TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 12-W STEREO CLASS-D AUDIO POWER AMPLIFIER WITH DC VOLUME CONTROL FEATURES D 12-W/Ch Into an 8-Ω Load From 15-V Supply D Efficient, Class-D Operation Eliminates D D D The TPA3004D2 is a 12-W (per channel) efficient, Class-D audio amplifier for driving bridged-tied stereo speakers. The TPA3004D2 can drive stereo speakers as low as 4 Ω. The high efficiency of the TPA3004D2 eliminates the need for external heatsinks when playing music. Heatsinks and Reduces Power Supply Requirements 32-Step DC Volume Control From –40 dB to 36 dB Line Outputs For External Headphone Amplifier With Volume Control Regulated 5-V Supply Output for Powering TPA6110A2 Space-Saving, Thermally-Enhanced PowerPAD Packaging Thermal and Short-Circuit Protection Stereo speaker volume is controlled with a dc voltage applied to the volume control terminal offering a range of gain from –40 dB to 36 dB. Line outputs, for driving external headphone amplifier inputs, are also dc voltage controlled with a range of gain from –56 dB to 20 dB. D APPLICATIONS D LCD Monitors and TVs D Powered Speakers An integrated 5-V regulated supply is provided for powering an external headphone amplifier. 10 µF Cs 0.1 µF Cs 0.1 µF RINN RINP Crinn Crinp 1 µF 1 µF C2p5 LINP LINN Clinp 1 µF 1 µF Clinn 1 µF 10 nF Cbs PVCCR PVCCR PGNDR ROUTN Cs PGNDR PVCCR SD ROUTN BSRN SYSTEM CONTROL PVCCR Cs PVCC ROUTP Cbs 10 µF ROUTP PVCC 10 nF BSRP D DESCRIPTION MODE_OUT RINN RINP MODE V2P5 AVCC LINP 1 µF MODE_OUT SYSTEM CONTROL VAROUTR LINN RLINE_OUT VAROUTL TPA3004D2 AVDDREF FADE VREF AVDD VARDIFF VARDIFF COSC VARMAX VARMAX ROSC BSLP PVCCL PVCCL LOUTP LOUTP PGNDL PGNDL LOUTN LOUTN VCLAMPL PVCCL AGND REFGND PVCCL VOLUME BSLN VOL Ccpr VCLAMPR AVCC Cs 0.1 µF Cvcc 10 µF LLINE_OUT AVDD Cvdd Cosc 100 nF 220 pF SYSTEM CONTROL Rosc 120 kΩ Ccpl 1 µF 10 kΩ 10 kΩ Cs Cbs 10 nF PVCC 0.1 µF Cs 0.1 µF Cs Cs 10 µF 10 µF Cbs 10 nF PVCC Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com 1 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 AVAILABLE OPTIONS PACKAGED DEVICE TA 48-PIN HTQFP (PHP)† – 40°C to 85°C TPA3004D2PHP † The PHP package is available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TPA3004D2PHPR). PHP PACKAGE 2 PVCCR 41 40 39 38 37 ROUTP BSRP 43 42 ROUTP PGNDR PGNDR ROUTN ROUTN 46 45 44 PVCCR 48 47 PVCCR PVCCR BSRN (TOP VIEW) SD 1 36 VCLAMPR RINN 2 35 MODE_OUT RINP 3 34 MODE V2P5 4 33 AVCC LINP 5 32 VAROUTR LINN 6 31 VAROUTL AVDDREF 7 30 FADE VREF 8 29 AVDD VARDIFF 9 28 COSC VARMAX 10 27 ROSC VOLUME 11 26 AGND REFGND 12 25 VCLAMPL 24 BSLP PVCCL LOUTP PVCCL PGNDL www.ti.com LOUTP PVCCL PGNDL 20 21 22 23 LOUTN 18 19 LOUTN 15 16 17 PVCCL 13 14 BSLN TPA3004D2 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 functional block diagram V2P5 PVCC V2P5 VClamp Gen VAROUTR V2P5 VCLAMPR BSRN Gain Adj. PVCCR(2) Gate Drive Cint2 RINN Gain Adj. Rfdbk2 RINP ROUTN(2) Deglitch & PGNDR Modulation Logic BSRP PVCCR(2) Rfdbk2 V2P5 VREF Gate Drive Cint2 ROUTP(2) VOLUME VARDIFF VARMAX FADE Gain Control PGNDR To Gain Adj. Blocks REFGND OC Detect V2P5 ROSC Ramp Generator Biases Startup Protection Logic & COSC References AVDDREF VDD VDDok AVCC AVDD VCCok AVDD 5V LDO PVCC TTL Input Buffer SD MODE MODE_OUT AVCC AGND VClamp Gen VCLAMPL BSLN Mode PVCCL(2) Control Gate Drive Cint2 V2P5 LINN Thermal PGNDL Deglitch & Gain Adj. Rfdbk2 BSLP Modulation Logic LINP LOUTN(2) PVCCL(2) Rfdbk2 V2P5 Gate Drive Cint2 Gain Adj. LOUTP(2) PGNDL VAROUTL www.ti.com 3 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 Terminal Functions TERMINAL NO. NAME I/O DESCRIPTION AGND 26 – Analog ground for digital/analog cells in core AVCC AVDD 33 – High-voltage analog power supply (8.5 V to 18 V) 29 O 5-V Regulated output capable of 100-mA output AVDDREF BSLN 7 O 5-V Reference output—provided for connection to adjacent VREF terminal. 13 I/O Bootstrap I/O for left channel, negative high-side FET BSLP 24 I/O Bootstrap I/O for left channel, positive high-side FET BSRN 48 I/O Bootstrap I/O for right channel, negative high-side FET BSRP 37 I/O Bootstrap I/O for right channel, positive high-side FET COSC 28 I/O I/O for charge/discharging currents onto capacitor for ramp generator triangle wave biased at V2P5 FADE 30 I Input for controlling volume ramp rate. A logic low on this pin places the amplifier in fade mode. A logic high on this pin allows a quick transition to the desired volume setting when cycling SD or during power-up. LINN 6 I Negative differential audio input for left channel LINP 5 I Positive differential audio input for left channel LOUTN 16, 17 O Class-D 1/2-H-bridge negative output for left channel LOUTP 20, 21 O Class-D 1/2-H-bridge positive output for left channel MODE 34 I Input for MODE control. A logic high on this pin places the amplifier in the variable output mode and the Class-D outputs are disabled. A logic low on this pin places the amplifier in the Class-D mode and Class-D stereo outputs are enabled. Variable outputs (VAROUTL and VAROUTR) are still enabled in Class-D mode to be used as line-level outputs for external amplifiers. MODE_OUT 35 O Output for control of the variable output amplifiers. When the MODE pin (34) is a logic high, the MODE_OUT pin is driven low. When the MODE pin (34) is a logic low, the MODE_OUT pin is driven high. This pin is intended for MUTE control of an external headphone amplifier. Leave unconnected when not used for headphone amplifier control. PGNDL 18, 19 – Power ground for left channel H-bridge PGNDR 42, 43 – Power ground for right channel H-bridge PVCCL 14, 15 – Power supply for left channel H-bridge (tied to pins 22 and 23 internally), not connected to PVCCR or AVCC. PVCCL 22, 23 – Power supply for left channel H-bridge (tied to pins 14 and 15 internally), not connected to PVCCR or AVCC. PVCCR 38,39 – PVCCR 46, 47 – REFGND 12 – Power supply for right channel H-bridge (tied to pins 46 and 47 internally), not connected to PVCCL or AVCC. Power supply for right channel H-bridge (tied to pins 38 and 39 internally), not connected to PVCCL or AVCC. Ground for gain control circuitry. Connect to AGND. If using a DAC to control the volume, connect the DAC ground to this terminal. RINP 3 I Positive differential audio input for right channel RINN 2 I Negative differential audio input for right channel ROSC 27 I/O Current setting resistor for ramp generator. Nominally equal to 1/8*VCC ROUTN 44, 45 O Class-D 1/2-H-bridge negative output for right channel ROUTP 40, 41 O Class-D 1/2-H-bridge positive output for right channel SD 1 I Shutdown signal for IC (low = shutdown, high = operational). TTL logic levels with compliance to VCC. VARDIFF 9 I DC voltage to set the difference in gain between the Class-D and VAROUT outputs. Connect to GND or AVDDREF if VAROUT outputs are unconnected. VARMAX 10 I DC voltage that sets the maximum gain for the VAROUT outputs. Connect to GND or AVDDREF if VAROUT outputs are unconnected. VAROUTL 31 O Variable output for left channel audio. Line level output for driving external HP amplifier. 4 www.ti.com TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 Terminal Functions (Continued) TERMINAL NO. NAME I/O DESCRIPTION VAROUTR 32 O Variable output for right channel audio. Line level output for driving external HP amplifier. VCLAMPL 25 – Internally generated voltage supply for left channel bootstrap capacitors. VCLAMPR 36 – Internally generated voltage supply for right channel bootstrap capacitors. VOLUME 11 I DC voltage that sets the gain of the Class-D and VAROUT outputs. VREF 8 I Analog reference for gain control section. V2P5 4 O 2.5-V Reference for analog cells, as well as reference for unused audio input when using single-ended inputs. Thermal Pad – Connect to AGND and PGND—should be center point for both grounds. — absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range: AVCC, PVCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 20 V Load impedance, RL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≥ 3.6 Ω Input voltage range, VI: MODE, VREF, VARDIFF, VARMAX, VOLUME, FADE . . . . . . . . . . . . . . . . . . . . . 