TI TXS0102YZPR

TXS0102
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES640 – JANUARY 2007
FEATURES
•
•
•
•
•
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on
B port (VCCA ≤ VCCB)
VCC Isolation Feature – If Either VCC Input Is at
GND, Both Ports Are in the High-Impedance
State
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– A Port
– 2500-V Human-Body Model (A114-B)
– 250-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
– B Port
– 8-kV Human-Body Model (A114-B)
– 250-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
DCT OR DCU PACKAGE
(TOP VIEW)
B2
1
8
B1
GND
2
7
VCCB
VCCA
3
6
OE
A2
4
5
A1
YZP PACKAGE
(BOTTOM VIEW)
A2
D1
4 5
D2
A1
VCCA
C1
3 6
C2
OE
GND
B1
2 7
B2
VCCB
B2
A1
1 8
A2
B1
abc
abc
abc
abc
DESCRIPTION/ORDERING INFORMATION
This two-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.65 V to 3.6 V. The B port is designed to track VCCB. VCCA
must be less than or equal to VCCB. VCCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for
low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the
driver.
ORDERING INFORMATION
PACKAGE (1)
TA
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
–40°C to 85°C
SSOP – DCT
VSSOP – DCU
(1)
(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING (2)
Reel of 3000
TXS0102YZPR
Reel of 3000
TXS0102DCTR
NFEZ_ _ _
Tube of 250
TXS0102DCTT
NFEZ _ _ _
Reel of 3000
TXS0102DCUR
_ _ NFE
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TXS0102
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES640 – JANUARY 2007
PIN DESCRIPTION
(DCT AND DCU PACKAGES)
NO.
NAME
1
B2
FUNCTION
2
GND
Ground
3
VCCA
A-port supply voltage. 1.65 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB
4
A2
Input/output A. Referenced to VCCA.
5
A1
Input/output A. Referenced to VCCA.
6
OE
3-state output mode enable. Pull OE low to place all outputs in 3-state mode.
Referenced to VCCA.
7
VCCB
8
B1
Input/output B. Referenced to VCCB.
B-port supply voltage. 2.3 V ≤ VCCB ≤ 5.5 V
Input/output B. Referenced to VCCB.
TYPICAL OPERATING CIRCUIT
1.8 V
3.3 V
0.1 mF
0.1 mF
1.8 V
System
Controller
Data
2
VCCA
VCCB
OE
A1
A2
B1
B2
3.3 V
System
Data
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1 mF
TXS0102
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES640 – JANUARY 2007
Absolute Maximum Ratings
(1)
over recommended operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCCA
Supply voltage range
–0.5
4.6
V
VCCB
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
A port
–0.5
4.6
B port
–0.5
6.5
VO
Voltage range applied to any output
in the high-impedance or power-off state (2)
A port
–0.5
4.6
B port
–0.5
6.5
VO
Voltage range applied to any output in the high or low state (2) (3)
A port
–0.5
VCCA + 0.5
B port
–0.5
VCCB + 0.5
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through VCCA, VCCB, or GND
θJA
Tstg
(1)
(2)
(3)
(4)
Package thermal impedance (4)
DCT package
220
DCU package
227
YZP package
102
Storage temperature range
–65
150
UNIT
V
V
V
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCCA and VCCB are provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
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TXS0102
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES640 – JANUARY 2007
Recommended Operating Conditions (1) (2)
VCCA
VCCA
VCCB
Supply voltage (3)
A-port I/Os
VIH
VCCB
High-level input voltage
B-port I/Os
OE input
1.65 V to 1.95 V
2.3 V to 3.6 V
2.3 V to 5.5 V
1.65 V to 3.6 V
2.3 V to 5.5 V
1.65 V to 3.6 V
2.3 V to 5.5 V
A-port I/Os
VIL
Low-level input voltage
B-port I/Os
OE input
MIN
MAX
1.65
3.6
2.3
5.5
VCCI – 0.2
VCCI
VCCI – 0.4
VCCI
VCCI – 0.4
VCCI
VCCA × 0.65
5.5
0
0.15
0
0.15
0
VCCA × 0.35
A-port I/Os,
push-pull
driving
∆t/∆v
Input transition
rise or fall rate
B-port I/Os,
push-pull
driving
(1)
(2)
(3)
4
V
V
V
10
1.65 V to 3.6 V
2.3 V to 5.5 V
ns/V
10
Control input
TA
UNIT
10
Operating free-air temperature
–40
VCCI is the supply voltage associated with the input port.
