TI TXB0104-Q1

TXB0104-Q1
www.ti.com...................................................................................................................................................................................................... SCES727 – JUNE 2008
4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
WITH AUTOMATIC DIRECTION SENSING AND ±15-kV ESD PROTECTION
FEATURES
1
•
ESD Protection Exceeds JESD 22
– A Port
– 2500-V Human-Body Model (A114-B)
– 200-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
– B Port
– ±15-kV Human-Body Model (A114-B)
– 200-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
PW PACKAGE
(TOP VIEW)
RGY PACKAGE
(TOP VIEW)
VCCA
1
14
VCCB
A1
2
13
B1
A2
3
12
B2
A3
4
11
B3
A4
5
10
B4
NC
GND
6
9
7
8
NC
OE
A1
A2
A3
A4
NC
VCCB
•
•
•
1
14
13 B1
2
3
12 B2
Exposed
Center
Pad
4
5
6
11 B3
10 B4
9 NC
GND
7
8
OE
•
Qualified for Automotive Applications
1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on
B Port (VCCA ≤ VCCB)
VCC Isolation Feature – If Either VCC Input Is at
GND, All Outputs Are in the High-Impedance
State
OE Input Circuit Referenced to VCCA
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
VCCA
•
•
NC − No internal connection
For RGY, if the exposed center pad is used, it must be connected only to as a secondary ground or left electrically
open.
DESCRIPTION/ORDERING INFORMATION
This 4-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB
accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation
between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the
high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor;
the minimum value of the resistor is determined by the current-sourcing capability of the driver.
The TXB0104 is designed so that the OE input circuit is supplied by VCCA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TXB0104-Q1
SCES727 – JUNE 2008...................................................................................................................................................................................................... www.ti.com
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 125°C
(1)
(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
QFN – RGY
Reel of 1000
TXB0104QRGYRQ1
YE04Q1
TSSOP – PW
Reel of 2000
TXB0104QPWRQ1
YE04Q1
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
TERMINAL FUNCTIONS
PIN
DESCRIPTION
NO.
NAME
1
VCCA
2
A1
Input/output 1. Referenced to VCCA.
3
A2
Input/output 2. Referenced to VCCA.
4
A3
Input/output 3. Referenced to VCCA.
5
A4
Input/output 4. Referenced to VCCA.
6
NC
No connection. Not internally connected.
7
GND
8
OE
3-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.
9
NC
No connection. Not internally connected.
10
B4
Input/output 4. Referenced to VCCB.
11
B3
Input/output 3. Referenced to VCCB.
12
B2
Input/output 2. Referenced to VCCB.
13
B1
Input/output 1. Referenced to VCCB.
14
VCCB
A-port supply voltage 1.2 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB.
Ground
B-port supply voltage 1.65 V ≤ VCCB ≤ 5.5 V.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCCA
VCCB
MIN
MAX
–0.5
4.6
–0.5
6.5
A port
–0.5
4.6
B port
–0.5
6.5
A port
–0.5
4.6
B port
-0.5
6.5
A port
–0.5
VCCA + 0.5
B port
–0.5
VCCB + 0.5
Supply voltage range
UNIT
V
VI
Input voltage range
VO
Voltage range applied to any output in the high-impedance or
power-off state
VO
Voltage range applied to any output in the high or low state (2)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
Continuous current through VCCA, VCCB, or GND
Tstg
(1)
(2)
2
Storage temperature range
–65
V
V
V
±50
mA
±100
mA
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The value of VCCA and VCCB are provided in the recommended operating conditions table.
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THERMAL IMPEDANCE RATINGS
TYP
θJA
(1)
(2)
PW package
Package thermal impedance
(1)
113
RGY package (2)
47
UNIT
°C/W
The package thermal impedance is calculated in accordance with JESD 51-7.
The package thermal impedance is calculated in accordance with JESD 51-5.