0 V to 5.5 V SD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VCC + 0.3 V RINN, RINP, LINN, LINP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 7 V Supply current: AVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA AVDDREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA Output current, VAROUTL, VAROUTR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C Operating junction temperature range, TJ‡ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. ‡ The (TPA3004D2) incorporates an exposed PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature that couldm permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C 4.3 W DERATING FACTOR 34.7 mW/°C§ TA = 70°C 2.7 W TA = 85°C 2.2 W PHP § The PowerPAD must be soldered to a thermal land on the printed circuit board. Please refer to the PowerPAD Thermally Enhanced Package application note (SLMA002). www.ti.com 5 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 recommended operating conditions MIN ≥ 3.6 Ω Volume reference voltage PVCC, AVCC; RL VREF Volume control pins, input voltage VARDIFF, VARMAX, VOLUME Supply voltage, VCC SD High-level High level in input ut voltage, VIH MAX UNIT 8.5 18 V 3.0 5.5 V 5.5 V 2 MODE 3.5 FADE 4.0 V SD 0.8 Low level input voltage, Low-level voltage VIL MODE, FADE High-level output voltage, VOH MODE_OUT, IOH = 1 mA Low-level output voltage, VOL MODE_OUT, IOL = –1 mA High-level High level in input ut current, IIH MODE,VI= 5 V, VCC = 18 V FADE, VI= 18 V, VCC = 18 V AVDD–100mV V AGND+100mV V 1 150 SD, VI= 18 V, VCC = 18 V Low level input current, current IIL Low-level V 2 uA 50 MODE, FADE , VI= 0 V, VCC = 18 V 1 uA SD, VI= 0 V, VCC = 18 V 1 uA 275 kHz Oscillator frequency, fOSC 225 °C Operating junction temperature, TJ† 125 °C † Continuous operation above the recommended junction temperature may result in reduced reliability and/or lifetime of the device. The junction temperature is controlled by the thermal design of the application and should be carefully considered in high power dissipation applications. See the thermal considerations section on pages 33–35 for recommendations on improving the thermal performance of your application. Operating free-air temperature, TA –40 85 dc characteristics, TA = 25°C, VCC = 12 V, RL = 8 Ω (unless otherwise noted) PARAMETER TEST CONDITIONS | VOS | Class-D Output offset voltage (measured differentially) INN and INP connected together, Gain = 36 dB V2P5 (terminal 4) 2.5-V Bias voltage No load AVDD 5-V Regulated output IO = 0 to 100 mA, SD = 2 V, VCC = 8.5 V to 18 V PSRR Class-D power supply rejection ratio ICC(class-D) Class-D mode quiescent current ICC(varout) Variable output mode quiescent current ICC(class-D – max power) Class-D mode RMS current at max power VCC = 11.5 V to 12.5 V MODE = 2 V, SD = 2 V, VCC = 18 V MIN TYP MAX UNIT 10 65 0.45x AVDD 0.5x AVDD 0.55x AVDD V 4.5 5.0 5.5 V –80 mV dB 16 28.5 mA MODE = 3.5 V, SD = 2 V, VCC = 18 V 7 9 mA RL = 8 Ω, PO = 12 W, VCC = 15 V to 18 V 2 A ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ICC(SD) rds(on) 6 Supply current in shutdown mode Drain-source on-state resistance SD = 0.8 V, VCC = 12 V 1 SD = 0.8 V, VCC = 18 V VCC = 12 V, IO = 1 A, C TJ = 2 25°C www.ti.com 10 160 High side 300 Low side 250 Total 550 uA mΩ 650 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 ac characteristics for Class-D outputs, TA = 25°C, VCC = 12 V, RL = 8 Ω (unless otherwise noted) PARAMETER kSVR Supply ripple rejection ratio PO(max) Maximum continuous out output ut power ower (thermally limited) Vn Output integrated noise floor SNR TEST CONDITIONS MIN TYP MAX UNITS VCC = 11.5 V to 12.5 V from 10 Hz to 1 kHz, Gain = 36 dB –67 dB RL = 4 Ω 7.5 W RL = 8 Ω 20 Hz to 22 kHz, No weighting filter, Gain = 0.5 dB 12 W –82 dBV Crosstalk, Class-D–Left → Class-D–Right Gain = 13.2 dB, PO = 1 W, RL = 8 Ω –77 dB Crosstalk, Class-D → VAROUT Maximum output at THD < 0.5%, Gain = 36 dB –63 dB Signal-to-noise ratio Maximum output at THD+N < 0.5%, f= 1 kHz, Gain = 0.5 dB 102 dB Thermal trip point 150 °C Thermal hystersis 20 °C characteristics for VAROUT outputs PARAMETER |VOS| THD+N Output offset voltage Total harmonic distortion + noise TEST CONDITIONS Measured between V2P5 and VAROUT, Gain = 20 dB, RL = 10 kΩ MIN TYP 10 AV = 7.3 dB, f = 1 kHz, PO = 6 mW, RL = 32 Ω 0.025% AV = 7.3 dB, f = 1 kHz, RL = 2 kΩ, VO = 1 Vrms 0.002% MAX 65 UNITS mV PSRR DC power supply rejection ratio Gain = 20 dB –74 dB kSVR Supply ripple rejection ratio Gain = 20 dB, f = 1 kHz –95 dB Crosstalk, VAROUTL → VAROUTR Maximum output at THD < 0.5%, Gain = 20 dB –60 dB Crosstalk, VAROUT → Class-D Maximum output at THD < 0.5%, Gain = 20 dB –74 dB Vn Output integrated noise floor 20 Hz to 22 kHz, Gain = 20 dB 75 20 Hz to 22 kHz, Gain = –0.3 dB 15 www.ti.com µV V 7 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 Table 1. DC Volume Control for Class-D Outputs VOLTAGE ON THE VOLUME PIN AS A PERCENTAGE OF VREF (INCREASING VOLUME OR FIXED GAIN) VOLTAGE ON THE VOLUME PIN AS A PERCENTAGE OF VREF (DECREASING VOLUME) GAIN OF CLASS-D AMPLIFIER % % dB 0 – 4.5 0 – 2.9 –75† 4.5 – 6.7 2.9 – 5.1 –40.0 6.7 – 8.91 5.1 – 7.2 –37.5 8.9 – 11.1 7.2 – 9.4 –35.0 11.1 – 13.3 9.4 – 11.6 –32.4 13.3 – 15.5 11.6 – 13.8 –29.9 15.5 – 17.7 13.8 – 16.0 –27.4 17.7 – 19.9 16.0 – 18.2 –24.8 19.9 – 22.1 18.2 – 20.4 –22.3 22.1 – 24.3 20.4 – 22.6 –19.8 24.3 – 26.5 22.6 – 24.8 –17.2 26.5 – 28.7 24.8 – 27.0 –14.7 28.7 – 30.9 27.0 – 29.1 –12.2 30.9 – 33.1 29.1 – 31.3 –9.6 33.1 – 35.3 31.3 – 33.5 –7.1 35.3 – 37.5 33.5 – 35.7 –4.6 37.5 – 39.7 35.7 – 37.9 39.7 – 41.9 37.9 – 40.1 –2.0 0.5† 41.9 – 44.1 40.1 – 42.3 3.1 44.1 – 46.4 42.3 – 44.5 5.6 46.4 – 48.6 44.5 – 46.7 8.1 48.6 – 50.8 46.7 – 48.9 10.7 50.8 – 53.0 48.9 – 51.0 13.2 53.0 – 55.2 51.0 – 53.2 15.7 55.2 – 57.4 53.2 – 55.4 18.3 57.4 – 59.6 55.4 – 57.6 20.8 59.6 – 61.8 57.6 – 59.8 23.3 61.8 – 64.0 59.8 – 62.0 25.9 64.0 – 66.2 62.0 – 64.2 28.4 66.2 – 68.4 64.2 – 66.4 30.9 68.4 – 70.6 66.4 – 68.6 33.5 36.0† > 70.6 >68.6 † Tested in production. Remaining steps are specified by design. 8 www.ti.com TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 Table 2. DC Volume Control for VAROUT Outputs VAROUT_VOLUME (V)† – FROM FIGURE 24 – AS A PERCENTAGE OF VREF (INCREASING VOLUME OR FIXED GAIN) VAROUT_VOLUME (V) – FROM FIGURE 24 – AS A PERCENTAGE OF VREF (DECREASING VOLUME) GAIN OF VAROUT AMPLIFIER % % dB 0 – 4.5 0 – 2.9 –66† 4.5 – 6.7 2.9 – 5.1 –56.0 6.7 – 8.91 5.1 – 7.2 –53.5 8.9 – 11.1 7.2 – 9.4 –50.9 11.1 – 13.3 9.4 – 11.6 –48.4 13.3 – 15.5 11.6 – 13.8 –45.9 15.5 – 17.7 13.8 – 16.0 –43.3 17.7 – 19.9 16.0 – 18.2 –40.8 19.9 – 22.1 18.2 – 20.4 –38.3 22.1 – 24.3 20.4 – 22.6 –35.7 24.3 – 26.5 22.6 – 24.8 –33.2 26.5 – 28.7 24.8 – 27.0 –30.7 28.7 – 30.9 27.0 – 29.1 –28.1 30.9 – 33.1 29.1 – 31.3 –25.6 33.1 – 35.3 31.3 – 33.5 –23.1 35.3 – 37.5 33.5 – 35.7 –20.5 37.5 – 39.7 35.7 – 37.9 –18.0 39.7 – 41.9 37.9 – 40.1 41.9 – 44.1 40.1 – 42.3 –15.5 –13.0‡ 44.1 – 46.4 42.3 – 44.5 –10.4 46.4 – 48.6 44.5 – 46.7 –7.9 48.6 – 50.8 46.7 – 48.9 –5.3 50.8 – 53.0 48.9 – 51.0 –2.8 53.0 – 55.2 51.0 – 53.2 –0.3 55.2 – 57.4 53.2 – 55.4 2.3 57.4 – 59.6 55.4 – 57.6 4.8 59.6 – 61.8 57.6 – 59.8 7.3 61.8 – 64.0 59.8 – 62.0 9.9 64.0 – 66.2 62.0 – 64.2 12.4 66.2 – 68.4 64.2 – 66.4 14.9 68.4 – 70.6 66.4 – 68.6 17.5 20.0† > 70.6 >68.6 † VAROUT_VOLUME (V) = VOLUME (V) – VARDIFF (V), see pages 25 – 27. ‡ Tested in production. Remaining steps are specified by design. www.ti.com 9 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 TYPICAL CHARACTERISTICS Table of Graphs FIGURE PO ICC IO(sd) Class-D Efficiency vs Output power 1 Class-D Output power vs Load resistance 2 vs Supply voltage 3 vs Supply voltage 4 vs Output Power 5 Shutdown supply current vs Supply voltage 6 Class-D Input impedance vs Gain Class-D Supply y current THD+N Class D Total harmonic distortion + noise Class-D kSVR Class-D Supply ripple rejection ratio 8 – 12 vs Output power 13 – 17 vs Frequency Class-D Closed loop response 18 19 Class-D Intermodulation performance 20 Class-D Input offset voltage vs Common-mode input voltage 21 Class-D Crosstalk vs Frequency 22 Class-D Mute attenuation Class-D Shutdown attenuation 23 vs Frequency 24 Class-D Common-mode rejection ratio vs Frequency 25 VAROUT Input resistance vs Gain 26 VAROUT Noise vs Frequency 27 VAROUT Closed Loop Response 10 7 vs Frequency 28 VAROUT Common-mode rejection ratio vs Frequency 29 VAROUT Crosstalk vs Frequency 30 vs Output power 31 vs Output voltage 32 vs Frequency 33 vs Frequency 34 THD+N VAROUT Total harmonic distortion + noise kSVR VAROUT Supply ripple rejection ratio www.ti.com TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 TYPICAL CHARACTERISTICS EFFICIENCY vs OUTPUT POWER OUTPUT POWER vs LOAD RESISTANCE 12 100 VCC = 12 V, THD = 10% RL = 8 Ω, VCC = 18 V 90 10 80 Efficiency – % PO – Output Power – W RL = 4 Ω, VCC = 12 V 70 60 50 40 30 Class-D, LC Filter, Resistive Load 20 10 8 VCC = 8 V, THD = 10% 6 4 VCC = 8 V, THD = 1% 2 Dashed line may require external heat sinking 0 0 0 2 8 4 6 PO – Output Power – W 10 4 12 6 8 10 12 RL – Load