ICS ICS85411

ICS85411
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVDS FANOUT BUFFER
GENERAL DESCRIPTION
FEATURES
The ICS85411 is a low skew, high performance
1-to-2 Differential-to-LVDS Fanout Buffer and a
HiPerClockS™
member of the HiPerClockS™family of High
Performance Clock Solutions from ICS. The
CLK, nCLK pair can accept most standard differential input levels.The ICS85411 is characterized to operate from a 3.3V power supply. Guaranteed output and
par t-to-par t skew characteristics make the ICS85411
ideal for those clock distribution applications demanding well defined performance and repeatability.
• 2 differential LVDS outputs
ICS
• 1 differential CLK, nCLK clock input
• CLK, nCLK pair can accept the following differential
input levels: LVPECL, LVDS, LVHSTL, SSTL, HCSL
• Maximum output frequency: 650MHz
• Translates any single ended input signal to
LVDS levels with resistor bias on nCLK input
• Output skew: 20ps (maximum)
• Part-to-part skew: 250ps (maximum)
• Additive phase jitter, RMS: 0.05ps (typical)
• Propagation delay: 2.5 ns (maximum)
• 3.3V operating supply
• 0°C to 70°C ambient operating temperature
• Lead-Free package available
• Industrial temperature information available upon request
BLOCK DIAGRAM
CLK
nCLK
PIN ASSIGNMENT
Q0
nQ0
Q1
nQ1
Q0
nQ0
Q1
nQ1
1
2
3
4
8
7
6
5
VDD
CLK
nCLK
GND
ICS85411
8-Lead SOIC
3.90mm x 4.90mm x 1.37mm package body
M Package
Top View
85411AM
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1
REV. B JUNE 16, 2004
ICS85411
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVDS FANOUT BUFFER
TABLE 1. PIN DESCRIPTIONS
Number
Name
Type
Description
1, 2
Q0, nQ0
Output
3, 4
Q1, nQ1
Output
Differential output pair. LVDS interface levels.
5
GND
Power
Power supply ground.
6
nCLK
Input
7
CLK
Input
8
VDD
Power
Differential output pair. LVDS interface levels.
Pulldown Inver ting differential clock input.
Pullup
Non-inver ting differential clock input.
Positive supply pin.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
CIN
Input Capacitance
4
pF
RPULLUP
Input Pullup Resistor
51
KΩ
RPULLDOWN
Input Pulldown Resistor
51
KΩ
85411AM
Test Conditions
Minimum
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2
Typical
Maximum
Units
REV. B JUNE 16, 2004
ICS85411
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVDS FANOUT BUFFER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VDD
4.6V
Inputs, VI
-0.5V to VDD + 0.5V
Outputs, IO
Continuous Current
Surge Current
10mA
15mA
Package Thermal Impedance, θJA
112.7°C/W (0 lfpm)
Storage Temperature, TSTG
-65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
TABLE 3A. POWER SUPPLY DC CHARACTERISTICS, VDD = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
Test Conditions
VDD
Positive Supply Voltage
IDD
Power Supply Current
Minimum
Typical
Maximum
Units
3.135
3.3
3.465
V
50
mA
Maximum
Units
TABLE 3B. DIFFERENTIAL DC CHARACTERISTICS, VDD = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
Test Conditions
IIH
Input High Current
IIL
Input Low Current
V PP
Peak-to-Peak Input Voltage
Minimum
Typical
CLK
VDD = VIN = 3.465V
5
µA
nCLK
VDD = VIN = 3.465V
150
µA
CLK
VDD = 3.465V, VIN = 0V
nCLK
VDD = 3.465V, VIN = 0V
-150
µA
-5
µA
0.15
Common Mode Input Voltage; NOTE 1, 2
0.5
VCMR
NOTE 1: Common mode voltage is defined as VIH.
NOTE 2: For single ended applications, the maximum input voltage for CLK, nCLK is VDD + 0.3V.
