PRELIMINARY MX97103 ISDN S/T-PCI TRANSCEIVER FEATURE • Single chip solution for ISDN PC card with PCI interface • Supports full duplex 2B+D ISDN S/T transceiver according to ITU I.430 • Integrate S-interface, D & B channel protocol controllers, and PCI controller • 32-bit PCI bus interface • • • • • • • Each B channel has 2x64 byte FIFO for each direction D channel has 2x32 byte FIFO for each direction EEPROM interface for loading vendor-specific data One programmable LED Comply to ACPI Rev 1.0 0.5u CMOS 100-pin PQFP package GENERAL DESCRIPTION MX97103 is a single chip solution for ISDN-S connection on PCI bus. It integrates S-transceiver, D and B channel protocol controllers, and PCI interface. The layer 1 block comprises of PDLL, DAC, RT and MFC functions. DPLL's function is to establish S/T frame synchronization. DAC resolves the contention issue for differnet TE accessing D channel at the same time. RT deals with the receiving S/T data extraction and put out the transmitted data at the corrent time slot. MFC is the multiframing S and Q channel control block. It can be divided into the following major functional blocks : analog front end, layer 1 function, GCI interface. LAPD controller, B channel HDLC controllers, EEPROM interface and PCI interface. The important function of each major block will be described below. GCI is the digital bus for the IC. It can accomodate 8 GCI-compatible devices. This block converts the frame between GCI and S/T interface. According to ITU 1.430 spec. the S/T interface is a 4wire interface. Among them, 2 wires are used for transmitting, and the other two are for receiving. The wiring configurations include short passive bus, extended passive bus and point-to-point connection. For short passive bus, the operation distance is from 100m to 200m, and the TEs(max 8)can be connected at random points along the full length of the cable. For extended passive bus, TEs connect to the cable at the far end from the NT. The total length would be at least 500m and a differential distance between TE connection points is of 25 to 50m. For point-to-point connection, the cable length can be 1km. LAPD block relieves the microprocessor of the duty to generate HDLC frame on the D channel. It can generate flag, CRC, address and control field automatically. And it can generate S-frame for HDLC protocol. It contains 2 FIFO of 2x32 byte each to facilitate the D packet transmission and reception. Two B channel HDLC controllers can handle tasks like flag and CRC generation, zero insertion and deletion. For each direction a 2x64 byte FIFO is provided to buffer the data. The analog front end deals with the signals transmitted to and received from the wiring cable. It accepts the digital data from layer 1 block and converts them into appropriate signals to be sent out to the wire, and it also receive the attenuated and distorted signal from the wire and recover them to be processed by layer 1 block. The EEPROM interface is used to load specific vendor information after system hardware reset. Vendor ID and device ID can be load to distinguish different products. If EEPROM is not used, default values will be set. The PCI interface enables the chip attached to PCI bus directly without any glue logic. The bus speed can be from 25MHz to 33MHz. P/N:PM0564 REV. 1.0, FEB. 23, 1999 1 MX97103 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 AD15 VSS CBE1# PAR VDD PERR# STOP# VSS DEVSEL# TRDY# IRDY# FRAME# CBE2# VSS AD16 AD17 VSS AD18 AD19 VDD AD20 AD21 VSS AD22 AD23 VSS IDSEL CBE3# AD24 AD25 PIN CONFIGURATION 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 MX97103 VDD AD26 AD17 VSS AD28 AD29 VSS AD30 AD31 VDD CLK VSS RST# INTA# AVDD(C) SX2 SX1 AVDDX AVDD(P) AVSS(P+X) VSS AD1 AD0 VDD EEDO EEDI EECK EECS PME TEST4 VSS TEST3 TEST2 TEST1 LED1 VDD DD DU FSC DCL VSS SDS1 BCL SDS2 VSS XTAL2 XTAL1 AVSS(C) SR2 SR1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 AD14 VSS AD13 AD12 VDD AD11 AD10 VSS AD9 AD8 VSS CBE0# AD7 AD6 VSS AD5 AD4 VDD AD3 AD2 BLOCK DIAGRAM GCI interface DU DD S/T Interface LAP-D&B-HDLC Transmitter Multiframe Activation/ control Deactivation GCI B-channel Switching FIFOS Receiver DPLL PCI Interface 7.68MHZ OSC EEPROM Interface DCL FSC1 PCI bus P/N:PM0564 REV. 1.0, FEB. 23, 1999 2 MX97103 PIN DESCRIPTION PAD# 42, 43, 45, 46, 48, 49, 51, 52, 56, 57, 59, 60, 62, 63, 65, 66, 80, 81, 83, 84, 86, 87, 89, 90, 93, 94, 96, 97, 99, 100, 2, 3 53, 68, 78, 92 PIN NAME AD[31:0] TYPE I/O DESCRIPTION PCI address/data bus. CBE[3:0]# I 69 FRAME# I 71 70 