Resistance – Ω Figure 1 16 SUPPLY CURRENT vs SUPPLY VOLTAGE 20 12 8 Ω Speaker 10% THD+N 19 18 I CC– Supply Current – mA 10 8 8 Ω Speaker 1% THD+N 6 4 SD = 2 V, MODE = 2 V, Class-D, No Load 17 16 15 14 13 12 TA = 25°C 2 8.5 9 14 Figure 2 OUTPUT POWER vs SUPPLY VOLTAGE PO – Output Power – W f = 1 kHz, LC Filter, Class-D, Resistive Load, TA = 25°C VCC = 12 V, THD = 1% 10 11 12 13 14 15 16 VCC – Supply Voltage – V 11 17 18 10 8.5 9 10 11 12 13 14 15 16 VCC – Supply Voltage – V 17 18 Figure 4 Figure 3 www.ti.com 11 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 TYPICAL CHARACTERISTICS SUPPLY CURRENT vs OUTPUT POWER SHUTDOWN SUPPLY CURRENT vs SUPPLY VOLTAGE 2500 4.5 I CC– Supply Current – mA 2000 I CC(sd)– Shutdown Supply Current – µ A VCC = 12 V, MODE = 2 V, Class-D, Left/Right Channel Total Output Power 8Ω 1500 4Ω 1000 16 Ω 500 0 0 5 10 15 PO – Output Power – W 20 SD = 0 V, No Load 4 3.5 3 2.5 2 1.5 1 0.5 0 25 8 6 1 THD+N – Total Harmonic Distortion + Noise – % 120 Class-D 100 Z i – Input Impedance – k Ω 18 TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY INPUT IMPEDANCE vs GAIN 80 60 40 20 –30 –10 10 Gain – dB 30 50 VCC = 8 V RL = 8 Ω Gain = +36 dB Class-D PO = 3 W 0.1 PO = 0.25 W PO = 1.5 W 0.01 20 100 1k f – Frequency – Hz Figure 8 Figure 7 12 16 Figure 6 Figure 5 0 –50 10 12 14 VCC – Supply Voltage – V www.ti.com 10k TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 TYPICAL CHARACTERISTICS TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 10 1 THD+N –Total Harmonic Distortion + Noise – dB THD+N – Total Harmonic Distortion + Noise – % TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY VCC = 12 V RL = 8 Ω Gain = +36 dB Class-D PO = 0.5 W PO = 5 W 0.1 PO = 2.5 W 0.01 10 100 1k 10k VCC = 18 V, Gain = 36 dB, RL = 8 Ω 5 2 1 0.5 PO = 1 W 0.1 0.05 PO = 12 W 0.02 0.01 20 100 200 500 1 k 2 k f – Frequency – Hz Figure 9 Figure 10 PO = 4 W THD+N – Total Harmonic Distortion + Noise – % VCC = 8 V RL = 4 Ω Gain = +36 dB PO = 0.5 W 0.1 PO = 2 W 0.01 100 1k 5 k 10 k 20 k TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 1 THD+N – Total Harmonic Distortion + Noise – % 50 f – Frequency – Hz TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 20 PO = 4 W 0.2 1 VCC = 12 V RL = 4 Ω Gain = +36 dB PO = 0.5 W 0.1 PO = 7 W PO = 3.5 W 0.01 10k 20 f – Frequency – Hz 100 1k 10k f – Frequency – Hz Figure 12 Figure 11 www.ti.com 13 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 TYPICAL CHARACTERISTICS TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 10 VCC = 8 V RL = 8 Ω Gain = +13.2 dB Class-D THD+N – Total Harmonic Distortion + Noise – % THD+N – Total Harmonic Distortion + Noise – % 10 1 f = 1 kHz f = 20 Hz 0.1 0.01 10 m 100 m 1 10 VCC = 12 V RL = 8 Ω Gain = +13.2 dB Class-D 1 f = 20 Hz f = 1 kHz 0.1 0.01 10 m 100 m PO – Output Power – W TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 10 VCC = 18 V, RL = 8 Ω THD+N – Total Harmonic Distortion + Noise – % THD+N –Total Harmonic Distortion + Noise – dB 10 2 1 0.5 f = 1 kHz 0.2 0.1 f = 20 kHz 0.05 0.02 0.01 100 m 200 m f = 20 Hz 5 500 m 1 2 PO – Output Power – W 10 20 VCC = 8 V RL = 4 Ω Gain = 13.2 dB 1 f = 1 kHz f = 20 Hz 0.1 0.01 20 m 100 m 1 PO – Output Power – W Figure 16 Figure 15 14 10 Figure 14 Figure 13 5 1 PO – Output Power – W www.ti.com 10 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 TYPICAL CHARACTERISTICS SUPPLY RIPPLE REJECTION RATIO vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER –40 VCC = 12 V RL = 4 Ω Gain = 13.2 dB k SVR – Supply Ripple Rejection Ratio – dB THD+N – Total Harmonic Distortion + Noise – % 10 1 f = 20 Hz f = 1 kHz 0.1 0.01 20 m 100 m 1 –45 RL = 8 Ω, C2p5 = 1 µF, Class-D –50 –55 VCC = 8 V –60 –65 VCC = 12 V –70 –75 –80 20 10 100 PO – Output Power – W Figure 17 INTERMODULATION PERFORMANCE CLOSED LOOP RESPONSE Gain –20 50 –40 FFT – dBr Phase – Deg 0 Phase Gain – dB 0 100 0 –50 –100 –100 –150 –150 –100 –200 –120 –250 10 VCC = 12 V, Gain= +36 dB, RL = 8 Ω Class-D 100 1k 10 k f – Frequency – Hz 100 k –250 1M VCC = 12 V, 19 kHz, 20 kHz, 1:1, PO = 1 W, RL = 8 Ω Gain= +13.2 dB, BW =20 Hz to 22 kHz, Class-D No Filter –60 –50 –200 10 k 20 k Figure 18 100 50 1k f – Frequency – Hz –80 –140 50 Figure 19 100 1k f – Frequency – Hz 10 k Figure 20 www.ti.com 15 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 TYPICAL CHARACTERISTICS INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE CROSSTALK vs FREQUENCY 6 0 VCC = 12 V Class-D –20 4 Crosstalk – dB VIO – Input Offset Voltage – mV 5 VCC = 12 V, C2p5 = 1 µF, PO = 1 W, Gain = +13.2 dB, Class-D, RL = 8 Ω –10 3 2 –30 –40 –50 –60 1 –70 0 –80 –90 20 –1 0 4 1 2 3 VICM – Common-Mode Input Voltage – V 5 10 k 20 k Figure 22 SHUTDOWN ATTENUATION vs FREQUENCY MUTE ATTENUATION vs FREQUENCY –80 –30 VCC = 12 V, RL = 8 Ω, VI = 1 Vrms Class-D, VOLUME = 0 V –50 VCC = 12 V, RL = 8 Ω, VI = 1 Vrms Gain = +13.2 dB, Class-D –85 Shutdown Attenuation – dB –40 Mute Attenuation – dB 1k f – Frequency – Hz Figure 21 –60 –70 –80 –90 –100 –90 –95 –100 –105 –110 –115 –110 –120 –120 –125 –130 –130 10 100 1k 10 10 k 100 1k f – Frequency – Hz f – Frequency – Hz Figure 24 Figure 23 16 100 www.ti.com 10 k TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 TYPICAL CHARACTERISTICS INPUT RESISTANCE vs GAIN COMMON-MODE REJECTION RATIO vs FREQUENCY 160 VCC = 12 V, RL = 8 Ω, C2p5 = 1 µF, Class-D –50 VAROUT 140 RL – Input Resistance – k Ω –60 –70 –80 –90 120 100 80 60 40 20 0 –50 –100 10 100 10 k 1k f – Frequency – Hz 100 k –30 Figure 25 12.853 VCC = 12 V, Gain= +20 dB, RL = 8 Ω Inputs AC Coupled to GND, VAROUT, No Filter –40 –60 175 Gain 9.318 150 125 Gain – dB –80 –100 –120 –140 5.784 100 2.249 75 50 –1.285 Phase –4.82 –160 –15.424 –180 –18.958 –200 100 1k f – Frequency – Hz 10 k –22.493 10 25 0 –25 –8.354 –50 –11.889 20 30 CLOSED LOOP RESPONSE 0 –20 10 Figure 26 NOISE vs FREQUENCY Noise FFT – dBV –10 Gain – dB Phase – Deg CMRR – Common-Mode Rejection Ratio – dB –40 –75 VCC = 12 V, Gain= +7.9 dB, RL = 8 Ω VAROUT –100 –125 –150 –175 100 1k 10 k f – Frequency – Hz Figure 28 Figure 27 www.ti.com 17 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 TYPICAL CHARACTERISTICS COMMON-MODE REJECTION RATIO vs FREQUENCY CROSSTALK (VAROUTL-TO-VAROUTR) vs FREQUENCY 0 VCC = 12 V, RL = 8 Ω , C2P5 = 1 µF, VAROUT –42 –44 VO = 1 Vrms, RL = 10 kΩ, VAROUT –10 –20 –46 G = 20 dB G = 10 dB G = 0 dB –30 Crosstalk – dB CMRR – Common-Mode Rejection Ratio – dBv –40 –48 –50 –52 –40 G = –10 dB –50 –60 –54 –70 –56 –80 –58 –90 –60 20 100 1k f– Frequency – Hz –100 10 k 20 100 Figure 29 20 VCC = 12 V RL = 32 Ω, Gain = +6 dB, VAROUT THD+N –Total Harmonic Distortion + Noise – % THD+N –Total Harmonic Distortion + Noise – % TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT VOLTAGE 20 2 1 0.2 f = 1 kHz 0.1 f = 20 kHz 0.02 0.01 f = 20 Hz 0.001 20 µ 100 µ 200 µ 1m 2m 10 m 20 m 10 2 1 VCC = 12 V RL = 10 kΩ, Gain = +6 dB VAROUT 0.2 0.1 0.02 f = 1 kHz 0.01 0.001 20 m PO – Output Power – W Figure 31 18 10 k Figure 30 TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 10 1k f – Frequency – Hz 100 m 200 m VO – Output Voltage – VRMS Figure 32 www.ti.com 1 2 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 TYPICAL CHARACTERISTICS SUPPLY RIPPLE REJECTION RATIO vs FREQUENCY 10 2 1 –40 VCC = 12 V RL = 32 Ω, PO = 5 mW, Gain = +7.9 dB, VAROUT k SVR – Supply Ripple Rejection Ratio – dB THD+N –Total Harmonic Distortion + Noise – % TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 0.2 0.1 0.02 0.01 0.005 20 100 1k f – Frequency – Hz 10 k –50 VCC = 12 V VAROUT –60 –70 –80 –90 –100 –110 20 100 1k 10 k f – frequency – Hz Figure 34 Figure 33 www.ti.com 19 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 C22 1 nF VCC ROUT+ GND VCC ROUT– APPLICATION INFORMATION C23 1 nF L1 (Bead) L2 (Bead) 10 µF PGND 10 nF 10 nF C15 0.1uF 0.1uF C9 C10 C2 1 µF C3 1 µF 1 µF C4 LIN– 1 µF BSRP PVCCR ROUTP ROUTP PGNDR ROUTN PGNDR ROUTN V2P5 AVCC LINP VAROUTR VAROUTR LINN VAROUTL VAROUTL TPA3004D2 AVDDREF MODE C13 0.1 µF FADE VREF AVDD VARDIFF COSC VARMAX ROSC T5 VOLUME AGND REFGND VCLAMPL C16 10 µF 220pF C11 100 nF R1 120 kΩ BSLP PVCCL PGND L3 (Bead) L4 (Bead) C24 1nF C25 1nF GND VCC PVCCL 10 nF 10 µF LOUT– C21 0.1 µF VCC 10 nF LOUTP C12 0.1 µF C17 LOUT+ C20 LOUTP PGNDL PGNDL LOUTN LOUTN PVCCL PVCCL AGND Figure 35. Stereo Class-D With Single-Ended Inputs www.ti.com VCC AVDD C14 C6 AGND C8 GND 20 MODEB MODE T6 P1 50 kΩ PGND RINP T7 P2 50 kΩ GND 1 µF MODE_OUT BSLN P3 50k C7 VCLAMPR RINN 1 µF C5 AGND PVCCR SD C1 RIN– PVCCR BSRN SHUTDOWN PVCCR C19 C18 GND 1 µF PGND www.ti.com AGND REFGND VOLUME VARMAX VARDIFF VREF AVDDREF LINN BSRN T5 1 µF LINP V2P5 