VCCO is the supply voltage associated with the output port.
VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
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85
°C
TXS0102
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES640 – JANUARY 2007
Electrical Characteristics
(1) (2) (3)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
VCCA
VCCB
TA = 25°C
MIN
VOHA
IOH = –20 µA,
VIB ≥ VCCB – 0.4 V
1.65 V to 3.6 V
2.3 V to 5.5 V
VOLA
IOL = 1 mA,
VIB ≤ 0.15 V
1.65 V to 3.6 V
2.3 V to 5.5 V
VOHB
IOH = –20 µA,
VIA ≥ VCCA – 0.2 V
1.65 V to 3.6 V
2.3 V to 5.5 V
VOLB
IOL = 1 mA,
VIA ≤ 0.15 V
1.65 V to 3.6 V
2.3 V to 5.5 V
II
Ioff
IOZ
V
0.4
V
VCCB × 0.67
V
0.4
V
1.65 V to 5.5 V
±1
±2
µA
0V
0 to 5.5 V
±1
±2
µA
B port
0 to 3.6 V
0V
±1
±2
µA
1.65 V to 5.5 V
2.3 V to 5.5 V
±1
±2
µA
1.65 V to VCCB
2.3 V to 5.5 V
2.4
3.6 V
0V
2.2
0V
5.5 V
–1
1.65 V to VCCB
2.3 V to 5.5 V
12
3.6 V
0V
–1
0V
5.5 V
1
1.65 V to VCCB
2.3 V to 5.5 V
OE
3.3 V
3.3 V
2.5
A or B port
3.3 V
3.3 V
10
A or B port
VI = VO = open,
IO = 0
VI = VO = open,
IO = 0
ICCA + ICCB
(1)
(2)
(3)
VCCA × 0.67
1.65 V to 5.5 V
ICCB
Cio
UNIT
MIN MAX
A port
OE
ICCA
CI
–40°C to 85°C
TYP MAX
VI = VCCI or GND,
IO = 0
A port
5
6
B port
6
7.5
µA
µA
14.4
µA
3.5
pF
pF
VCCI is the VCC associated with the input port.
VCCO is the VCC associated with the output port.
VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
Timing Requirements
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
MIN MAX
Data rate
tw
Pulse duration
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Data inputs
VCC = 3.3 V
± 0.3 V
MIN
VCC = 5 V
± 0.5 V
MAX
MIN
UNIT
MAX
21
22
24
1
1
1
47
45
41
500
500
500
Mbps
ns
Timing Requirements
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
MIN MAX
Data rate
tw
Pulse duration
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Data inputs
VCC = 3.3 V
± 0.3 V
MIN
VCC = 5 V
± 0.5 V
MAX
MIN
20
22
24
1
1
1
50
45
41
500
500
500
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UNIT
MAX
Mbps
ns
5
TXS0102
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES640 – JANUARY 2007
Timing Requirements
over recommended operating free-air temperature range, VCCA = 3 V ± 0.3 V (unless otherwise noted)
VCC = 3.3 V
± 0.3 V
MIN
Data rate
tw
Pulse duration
Push-pull driving
Open-drain driving
Push-pull driving
Data inputs
Open-drain driving
VCC = 5 V
± 0.5 V
MAX
MIN
UNIT
MAX
23
24
1
1
43
41
500
500
Mbps
ns
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCCB = 2.5 V
± 0.2 V
MIN
Push-pull driving
tPHL
A
B
tPLH
Open-drain driving
2.3
B
A
tPLH
45
8.8
2.4
260
5.3
36
175
MAX
MIN MAX
5.4
6.8
9.6
2.6
208
4.4
27
140
UNIT
ns
198
4.7
1.2
4.5
36
10
7.5
4.5
1.1
5.3
45
VCCB = 5 V
± 0.5 V
7.1
4.4
1.9
Push-pull driving
Open-drain driving
MIN
6.8
Push-pull driving
Open-drain driving
MAX
VCCB = 3.3 V
± 0.3 V
5.3
Push-pull driving
Open-drain driving
tPHL
4
0.5
27
ns
102
ten
OE
A or B
200
200
200
ns
tdis
OE
A or B
50
40
35
ns
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
Push-pull driving
3.2
9.5
2.3
9.3
2
7.6
