SN28846 SERIAL DRIVER SOCS024B – FEBRUARY 1991 • • • • • • DW PACKAGE (TOP VIEW) TTL-Compatible Inputs CCD-Compatible Outputs Full-Frame Operation Frame-Transfer Operation Solid-State Reliability Adjustable Clock Levels SEL0OUT GND PD SRG3IN SRG2IN SRG1IN TRGIN NC SEL1OUT VSS description 1 20 2 19 3 18 4 17 5 16 6 15 7 14 VSS SEL0 NC VCC SRG3OUT SRG2OUT SRG1OUT TRGOUT VCC SEL1 The SN28846 serial driver is a monolithic CMOS 8 13 integrated circuit designed to drive the serial-reg9 12 ister gate (SRGn) and transfer-gate (TRG) inputs 10 11 of the Texas Instruments (TI) virtual-phase CCD image sensors. The SN28846 interfaces a NC – No internal connection user-defined timing generator to the CCD image sensor; it receives TTL signals from the timing generator and outputs level-shifted signals to the image sensor. The SN28846 contains three noninverting serial-gate drivers and one noninverting transfer-gate driver. The voltage levels on SRG1OUT, SRG2OUT, SRG3OUT, and TRGOUT are controlled by the levels on VSS and VCC. The propagation delays for these outputs are controlled by SEL0 and SEL1. The PD, SRG1IN, SRG2IN, SRG3IN, and TRGIN are TTL compatible. A high level on PD allows the SN28846 to operate normally with the level-shifted outputs following the inputs. When PD is low, the device is in a low power-consumption mode and all outputs are at VCC. The SN28846 is available in a 20-pin surface-mount package and is characterized for operation from –20°C to 45°C. This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C, Method 3015; however, precautions should be taken to avoid application of any voltage higher than maximum-rated voltages to these high-impedance circuits. During storage or handling, the device leads should be shorted together or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic voltage level, preferably either VCC or ground. Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments. TI is a trademark of Texas Instruments Incorporated. Copyright 1991, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN28846 SERIAL DRIVER SOCS024B – FEBRUARY 1991 logic symbol† Φ SEL0 SEL1 19 11 3 PD SRG1IN SRG2IN 6 14 5 15 4 16 SRG3IN SRG1OUT SRG2OUT SRG3OUT 13 7 TRGIN TRGOUT † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. Terminal Functions TERMINAL I/O DESCRIPTION NAME NO. GND NC‡ 2 Ground 8 No connect NC‡ 18 PD 3 I Power down SEL0 19 I Propagation delay mode select SEL1 11 I Propagation delay mode select SEL0OUT 1 O Test pin (factory use only) SEL1OUT 9 O Test pin (factory use only) SRG1IN 6 I Serial-register gate 1 in SRG2IN 5 I Serial-register gate 2 in SRG3IN 4 I Serial-register gate 3 in SRG1OUT 14 O Serial-register gate 1 out SRG2OUT 15 O Serial-register gate 2 out SRG3OUT 16 O Serial-register gate 3 out TRGIN 7 I Transfer gate in TRGOUT VCC‡ 13 O Transfer gate out 12 I Positive supply voltage VCC‡ VSS‡ 17 I Positive supply voltage 10 I Negative supply voltage VSS‡ 20 I Negative supply voltage No connect ‡ All terminals of the same name should be connected together externally. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN28846 SERIAL DRIVER SOCS024B – FEBRUARY 1991 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Positive supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 V Negative supply voltage, VSS (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –11.1 V Input voltage range: SEL0 and SEL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS to VCC Other inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 5.5 V Continuous total power dissipation at (or below) TA ≤ 25°C: Unmounted device (see Figure 1) . . . 