ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com Isolated Profibus RS-485 Transceiver with Integrated Transformer Driver Check for Samples: ISO1176T FEATURES APPLICATIONS • • • • • • • • 1 2 • • • • • • • • 3000VRMS / 4242VPK Isolation Meets or Exceeds the Requirements of EN 50170 and TIA/EIA RS-485 Signaling Rates up to 40 Mbps Easy Isolated Power Design with Integrated Transformer Driver Typical Efficiency > 60% (ILOAD = 100 mA) - see sluu471 Differential Output exceeds 2.1V (54Ω Load) Low Bus Capacitance 10pF (MAX) 50kV/µs Typical Transient Immunity UL 1577, IEC 60747-5-2 (VDE 0884, Rev. 2) Approvals Pending Fail-safe Receiver for Bus Open, Short, or Idle Profibus® Factory Automation Networked Sensors Motor/motion Control HVAC and Building Automation Networks Networked Security Stations DESCRIPTION The ISO1176T is an isolated differential line transceiver with integrated oscillator outputs that provide the primary voltage for an isolation transformer. The device is ideal for long transmission lines because the ground loop is broken to allow the device to operate with a much larger common-mode voltage range. The symmetrical isolation barrier of each device is tested to provide 4242VPK of isolation per VDE for 60 seconds between the line transceiver and the logic-level interface. The galvanically isolated differential bus transceiver is an integrated circuit designed for bi-directional data communication on multipoint bus-transmission lines. The transceiver combines a galvanically isolated differential line driver and differential input line receiver. The driver has an active-high enable with isolated enable-state output on the ISODE pin (pin 10) to facilitate direction control. The driver differential outputs and the receiver differential inputs connect internally to form a differential input/output (I/O) bus port that is designed to offer minimum loading to the bus whenever the driver is disabled or VCC2 = 0. Any cabled I/O can be subjected to electrical noise transients from various sources. These noise transients can cause damage to the transceiver and/or near-by sensitive circuitry if they are of sufficient magnitude and duration. The ISO1176T can significantly reduce the risk of data corruption and damage to expensive control circuits. The device is characterized for operation over the ambient temperature range of –40°C to 85°C. D1 D1 D2 GND1 VCC1 R RE DE D 1 2 3 16 15 4 14 13 5 12 6 11 7 10 8 9 VCC2 GND2 GND2 B A GND2 ISODE GND2 D2 R RE 1 2 5 6 8 D DE 7 OSC GALVANIC ISOLATIO N DW PACKAGE 13 B 12 A 10 ISODE 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Profibus is a registered trademark of Profibus International. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2011, Texas Instruments Incorporated ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DEVICE INFORMATION X-FMR 4 8 3 2 7 6 1 5 LDO D1 1 C4 C5 3 2 C1 OUT IN 5 C6 EN GND NC 4 D2 1 2 4 C2 3 5 6 Control Circuitry VCC2 D1 16 C3 Isolated Supply to other Components D2 VCC1 B GND1 A R ISODE 13 12 10 Profibus Interface RE 7 DE GND2 D GND2 8 14, 15 9, 11 Figure 1. Typical Applications PIN DESCRIPTIONS NAME PIN # FUNCTION D1 1 Transformer Driver Terminal 1, Open Drain Output D2 2 Transformer Driver Terminal 2, Open Drain Output GND1 3 Logic-side Ground VCC1 4 Logic-side Power Supply R 5 Receiver Output RE 6 Receiver Enable Input. This pin has complementary logic. DE 7 Driver Enable Input D 8 Driver Input GND2 9, 11, 14, 15 ISODE 10 Bus-side Driver Enable Output Status A 12 Non-inverting Driver Output / Receiver Input B 13 Inverting Driver Output / Receiver Input VCC2 16 Bus-side Power Supply 2 Bus-side Ground. All pins are internally connected. Copyright © 2010–2011, Texas Instruments Incorporated ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) VCC1, VCC2 