PGNDL LOUTN LOUT– PVCCR PVCCL VCC PVCCR PVCCL 10 nF LOUTN C24 1 nF L3 (Bead) C25 1 nF L4 (Bead) PGND PGNDL 10 µ F 0.1 µ F C12 LOUTP C11 VCLAMPR VCLAMPL AGND ROSC COSC AVDD FADE VAROUTL VAROUTR AVCC MODE MODE_OUT 10 nF C21 PVCCL 0.1 µ F C17 C19 PVCCR C20 C10 10 nF VCC PVCCR PVCCL VCC ROUT+ ROUTP LOUTP LOUT+ TPA3004D2 ROUTN GND C4 1 µF RINP RINN PGNDR P1 50 kΩ T6 C5 1 µF 1 µF PGNDR P2 50 k Ω T7 C3 C1 1 µF C9 0.1 µ F PGND ROUTP P3 50 kΩ LIN– AGND C2 SD ROUTN VCC C18 C15 0.1 µ F 10 µ F L2 (Bead) C23 1 nF BSRP RIN– SHUTDOWN ROUT– 10 nF GND L1 (Bead) C22 1 nF 1 µF C8 220 pF C6 120 k Ω R1 100 nF C14 C16 10 µ F PGND C13 0.1µ F 1 µF AVDD AVCC C7 Cin2 (T2) 1 µF Rin2 10 kΩ (T1) 1 µF Rin1 10 kΩ Cin1 10 k Ω (T3) Rhps2 0.47µ F Cvcc 10 kΩ Rhps1 Rout1 1 kΩ Rout2 1 kΩ R3 120 k Ω AVDD Cout2 BYP IN1 10 kΩ Rhpf2 IN2 Vo2 SD VDD GND Vo1 AVDD (T4) 220 µ F Rhpf1 10 k Ω 220 µ F TPA6110A2 Cout1 SLOS407A – FEBRUARY 2003 – MARCH 2003 TPA3004D2 APPLICATION INFORMATION BSLP GND BSLN Figure 36. Stereo Class-D With Single-Ended Inputs and Stereo Headphone Amplifier Interface 21 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION class-D operation This section focuses on the class-D operation of the TPA3004D2. traditional class-D modulation scheme The traditional class-D modulation scheme, which is used in the TPA032D0x family, has a differential output where each output is 180 degrees out of phase and changes from ground to the supply voltage, VCC. Therefore, the differential prefiltered output varies between positive and negative VCC, where filtered 50% duty cycle yields 0 V across the load. The traditional class-D modulation scheme with voltage and current waveforms is shown in Figure 37. Note that even at an average of 0 V across the load (50% duty cycle), the current to the load is high, causing high loss, thus causing a high supply current. OUTP OUTN +12 V Differential Voltage Across Load 0V –12 V Current Figure 37. Traditional Class-D Modulation Scheme’s Output Voltage and Current Waveforms Into an Inductive Load With No Input TPA3004D2 modulation scheme The TPA3004D2 uses a modulation scheme that still has each output switching from 0 to the supply voltage. However, OUTP and OUTN are now in phase with each other with no input. The duty cycle of OUTP is greater than 50% and OUTN is less than 50% for positive output voltages. The duty cycle of OUTP is less than 50% and OUTN is greater than 50% for negative output voltages. The voltage across the load sits at 0 V throughout most of the switching period, greatly reducing the switching current, which reduces any I2R losses in the load. 22 www.ti.com TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION TPA3004D2 modulation scheme (continued) OUTP OUTN Differential Voltage Across Load Output = 0 V +12 V 0V –12 V Current OUTP OUTN Differential Voltage Output > 0 V +12 V 0V Across Load –12 V Current Figure 38. The TPA3004D2 Output Voltage and Current Waveforms Into an Inductive Load efficiency: LC filter required with the traditional class-D modulation scheme The main reason that the traditional class-D amplifier needs an output filter is that the switching waveform results in maximum current flow. This causes more loss in the load, which causes lower efficiency. The ripple current is large for the traditional modulation scheme, because the ripple current is proportional to voltage multiplied by the time at that voltage. The differential voltage swing is 2 × VCC, and the time at each voltage is half the period for the traditional modulation scheme. An ideal LC filter is needed to store the ripple current from each half cycle for the next half cycle, while any resistance causes power dissipation. The speaker is both resistive and reactive, whereas an LC filter is almost purely reactive. The TPA3004D2 modulation scheme has very little loss in the load without a filter because the pulses are very short and the change in voltage is VCC instead of 2 × VCC. As the output power increases, the pulses widen, making the ripple current larger. Ripple current could be filtered with an LC filter for increased efficiency, but for most applications the filter is not needed. An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flow through the filter instead of the load. The filter has less resistance than the speaker, which results in less power dissipation, therefore increasing efficiency. www.ti.com 23 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION effects of applying a square wave into a speaker Audio specialists have advised for years not to apply a square wave to speakers. If the amplitude of the waveform is high enough and the frequency of the square wave is within the bandwidth of the speaker, the square wave could cause the voice coil to jump out of the air gap and/or scar the voice coil. A 250-kHz switching frequency, however, does not significantly move the voice coil, as the cone movement is proportional to 1/f2 for frequencies beyond the audio band. Damage may occur if the voice coil cannot handle the additional heat generated from the high-frequency switching current. The amount of power dissipated in the speaker may be estimated by first considering the overall efficiency of the system. If the on-resistance (rds(on)) of the output transistors is considered to cause the dominant loss in the system, then the maximum theoretical efficiency for the TPA3004D2 with an 8-Ω load is as follows: ǒ Efficiency (theoretical, %) + R ń R ) r L L ds(on) Ǔ 100% + 8ń(8 ) 0.58) 100% + 93.24% (1) The maximum measured output power is approximately 7.5 W with an 12-V power supply. The total theoretical power supplied (P(total)) for this worst-case condition would therefore be as follows: P (total) + P ńEfficiency + 7.5 W ń 0.9324 + 8.04 W O (2) The efficiency measured in the lab using an 8-Ω speaker was 89%. The power not accounted for as dissipated across the rds(on) may be calculated by simply subtracting the theoretical power from the measured power: Other losses + P (total) (measured) * P (total) (theoretical) + 8.43 * 8.04 + 0.387 W (3) The quiescent supply current at 14 V is measured to be 14.3 mA. It can be assumed that the quiescent current encapsulates all remaining losses in the device, i.e., biasing and switching losses. It may be assumed that any remaining power is dissipated in the speaker and is calculated as follows: P (dis) + 0.387 W * (14 V 14.3 mA) + 0.19 W (4) Note that these calculations are for the worst-case condition of 7.5 W delivered to the speaker. Since the 0.19 W is only 2.5% of the power delivered to the speaker, it may be concluded that the amount of power actually dissipated in the speaker is relatively insignificant. Furthermore, this power dissipated is well within the specifications of most loudspeaker drivers in a system, as the power rating is typically selected to handle the power generated from a clipping waveform. when to use an output filter Design the TPA3004D2 without the filter if the traces from amplifier to speaker are short (< 1 inch). Powered speakers, where the speaker is in the same enclosure as the amplifier, is a typical application for class-D without a filter. Most applications require a ferrite bead filter. The ferrite filter reduces EMI around 1 MHz and higher (FCC and CE only test radiated emissions greater than 30 MHz). When selecting a ferrite bead, choose one with high impedance at high frequencies, but very low impedance at low frequencies. Use a LC output filter if there are low frequency (<1 MHz) EMI sensitive circuits and/or there are long wires from the amplifier to the speaker. 