825 mW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mounted device (see Figure 1) . . . . . 1150 mW Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 20°C to 45°C Storage temperature range, TSTG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values are with respect to the GND terminal. 2. The algebraic convention, in which the least positive (most negative) value is designated minimum, is used in this data sheet for voltage levels only. POWER DISSIPATION vs FREE-AIR TEMPERATURE 1500 1400 Mounted Device (see Note A) PD – Power Dissipation – mW 1300 1200 1100 1000 900 800 700 600 500 400 300 Unmounted Device 200 100 0 0 10 20 30 40 50 60 70 TA – Free-Air Temperature – °C Figure 1 NOTE A: The mounted-device derating curve of Figure 1 is obtained under the following conditions: The board is 50 mm by 50 mm by 1.6 mm thick. The board material is glass epoxy. The copper thickness of all the etch runs is 35 microns. Etch run dimensions – All 20 etch runs are 0.4 mm by 22 mm. Each chip is soldered to the board. An aluminum cooling fin 10 mm by 10 mm by 1 mm thick is coupled to the chip with thermal paste. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN28846 SERIAL DRIVER SOCS024B – FEBRUARY 1991 recommended operating conditions Positive supply voltage, VCC Negative supply voltage, VSS (see Note 2) SRG1IN, SRG2IN, SRG3IN, TRGIN High-level input voltage, VIH MIN NOM MAX 0 1.5 3 –11.1 –10.4 –9.7 2 5 4 VCC 5 SEL0, SEL1 PD SRG1IN, SRG2IN, SRG3IN, TRGIN Low-level input voltage, VIL SEL0, SEL1 PD Capacitance load V V 0 0.8 VSS 0 0.4 V SRG1OUT, SRG2OUT, SRG3OUT 200 TRGOUT 350 Operating free-air temperature, TA UNIT – 20 45 pF °C NOTE 2: The algebraic convention, in which the least positive (most negative) value is designated minimum, is used in this data sheet for voltage levels only. electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER VOH VOL High-level out output ut voltage output Low-level out ut voltage TEST CONDITIONS SRG1OUT, SRG2OUT, SRG3OUT f = 4.8 MHz, See Figure 2 tw = 70 ns, TRGOUT f = 3.6 MHz, See Figure 2 tw = 140 ns, SRG1OUT, SRG2OUT, SRG3OUT f = 4.8 MHz, See Figure 2 tw = 70 ns, TRGOUT f = 3.6 MHz, See Figure 2 tw = 140 ns, VN(PP) Peak-to-peak output noise voltage SRG1OUT, SRG2OUT, SRG3OUT See Figure 2 IIH High-level input current SRG1IN, SRG2IN, SRG3IN, TRGIN, SEL0, SEL1 VI = 5.5 V IIL Low-level input current ISS Supply current fmax Maximum frequency of oscillation MIN MAX UNIT VCC – 0.5 05 VCC+0.5 +0 5 V 8 VSS – 0 0.8 +0 8 VSS+0.8 V 300 mV 50 µA ± 10 µA VI = 0 No load, PD at 0 V, TA = 25°C – 0.5 See Note 3 –25 SRG1OUT, SRG2OUT, SRG3OUT CL = 200 pF 10 TRGOUT CL = 350 pF 1 mA MHz NOTE 3: SRG1OUT, SRG2OUT, and SRG3OUT are loaded with 80-pF capacitive loads; TRGOUT is loaded with a 180-pF load. The SN28846 driver is clocked by the SN28835 timer. SEL0 and SEL1 are both held at –11.1 V. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN28846 SERIAL DRIVER SOCS024B – FEBRUARY 1991 switching characteristics for SRG1OUT, SRG2OUT, and SRG3OUT, VCC = 2.3 V, VSS = –10.3 V, TA = 25°C (unless otherwise noted) (see Figure 2)† PARAMETER SELECT MODE ‡ TEST CONDITIONS MIN 0 tPLH tPHL Propagation g delay y time, low-to-high-level output Propagation g delay y time, high-to-low-level output 1 2 tw = 70 ns, ns 36 f=4 4.8 8 MHz 48 0 25 2 (see Note 4) tsk(o) k( ) Skew time (see Note 5) (see Note 4) tw = 70 ns, ns 24 f=4 4.8 8 MHz Pulse duration tw(n) – tw(m) Pulse