Input supply voltage (2) Voltage at any bus I/O terminal VO Voltage at D1, D2 VI Voltage input at D, DE or RE terminal IO Receiver output current ID1, ID2 Transformer Driver Output Current ESD Human Body Model JEDEC Standard 22, Test Method A114-C.01 Charged Device Model JEDEC Standard 22, Test Method C101 Machine Model ANSI/ESDS5.2-1996 Electrostatic Discharge Maximum junction temperature TSTG Storage temperature (1) (2) UNIT –0.5 to 7 V –9 to 14 V 14 V –0.5 to 7 V ±10 mA 450 mA Bus pins to GND1 ±6 Bus pins to GND2 ±10 kV ±4 all pins TJ VALUE ±1.5 all pins kV ±200 V 170 °C -65 to 150 °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values except differential I/O bus voltages are with respect to the referenced network ground terminal and are peak voltage values. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN VCC Logic side supply voltage, VCC1 (with respect to GND1) Bus side supply voltage, VCC2 (with respect to GND2) VCM Voltage at either bus I/O terminal VIH High-level input voltage VIL Low-level input voltage VID Differential input voltage IO Output Current TA Ambient temperature TJ Operating junction temperature 1 / tUI Signaling Rate Copyright © 2010–2011, Texas Instruments Incorporated A, B RE D, DE RE NOM MAX UNIT 3 5.5 4.75 5.25 V –7 12 V 2 VCC1 V 0.8 V 0.7 VCC1 0 D, DE 0.3 VCC1 A with respect to B –12 12 V RS-485 driver –70 70 mA Receiver –8 8 -40 85 °C 150 °C 40 Mbps 3 ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com SUPPLY CURRENT over operating free-air temperature range (unless otherwise noted) PARAMETER ICC1 (1) ICC2 (1) (1) Logic-side quiescent supply current Bus-side quiescent supply current TEST CONDITIONS MIN VCC1 = 3.3 V ± 10%, DE, RE = 0V or VCC1, No load TYP MAX 4.5 8 mA 7 11 mA 13.5 18 mA VCC1 = 5 V ± 10%, DE, RE = 0V or VCC1, No load VCC2 = 5 V ± 5%, DE, RE = 0V or VCC1, No load UNIT ICC1 and ICC2 are measured when device is connected to external power supplies. D1 and D2 are disconnected from external transformer. ISODE-PIN ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER VOH High-level output voltage VOL Low-level output voltage MIN TYP IOH = –8mA TEST CONDITIONS VCC2 – 0.8 4.6 IOH = –20µA VCC2 – 0.1 5 MAX UNIT V IOL = 8mA 0.2 0.4 IOL = 20µA 0 0.1 V RS-485 DRIVER ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER VOD Open-circuit differential output voltage TEST CONDITIONS 2.1 See Figure 5 and Figure 6, RL = 54Ω -0.2 0.2 2 3 –0.2 0.2 VOC(SS) Steady-state common-mode output voltage ΔVOC(SS) Change in steady-state common-mode output voltage VOC(pp) Peak-to-peak common-mode output voltage VOD(ring) Differential output voltage over and under shoot See Figure 7 and Figure 10 II Input current D, DE at 0V or VCC1 IO(OFF) Power-off output current VCC2 = 0 V IOZ High-impedance output current DE at 0V IOS(P) Peak short-circuit output current Differential output capacitance Common-mode transient immunity 4 V See Figure 4, Common-mode loading with Vtest from –7V to +12V Change in steady-state differential output voltage between logic states CMTI UNIT VCC2 2.1 |ΔVOD(SS)| COD MAX See Figure 3 and Figure 7 Steady-state differential output voltage magnitude Steady-state short-circuit output current TYP 1.5 |VOD(SS)| IOS(SS) MIN |VA – VB|, See Figure 2 See Figure 5 and Figure 65, RL = 54Ω V V V 0.5 See Figure 9, DE at VCC1 10% –10 10 VOD(pp) µA See receiver input current VOS = –7V to 12V -250 VOS = 12V, D at GND1 VOS = –7V, D at VCC1 250 135 mA –135 See receiver CIN See Figure 20 25 kV/µs Copyright © 2010–2011, Texas Instruments Incorporated ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com RS-485 DRIVER SWITCHING CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 23 35 2 5 25 40 2 5 UNIT tPLH, tPHL Prop delay time tsk(p) Pulse skew (|tPHL – tPLH|) tPLH, tPHL Prop delay time tsk(p) Pulse skew (|tPHL – tPLH|) tr Differential output signal rise time 2 3 7.5 tf Differential output signal fall time 2 3 7.5 tpDE DE to ISODE prop delay See Figure 14 30 ns tt(MLH) , tt(MHL) Output transition skew See Figure 11 1 ns tp(AZH), tp(BZH), tp(AZL), tp(BZL) Propagation delay, high-impedance-to-active output tp(AHZ), tp(BHZ), tp(ALZ), tp(BLZ) Propagation delay, active-to-high-impedance output See Figure 12 and Figure 13, CL = 50pf, RE at 0 V | tp(AZL) – tp(BZH) | | tp(AZH) – tp(BZL) | Enable skew time t(CFB) Time from application of short-circuit to current fold back t(TSD) Time from application of short-circuit to thermal shutdown See Figure 9, TA = 25°C VCC1 = 5V ± 10%, VCC2 = 5V ± 5% VCC1 = 3.3V ± 10%, VCC2 = 5V ± 5% See Figure 10 ns ns ns 80 ns 80 0.55 See Figure 9 1.5 ns µs 0.5 µs 100 RECEIVER ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS VIT(+) Positive-going input threshold voltage VIT(–) Negative-going input threshold voltage Vhys Hysteresis voltage (VIT+ – VIT–) VOH High-level output voltage VOL Low-level output voltage VOH High-level output voltage VOL Low-level output voltage VID = 200 mV, See Figure 16 VCC1 = 5V ± 10% and VCC2 = VID = –200 mV, 5V ± 5% See Figure 16 Bus pin input current IO = 8mA –200 TYP MAX –80 -10 –120 UNIT mV 25 VID = 200 mV, See VCC1 = 3.3V ± Figure 16 10% and VCC2 = VID = -200 mV, See 5V ± 5% Figure 16 IA, IB IA(off), IB(off) See Figure 16 MIN IO = –8mA VI = –7 or 12V, Other input = 0 V IOH = -8mA VCC1 – 0.4 3 IOH = -20µA VCC1 – 0.1 3.3 V IOL = 8mA 0.2 0.4 IOL = 20µA 0 0.1 IOH = –8mA VCC1 – 0.8 4.6 IOH = –20µA VCC1 – 0.1 5 V IOL = 8mA 0.2 0.4 IOL = 20µA 0 0.1 VCC2 = 4.75V or 5.25V V V –160 200 µA VCC2 = 0V II Receiver enable input current RE = 0 V –50 50 µA IOZ High-impedance state output current RE = VCC1 –1 1 µA RID Differential input resistance A, B 60 CID Differential input capacitance Test input signal is a 1MHz sine wave with 1Vpp amplitude. CD is measured across A and B. 7 CMR Common mode rejection See Figure 19 4 Copyright © 2010–2011, Texas Instruments Incorporated kΩ 10 pF V 5 ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com RECEIVER SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS tPLH, tPHL Propagation delay time tsk(p) Pulse skew (|tPHL – tPLH|) tPLH, tPHL Propagation delay time tsk(p) Pulse skew (|tpHL - tpLH|) tr tf tPZH Propagation delay, high-impedance-to-high-level output tPHZ Propagation delay, high-level-to-high-impedance output tPZL Propagation delay, high-impedance-to-low-level output tPLZ Propagation delay, low-level-to-high-impedance output MIN VCC1 = 5V ± 10%, VCC2 = 5V ± 5% TYP MAX 50 65 2 5 53 70 2 5 Output signal rise time 2 4 Output signal fall time 2 4 13 25 13 25 13 25 13 25 See Figure 16 VCC1 = 3.3V ± 10%, VCC2 = 5V ± 5% DE at VCC1, See Figure 17 DE at VCC1, See Figure 18 UNIT ns TRANSFORMER DRIVER CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER fOSC RON tr_D tf_D fSt tBBM 6 Oscillator frequency Switch on resistance D1, D2 output rise time D1, D2 output fall time Startup frequency Break before make time delay TEST CONDITIONS MIN TYP MAX VCC1 = 5V ± 10%, D1 and D2 connected to Transformer 350 450 610 VCC1 = 3.3V ± 10%, D1 and D2 connected to Transformer 300 400 550 D1 and D2 connected to 50Ω pull-up resistors 1 2.5 VCC1 = 5V ± 10%, See Figure 21, D1 and D2 connected to 50Ω pull-up resistors 80 VCC1 = 3.3V ± 10%, See Figure 21, D1 and D2 connected to 50Ω pull-up resistors 70 VCC1 = 5V ± 10%, See Figure 21, D1 and D2 connected to 50Ω pull-up resistors 55 VCC1 = 3.3V ± 10%, See Figure 21, D1 and D2 connected to 50Ω pull-up resistors 80 VCC1 = 2.4 V, D1 and D2 connected to Transformer kHz VCC1 = 3.3V ± 10%, See Figure 21, D1 and D2 connected to 50Ω pull-up resistors Ω ns ns 350 