TI SN28846DW

SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
•
•
•
•
•
•
DW PACKAGE
(TOP VIEW)
TTL-Compatible Inputs
CCD-Compatible Outputs
Full-Frame Operation
Frame-Transfer Operation
Solid-State Reliability
Adjustable Clock Levels
SEL0OUT
GND
PD
SRG3IN
SRG2IN
SRG1IN
TRGIN
NC
SEL1OUT
VSS
description
1
20
2
19
3
18
4
17
5
16
6
15
7
14
VSS
SEL0
NC
VCC
SRG3OUT
SRG2OUT
SRG1OUT
TRGOUT
VCC
SEL1
The SN28846 serial driver is a monolithic CMOS
8
13
integrated circuit designed to drive the serial-reg9
12
ister gate (SRGn) and transfer-gate (TRG) inputs
10
11
of the Texas Instruments (TI) virtual-phase CCD
image sensors. The SN28846 interfaces a
NC – No internal connection
user-defined timing generator to the CCD image
sensor; it receives TTL signals from the timing generator and outputs level-shifted signals to the image sensor.
The SN28846 contains three noninverting serial-gate drivers and one noninverting transfer-gate driver.
The voltage levels on SRG1OUT, SRG2OUT, SRG3OUT, and TRGOUT are controlled by the levels on VSS and
VCC. The propagation delays for these outputs are controlled by SEL0 and SEL1. The PD, SRG1IN, SRG2IN,
SRG3IN, and TRGIN are TTL compatible.
A high level on PD allows the SN28846 to operate normally with the level-shifted outputs following the inputs.
When PD is low, the device is in a low power-consumption mode and all outputs are at VCC.
The SN28846 is available in a 20-pin surface-mount package and is characterized for operation from –20°C
to 45°C.
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These
circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,
Method 3015; however, precautions should be taken to avoid application of any voltage higher than maximum-rated voltages to these
high-impedance circuits. During storage or handling, the device leads should be shorted together or the device should be placed in
conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic voltage level, preferably either VCC or ground.
Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices and Assemblies available from Texas Instruments.
TI is a trademark of Texas Instruments Incorporated.
Copyright  1991, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
logic symbol†
Φ
SEL0
SEL1
19
11
3
PD
SRG1IN
SRG2IN
6
14
5
15
4
16
SRG3IN
SRG1OUT
SRG2OUT
SRG3OUT
13
7
TRGIN
TRGOUT
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
NO.
GND
NC‡
2
Ground
8
No connect
NC‡
18
PD
3
I
Power down
SEL0
19
I
Propagation delay mode select
SEL1
11
I
Propagation delay mode select
SEL0OUT
1
O
Test pin (factory use only)
SEL1OUT
9
O
Test pin (factory use only)
SRG1IN
6
I
Serial-register gate 1 in
SRG2IN
5
I
Serial-register gate 2 in
SRG3IN
4
I
Serial-register gate 3 in
SRG1OUT
14
O
Serial-register gate 1 out
SRG2OUT
15
O
Serial-register gate 2 out
SRG3OUT
16
O
Serial-register gate 3 out
TRGIN
7
I
Transfer gate in
TRGOUT
VCC‡
13
O
Transfer gate out
12
I
Positive supply voltage
VCC‡
VSS‡
17
I
Positive supply voltage
10
I
Negative supply voltage
VSS‡
20
I
Negative supply voltage
No connect
‡ All terminals of the same name should be connected together externally.
2
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SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Positive supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 V
Negative supply voltage, VSS (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –11.1 V
Input voltage range: SEL0 and SEL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS to VCC
Other inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 5.5 V
Continuous total power dissipation at (or below) TA ≤ 25°C: Unmounted device (see Figure 1) . . . 825 mW
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mounted device (see Figure 1) . . . . . 1150 mW
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 20°C to 45°C
Storage temperature range, TSTG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to the GND terminal.
2. The algebraic convention, in which the least positive (most negative) value is designated minimum, is used in this data sheet for
voltage levels only.
POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
1500
1400
Mounted Device
(see Note A)
PD – Power Dissipation – mW
1300
1200
1100
1000
900
800
700
600
500
400
300
Unmounted Device
200
100
0
0
10
20
30
40
50
60
70
TA – Free-Air Temperature – °C
Figure 1
NOTE A: The mounted-device derating curve of Figure 1 is obtained under the following conditions:
The board is 50 mm by 50 mm by 1.6 mm thick.
The board material is glass epoxy.