duration differential (see Note 6) ns 23 23 ±5 Any ±5 TA = – 20°C to 55°C 5 ns 5 0 tw UNIT ns 42 3 1 MAX 28 3 ∆tPLH ∆tPHL TYP 1 2 tw = 70 ns, ns f=4 4.8 8 MHz 3 Any tw = 70 ns, f = 4.8 MHz 63 68 73 54 59 64 47 52 57 40 45 50 5 ns ns tr Rise time 10 14 18 ns 8 MHz Any tw = 70 ns, f=4 4.8 ns 6 10 13 tf Fall time † The load is a Texas Instruments CCD image sensor. ‡ The select mode is determined by the voltage levels applied to the SEL1 and SEL0 inputs as follows: SELECT MODE SEL1 SEL0 0 VSS VSS 1 VSS VCC 2 VCC VSS 3 VCC VCC NOTES: 4. For a given channel, ∆tPLH and ∆tPHL are the changes in tPLH and tPHL, respectively, when the device is operated over the temperature range – 20°C to 55°C rather than at 25°C. 5. This is the maximum absolute difference in propagation delay time, either tPLH or tPHL, through the three channels at any given temperature within the specified range. 6. This is the maximum difference in the pulse duration through the three channels. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN28846 SERIAL DRIVER SOCS024B – FEBRUARY 1991 switching characteristics for TRGOUT, VCC = 2.3 V, VSS = –10.3 V, TA = 25°C (unless otherwise noted) (see Figure 2)† PARAMETER SELECT MODE ‡ TEST CONDITIONS MIN 0 tPLH tPHL Propagation g delay y time, low-to-high-level output Propagation g delay y time, high-to-low-level output 1 2 tw = 140 ns, ns 33 f=3 3.6 6 MHz 47 0 24 2 (see Note 7) tw tr Pulse duration (see Note 7) Any UNIT tw = 140 ns, ns ns 39 3 1 MAX 24 23 f=3 3.6 6 MHz ns 22 3 ∆tPLH ∆tPHL TYP 22 20 TA = – 20°C to 55°C 20 100 140 ns 180 Rise time Any tw = 140 ns, f = 3.6 MHz 17 ns 10 tf Fall time † The load is a Texas Instruments CCD image sensor. ‡ The select mode is determined by the voltage levels applied to SEL1 and SEL0 as follows: SELECT MODE SEL1 SEL0 0 VSS VSS 1 VSS VCC 2 VCC VSS 3 VCC VCC NOTE 7: ∆tPLH and ∆tPHL are the changes in tPLH and tPHL, respectively, when the device is operated over the temperature range – 20°C to 55°C rather than at 25°C. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN28846 SERIAL DRIVER SOCS024B – FEBRUARY 1991 PARAMETER MEASUREMENT INFORMATION SRG1IN, SRG2IN, SRG3IN, or TRGIN 50% 50% 90% SRG1OUT, SRG2OUT, SRG3OUT, or TRGOUT 10% tPHL tPLH PROPAGATION DELAYS SRG1OUT, SRG2OUT, SRG3OUT, or TRGOUT 90% 100% – 2 V 10% 0% + 2 V tw tr tf PULSE DURATION AND RISE AND FALL TIMES VCC + 0.5 V VCC VCC – 0.5 V SRG1OUT, SRG2OUT, or SRG3OUT SRG1OUT, SRG2OUT, or SRG3OUT VSS + 0.8 V VSS VSS + 0.15 V VSS – 0.15 V VSS – 0.6 V (typical) VCC + 0.5 V VCC SRG1OUT, SRG2OUT, or SRG3OUT VCC – 0.5 V SRG1OUT, SRG2OUT, or SRG3OUT VSS + 0.8 V VSS (worst case) TYPICAL AND WORST-CASE OUTPUT NOISE From Output Under Test VSS + 0.15 V VSS – 0.15 V VSS – 0.6 V 51 Ω CL = 80 pF (see Note A) NOTE A: CL Includes probe and jig capacitance. Figure 2. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SN28846 SERIAL DRIVER SOCS024B – FEBRUARY 1991 MECHANICAL DATA DW/R-PDSO-G** PLASTIC WIDE-BODY SMALL-OUTLINE PACKAGE 20 PIN SHOWN A 20 11 PINS** 16 20 24 28 A MIN 0.400 (10,16) 0.500 (12,70) 0.600 (15,24) 0.700 (17,78) A MAX 0.410 (10,41) 0.510 (12,95) 0.610 (15,49) 0.710 (18,03) DIM 0.419 (10,65) 0.400 (10,15) 0.299 (7,59) 0.293 (7,45) 10 1 0.104 (2,65) 0.093 (2,35) 0.012 (0,30) 0.004 (0,10) 0.364 (9,24) 0.338 (8,58) Seating Plane 0.004 (0,10) 0.020 (0,51) 0.014 (0,35) 0°– 8° 0.012 (0,30) 0.009 (0,23) 0.050 (1,27) 0.016 (0,40) 0.010 (0,25) M 0.050 (1,27) 4040000/A–10/93 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 1998, Texas Instruments Incorporated