RECOMMENDED OPERATING CONDITIONS (1) (2)
VCCA
VCCA
VCCB
Supply voltage
MIN
MAX
1.2
3.6
1.65
5.5
Data inputs
1.2 V to 3.6 V
1.65 V to 5.5 V
VCCI × 0.65 (3)
VCCI
OE
1.2 V to 3.6 V
1.65 V to 5.5 V
VCCA × 0.65
5.5
Data inputs
1.2 V to 5.5 V
1.65 V to 5.5 V
0
VCCI × 0.35 (3)
OE
1.2 V to 3.6 V
1.65 V to 5.5 V
0
VCCA × 0.35
0
3.6
1.2 V to 3.6 V
1.65 V to 5.5 V
0
5.5
1.2 V to 3.6 V
1.65 V to 5.5 V
40
1.65 V to 3.6 V
40
VIH
High-level input voltage
VIL
Low-level input voltage
VO
Voltage range applied to any A-port
output in the high-impedance
B-port
or power-off state
Δt/Δv
Input transition
rise or fall rate
TA
Operating free-air temperature
A-port inputs
(1)
(2)
(3)
VCCB
B-port inputs
1.2 V to 3.6 V
4.5 V to 5.5 V
UNIT
V
V
V
V
ns/V
30
–40
125
°C
The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND.
VCCA must be less than or equal to VCCB and must not exceed 3.6 V.
VCCI is the supply voltage associated with the input port.
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ELECTRICAL CHARACTERISTICS (1) (2)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCCA
VCCB
1.2 V
IOH = –20 µA
VOLA
IOL = 20 µA
VOHB
IOH = –20 µA
1.65 V to 5.5 V
VOLB
IOL = 20 µA
1.65 V to 5.5 V
Ioff
IOZ
OE
VI = VCCI or GND
A port
B port
A or B port
OE = GND
MIN MAX
1.4 V to 3.6 V
1.2 V
0.9
1.4 V to 3.6 V
0.4
VCCB – 0.4
V
V
µA
1.65 V to 5.5 V
±1
±5
VI or VO = 0 to 3.6 V
0V
0 V to 5.5 V
±1
±10
VI or VO = 0 to 5.5 V
0 V to 3.6 V
0V
±1
±10
1.2 V to 3.6 V
1.65 V to 5.5 V
±1
±10
1.2 V
1.65 V to 5.5 V
1.4 V to 3.6 V
1.65 V to 5.5 V
20
3.6 V
0V
15
0V
5.5 V
–15
1.2 V
1.65 V to 5.5 V
ICCB
1.65 V to 5.5 V
20
3.6 V
0V
–15
0V
5.5 V
ICCA + ICCB
VI = VCCI or GND,
IO = 0
1.2 V
1.65 V to 5.5 V
1.4 V to 3.6 V
1.65 V to 5.5 V
VI = VCCI or GND,
IO = 0,
OE = GND
1.2 V
1.65 V to 5.5 V
ICCZA
1.4 V to 3.6 V
1.65 V to 5.5 V
VI = VCCI or GND,
IO = 0,
OE = GND
1.2 V
1.65 V to 5.5 V
ICCZB
1.4 V to 3.6 V
1.65 V to 5.5 V
1.2 V to 3.6 V
1.65 V to 5.5 V
Cio
(1)
(2)
4
A port
B port
1.2 V to 3.6 V
1.65 V to 5.5 V
µA
µA
0.06
1.4 V to 3.6 V
OE
V
0.4
VI = VCCI or GND,
IO = 0
Ci
UNIT
V
VCCA – 0.4
1.2 V to 3.6 V
VI = VCCI or GND,
IO = 0
ICCA
–40°C to 125°C
TYP MAX
1.1
VOHA
II
TA = 25°C
MIN
µA
3.4
µA
15
3.5
40
0.05
15
3.3
15
3
5
11
µA
µA
µA
pF
pF
VCCI is the supply voltage associated with the input port.
VCCO is the supply voltage associated with the output port.