24 www.ti.com TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION when to use an output filter (continued) 15 µH OUTP L1 15 µH C1 C2 0.22 µF 1 µF OUTN C3 L2 0.22 µF Figure 39. Typical LC Output Filter, Cutoff Frequency of 41 kHz, Speaker Impedance = 4 Ω 33 µH OUTP L1 33 µH C1 C2 0.1 µF 0.47 µF OUTN L2 C3 0.1 µF Figure 40. Typical LC Output Filter, Cutoff Frequency of 41 kHz, Speaker Impedance = 8 Ω Ferrite Chip Bead OUTP 1 nF Ferrite Chip Bead OUTN 1 nF Figure 41. Typical Ferrite Chip Bead Filter (Chip bead example: Fair-Rite 2512067007Y3) volume control operation Three pins labeled VOLUME, VARDIFF, and VARMAX control the class-D volume when driving speakers and the VAROUT volume. All of these pins are controlled with a dc voltage, which should not exceed VREF. When driving speakers in class-D mode, the VOLUME pin is the only pin that controls the gain. Table 1 lists the gain in class-D mode as determined by the voltage on the VOLUME pin in reference to the voltage on VREF. If using a resistor divider to fix the gain of the amplifier, the VREF terminal can be directly connected to AVDDREF and a resistor divider can be connected across VREF and REFGND. (See Figure 35 in the Application Information section). For fixed gain, calculate the resistor divider values necessary to center the voltage between the two percentage points given in the first column of Table 1. For example, if a gain of 10.7 dB is desired, the resistors in the divider network can both be 10 kΩ. With these resistor values, a voltage of 50%*VREF will be present at the VOLUME pin and result in a class-D gain of 10.7 dB. www.ti.com 25 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION volume control operation (continued) If using a DAC to control the class-D gain, VREF and REFGND should be connected to the reference voltage for the DAC and the GND terminal of the DAC, respectively. For the DAC application, AVDDREF would be left unconnected. The reference voltage of the DAC provides the reference to the internal gain circuitry through the VREF input and any fluctuations in the DAC output voltage will not affect the TPA3004D2 gain. The percentages in the first column of Table 1 should be used for setting the voltages of the DAC when the voltage on the VOLUME terminal is increased. The percentages in the second column should be used for the DAC voltages when decreasing the voltage on the VOLUME terminal. Two lookup tables should be used in software to control the gain based on an increase or decrease in the desired system volume. This is explained further in a section below. If using an analog potentiometer to control the gain, it should be connected between VREF and REFGND. VREF can be connected to AVDDREF or an external voltage source, if desired. The first and second column in Table 1 should be used to determine the point at which the gain changes depending on the direction that the potentiometer is turned. If the voltage on the center tap of the potentiometer is increasing, the first column in Table 1 should be referenced to determine the trip points. If the voltage is decreasing, the trip points in the second column should be referenced. The trip point, where the gain actually changes, is different depending on whether the voltage on the VOLUME terminal is increasing or decreasing as a result of hysteresis about each trip point. The hysteresis ensures that the gain control is monotonic and does not oscillate from one gain step to another. A pictorial representation of the volume control can be found in Figure 43. The graph focuses on three gain steps with the trip points defined in the first and second columns of Table 1 for class–D gain. The dotted lines represent the hysteresis about each gain step. The timing of the volume control circuitry is controlled by an internal 60 Hz clock. This clock determines the rate at which the gain changes when adjusting the voltage on the external volume control pins. The gain updates every 4 clock cycles (nominally 67 ms based on a 60 Hz clock) to the next step until the final desired gain is reached. For example, if the TPA3004D2 is currently in the +0.53 db class-D gain step and the VOLUME pin is adjusted for maximum gain at +36 dB, the time required for the gain to reach 36dB is 14 steps x 67ms/step = 0.938 seconds. Referencing table 1, there are 14 steps between the +0.53 dB gain step and the maximum gain step of +36 dB. VARDIFF and VARMAX operation The TPA3004D2 allows the user to specify a difference between the class–D gain and VAROUT gain. This is desirable to avoid any listening discomfort when plugging in headphones. When interfacing with the variable outputs, the VARDIFF and VARMAX pins control the VAROUT channel gain proportional to the gain set by the voltage on the VOLUME pin. When VARDIFF=0 V, the difference between the class–D gain and the VAROUT gain is 16 dB. As the voltage on the VARDIFF terminal is increased, the VAROUT channel gain decreases. Internal to the TPA3004D2 device, the voltage on the VARDIFF terminal is subtracted from the voltage on the VOLUME terminal and this value is used to determine the VAROUT gain. Some audio systems require that the gain be limited in the VAROUT mode to a level that is comfortable for headphone listening. The VARMAX terminal controls the maximum gain for the VAROUT channels. The functionality of the VARDIFF and VARMAX pin are combined to fix the VAROUT channel gain. A block diagram of the combined functionality is shown in Figure 42. The value obtained from the block diagram for VAROUT_VOLUME is a DC voltage that can be used in conjunction with Table 2 to determine the VAROUT channel gain. Table 2 lists the gain in VAROUT mode as determined by the VAROUT_VOLUME voltage in reference to the voltage on VREF. 26 www.ti.com TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION VARDIFF and VARMAX operation (continued) VARDIFF (V) VARMAX (V) – VOLUME (V) VOLUME–VARDIFF Is VARMAX> YES (VOLUME–VARDIFF) VAROUT_VOLUME (V) = VOLUME (V) – VARDIFF (V) ? NO VAROUT_VOLUME (V) = VARMAX (V) Figure 42. Block Diagram of VAROUT Volume Control Decreasing Voltage on VOLUME Terminal 5.6 Class-D Gain – dB + 3.1 Increasing Voltage on VOLUME Terminal 0.5 2.00 (40.1%*VREF) 2.21 2.10 2.11 (44.1%*VREF) (41.9%*VREF) (42.3%*VREF) Voltage on VOLUME Pin – V Figure 43. DC Volume Control Operation, VREF = 5 V www.ti.com 27 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION MODE operation The MODE pin is an input for controlling the output mode of the TPA3004D2. A logic HIGH on this pin disables the Class-D outputs. A logic LOW on this pin enables the class-D outputs. The VAROUT outputs are active in both modes and can be used as line level inputs to an external powered subwoofer while driving internal stereo speakers with the class-D outputs. The trip levels are defined in the specifications table. For interfacing with an external headphone amplifier like the TPA6110A2, the MODE pin can be connected to the switch on a headphone jack. When configured like Figure 36, the class-D outputs will be disabled when a headphone plug is inserted into the headphone jack. MODE_OUT operation The MODE_OUT pin is an output for controlling the SHUTDOWN pin on an external headphone amplifier like the TPA6110A2 or for interfacing with other logic. The output voltages for a given load condition are given in the specifications table. This output is controlled by the MODE pin logic. When the MODE input is driven to a logic low, the MODE_OUT output drives to a logic high. Conversely, when the MODE pin is driven to a logic high, the MODE_OUT output drives LOW. The MODE_OUT output is simply the inverted state of the MODE input. It is designed in this manner because the TPA6110A2 SHUTDOWN input is active high. This allows the TPA3004D2 to place the TPA6110A2 into the shutdown state when driving internal speakers in the Class–D mode. Conversely, the MODE_OUT pin drives low to enable the TPA6110A2 headphone amplifier when headphones are plugged into the headphone jack and the MODE input is driven high. FADE operation The FADE terminal is a logic input that controls the operation of the volume control circuitry during transitions to and from the shutdown state and during power-up. A logic low on this terminal, places the amplifier in the fade mode. During power-up or recovering from the shutdown state (a logic high is applied to the SD terminal), the volume is smoothly ramped up from the mute state, –75 dB, to the desired volume setting determined by the voltage on the volume control terminals. Conversely, the volume is smoothly ramped down from the current state to the mute state when a logic low is applied to the SD terminal. The timing of the volume control circuitry is controlled by an internal 60-Hz clock. This clock determines the rate at which the gain changes when adjusting the voltage on the external volume control pins. The gain updates every 4 clock cycles (nominally 67 ms based on a 60 Hz clock) to the next step until the final desired gain is reached. For example, if the TPA3004D2 is currently in the +0.53 db class-D gain step and the VOLUME pin is adjusted for maximum gain at +36 dB, the time required for the gain to reach 36 dB is 14 steps x 67 ms/step = 0.938 seconds. Referencing table 1, there are 14 steps between the +0.53 dB gain step and the maximum gain step of +36 dB. Figure 44 shows a scope capture of the differential output (measured across OUT+ and OUT–) with the amplifier in the fade mode. A 1 Vpp dc voltage was applied across the differential inputs and a logic low was applied to the SD terminal at the time defined in the figure. The figure depicts the outputs transitioning from one gain step to the next lower step at approximately 67 ms/step. A logic high on this pin disables the volume fade effect during transitions to and from the shutdown state and during power-up. During power-up or recovering from the shutdown state (a logic high is applied to the SD terminal), the transition from the mute state, –75 dB, to the desired volume setting is less than 1 ms. Conversely, the volume ramps down from current state to the mute state within 1 ms when a logic low is applied to the SD terminal. 