VCC1 = 5V ± 10%, See Figure 21, D1 and D2 connected to 50Ω pull-up resistors UNIT kHz 38 ns 140 Copyright © 2010–2011, Texas Instruments Incorporated ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION VCC1 VCC1 IOA DE IOA DE A A II 0 or VCC1 VOD D B GND1 II 0 or VCC1 IOB GND2 B GND2 GND1 VI 54 W VOD D IOB VI VOA VOB GND1 VOA VOB GND2 GND 1 GND2 Figure 2. Open Circuit Voltage Test Circuit Figure 3. VOD Test Circuit VCC2 VCC1 IOA RL 2 DE DE 375 W A D 0 or 3 V . B + VOD - A II 0 or VCC1 60 W VOD D - 7 V to12 V B GND1 RL 2 IOB VI 375 W GND2 GND2 VOB GND1 Figure 4. Driver VOD with Common-mode Loading Test Circuit VOC VOA GND2 Figure 5. Driver VOD and VOC Without Common-Mode Loading Test Circuit VCC1 IOA DE RL 2 A Input Input Generator : PRR = 500 kHz , 50 % duty VI cycle, t r < 6 ns , t f < 6 ns , ZO = 50 W II D VOD B GND1 VOB GND1 RL 2 IOB GND2 VOA A VA B VB VOC VOC(p-p) VOC VOC (SS ) GND2 Figure 6. Steady-State Output Voltage Test Circuit and Voltage Waveforms VOD(RING ) VOD (SS ) VOD ( pp) 0V differential Figure 7. VOD(RING) Waveform and Definitions Copyright © 2010–2011, Texas Instruments Incorporated 7 ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VCC1 IOA DE A 0 or VCC1 II VI V OD B D IOB GND 2 GND 1 V OA V OB GND 1 54 W GND 2 Figure 8. Input Voltage Hysteresis Test Circuit DE 250 Output Current - mA IOS A D IOS B + V_ OS GND1 GND2 135 60 t(CFB) time t(TSD) Figure 9. Driver Short-Circuit Test Circuit and Waveforms (Short Circuit applied at Time t=0) 3V DE VCC1 A D Input Generator B VI VOD R L = 54 W ±1 % VI C L = 50 pF ± 20% VOD C L includes fixture and instrumentation capacitance Generator: PRR= 500 kHz , 50 % duty cycle, t r < 6ns , t f < 6 ns ,ZO = 50 W tpHL tpLH 50 W GND1 1.5 V 1.5 V 90% 90% 0V 10 % VOD(H) 0V 10% VOD(L) tf tr Figure 10. Driver Switching Test Circuit and Waveforms DE VCC1 A 50 % D Input Generator VI RL= 54 W CL = 50pF ± 20% ±1% B 50 W GND1 Generator : PRR= 500 kHz, 50 % duty cycle, t r< 6ns , t f <6 ns ,ZO = 50 W 50 % A VO B tt(MHL) GND2 V OA VOB tt(MLH) 50 % 50 % CL includes fixture and instrumentation capacitance Figure 11. Driver Output Transition Skew Test Circuit and Waveforms RL= 110 W VCC2 A V IN = 0V B 50 W GND 1 DE 1.5 V t(ALZ) t(AZL) D DE Signal Generator CL = 50 pF A RL= 110 W 0V VOA VOB CL = 50 pF 50% t(BZH) B VOL+ 0.5V t(BHZ) 50% VOH - 0.5 V GND 2 Figure 12. Driver Enable/Disable Test, D at Logic Low Test Circuit and Waveforms 8 Copyright © 2010–2011, Texas Instruments Incorporated ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) RL= 110 W 0V A VIN = 3. 0V CL = 50 pF t(AHZ) t(AZH) B R = 110 W DE Signal Generator 1.5 V DE D VOA VOB 50 W GND 1 VOH -0.5 V A VCC2 50 % t(BZL) C L = 50 pF t(BLZ) B VOL 0.5 V 50 % GND 2 Figure 13. Driver Enable/Disable Test, D at Logic High Test Circuit and Waveforms VCC1 GALVANIC ISOLATION VIN = VCC1 VCC2 D DE Signal Generator tpDE_HL tpDE_LH CL = 15 pF ± 20% 50 % 50 % ISODE 50 W GND 1 50 % 50 % DE ISODE GND 2 Figure 14. DE to ISODE Prop Delay Test Circuit and Waveforms IO V ID VO Figure 15. Receiver DC Parameter Definitions Signal Generator Input B 50 W PRR=100 kHz, 50% duty cycle, t r <6ns, t f <6ns, ZO = 50 W Signal Generator 50 W A R VID B C L = 15 pF (includes probe and jig capacitance) 1.5 V 50% IO Input A 0V tpLH VO tpHL V OH 90% Output 1.5 V 10% tr tf V OL Figure 16. Receiver Switching Test Circuit and Waveforms Copyright © 2010–2011, Texas Instruments Incorporated 9 ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VCC D VCC DE A 3V RE 54 W 1.5 V 1.5 V B 0V 1 kW R tpHZ tpZH 0V VOH -0.5 V C L = 15 pF Signal Generator 1.5 V (includes probe and jig capacitance) RE VO R GND 50 W PRR=100 kHz, 50% duty cycle, tr<6ns, t f <6ns, ZO = 50 W Figure 17. Receiver Enable Test Circuit and Waveforms, Data Output High 0V D VCC DE A 3V RE 54 