1.3
V
VDD - 0.85
V
TABLE 3C. LVDS DC CHARACTERISTICS, VDD = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
VOD
Differential Output Voltage
∆ VOD
VOD Magnitude Change
VOS
Offset Voltage
Test Conditions
Minimum
Typical
Maximum
Units
200
280
360
mV
0
40
mV
1.125
1.25
1.375
V
5
25
mV
-20
±1
+20
µA
∆ VOS
VOS Magnitude Change
IOFF
Power Off Leakage
IOSD
Differential Output Shor t Circuit Current
-3.5
-5
mA
IOS
Output Shor t Circuit Current
-3.5
-5
mA
VOH
Output High Voltage
1.34
1.6
V
VOL
Output Low Voltage
85411AM
0.9
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3
1.06
V
REV. B JUNE 16, 2004
ICS85411
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVDS FANOUT BUFFER
TABLE 4. AC CHARACTERISTICS, VDD = 3.3V±5% TA = 0°C TO 70°C
Symbol Parameter
Test Conditions
Minimum
Typical
Maximum
Units
650
MHz
fMAX
Output Frequency
t PD
Propagation Delay; NOTE 1
2.5
ns
tsk(o)
Output Skew; NOTE 2, 4
20
ps
tsk(pp)
250
ps
tR / tF
Par t-to-Par t Skew; NOTE 3, 4
Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter Section
Output Rise/Fall Time
odc
Output Duty Cycle
tjit
1.5
(12KHz to 20MHz)
0.05
20% to 80%
150
350
> 500MHz
47
53
%
52
%
48
≤ 500MHz
All parameters measured at IJ 650MHz unless noted otherwise.
NOTE 1: Measured from the differential input crossing point to the differential output crossing point.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differential cross points.
NOTE 3: Defined as skew between outputs on different devices operating at the same supply voltages
and with equal load conditions. Using the same type of inputs on each device, the outputs are measured
at the differential cross points.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
85411AM
ps
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4
ps
REV. B JUNE 16, 2004
ICS85411
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVDS FANOUT BUFFER
ADDITIVE PHASE JITTER
the 1Hz band to the power in the fundamental. When the required offset is specified, the phase noise is called a dBc value,
which simply means dBm at a specified offset from the fundamental. By investigating jitter in the frequency domain, we get a
better understanding of its effects on the desired application over
the entire time record of the signal. It is mathematically possible
to calculate an expected bit error rate given a phase noise plot.
The spectral purity in a band at a specific offset from the fundamental compared to the power of the fundamental is called the
dBc Phase Noise. This value is normally expressed using a
Phase noise plot and is most often the specified plot in many
applications. Phase noise is defined as the ratio of the noise
power present in a 1Hz band at a specified offset from the fundamental frequency to the power value of the fundamental. This
ratio is expressed in decibels (dBm) or a ratio of the power in
0
-10
Input/Output Additive Phase Jitter
-20
@ 200MHz (12KHz to 20MHz)
= 0.05ps typical
-30
-40
-50
SSB PHASE NOISE dBc/HZ
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
-190
100
1k
10k
100k
1M
10M
100M
500M
OFFSET FROM CARRIER FREQUENCY (HZ)
As with most timing specifications, phase noise measurements
have issues. The primary issue relates to the limitations of the
equipment. Often the noise floor of the equipment is higher than
the noise floor of the device. This is illustrated above. The de-
85411AM
vice meets the noise floor of what is shown, but can actually be
lower. The phase noise is dependant on the input source and
measurement equipment.