28 www.ti.com TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION Figure 45 shows a scope capture of the differential output with the fade effect disabled. The outputs transition to the lowest gain state within 1ms of applying a logic low to the SD terminal. SD = 0V GND Figure 44. Differential Output With FADE (Terminal 30) Held Low SD = 0 V GND Figure 45. Differential Output With FADE Terminal Held High www.ti.com 29 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION selection of COSC and ROSC The switching frequency is determined using the values of the components connected to ROSC (pin 20) and COSC (pin 21) and may be calculated with the following equation: fOSC = 6.6 / (ROSC * COSC) The frequency may be varied from 225 kHz to 275 kHz by adjusting the values chosen for ROSC and COSC. The recommended values are COSC = 220 pF, ROSC=120 kΩ for a switching frequency of 250 kHz. internal 2.5-V bias generator capacitor selection The internal 2.5-V bias generator (V2P5) provides the internal bias for the preamplifier stages on both the class-D amplifiers and the variable amplifiers. The external input capacitors and this internal reference allow the inputs to be biased within the optimal common-mode range of the input preamplifiers. The selection of the capacitor value on the V2P5 terminal is critical for achieving the best device performance. During startup or recovery from the shutdown state, the V2P5 capacitor determines the rate at which the amplifier starts up. When the voltage on the V2P5 capacitor equals 0.75xV2P5, or 75% of its final value, the device turns on and the class-D outputs start switching. The startup time is not critical for the best depop performance since any pop sound that is heard is the result of the class-D outputs switching on and not the startup time. However, at least a 0.47-µF capacitor is recommended for the V2P5 capacitor. A secondary function of the V2P5 capacitor is to filter high frequency noise on the internal 2.5-V bias generator. input resistance Each gain setting is achieved by varying the input resistance of the amplifier, which can range from its smallest value to over six times that value. As a result, if a single capacitor is used in the input high-pass filter, the –3 dB or cutoff frequency also changes by over six times. Zf Ci Input Signal IN Zi The –3-dB frequency can be calculated using equation 5. Input impedance (Zi) vs Gain can be found in Figure 7. f *3dB + 30 1 2p Z iC i (5) www.ti.com TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION input capacitor, Ci In the typical application an input capacitor (Ci) is required to allow the amplifier to bias the input signal to the proper dc level (V2P5)for optimum operation. In this case, Ci and the input impedance of the amplifier (Zi) form a high-pass filter with the corner frequency determined in equation 6. –3 dB (6) fc + 1 2 p Zi Ci fc The value of Ci is important, as it directly affects the bass (low frequency) performance of the circuit. Consider the example where Zi is 20 kΩ and the specification calls for a flat bass response down to 20 Hz. Equation 6 is reconfigured as equation 7. Ci + 1 2p Z i f c (7) In this example, Ci is 0.4 µF, so one would likely choose a value in the range of 0.47 µF to 1 µF. If the gain is known and will be constant, use Zi from Figure 7 (Input Impedance vs Gain) to calculate Ci. Calculations for Ci should be based off the impedance at the lowest gain step intended for use in the system. A further consideration for this capacitor is the leakage path from the input source through the input network (Ci) and the feedback network to the load. This leakage current creates a dc offset voltage at the input to the amplifier that reduces useful headroom, especially in high gain applications. For this reason a low-leakage tantalum or ceramic capacitor is the best choice. When polarized capacitors are used, the positive side of the capacitor should face the amplifier input in most applications as the dc level there is held at 2.5 V, which is likely higher than the source dc level. Note that it is important to confirm the capacitor polarity in the application. power supply decoupling, CS The TPA3004D2 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to ensure the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also prevents oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is achieved by using two capacitors of different types that target different types of noise on the power supply leads. For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) ceramic capacitor, typically 0.1 µF placed as close as possible to the device VCC lead works best. For filtering lower-frequency noise signals, a larger aluminum electrolytic capacitor of 10 µF or greater placed near the audio power amplifier is recommended. The 10-µF capacitor also serves as local storage capacitor for supplying current during large signal transients on the amplifier outputs. BSN and BSP capacitors The full H-bridge output stages use only NMOS transistors. They therefore require bootstrap capacitors for the high side of each output to turn on correctly. A 10-nF ceramic capacitor, rated for at least 25 V, must be connected from each output to its corresponding bootstrap input. Specifically, one 10-nF capacitor must be connected from xOUTP to xBSP, and one 10-nF capacitor must be connected from xOUTN to xBSN. (See the application circuit diagram in Figure 35.) www.ti.com 31 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION VCLAMP capacitors To ensure that the maximum gate-to-source voltage for the NMOS output transistors is not exceeded, two internal regulators clamp the gate voltage. Two 1-µF capacitors must be connected from VCLAMPL (pin 25) and VCLAMPR (pin 36) to ground and must be rated for at least 25 V. The voltages at the VCLAMP terminals vary with VCC and may not be used for powering any other circuitry. internal regulated 5-V supply (AVDD) The AVDD terminal (pin 29) is the output of an internally-generated 5-V supply, used for the oscillator, preamplifier, and volume control circuitry. It requires a 0.1-µF to 1-µF capacitor, placed very close to the pin, to ground to keep the regulator stable. The regulator may be used to power an external headphone amplifier or other circuitry, up to a current limit specified in the specification table. AVDD – POWER-UP RESPONSE Power–Up Ch1 (AVDD) AVDD (pin 29) AVCC (pin 33) Ch2 (AVCC) Ch1 5.00 V/div Ch2 2.00 V/div M 10.0 µs Figure 46. Power-Up Response differential input The differential input stage of the amplifier cancels any noise that appears on both input lines of the channel. To use the TPA3004D2 EVM with a differential source, connect the positive lead of the audio source to the INP input and the negative lead from the audio source to the INN input. To use the TPA3004D2 with a single-ended source, ac ground the INP input through a capacitor equal in value to the input capacitor on INN and apply the audio source to the INN input. In a single-ended input application, the INP input should be ac-grounded at the audio source instead of at the device input for best noise performance. SD operation The TPA3004D2 employs a shutdown mode of operation designed to reduce supply current (ICC) to the absolute minimum level during periods of nonuse for power conservation. The SD input terminal should be held high (see specification table for trip point)during normal operation when the amplifier is in use. Pulling SD low causes the outputs to mute and the amplifier to enter a low-current state, ICC(SD) = 10 µA. SD should never be left unconnected, because amplifier operation would be unpredictable. For the best power-off pop performance, the amplifier should be placed in the shutdown mode prior to removing the power supply voltage. 