Open-drain driving
38
165
30
132
22
95
Push-pull driving
Open-drain driving
Push-pull driving
tfB
B-port fall time
tSK(O)
Channel-to-channel skew
Max data rate
6
TEST
CONDITIONS
4
10.8
2.7
9.1
2.7
7.6
34
145
23
106
10
58
13.3
2
5.9
1.9
6
1.7
Open-drain driving
4.4
6.9
4.3
6.4
4.2
6.1
Push-pull driving
2.9
13.8
2.8
16.2
2.8
16.2
Open-drain driving
6.9
13.8
7.5
16.2
7
16.2
Push-pull driving
21
22
24
1
1
1
0.7
Open-drain driving
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0.7
0.7
ns
ns
ns
ns
Mbps
TXS0102
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES640 – JANUARY 2007
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
VCCB = 2.5 V
± 0.2 V
MIN
Push-pull driving
tPHL
A
B
tPLH
Open-drain driving
Open-drain driving
6.3
43
250
4.7
6
36
206
3.8
2.1
4.2
5.8
4.4
27
3.6
2.6
UNIT
MIN MAX
4.1
3
1.8
MAX
VCCB = 5 V
± 0.5 V
3.7
2
3.5
Push-pull driving
tPHL
MIN
3.2
1.7
Push-pull driving
Open-drain driving
MAX
VCCB = 3.3 V
± 0.3 V
ns
190
4.3
1.2
4
B
A
ten
OE
A or B
200
200
200
ns
tdis
OE
A or B
50
40
35
ns
tPLH
Open-drain driving
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
tSK(O)
Channel-to-channel skew
Max data rate
Push-pull driving
2.5
44
170
1.6
37
140
1
27
103
Push-pull driving
2.8
7.4
2.6
6.6
1.8
5.6
Open-drain driving
34
149
28
121
24
89
Push-pull driving
3.2
8.3
2.9
7.2
2.4
6.1
Open-drain driving
35
151
24
112
12
64
Push-pull driving
1.9
5.7
1.9
5.5
1.8
5.3
Open-drain driving
4.4
6.9
4.3
6.2
4.2
5.8
Push-pull driving
2.2
7.8
2.4
6.7
2.6
6.6
Open-drain driving
5.1
8.8
5.4
9.4
5.4
10.4
Push-pull driving
20
22
24
1
1
1
0.7
Open-drain driving
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0.7
ns
0.7
ns
ns
ns
ns
ns
Mbps
7
TXS0102
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES640 – JANUARY 2007
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
VCCB = 3.3 V
± 0.3 V
MIN
Push-pull driving
tPHL
A
B
tPLH
Open-drain driving
Open-drain driving
3.1
1.4
4.2
36
Push-pull driving
tPHL
4.2
204
124
4.6
4.4
28
2.5
1
UNIT
MIN MAX
2.4
1.3
Push-pull driving
Open-drain driving
MAX
VCCB = 5 V
± 0.5 V
ns
165
3.3
1
97
B
A
ten
OE
A or B
200
200
ns
tdis
OE
A or B
40
35
ns
tPLH
Open-drain driving
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
tSK(O)
Channel-to-channel skew
Max data rate
Push-pull driving
2.5
3
139
2.6
3
105
Push-pull driving
2.3
5.6
1.9
4.8
Open-drain driving
25
116
19
85
Push-pull driving
2.5
6.4
2.1
7.4
Open-drain driving
26
116
14
72
Push-pull driving
2
5.4
1.9
5
Open-drain driving
4.3
6.1
4.2
5.7
Push-pull driving
2.3
7.4
2.4
7.6
5
7.6
4.8
8.3
Open-drain driving
0.7
Push-pull driving
Open-drain driving
0.7
23
24
1
1
ns
ns
ns
ns
ns
ns
Mbps
PRINCIPLES OF OPERATION
Applications
The TXS0102 can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another. The TXS0102 is ideal for use in applications where an open-drain
driver is connected to the data I/Os. The TXS0102 can also be used in applications where a push-pull driver is
connected to the data I/Os, but the TXB0102 might be a better option for such push-pull applications.
