terminating resistors (DC current path to ground) or current sources
must be used for functionality. These outputs are designed to
3.3V
Zo = 50Ω
125Ω
FOUT
125Ω
FIN
Zo = 50Ω
Zo = 50Ω
FOUT
50Ω
RTT =
1
Z
((VOH + VOL) / (VCC – 2)) – 2 o
Zo = 50Ω
VCC - 2V
RTT
84Ω
FIGURE 3A. LVPECL OUTPUT TERMINATION
8430AYI-61
FIN
50Ω
84Ω
FIGURE 3B. LVPECL OUTPUT TERMINATION
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8
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
Circuit
Systems, Inc.
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
CRYSTAL INPUT INTERFACE
error. These same capacitor values will tune any 18pF parallel resonant crystal over the frequency range and other parameters specified in this data sheet. The optimum C1 and C2
values can be slightly adjusted for different board layouts.
The ICS8430I-61 has been characterized with 18pF parallel
resonant crystals. The capacitor values, C1 and C2, shown
in Figure 4 below were determined using a 25MHz, 18pF parallel resonant crystal and were chosen to minimize the ppm
XTAL_IN
C1
22p
X1
18pF Parallel Cry stal
XTAL_OUT
C2
22p
ICS84332
ICS8430I-61
Figure 4. CRYSTAL INPUt INTERFACE
LAYOUT GUIDELINE
The schematic of the ICS8430I-61 layout example used in
this layout guideline is shown in Figure 5A. The ICS8430I-61
recommended PCB board layout for this example is shown in
Figure 5B. This layout example is used as a general guideline.
The layout in the actual system will depend on the selected
component types, the density of the components, the density
of the traces, and the stack up of the P.C. board.
C2
C1
U1
M5
M6
M7
M8
N0
N1
N2
VEE
XTAL_IN
REF_IN
nXTAL_SEL
VCCA
S_LOAD
S_DATA
S_CLOCK
MR
VCC
24
23
22
21
20
19
18
17
R7
10
REF_IN
XTAL_SEL
VCCA
S_LOAD
S_DATA
S_CLOCK
C11
C16
10u
0.01u
VCC
8430-61
9
10
11
12
VCC
13
FOUT
14
FOUTN 15
16
TEST
VCC
FOUT1
nFOUT1
VCCO
FOUT0
nFOUT0
VEE
1
2
3
4
5
6
7
8
M4
M3
M2
M1
M0
VCO_SEL
nP_LOAD
XTAL_OUT
32
31
30
29
28
27
26
25
X1
VCC
R1
125
R3
125
Zo = 50 Ohm
IN+
C14
0.1u
TL1
C15
0.1u
+
Zo = 50 Ohm
IN-
-
TL2
R2
84
FIGURE 5A. SCHEMATIC
8430AYI-61
OF
RECOMMENDED LAYOUT
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9
R4
84
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
Circuit
Systems, Inc.
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
• The traces with 50Ω transmission lines TL1 and TL2 at
FOUT and nFOUT should have equal delay and run adjacent to each other. Avoid sharp angles on the clock trace.
Sharp angle turns cause the characteristic impedance to
change on the transmission lines.
The following component footprints are used in this layout
example: All the resistors and capacitors are size 0603.
POWER
AND
GROUNDING
Place the decoupling capacitors C14 and C15 as close as possible to the power pins. If space allows, placing the decoupling
capacitor at the component side is preferred. This can reduce
unwanted inductance between the decoupling capacitor and the
power pin generated by the via.
• Keep the clock trace on the same layer. Whenever possible, avoid any vias on the clock traces. Any via on the
trace can affect the trace characteristic impedance and
hence degrade signal quality.
• To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow more space between the clock trace
and the other signal trace.
Maximize the pad size of the power (ground) at the decoupling
capacitor. Maximize the number of vias between power (ground)
and the pads. This can reduce the inductance between the power
(ground) plane and the component power (ground) pins.
• Make sure no other signal trace is routed between the
clock trace pair.
If VCCA shares the same power supply with VCC, insert the RC
filter R7, C11, and C16 in between. Place this RC filter as close
to the VCCA pin as possible.
CLOCK TRACES
AND
The matching termination resistors R1, R2, R3 and R4 should
be located as close to the receiver input pins as possible. Other
termination schemes can also be used but are not shown in
this example.
TERMINATION
The component placements, locations and orientations should be
arranged to achieve the best clock signal quality. Poor clock signal
quality can degrade the system performance or cause system failure. In the synchronous high-speed digital system, the clock signal
is less tolerable to poor signal quality than other signals. Any ringing on the rising or falling edge or excessive ring back can cause
system failure. The trace shape and the trace delay might be restricted by the available space on the board and the component
location. While routing the traces, the clock signal traces should be
routed first and should be locked prior to routing other signal traces.