32 www.ti.com TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION using low-ESR capacitors Low-ESR capacitors are recommended throughout this application section. A real (as opposed to ideal) capacitor can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across this resistor minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of this resistance the more the real capacitor behaves like an ideal capacitor. short-circuit protection The TPA3004D2 has short circuit protection circuitry on the outputs that prevents damage to the device during output-to-output shorts, output-to-GND shorts, and output-to-VCC shorts. When a short-circuit is detected on the outputs, the part immediately disables the output drive. This is a latched fault and must be reset by cycling the voltage on the SD pin to a logic low and back to the logic high state for normal operation. This will clear the short-circuit flag and allow for normal operation if the short was removed. If the short was not removed, the protection circuitry will again activate. The trip-point for the short-circuit protection is nominally set at 8 A. thermal protection Thermal protection on the TPA3004D2 prevents damage to the device when the internal die temperature exceeds 150°C. There is a ±15 degree tolerance on this trip point from device to device. Once the die temperature exceeds the thermal set point, the device enters into the shutdown state and the outputs are disabled. This is not a latched fault. The thermal fault is cleared once the temperature of the die is reduced by 20°C. The device begins normal operation at this point with no external system interaction. thermal considerations: output power and maximum ambient temperature To calculate the maximum ambient temperature, the following equation may be used: TAmax = TJ – ΘJAPDissipated where: TJ = 125°C ΘJA = 19°C/W (2-Layer PCB, 5 sq. in. copper, see Figure 47) (8) (The derating factor for the 48-pin PHP package is given in the dissipation rating table.) To estimate the power dissipation, the following equation may be used: PDissipated = PO(average) x ((1 / Efficiency) – 1) Efficiency = ~85% for an 8-Ω load = ~75% for a 4-Ω load (9) Example. What is the maximum ambient temperature for an application that requires the TPA3004D2 to drive 10 W into an 8-Ω speaker (stereo)? PDissipated = 20 W x ((1 / 0.85) – 1) = 3.5 W (PO = 10 W * 2) TAmax = 125°C – (19°C/W x 3.5 W) = 58.5°C www.ti.com 33 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION thermal considerations: output power and maximum ambient temperature (continued) This calculation shows that the TPA3004D2 can drive 10 W of continuous RMS power per channel into an 8-Ω speaker up an ambient temperature of 58.5°C. Figures 47 and 48 show the results of several thermal experiments conducted with the TPA3004D2. Both figures show that the best thermal performance can be achieved with more copper area for heat dissipation and an adequate number of thermal vias. Figure 47 shows two curves for a 2–layer and 4–layer PCB. The 2–layer PCB layout was tightly controlled with a fixed amount of 2 oz. copper on the bottom layer of the PCB. The amount of copper is shown on the x–axis. Nine thermal vias of 13 mil (0.33mm) diameter were drilled under the PowerPad and connected to the bottom layer. The top layer only consisted of traces for signal routing. The 4–layer PCB layout was also tightly controlled with a fixed amount of 2 oz. copper in middle GND layer. The top layer only consisted of traces for signal routing. The bottom and other middle layer were left blank. Nine thermal vias of 0.33mm diameter were drilled under the PowerPad and connected to the middle layer. Figure 48 shows the effect of the number of thermal vias drilled under the PowerPad on the thermal performance of the PCB. The experiment was conducted with a 2–layer PCB and 3 square inches of copper on the bottom layer. For the best thermal performance, at least 16 vias in a 4x4 pattern should be used under the PowerPad. Refer to the TPA3004D2 EVM User’s Manual, SLOU115, for an example layout with a 4x4 via pattern. PCB gerber files are available at request. printed circuit board (PCB) layout Because the TPA3004D2 is a class-D amplifier that switches at a high frequency, the layout of the printed circuit board (PCB) should be optimized according to the following guidelines for the best possible performance. D Decoupling capacitors — As described on page 31, the high-frequency 0.1-uF decoupling capacitors should be placed as close to the PVCC (pin 14, 15, 22, 23, 38, 39, 46, 47) and AVCC (pin 33) terminals as possible. The V2P5 (pin 4) capacitor, AVDD (pin 29) capacitor, and VCLAMP (pins 25, 36) capacitor should also be placed as close to the device as possible. Large (10 uF or greater) bulk power supply decoupling capacitors should be placed near the TPA3004D2 on the PVCCL, PVCCR, and AVCC terminals. D Grounding — The AVCC (pin 33) decoupling capacitor, AVDD (pin 29) capacitor, V2P5 (pin 4) capacitor, COSC (pin 28) capacitor, and ROSC (pin 27) resistor should each be grounded to analog ground (AGND, pin 26 and pin 30). The PVCC (pin 9 and pin 16) decoupling capacitors should each be grounded to power ground (PGND, pins 18, 19, 42, 43). Analog ground and power ground may be connected at the PowerPAD, which should be used as a central ground connection or star ground for the TPA3004D2. Basically, an island should be created with a single connection to PGND at the PowerPAD. D Output filter — The ferrite EMI filter (Figure 41, page 25) should be placed as close to the output terminals as possible for the best EMI performance. The LC filter (Figure 40, page 25 should be placed close to the outputs. The capacitors used in both the ferrite and LC filters should be grounded to power ground. D PowerPAD — The PowerPAD must be soldered to the PCB for proper thermal performance and optimal reliability. The dimensions of the PowerPAD thermal land should be 5 mm by 5 mm (197 mils by 197 mils). The PowerPAD size measures 4.55 x 4.55 mm. Four rows of solid vias (four vias per row, 0.3302 mm or 13 mils diameter) should be equally spaced underneath the thermal land. The vias should connect to a solid copper plane, either on an internal layer or on the bottom layer of the PCB. The vias must be solid vias, not thermal relief or webbed vias. For additional information, please refer to the PowerPAD Thermally Enhanced Package application note, TI literature number SLMA002. 34 www.ti.com TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION For an example layout, please refer to the TPA3004D2 Evaluation Module (TPA3004D2EVM) User Manual, TI literature number SLOU158. Both the EVM user manual and the PowerPAD application note are available on the TI web site at http://www.ti.com. THERMAL RESISTANCE vs COPPER AREA 2-LAYER PCB THERMAL RESISTANCE vs COPPER AREA 4-LAYER PCB θ JA – Thermal Resistance – °C/W 35 30 25 20 15 1 1.5 2 2.5 3 3.5 4 Copper Area – sq. Inches 4.5 5 30 25 20 15 1 2 3 4 Copper Area – sq. Inches 5 Figure 47. Thermal Resistance THERMAL RESISTANCE vs THERMAL VIA QUANTITY 2-LAYER PCB 25 θ JA – Thermal Resistance – °C/W θ JA – Thermal Resistance – °C/W 35 24 23 22 21 20 4 6 8 10 12 14 Thermal Via Quantity (13 Mil Diameter) 16 Figure 48. Thermal Resistance www.ti.com 35 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION basic measurement system This application note focuses on methods that use the basic equipment listed below: D D D D D D D D D Audio analyzer or spectrum analyzer Digital multimeter (DMM) Oscilloscope Twisted pair wires Signal generator Power resistor(s) Linear regulated power supply Filter components EVM or other complete audio circuit Figure 49 shows the block diagrams of basic measurement systems for class-AB and class-D amplifiers. A sine wave is normally used as the input signal since it consists of the fundamental frequency only (no other harmonics are present). An analyzer is then connected to the APA output to measure the voltage output. The analyzer must be capable of measuring the entire audio bandwidth. A regulated dc power supply is used to reduce the noise and distortion injected into the APA through the power pins. A System Two audio measurement system (AP-II) (Reference 1) by Audio Precision includes the signal generator and analyzer in one package. The generator output and amplifier input must be ac-coupled. However, the EVMs already have the ac-coupling capacitors, (CIN), so no additional coupling is required. The generator output impedance should be low to avoid attenuating the test signal, and is important since the input resistance of APAs is not very high (about 10 kΩ). Conversely the analyzer-input impedance should be high. The output impedance, ROUT, of the APA is normally in the hundreds of milliohms and can be ignored for all but the power-related calculations. Figure 49(a) shows a class-AB amplifier system, which is relatively simple because these amplifiers are linear their output signal is a linear representation of the input signal. They take analog signal input and produce analog signal output. These amplifier circuits can be directly connected to the AP-II or other analyzer input. This is not true of the class-D amplifier system shown in Figure 49(b), which requires low pass filters in most cases in order to measure the audio output waveforms. This is because it takes an analog input signal and converts it into a pulse-width modulated (PWM) output signal that is not accurately processed by some analyzers. 