Architecture
The TXS0102 architecture (see Figure 1) does not require a direction-control signal to control the direction of
data flow from A to B or from B to A.
8
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TXS0102
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES640 – JANUARY 2007
PRINCIPLES OF OPERATION (continued)
VCCB
VCCA
T1
Oneshot
Oneshot
T2
10k
10k
Gate Bias
A
B
Figure 1. Architecture of a TXS01xx Cell
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup
resistor to VCCB. The output one-shots detect rising edges on the A or B ports. During a rising edge, the
one-shot turns on the PMOS transistors (T1,T2) for a short duration, which speeds up the low-to-high transition.
Input Driver Requirements
The fall time (tfA, tfB) of a signal depends on the output impedance of the external device driving the data I/Os of
the TXS0102. Similarly, the tPHL and max data rates also depend on the output impedance of the external driver.
The values for tfA, tfB, tPHL, and maximum data rates in the data sheet assume that the output impedance of the
external driver is less than 50 Ω.
Power Up
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not
damage the device, so any power supply can be ramped up first.
Enable and Disable
The TXS0102 has an OE input that is used to disable the device by setting OE low, which places all I/Os in the
Hi-Z state. The disable time (tdis) indicates the delay between the time when OE goes low and when the outputs
actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the
one-shot circuitry to become operational after OE is taken high.
Pullup or Pulldown Resistors on I/O Lines
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup
resistor to VCCB. If a smaller value of pullup resistor is required, an external resistor must be added from the I/O
to VCCA or VCCB (in parallel with the internal 10-kΩ resistors).
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TXS0102
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES640 – JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
VCCI
VCCO
VCCI
VCCO
DUT
IN
DUT
IN
OUT
OUT
1 MW
15 pF
1 MW
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
2 × VCCO
50 kW
From Output
Under Test
15 pF
S1
Open
50 kW
LOAD CIRCUIT FOR ENABLE/DISABLE
TIME MEASUREMENT
TEST
S1
tPZL/tPLZ
tPHZ/tPZH
2 × VCCO
Open
tw
VCCI
VCCI/2
Input
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VCCA
Output
Control
(low-level
enabling)
VCCA/2
0V
tPZL
VCCI
Input
VCCO/2
VCCO/2
0V
tPLH
Output
tPHL
VCCO/2
VOH
VCCO/2
VOL
0.9 y VCCO
0.1 y VCCO
tPLZ
VCCO
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VCCA/2
VCCO/2
0.1 y VCCO
tPZH
VOL
tPHZ
VOH
0.9 y VCCO
VCCO/2
0V
tf
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
J. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
10
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PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
TXS0102DCUR
ACTIVE
US8
DCU
Pins Package Eco Plan (2)
Qty
8
3000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
MSL Peak Temp (3)
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
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Addendum-Page 1
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