The copper thickness of all the etch runs is 35 microns.
Etch run dimensions – All 20 etch runs are 0.4 mm by 22 mm.
Each chip is soldered to the board.
An aluminum cooling fin 10 mm by 10 mm by 1 mm thick is coupled to the chip with thermal paste.
POST OFFICE BOX 655303
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3
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
recommended operating conditions
Positive supply voltage, VCC
Negative supply voltage, VSS (see Note 2)
SRG1IN, SRG2IN, SRG3IN, TRGIN
High-level input voltage, VIH
MIN
NOM
MAX
0
1.5
3
–11.1
–10.4
–9.7
2
5
4
VCC
5
SEL0, SEL1
PD
SRG1IN, SRG2IN, SRG3IN, TRGIN
Low-level input voltage, VIL
SEL0, SEL1
PD
Capacitance load
V
V
0
0.8
VSS
0
0.4
V
SRG1OUT, SRG2OUT, SRG3OUT
200
TRGOUT
350
Operating free-air temperature, TA
UNIT
– 20
45
pF
°C
NOTE 2: The algebraic convention, in which the least positive (most negative) value is designated minimum, is used in this data sheet for voltage
levels only.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER
VOH
VOL
High-level out
output
ut voltage
output
Low-level out
ut voltage
TEST CONDITIONS
SRG1OUT, SRG2OUT,
SRG3OUT
f = 4.8 MHz,
See Figure 2
tw = 70 ns,
TRGOUT
f = 3.6 MHz,
See Figure 2
tw = 140 ns,
SRG1OUT, SRG2OUT,
SRG3OUT
f = 4.8 MHz,
See Figure 2
tw = 70 ns,
TRGOUT
f = 3.6 MHz,
See Figure 2
tw = 140 ns,
VN(PP)
Peak-to-peak output
noise voltage
SRG1OUT, SRG2OUT,
SRG3OUT
See Figure 2
IIH
High-level input current
SRG1IN, SRG2IN,
SRG3IN, TRGIN,
SEL0, SEL1
VI = 5.5 V
IIL
Low-level input current
ISS
Supply current
fmax
Maximum frequency
of oscillation
MIN
MAX
UNIT
VCC – 0.5
05
VCC+0.5
+0 5
V
8
VSS – 0
0.8
+0 8
VSS+0.8
V
300
mV
50
µA
± 10
µA
VI = 0
No load, PD at 0 V, TA = 25°C
– 0.5
See Note 3
–25
SRG1OUT, SRG2OUT,
SRG3OUT
CL = 200 pF
10
TRGOUT
CL = 350 pF
1
mA
MHz
NOTE 3: SRG1OUT, SRG2OUT, and SRG3OUT are loaded with 80-pF capacitive loads; TRGOUT is loaded with a 180-pF load. The SN28846
driver is clocked by the SN28835 timer. SEL0 and SEL1 are both held at –11.1 V.
4
POST OFFICE BOX 655303
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SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
switching characteristics for SRG1OUT, SRG2OUT, and SRG3OUT, VCC = 2.3 V, VSS = –10.3 V,
TA = 25°C (unless otherwise noted) (see Figure 2)†
PARAMETER
SELECT
MODE ‡
TEST CONDITIONS
MIN
0
tPLH
tPHL
Propagation
g
delay
y time,
low-to-high-level output
Propagation
g
delay
y time,
high-to-low-level output
1
2
tw = 70 ns,
ns
36
f=4
4.8
8 MHz
48
0
25
2
(see Note 4)
tsk(o)
k( )
Skew time (see Note 5)
(see Note 4)
tw = 70 ns,
ns
24
f=4
4.8
8 MHz
Pulse duration
tw(n) – tw(m)
Pulse duration differential
(see Note 6)
ns
23
23
±5
Any
±5
TA = – 20°C to 55°C
5
ns
5
0
tw
UNIT
ns
42
3
1
MAX
28
3
∆tPLH
∆tPHL
TYP
1
2
tw = 70 ns,
ns
f=4
4.8
8 MHz
3
Any
tw = 70 ns,
f = 4.8 MHz
63
68
73
54
59
64
47
52
57
40
45
50
5
ns
ns
tr
Rise time
10
14
18
ns
8 MHz
Any
tw = 70 ns,
f=4
4.8
ns
6
10
13
tf
Fall time
† The load is a Texas Instruments CCD image sensor.