W B 1.5 V 0V R tpLZ tpZL 1 kW VCC1 VOH R 1.5 V C L = 15 pF VOL +0.5 V (includes probe and jig capacitance) RE Signal Generator 1.5 V VOL 50 W PRR=100 kHz, 50% duty cycle, tr<6ns, t f <6ns, Z O = 50 W Figure 18. Receiver Enable Test Circuit and Waveforms, Data Output Low VINPUT freq = 1 to 50 MHz ampl. = ±5 V A 100 nF 50 W 470 nF R B RE 50 W 2.2 kW DE V R Scope 2.2 kW D VOFFSET = -2V to7V Scope GND VCC 100 nF Figure 19. Common-Mode Rejection Test Circuit 10 Copyright © 2010–2011, Texas Instruments Incorporated ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) C = 0.1 mF VCC1 ±1% DE 2.0V GND 1 VCC2 D S1 C = 0.1 mF ±1% A 54 W B VOH or VOL 0.8V R VOH or VOL Success / fail criterion : stabile VOH or V OL outputs. RE 1 kW GND1 GND2 CL=15 pF (includes probe and jig capacitance) VTEST Figure 20. Common-Mode Transient Immunity Test Circuit tf_D tr_D 90% D1 10% tBBM tBBM 90 % D2 10 % tf_D tr_D Figure 21. Transition Times and Break-Before-Make Time Delay for D1, D2 Outputs Copyright © 2010–2011, Texas Instruments Incorporated 11 ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com Table 1. DRIVER FUNCTION TABLE (1) (1) VCC1 VCC2 INPUT (D) ENABLE INPUT (DE) ENABLE OUTPUT (ISODE) OUTPUTS PU PU H H H H L PU PU L H H L H PU PU X L L Z Z PU PU X open L Z Z PU PU open H H H L PD PU X X L Z Z PU PD X X L Z Z PD PD X X L Z Z A B PU = Powered Up, PD = Powered Down, H = High Level, L= Low Level, X = Don't Care, Z = High Impedance (off) Table 2. RECEIVER FUNCTION TABLE (1) (1) 12 VCC1 VCC2 DIFFERENTIAL INPUT VID = (VA – VB) ENABLE (RE) OUTPUT (R) PU PU –0.01V ≤ VID L H PU PU -0.2V < VID < –0.01V L ? PU PU VID ≤ –0.2V L L PU PU X H Z PU PU X open Z PU PU Open circuit L H PU PU Short Circuit L H PU PU Idle (terminated) bus L H PD PU X X Z PU PD X L H PD PD X X Z PU = Powered Up, PD = Powered Down, H = High Level, L= Low Level, X = Don’t Care, Z = High Impedance (off), ? = Indeterminate Copyright © 2010–2011, Texas Instruments Incorporated ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com IEC INSULATION AND SAFETY RELATED SPECIFICATIONS FOR 16-DW PACKAGE over recommended operating conditions (unless otherwise noted) PARAMETER L(I01) Minimum air gap (Clearance) TEST CONDITIONS (1) (1) TYP MAX UNIT Shortest terminal to terminal distance through air 8.3 mm Shortest terminal to terminal distance across the package surface 8.1 mm 400 V L(I02) Minimum external tracking (Creepage) CTI Tracking resistance (Comparative Tracking Index) DIN IEC 60112 / VDE 0303 Part 1 Minimum Internal Gap (Internal Clearance) Distance through the insulation RIO Isolation resistance Input to output, VIO = 500 V, all pins on each side of the barrier tied together creating a two-terminal device CIO Barrier capacitance Input to output CI Input capacitance to ground PD Maximum device power dissipation VCC1 = 5.5V, VCC2 = 5.25V, TJ = 150°C, CL = 50pf, RL = 54Ω Input a 20MHz 50% duty cycle square wave (1) MIN 0.008 mm >1012 Ω VI = VCC/2 + 0.4 sin (2πft), f = 1MHz, VCC = 5 V 2 pF VI = 0.4 sin (2πft), f = 1MHz 2 pF 719 mW Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to make sure that the mounting pads of the isolator on the printed circuit board do not reduce this distance. spacer Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications IEC 60664-1 RATINGS TABLE PARAMETER Basic isolation group Installation classification TEST CONDITIONS Material group SPECIFICATION II Rated mains voltage ≤ 150Vrms I-IV Rated mains voltage ≤ 300Vrms I-III Rated mains voltage ≤ 400Vrms I-II IEC 60747-5-2 INSULATION CHARACTERISTICS (1) over recommended operating conditions (unless otherwise noted) PARAMETER VIORM Maximum working insulation voltage VPR Input to output test voltage TEST CONDITIONS SPECIFICATION UNIT 566 Vpeak Method b1, VPR = VIORM × 1.875, 100% Production