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TIMING REQUIREMENTS
TA = 25°C, VCCA = 1.2 V
Data rate
tw
Pulse duration
Data inputs
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
VCCB = 5 V
TYP
TYP
TYP
TYP
20
20
20
20
Mbps
50
50
50
50
ns
UNIT
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
MIN
Data rate
tw
Pulse duration
VCCB = 2.5 V
± 0.2 V
MAX
MIN
MAX
40
Data inputs
25
VCCB = 3.3 V
± 0.3 V
MIN
VCCB = 5 V
± 0.5 V
MAX
40
MIN
40
25
40
25
UNIT
MAX
25
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
MIN
Data rate
tw
Pulse duration
VCCB = 2.5 V
± 0.2 V
MAX
MIN
MAX
55
Data inputs
18
VCCB = 3.3 V
± 0.3 V
MIN
VCCB = 5 V
± 0.5 V
MAX
55
MIN
55
18
55
18
UNIT
MAX
18
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
MIN
MAX
Data rate
tw
Pulse duration
VCCB = 3.3 V
± 0.3 V
MIN
MAX
75
Data inputs
VCCB = 5 V
± 0.5 V
MIN
80
13
100
12
UNIT
MAX
10
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
± 0.3 V
MIN
Data rate
tw
Pulse duration
VCCB = 5 V
± 0.5 V
MAX
MIN
100
Data inputs
10
UNIT
MAX
100
10
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Mbps
ns
5
TXB0104-Q1
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SWITCHING CHARACTERISTICS
TA = 25°C, VCCA = 1.2 V
FROM
(INPUT)
TO
(OUTPUT)
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
VCCB = 5 V
TYP
TYP
TYP
TYP
A
B
6.9
5.7
5.3
5.5
B
A
7.4
6.4
6
5.8
A
1
1
1
1
B
1
1
1
1
A
320
320
320
330
B
150
110
150
110
trA, tfA
A-port rise and fall times
4.2
4.2
4.2
4.2
ns
trB, tfB
B-port rise and fall times
2.1
1.5
1.2
1.1
ns
PARAMETER
tpd
ten
OE
tdis
OE
UNIT
ns
µs
ns
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
A
B
15.9
13.1
13
12.9
B
A
17.2
15
14.7
16.7
A
1
1
1
1
B
1
1
1
1
A
340
280
280
300
B
220
220
220
220
trA, tfA
A-port rise and fall times
7.1
7.1
7.1
7.1
ns
trB, tfB
B-port rise and fall times
6.5
5.2
4.8
4.7
ns
PARAMETER
tpd
ten
OE
tdis
OE
MIN
MAX
MIN
MAX
MIN
MAX
MIN
UNIT
MAX
ns
µs
ns
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
TO
(OUTPUT)
A
B
14
10.7
9.8
9.5
B
A
15
11.4
10.6
10.1
A
1
1
1
1
B
1
1
1
1
A
280
250
250
250
B
220
220
220
220
trA, tfA
A-port rise and fall times
6.2
6.1
6.1
6.1
ns
trB, tfB
B-port rise and fall times
5.8
5.2
4.8
4.7
ns
tpd
6
VCCB = 1.8 V
± 0.15 V
FROM
(INPUT)
PARAMETER
ten
OE
tdis
OE
MIN
MAX
MIN
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MAX
MIN
MAX
MIN
UNIT
MAX
ns
µs
ns
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SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER
tpd
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
A
B
9.3
8.2
7.7
B
A
9.6
8.1
7.4
A
1
1
1
B
1
1
1
A
220
220
220
B
220
220
220
ten
OE
tdis
OE
MIN
MAX
MIN
MAX
MIN
UNIT
MAX
ns
µs
ns
trA, tfA
A-port rise and fall times
5
5
5
ns
trB, tfB
B-port rise and fall times
4.6
4.8
4.7
ns
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
tpd
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
A
B
7.7
7
B
A
7.9
6.8
A
1
1
B
1
1
A
280
280
B
220
220
ten
OE
tdis
OE
MIN
MAX
MIN
UNIT
MAX
ns
µs
ns
trA, tfA
A-port rise and fall times
4.5
4.5
ns
trB, tfB
B-port rise and fall times
4.1
4.7
ns
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OPERATING CHARACTERISTICS
TA = 25°C
VCCA
1.2 V
1.2 V
1.5 V
1.8 V
2.5 V
2.5 V
3.3 V
2.5 V
5V
3.3 V
to
5V
VCCB
PARAMETER
TEST CONDITIONS
5V
CpdA
CpdB
CpdA
CpdB
8
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
CL = 0, f = 10 MHz,
tr = tf = 1 ns,
OE = VCCA
(outputs enabled)
CL = 0, f = 10 MHz,
tr = tf = 1 ns,
OE = GND
(outputs disabled)
1.8 V
1.8 V
1.8 V
UNIT
TYP
TYP
TYP
TYP
TYP
TYP
7.8
10
9
8
8
8
TYP
9
12
11
11
11
11
11
11
38.1
28
28
28
29
29
29
25.4
19
18
18
19
21
22
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.03
0.01
0.01
0.01
0.01
0.01
0.01
0.04
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pF
pF
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PRINCIPLES OF OPERATION
Applications
The TXB0104 can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another.