36 www.ti.com TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION Power Supply Signal Generator APA RL Analyzer 20 Hz – 20 kHz (a) Basic Class–AB Power Supply Low–Pass RC Filter Signal Generator Class–D APA RL Low–Pass RC Filter Analyzer 20 Hz – 20 kHz (b) Filter–Free and Traditional Class–D Figure 49. Audio Measurement Systems The TPA3004D2 uses a modulation scheme that does not require an output filter for operation, but they do sometimes require an RC low-pass filter when making measurements. This is because some analyzer inputs cannot accurately process the rapidly changing square-wave output and therefore record an extremely high level of distortion. The RC low-pass measurement filter is used to remove the modulated waveforms so the analyzer can measure the output sine wave. www.ti.com 37 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION differential input and BTL output All of the class-D APAs and many class-AB APAs have differential inputs and bridge-tied load (BTL) outputs. Differential inputs have two input pins per channel and amplify the difference in voltage between the pins. Differential inputs reduce the common-mode noise and distortion of the input circuit. BTL is a term commonly used in audio to describe differential outputs. BTL outputs have two output pins providing voltages that are 180 degrees out of phase. The load is connected between these pins. This has the added benefits of quadrupling the output power to the load and eliminating a dc blocking capacitor. A block diagram of the measurement circuit is shown in Figure 50. The differential input is a balanced input, meaning the positive (+) and negative (–) pins will have the same impedance to ground. Similarly, the BTL output equates to a balanced output. Evaluation Module Audio Power Amplifier Generator Analyzer Low–Pass RC Filter CIN VGEN RGEN RIN ROUT RIN ROUT CIN RGEN RL Twisted–Pair Wire Low–Pass RC Filter RANA CANA RANA CANA Twisted–Pair Wire Figure 50. Differential Input—BTL output Measurement Circuit The generator should have balanced outputs and the signal should be balanced for best results. An unbalanced output can be used, but it may create a ground loop that will affect the measurement accuracy. The analyzer must also have balanced inputs for the system to be fully balanced, thereby cancelling out any common mode noise in the circuit and providing the most accurate measurement. The following general rules should be followed when connecting to APAs with differential inputs and BTL outputs: D D D D D Use a balanced source to supply the input signal. Use an analyzer with balanced inputs. Use twisted-pair wire for all connections. Use shielding when the system environment is noisy. Ensure the cables from the power supply to the APA, and from the APA to the load, can handle the large currents (see Table 3). Table 3 shows the recommended wire size for the power supply and load cables of the APA system. The real concern is the dc or ac power loss that occurs as the current flows through the cable. These recommendations are based on 12-inch long wire with a 20-kHz sine-wave signal at 25°C. 38 www.ti.com TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION Table 3. Recommended Minimum Wire Size for Power Cables POUT (W) RL (Ω) AWG SIZE 10 4 2 4 18 1 8 22 < 0.75 8 18 22 DC POWER LOSS (MW) 22 AC POWER LOSS (MW) 16 40 18 42 22 3.2 8.0 3.7 8.5 28 2.0 8.0 2.1 8.1 1.5 6.1 1.6 6.2 28 Class-D RC low-pass filter An RC filter is used to reduce the square-wave output when the analyzer inputs cannot process the pulse-width modulated class-D output waveform. This filter has little effect on the measurement accuracy because the cutoff frequency is set above the audio band. The high frequency of the square wave has negligible impact on measurement accuracy because it is well above the audible frequency range and the speaker cone cannot respond at such a fast rate. The RC filter is not required when an LC low-pass filter is used, such as with the class-D APAs that employ the traditional modulation scheme (TPA032D0x, TPA005Dxx). The component values of the RC filter are selected using the equivalent output circuit as shown in Figure 51. RL is the load impedance that the APA is driving for the test. The analyzer input impedance specifications should be available and substituted for RANA and CANA. The filter components, RFILT and CFILT, can then be derived for the system. The filter should be grounded to the APA near the output ground pins or at the power supply ground pin to minimize ground loops. Load RC Low–Pass Filters RFILT CFILT RL VL= VIN AP Analyzer Input CANA RANA CANA RANA VOUT RFILT CFILT To APA GND Figure 51. Measurement Low-Pass Filter Derivation Circuit—Class-D APAs www.ti.com 39 TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 APPLICATION INFORMATION The transfer function for this circuit is shown in equation (10) where ωO = REQCEQ, REQ = RFILTRANA and CEQ = (CFILT + CANA). The filter frequency should be set above fMAX, the highest frequency of the measurement bandwidth, to avoid attenuating the audio signal. Equation (11) provides this cutoff frequency, fC. The value of RFILT must be chosen large enough to minimize current that is shunted from the load, yet small enough to minimize the attenuation of the analyzer-input voltage through the voltage divider formed by RFILT and RANA. A rule of thumb is that RFILT should be small (~100 Ω) for most measurements. This reduces the measurement error to less than 1% for RANA ≥ 10 kΩ. ǒ Ǔ V OUT V IN f C + Ǹ2 ǒ R R + f ANA )R ANA FILT Ǔ ǒ Ǔ 1 ) j ww O (10) MAX (11) An exception occurs with the efficiency measurements, where RFILT must be increased by a factor of ten to reduce the current shunted through the filter. CFILT must be decreased by a factor of ten to maintain the same cutoff frequency. See Table 2 for the recommended filter component values. Once fC is determined and RFILT is selected, the filter capacitance is calculated using equation (11). When the calculated value is not available, it is better to choose a smaller capacitance value to keep fC above the minimum desired value calculated in equation (12). C FILT + 1 2p f C R FILT (12) Table 4 shows recommended values of RFILT and CFILT based on common component values. The value of fC was originally calculated to be 28 kHz for an fMAX of 20 kHz. CFILT, however, was calculated to be 57000 pF, but the nearest values of 56000 pF and 51000 pF were not available. A 47000 pF capacitor was used instead, and fC is 34 kHz, which is above the desired value of 28 kHz. Table 4. Typical RC Measurement Filter Values MEASUREMENT RFILT Efficiency All other measurements 40 CFILT 1 000 Ω 5 600 pF 100 Ω 56 000 pF www.ti.com TPA3004D2 SLOS407A – FEBRUARY 2003 – MARCH 2003 MECHANICAL DATA PHP (S-PQFP-G48) PowerPAD PLASTIC QUAD FLATPACK 0,27 0,17 0,50 36 0,08 M 25 37 24 Thermal Pad (see Note D) 48 13 0,13 NOM 1 12 5,50 TYP Gage Plane 7,20 SQ 6,80 9,20 SQ 8,80 0,25 0,15 0,05 1,05 0,95 0°–ā7° 0,75 0,45 Seating Plane 1,20 MAX 0,08 4146927/A 01/98 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. E. Falls within JEDEC MS-026 PowerPAD is a trademark of Texas Instruments. www.ti.com 41 MECHANICAL DATA MPQF051 – JANUARY 1998 PHP (S-PQFP-G48) PowerPAD PLASTIC QUAD FLATPACK 0,27 0,17 0,50 36 0,08 M 25 37 24 Thermal Pad (see Note D) 48 13 0,13 NOM 1 12 5,50 TYP Gage Plane 7,20 SQ 6,80 9,20 SQ 8,80 0,25 0,15 0,05 1,05 0,95 0°– 7° 0,75 0,45 Seating Plane 0,08 1,20 MAX 4146927/A 01/98 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. E. Falls within JEDEC MS-026 PowerPAD is a trademark of Texas Instruments Incorporated. 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