‡ The select mode is determined by the voltage levels applied to the SEL1 and SEL0 inputs as follows:
SELECT MODE
SEL1
SEL0
0
VSS
VSS
1
VSS
VCC
2
VCC
VSS
3
VCC
VCC
NOTES: 4. For a given channel, ∆tPLH and ∆tPHL are the changes in tPLH and tPHL, respectively, when the device is operated over the
temperature range – 20°C to 55°C rather than at 25°C.
5. This is the maximum absolute difference in propagation delay time, either tPLH or tPHL, through the three channels at any given
temperature within the specified range.
6. This is the maximum difference in the pulse duration through the three channels.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
switching characteristics for TRGOUT, VCC = 2.3 V, VSS = –10.3 V, TA = 25°C (unless otherwise noted)
(see Figure 2)†
PARAMETER
SELECT
MODE ‡
TEST CONDITIONS
MIN
0
tPLH
tPHL
Propagation
g
delay
y time,
low-to-high-level output
Propagation
g
delay
y time,
high-to-low-level output
1
2
tw = 140 ns,
ns
33
f=3
3.6
6 MHz
47
0
24
2
(see Note 7)
tw
tr
Pulse duration
(see Note 7)
Any
UNIT
tw = 140 ns,
ns
ns
39
3
1
MAX
24
23
f=3
3.6
6 MHz
ns
22
3
∆tPLH
∆tPHL
TYP
22
20
TA = – 20°C to 55°C
20
100
140
ns
180
Rise time
Any
tw = 140 ns,
f = 3.6 MHz
17
ns
10
tf
Fall time
† The load is a Texas Instruments CCD image sensor.
‡ The select mode is determined by the voltage levels applied to SEL1 and SEL0 as follows:
SELECT MODE
SEL1
SEL0
0
VSS
VSS
1
VSS
VCC
2
VCC
VSS
3
VCC
VCC
NOTE 7: ∆tPLH and ∆tPHL are the changes in tPLH and tPHL, respectively, when the device is operated over the temperature range – 20°C to 55°C
rather than at 25°C.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
PARAMETER MEASUREMENT INFORMATION
SRG1IN, SRG2IN,
SRG3IN, or TRGIN
50%
50%
90%
SRG1OUT, SRG2OUT,
SRG3OUT, or TRGOUT
10%
tPHL
tPLH
PROPAGATION DELAYS
SRG1OUT, SRG2OUT,
SRG3OUT, or TRGOUT
90%
100% – 2 V
10%
0% + 2 V
tw
tr
tf
PULSE DURATION AND RISE AND FALL TIMES
VCC + 0.5 V
VCC
VCC – 0.5 V
SRG1OUT, SRG2OUT,
or SRG3OUT
SRG1OUT, SRG2OUT,
or SRG3OUT
VSS + 0.8 V
VSS
VSS + 0.15 V
VSS – 0.15 V
VSS – 0.6 V
(typical)
VCC + 0.5 V
VCC
SRG1OUT, SRG2OUT,
or SRG3OUT
VCC – 0.5 V
SRG1OUT, SRG2OUT,
or SRG3OUT
VSS + 0.8 V
VSS
(worst case)
TYPICAL AND WORST-CASE OUTPUT NOISE
From Output
Under Test
VSS + 0.15 V
VSS – 0.15 V
VSS – 0.6 V
51 Ω
CL = 80 pF
(see Note A)
NOTE A: CL Includes probe and jig capacitance.
Figure 2. Load Circuit and Voltage Waveforms
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7
SN28846
SERIAL DRIVER
SOCS024B – FEBRUARY 1991
MECHANICAL DATA
DW/R-PDSO-G**
PLASTIC WIDE-BODY SMALL-OUTLINE PACKAGE
20 PIN SHOWN
A
20
11
PINS**
16
20
24
28
A MIN
0.400
(10,16)
0.500
(12,70)
0.600
(15,24)
0.700
(17,78)
A MAX
0.410
(10,41)
0.510
(12,95)
0.610
(15,49)
0.710
(18,03)
DIM
0.419 (10,65)
0.400 (10,15)
0.299 (7,59)
0.293 (7,45)
10
1
0.104 (2,65)
0.093 (2,35)
0.012 (0,30)
0.004 (0,10)
0.364 (9,24)
0.338 (8,58)
Seating Plane
0.004 (0,10)
0.020 (0,51)
0.014 (0,35)
0°– 8°
0.012 (0,30)
0.009 (0,23)
0.050 (1,27)
0.016 (0,40)
0.010 (0,25) M
0.050 (1,27)
4040000/A–10/93
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
8
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Copyright  1998, Texas Instruments Incorporated