test with t = 1s, Partial discharge < 5pC 1062 Vpeak Method a, After environmental tests subgroup 1, VPR = VIORM × 1.6, t = 10s, Partial discharge < 5pC 906 After Input/Output Safety Test Subgroup 2/3, VPR = VIORM x 1.2, t = 10s, Partial discharge < 5pC 680 4242 Vpeak VIOTM Transient overvoltage t = 60s (qualification), t = 1s (100% production) VIOSM Maximum surge voltage Tested per IEC 60065 (Qualification Test) 4242 Vpeak RS Insulation resistance VIO = 500V at TS = 150°C > 109 Ω Pollution degree (1) 2 Climatic Classification 40/125/21 Copyright © 2010–2011, Texas Instruments Incorporated 13 ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com REGULATORY INFORMATION VDE UL Certified according to DIN EN 60747-5-2 (VDE 0884 Part 2) Recognized under 1577 Component Recognition Program Basic Insulation Maximum Transient Overvoltage, 4242 VPK Maximum Surge Voltage, 4242 VPK Maximum Working Voltage, 566 VPK Single / Basic Isolation Voltage, 2500 VRMS (1) File Number: Pending File Number: Pending (1) Production tested ≥ 3000 Vrms for 1 second in accordance with UL 1577. IEC SAFETY LIMITING VALUES Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures. PARAMETER TEST CONDITIONS IS Safety input, output, or supply current DW-16 TS Maximum case temperature DW-16 MIN TYP θJA = 76°C/W, VI = 5.5 V, TJ = 170°C, TA = 25°C MAX UNIT 347 mA 150 °C The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Characteristics table is that of a device installed on a High-K Test Board for Leaded Surface Mount Packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. THERMAL INFORMATION THERMAL METRIC (1) ISO1176T DW-16 θJA Junction-to-ambient thermal resistance θJC(top) Junction-to-case(top) thermal resistance 37.9 θJB Junction-to-board thermal resistance 44.6 ψJT Junction-to-top characterization parameter 12.1 ψJB Junction-to-board characterization parameter 37.9 θJC(bottom) Junction-to-case(bottom) thermal resistance n/a (1) 14 UNITS 76 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s) :ISO1176T ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com 400 VCC1 = VCC2 = 5.5 V Safety Limiting Current - mA 350 300 250 200 150 100 50 0 0 50 100 150 TC - Case Temperature - °C 200 Figure 22. DW-16 θJC THERMAL DERATING CURVE per IEC 60747-5-2 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s) :ISO1176T 15 ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com EQUIVALENT CIRCUIT SCHEMATICS DE Input D , RE Input V CC1 V CC1 V CC1 V CC1 V CC1 1 MW 500 W 500 W 1 MW ISODE Output 3 .3 -V R Output V CC2 V CC1 5.5 W 4W 11 W 6.4 W 5 -V R Output V CC1 5.5 W 11 W 16 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s) :ISO1176T ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com A Input B Input V CC2 V CC2 16V 90 kW Input 16V 16V 18 k W 90 kW Input 18 kW 18 kW 16V 18 kW A and B Outputs V CC2 16V Output 16V Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s) :ISO1176T 17 ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com TYPICAL CHARACTERISTICS 90 35 No Load TA = 25°C 30 ICC2 @ 5 V 80 RL = 54 W, CL = 50 pF, TA = 25°C ICC - Supply Current - mA ICC - Supply Current - mA 70 25 ICC2 @ 5 V 20 15 ICC1 @ 5 V ICC1 @ 3.3 V 10 5 40 30 20 0 0 5 10 15 20 25 Data Rate - Mbps 30 35 40 Figure 23. RMS SUPPLY CURRENT (ICC1 and ICC2) vs SIGNALING RATE WITH NO LOAD ICC1 @ 3.3 V ICC1 @ 5 V 5 10 15 20 25 Data Rate - Mbps 30 35 40 -99 VCC2 = 5 V VCC2 = 5.25 V 4 100 Ω -79 3.5 50 Ω 3 15 pF Load TA = 25°C -89 IO - Output Current - mA 4.5 VCC2 = 4.75 V 2.5 2 1.5 -69 -59 -49 -39 -29 -19 1 0.5 -9 TA = 25 C 0 0 Figure 24. RMS SUPPLY CURRENT (ICC1 and ICC2) vs SIGNALING RATE WITH LOAD 5 VOD − Differential Output Voltage − V 50 10 0 0 20 40 60 IL − Load Current − mA Figure 25. DIFFERENTIAL OUTPUT VOLTAGE vs LOAD CURRENT 18 60 80 1 0 1 2 3 4 5 VO - Output