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5
REV. B JUNE 16, 2004
ICS85411
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVDS FANOUT BUFFER
PARAMETER MEASUREMENT INFORMATION
VDD
3.3V
SCOPE
nCLK
Qx
V
3.3V±5%
Power Supply
Float GND
+
-
LVDS
V
Cross Points
PP
CMR
CLK
nQx
GND
3.3V OUTPUT LOAD AC TEST CIRCUIT
DIFFERENTIAL INPUT LEVEL
nQx
PART 1
Qx
nQx
nQy
PART 2
Qy
nQy
Qx
Qy
t sk(pp)
t sk(o)
PART-TO-PART SKEW
OUTPUT SKEW
nCLK
80%
80%
CLK
VOD
Clock
Outputs
nQ0, nQ1
20%
20%
tR
Q0, Q1
tF
tPD
PROPAGATION DELAY
OUTPUT RISE/FALL TIME
VDD
out
Pulse Width
t
odc =
PERIOD
DC Input
LVDS
t PW
100
➤
VOD/∆ VOD
out
➤
Q0, Q1
➤
nQ0, nQ1
t PERIOD
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
85411AM
DIFFERENTIAL OUTPUT VOLTAGE SETUP
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6
REV. B JUNE 16, 2004
ICS85411
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVDS FANOUT BUFFER
VDD
out
LVDS
➤
DC Input
LVDS
➤
out
VOS/∆ VOS
➤
VDD
IOFF
➤
POWER OFF LEAKAGE SETUP
OFFSET VOLTAGE SETUP
VDD
VDD
out
DC Input
➤
out
IOS
LVDS
DC Input
➤
IOSB
IOSD
out
out
OUTPUT SHORT CIRCUIT CURRENT SETUP
85411AM
➤
LVDS
DIFFERENTIAL OUTPUT SHORT CIRCUIT CURRENT SETUP
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7
REV. B JUNE 16, 2004
ICS85411
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVDS FANOUT BUFFER
APPLICATION INFORMATION
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS
of R1 and R2 might need to be adjusted to position the V_REF in
the center of the input voltage swing. For example, if the input
clock swing is only 2.5V and VDD = 3.3V, V_REF should be 1.25V
and R2/R1 = 0.609.
Figure 1 shows how the differential input can be wired to accept
single ended levels. The reference voltage V_REF = VDD/2 is
generated by the bias resistors R1, R2 and C1. This bias circuit
should be located as close as possible to the input pin. The ratio
VDD
R1
1K
Single Ended Clock Input
CLK
V_REF
nCLK
C1
0.1u
R2
1K
FIGURE 1. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT
LVDS DRIVER TERMINATION
A general LVDS interface is shown in Figure 2. In a 100Ω
differential transmission line environment, LVDS drivers
require a matched load termination of 100Ω across near the
receiver input. For a multiple LVDS outputs buffer, if only
partial outputs are used, it is recommended to terminate
the un-used outputs.
3.3V
3.3V
LVDS
+
R1
100
-
100 Ohm Differential Transmission Line
FIGURE 2. TYPICAL LVDS DRIVER TERMINATION
85411AM
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8
REV. B JUNE 16, 2004
ICS85411
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVDS FANOUT BUFFER
DIFFERENTIAL CLOCK INPUT INTERFACE
The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL
and other differential signals. Both VSWING and VOH must meet the
VPP and VCMR input requirements. Figures 3A to 3E show interface examples for the HiPerClockS CLK/nCLK input driven by
the most common driver types. The input interfaces suggested
here are examples only. Please consult with the vendor of the
driver component to confirm the driver termination requirements.
For example in Figure 3A, the input termination applies for ICS
HiPerClockS LVHSTL drivers. If you are using an LVHSTL driver
from another vendor, use their termination recommendation.