CRYSTAL
The crystal X1 should be located as close as possible to the pins
24 (XTAL_IN) and 25 (XTAL_OUT). The trace length between the
X1 and U1 should be kept to a minimum to avoid unwanted parasitic inductance and capacitance. Other signal traces should not
be routed near the crystal traces.
GND
C1
C2
VCC
X1
VIA
U1
PIN 1
C16
C11
VCCA
R7
Close to the input
pins of the
receiver
TL1N
C15
TL1
C14
TL1
R1
R2
TL1N
R3
R4
TL1, TL21N are 50 Ohm
traces and equal length
FIGURE 5B. PCB BOARD LAYOUT FOR ICS8430I-61
8430AYI-61
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10
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
Circuit
Systems, Inc.
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8430I-61.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8430I-61 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 155mA = 537.1mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 30mW = 60mW
Total Power_MAX (3.465V, with all outputs switching) = 537.1mW + 60mW = 597.1mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 8 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.597W * 42.1°C/W = 110.1°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 8. THERMAL RESISTANCE θJA
FOR
32-PIN LQFP, FORCED CONVECTION
θJA by Velocity (Linear Feet per Minute)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
67.8°C/W
47.9°C/W
55.9°C/W
42.1°C/W
50.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
8430AYI-61
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11
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
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Systems, Inc.
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 6.
VCCO
Q1
VOUT
RL
50
VCCO - 2V
FIGURE 6. LVPECL DRIVER CIRCUIT
TERMINATION
AND
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination
voltage of V - 2V.
CCO
•
For logic high, VOUT = V
OH_MAX
(V
CCO_MAX
•
-V
OH_MAX
OL_MAX
CCO_MAX
-V
OL_MAX
CCO_MAX
– 0.9V
) = 0.9V
For logic low, VOUT = V
(V
=V
=V
CCO_MAX
– 1.7V
) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(V
OH_MAX
– (V
CCO_MAX
- 2V))/R ] * (V
CCO_MAX
L
-V
OH_MAX
) = [(2V - (V
CCO_MAX
-V
OH_MAX
))/R ] * (V
CCO_MAX
L
-V
OH_MAX
)=
[(2V - 0.9V)/50Ω] * 0.9V = 19.8mW
Pd_L = [(V
OL_MAX
– (V
CCO_MAX
- 2V))/R ] * (V
L
CCO_MAX
-V
OL_MAX
) = [(2V - (V
CCO_MAX
-V
OL_MAX
))/R ] * (V
L
CCO_MAX
-V
OL_MAX
)=
[(2V - 1.7V)/50Ω] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
8430AYI-61
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12
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
Circuit
Systems, Inc.
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
RELIABILITY INFORMATION
TABLE 9. θJAVS. AIR FLOW TABLE
FOR
32 LEAD LQFP
θJA by Velocity (Linear Feet per Minute)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
67.8°C/W
47.9°C/W
55.9°C/W
42.1°C/W
50.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS8430I-61 is: 4258
8430AYI-61
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13
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
Circuit
Systems, Inc.
PACKAGE OUTLINE - Y SUFFIX
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
FOR
32 LEAD LQFP
TABLE 10. PACKAGE DIMENSIONS
JEDEC VARIATION
ALL DIMENSIONS IN MILLIMETERS
BBA
SYMBOL
MINIMUM
NOMINAL
MAXIMUM
32
N
A
--
--
1.60
A1
0.05
--
0.15
A2
1.35
1.40
1.45
b
0.30
0.37
0.45
c
0.09
--
0.20
D
9.00 BASIC
D1
7.00 BASIC
D2
5.60 Ref.
E
9.00 BASIC
E1
7.00 BASIC
E2
5.60 Ref.
e
0.80 BASIC
L
0.45
0.60
0.75
θ
0°
--
7°
ccc
--
--
0.10
Reference Document: JEDEC Publication 95, MS-026
8430AYI-61
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14
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
Circuit
Systems, Inc.
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
TABLE 11. ORDERING INFORMATION
Part/Order Number
Marking
Package
Count
Temperature
ICS8430AYI-61
ICS8430AYI-61
32 Lead LQFP
250 per tray
-40°C to 85°C
ICS8430AYI-61T
ICS8430AYI-61
32 Lead LQFP on Tape and Reel
1000
-40°C to 85°C
The aforementioned trademark, HiPerClockS™ is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not
recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product
for use in life support devices or critical medical instruments.
8430AYI-61
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15
REV. A OCTOBER 21, 2004
ICS8430I-61
Integrated
Circuit
Systems, Inc.
500MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
REVISION HISTORY SHEET
Rev
A
8430AYI-61
Table
Page
1
T7
6
Description of Change
Features Section - changed Supply Voltage bullet.
AC Table - Added 3V Note.
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16
Date
10/21/04
REV. A OCTOBER 21, 2004