Architecture
The TXB0104 architecture (see Figure 1) does not require a direction-control signal to control the direction of
data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0104 can maintain a high or low,
but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts
flowing the opposite direction.
The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns
on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly,
during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up
the high-to-low transition. The typical output impedance during output transition is 70 Ω at VCCO = 1.2 V to 1.8 V,
50 Ω at VCCO = 1.8 V to 3.3 V, and 40 Ω at VCCO = 3.3 V to 5 V.
VCCA
VCCB
One
Shot
T1
4k
One
Shot
T2
A
B
One
Shot
T3
4k
T4
One
Shot
Figure 1. Architecture of TXB0104 I/O Cell
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Input Driver Requirements
Typical IIN vs VIN characteristics of the TXB0104 are shown in Figure 2. For proper operation, the device driving
the data I/Os of the TXB0104 must have drive strength of at least ±2 mA.
IIN
VT/4 kW
VIN
–(VD – VT)/4 kW
A. VT is the input threshold voltage of the TXB0104 (typically VCCI/2).
B. VD is the supply voltage of the external driver.
Figure 2. Typical IIN vs VIN Curve
Power Up
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not
damage the device, so any power supply can be ramped up first. The TXB0104 has circuitry that disables all
output ports when either VCC is switched off (VCCA/B = 0 V).
Enable and Disable
The TXB0104 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the
high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the
outputs actually are disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for
the one-shot circuitry to become operational after OE is taken high.
Pullup or Pulldown Resistors on I/O Lines
The TXB0104 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0104 have low
dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be
kept higher than 50 kΩ to ensure that they do not contend with the output drivers of the TXB0104.
For the same reason, the TXB0104 should not be used in applications such as I2C or 1-Wire where an
open-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI
TXS01xx series of level translators.
10
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PARAMETER MEASUREMENT INFORMATION
2 × VCCO
From Output
Under Test
50 kW
From Output
Under Test
15 pF
1 MW
VCCO
VTP
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
0.15 V
0.15 V
0.3 V
0.3 V
Open
50 kW
15 pF
LOAD CIRCUIT FOR
ENABLE/DISABLE
TIME MEASUREMENT
LOAD CIRCUIT FOR MAX DATA RATE,
PULSE DURATION PROPAGATION
DELAY OUTPUT RISE AND FALL TIME
MEASUREMENT
S1
TEST
S1
tPZL/tPLZ
tPHZ/tPZH
2 × VCCO
Open
tw
VCCI
VCCI/2
Input
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
Output
tPHL
VCCO/2
0.9 y VCCO
0.1 y VCCO
tf
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOL
VCCA/2
VCCA/2
0V
tPLZ
tPZL
VOH
VCCO/2
VCCA
Output
Control
(low-level
enabling)
VCCO
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
VCCO/2
VOL + VTP
VOL
tPZH
tPHZ
Output
Waveform 2
S1 Open
(see Note B)
VCCO/2
VOH − VTP
VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A.CL includes probe and jig capacitance.
B.All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
C.The outputs are measured one at a time, with one transition per measurement.
D.tPLH and tPHL are the same as tpd.
E.VCCI is the VCC associated with the input port.
F.VCCO is the VCC associated with the output port.
G.All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuits and Voltage Waveforms
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TXB0104-Q1
11
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TXB0104QPWRQ1
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXB0104QRGYRQ1
ACTIVE
VQFN
RGY
14
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TXB0104-Q1 :
• Catalog: TXB0104
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TXB0104QPWRQ1
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
TXB0104QRGYRQ1
VQFN
RGY
14
3000
330.0
12.4
3.75
3.75
1.15
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TXB0104QPWRQ1
TXB0104QRGYRQ1
TSSOP
PW
14
2000
346.0
346.0
29.0
VQFN
RGY
14
3000
346.0
346.0
29.0
Pack Materials-Page 2
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