3.3V
3.3V
3.3V
1.8V
Zo = 50 Ohm
CLK
Zo = 50 Ohm
CLK
Zo = 50 Ohm
nCLK
Zo = 50 Ohm
LVPECL
nCLK
HiPerClockS
Input
LVHSTL
ICS
HiPerClockS
LVHSTL Driver
R1
50
R1
50
HiPerClockS
Input
R2
50
R2
50
R3
50
FIGURE 3A. HIPERCLOCKS CLK/nCLK INPUT DRIVEN
ICS HIPERCLOCKS LVHSTL DRIVER
FIGURE 3B. HIPERCLOCKS CLK/nCLK INPUT DRIVEN
3.3V LVPECL DRIVER
BY
3.3V
3.3V
3.3V
Zo = 50 Ohm
3.3V
3.3V
R3
125
BY
R4
125
LVDS_Driv er
Zo = 50 Ohm
CLK
CLK
R1
100
Zo = 50 Ohm
nCLK
LVPECL
R1
84
HiPerClockS
Input
nCLK
Receiv er
Zo = 50 Ohm
R2
84
FIGURE 3C. HIPERCLOCKS CLK/nCLK INPUT DRIVEN
3.3V LVPECL DRIVER
FIGURE 3D. HIPERCLOCKS CLK/nCLK INPUT DRIVEN
3.3V LVDS DRIVER
BY
BY
3.3V
3.3V
3.3V
LVPECL
Zo = 50 Ohm
C1
Zo = 50 Ohm
C2
R3
125
R4
125
CLK
nCLK
R5
100 - 200
R6
100 - 200
R1
84
HiPerClockS
Input
R2
84
R5,R6 locate near the driver pin.
FIGURE 3E. HIPERCLOCKS CLK/nCLK INPUT DRIVEN
3.3V LVPECL DRIVER WITH AC COUPLE
85411AM
BY
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9
REV. B JUNE 16, 2004
ICS85411
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVDS FANOUT BUFFER
RELIABILITY INFORMATION
TABLE 5.
θJAVS. AIR FLOW TABLE FOR 8 LEAD SOIC
θJA by Velocity (Linear Feet per Minute)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
153.3°C/W
112.7°C/W
128.5°C/W
103.3°C/W
115.5°C/W
97.1°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS85411 is: 636
85411AM
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10
REV. B JUNE 16, 2004
ICS85411
Integrated
Circuit
Systems, Inc.
PACKAGE OUTLINE - M SUFFIX
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVDS FANOUT BUFFER
FOR
8 LEAD SOIC
TABLE 6. PACKAGE DIMENSIONS
SYMBOL
Millimeters
MINIMUN
N
MAXIMUM
8
A
1.35
1.75
A1
0.10
0.25
B
0.33
0.51
C
0.19
0.25
D
4.80
5.00
E
3.80
4.00
e
1.27 BASIC
H
5.80
6.20
h
0.25
0.50
L
0.40
1.27
α
0°
8°
Reference Document: JEDEC Publication 95, MS-012
85411AM
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11
REV. B JUNE 16, 2004
ICS85411
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVDS FANOUT BUFFER
TABLE 7. ORDERING INFORMATION
Part/Order Number
Marking
Package
Count
Temperature
ICS85411AM
85411AM
8 lead SOIC
96 per tube
0°C to 70°C
ICS85411AMT
85411AM
8 lead SOIC on Tape and Reel
2500
0°C to 70°C
ICS85411AMLF
85411AMLF
8 lead "Lead Free" SOIC
96 per tube
0°C to 70°C
ICS85411AMLFT
85411AMLF
8 lead "Lead Free" SOIC on Tape and Reel
2500
0°C to 70°C
The aforementioned trademark, HiPerClockS™ is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are
not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS
product for use in life support devices or critical medical instruments.
85411AM
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12
REV. B JUNE 16, 2004
ICS85411
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVDS FANOUT BUFFER
REVISION HISTORY SHEET
Rev
Table
B
T4
B
T7
85411AM
Page
1
4
5
12
Description of Change
Features - added Additive Phase Jitter bullet.
AC Characteristics table - added tjit row.
Added Additive Phase Jitter Application Note
Ordering Information Table - added Lead Free Par t Number.
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13
Date
6/9/04
6/16/04
REV. B JUNE 16, 2004