Voltage - V Figure 26. RECEIVER HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s) :ISO1176T ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) 0.7 110 15 pF Load TA = 25°C 100 VCC = 4.75 V 0.6 Driver Enable Skew − ns IO - Output Current - mA 90 80 70 60 50 40 30 20 0.5 VCC = 5.25 V 0.4 VCC = 5 V 0.3 0.2 0.1 10 0 0 1 2 3 VO - Output Voltage - V 4 0 −40 5 Figure 27. RECEIVER LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 85 58 tPHL (VCC1 = 3.3 V) 56 26 Receiver Propagation Delay - ns Driver Propagation Delay - ns −15 10 35 60 TA − Free-Air Temperature − °C Figure 28. DRIVER ENABLE SKEW vs FREE-AIR TEMPERATURE 28 tPLH (VCC1 = 3.3 V) 24 22 tPHL (VCC1 = 5 V) 20 RL = 110 Ω, CL = 50 pF tPHL (VCC1 = 5 V) 54 CL = 15 pH, VCC2 = 5 V tPHL (VCC1 = 3.3 V) tPLH (VCC1 = 3.3 V) 52 50 48 tPHL (VCC1 = 5 V) 46 tPLH (VCC1 = 5 V) 44 18 -40 -15 10 35 60 TA - Free-Air Temperature - °C Figure 29. DRIVER PROPAGATION DELAY vs FREE-AIR TEMPERATURE 85 42 -40 -15 10 35 60 TA - Free-Air Temperature - °C 85 Figure 30. RECEIVER PROPAGATION DELAY vs FREE-AIR TEMPERATURE Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s) :ISO1176T 19 ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com APPLICATION INFORMATION REFERENCE DESIGN ISO1176T Reference Design (SLLU471) is available to provide complete isolated data and power solution. TRANSIENT VOLTAGES Isolation of a circuit insulates it from other circuits and earth so that noise develops across the insulation rather than circuit components. The most common noise threat to data-line circuits is voltage surges or electrical fast transients that occur after installation and the transient ratings of ISO1176T are sufficient for all but the most severe installations. However, some equipment manufacturers use their ESD generators to test transient susceptibility of their equipment and can exceed insulation ratings. ESD generators simulate static discharges that may occur during device or equipment handling with low-energy but high voltage transients. Figure 31 models the ISO1176T bus IO connected to a noise generator. CIN and RIN is the device and any other stray or added capacitance or resistance across the A or B pin to GND2, CISO and RISO is the capacitance and resistance between GND1 and GND2 of ISO1176T plus those of any other insulation (transformer, etc.), and we assume stray inductance negligible. From this model, the voltage at the isolated bus return is Z ISO vGND2 = vN ZISO + ZIN and will always be less than 16 V from V . If ISO1176T is tested as a stand-alone device, N RIN = 6 × 104Ω, CIN = 16 × 10-12 F, RISO = 109Ω and CISO = 10-12 F. SPACER Note from Figure 31 that the resistor ratio determines the voltage ratio at low frequency and it is the inverse capacitance ratio at high frequency. In the stand-alone case and for low frequency, A,B, Y, or Z C IN vGND2 RISO 109 = = vN RISO + RIN 109 + 6 ´ 104 R IN VN Bus Return(GND2) or essentially all of noise appears across the barrier. At high frequency, 1 v GND2 vN = CISO 1 CISO 1 + CIN C ISO = 1+ 1 = CISO CIN 1 1 1+ 16 16 V R ISO = 0.94 and 94% of VN appears across the barrier. As long as RISO is greater than RIN and CISO is less than CIN, most of transient noise appears across the isolation barrier, as it should. System Ground (GND1) Figure 31. Noise Model We recommend the reader not test equipment transient susceptibility with ESD generators or consider product claims of ESD ratings above the barrier transient ratings of an isolated interface. ESD is best managed through recessing or covering connector pins in a conductive connector shell and installer training. 20 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s) :ISO1176T ISO1176T SLLSE28E – OCTOBER 2010 – REVISED AUGUST 2011 www.ti.com REVISION HISTORY Changes from Revision initial (October 2010) to Revision A Page • Updated transformer driver characteristics ........................................................................................................................... 6 • Added Thermal Table data ................................................................................................................................................. 14 Changes from Revision A (December 2010) to Revision B Page • Changed the Steady-state short-circuit output current - Test Conditions and values. ......................................................... 4 • Changed the Oscillator frequency values ............................................................................................................................. 6 • Changed the D1, D2 output rise time values ........................................................................................................................ 6 Changes from Revision B (December 2010) to Revision C Page • Added a Typ value of 23ns to Prop delay time for VCC1 = 5V in the RS-485 DRIVER SWITCHING CHARACTERISTIC table ...................................................................................................................................................... 5 • Added a Typ value of 25ns to Prop delay time for VCC1 = 3.3V in the RS-485 DRIVER SWITCHING CHARACTERISTIC table ...................................................................................................................................................... 5 • Deleted ROFF from the TRANSFORMER DRIVER CHARACTERISTICS table ................................................................... 6 • Changed θJA = 212°C/W To: θJA = 76°C/W, Changed the IS Max value From: 128mA To: 347mA, and changed paragraph two in the IEC SAFETY LIMITING VALUES section ........................................................................................ 14 • Changed Figure 22 ............................................................................................................................................................. 15 Changes from Revision C (February 2011) to Revision D Page • Added Figure 1 ..................................................................................................................................................................... 2 • Moved the Pin Description closer to the Pin drawing ........................................................................................................... 2 Changes from Revision D (May 2011) to Revision E Page • Deleted the MIN and MAX values for tr_D, tf_D and tBBM specifications in the Transformer Driver Characteristics table. ..... 6 • Changed test conditions from 1.9 V to 2.4 V, and changed TYP value from 230 to 350 for fSt specification in the Transformer Driver Characteristics table. ............................................................................................................................. 6 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s) :ISO1176T 21 PACKAGE OPTION ADDENDUM www.ti.com 8-Oct-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) ISO1176TDW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ISO1176TDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Jul-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device ISO1176TDWR Package Package Pins Type Drawing SOIC DW 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 16.4 Pack Materials-Page 1 10.75 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.7 2.7 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Jul-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ISO1176TDWR SOIC DW 16 2000 358.0 335.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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