TRDY# IRDY# O I 72 54 DEVSEL# IDSEL O I 40 38 37 75 77 74 23 22 24 19 20 18 17 34 35 29 30 27 26 9 15 CLK RST# INTA# PERR# PAR STOP# BCL SDS1 SDS2 FSC DCL DU DD SX1 SX2 SR2 SR1 XTAL1 XTAL2 LED2 LED1 I I O/D I/O I/O O O O O O(I) O(I) I/O I/O O O I I I O O O PCI command/byte enable, command during address phase, byte enable during data phase. PCI FRAME# signal, asserted to indicate the start of a bus transaction. PCI Target ready, asserted by target agent. PCI master ready, data transferred on the rising edge of CLK when IRDY# and TRDY# both asserted. PCI slave device select, specific for configuration cycle. PCI Initialization device select, specific for configuration cycle. PCI clock, 33MHz PCI bus reset PCI bus interrupt request PCI bus data error PCI bus parity bit, even parity for AD and CBE PCI stop signal GCI bit clock, 768KHz GCI serial data strobe 1, programmable strobe signal GCI serial data strobe 2, programmable strobe signal GCI frame sync GCI data clock, 1.536MHz GCI data upward to ST interface GCI data downward from ST interface S-bus transmitter output(positive) S-bus transmitter output(negative) S-bus receiver input S-bus receiver reference Connection for 7.68MHz crystal/oscillator input Crystal output Auxillisry LED output 0 Auxilliary LED output 1 P/N:PM0564 REV. 1.0, FEB. 23, 1999 3 MX97103 PAD# 8 7 6 5 10, 12, 13, 14 36, 33, 32 31, 28 4, 16, 41, 50, 61, 76, 85, 98 1, 11, 21, 25, 39, 44, 47, 55, 58, 64, 67, 73, 79, 82, 88, 91, 95 PIN NAME EECS EECK EEDI EEDO TEST[4:1] AVDD AVSS VDD VSS TYPE O O O I DESCRIPTION EEPROM chip select EEPROM interface clock Output data to EEPROM Input data from EEPROM test pins Analog power Analog ground Digital power Digital ground ABSOLUTE MAXIMUM RATINGS Supply Voltage(VDD) DC Input Voltage(Vin) DC Output Voltage(Vout) Storage Temperature Range(Tstg) Power Dissipation(PD) Lead Temp.(TL)(Soldering, 10sec) ESD Rating(Rzap=1.5k, Czap=100pf) Clamp Diode Current 4.75V to 5.25V -0.5V to VDD+0.5V -0.5V to VDD+0.5V -55°C to 150°C 500mW 260°C 2000V ±20mA P/N:PM0564 REV. 1.0, FEB. 23, 1999 4 MX97103 DC CHARACTERISTICS PCI BUS D.C SPECS PCI System signals CLK, RST# PCI Shared signals AD[31:0](t/s), CBE[3:0]#(t/s), FRAME#(s/t/s), TRDY#(s/t/s), IDSEL(in), IRDY#(s/t/s), STOP#(s/t/s), DEVSEL#(s/t/s), PAR(t/s), PERR#(s/t/s), INTA#(o/d), SERR#(s/t/s) Temperature from 0 to 70°C; VDD=5V±5%, VSS=0V, AVSS=0V SYMBOL PARAMETER CONDITIONS MIN. VALUE VIL L-input voltage VIH VOL H-input voltage L-output voltage VOH IIL IIH CI/O CCLK CL H-output voltage L-input current H-input current Input/output capacitance CLK input capacitance Load capacitance 2.0V IOL1=3mA IOL2=6mA IOH=-2mA VIN=0.5V VIN=2.7V at 1MHz at 1MHz MAX. VALUE 0.8V 5.4V 0.45V NOTES 1 2.4V -70uA 70uA 10pF 17pF 50pF NOTE: 1. IOL2 applies to signals with external pull-ups: FRAME#, TRDY#, IRDY#, STOP#, DEVSEL# GCI BUS & EEPROM INTERFACE D.C. SPECS GCI signals: BCL, DCL, DD, DU, FSC.SDS1, SDS2 EEPROM signals: EECS, EECK, EEDI, EEDO SYMBOL PARAMETER VIL L-input voltage VIH H-input voltage VOL L-output voltage VOH H-output voltage CONDITIONS MIN. VALUE 2.0V IOL1=2mA IOL2=7mA IOH=-400uA MAX. VALUE 0.8V 5.4V 0.45V NOTES 1 2.4V NOTE: 1. IOL2 is for DD only. P/N:PM0564 REV. 1.0, FEB. 23, 1999 5 MX97103 S-BUS D.C. SPECS SX1, SX2, SR1, SR2 SYMBOL PARAMETER VX Absolute value of output pulse amplitude (VSX2-VSX1) IX Transmitter output current RX Transmitter output impedance VSR1 VTR Receive output voltage Receiver threshold voltage (VSR2-VSR1) CONDITIONS RL=50 ohm RL=400 ohm MIN. VALUE 2.03V 2.10V MAX. VALUE 2.31V 2.39V RL=5.6 ohm 7.5mA 13.4mA (1) Inactive or during binary 1, (2) during binary 0 RL=50 ohm (1)10K ohm (2) 0 ohm IO<5uA Dependent on peak level 2.35V 225mV 2.6V 375mV NOTES SX1, SX2 SR1, SR2 SR1, SR2 NOTE: 1. Due to the transformer, the load resistance seen by the circuit is four times RL. CRYSTAL SPEC 27pF XTAL1 External oscillator signal XTAL1 XTAL2 NC XTAL2 CL CL 27pF Crystal mode PARAMETER Frequency Frequency calibration tolerance Load capacitance Oscillator mode Driving from external source SYMBOL f CL LIMIT VALUES 7.680 max. 100 max. 35 fundamental UNIT MHz ppm pF XTAL1 CLOCK CHARACTERISTICS PARAMETER Duty cycle LIMIT VALUES MIN. MAX. 1:2 2:1 P/N:PM0564 REV. 1.0, FEB. 23, 1999 6 MX97103 AC CHARACTERISTICS Temperature from 0 to 70°C, VDD=5V±5% Inputs are driven to 2.4V for a logical "1" and to 0.4V for a logical "0". Timing meansurements are made at 2.0V for a logical "1" and 0.8v for a logical "0". The AC-testing output is loaded with a 150pF capacitor. 2.4 2.0 2.0 TEST POINTS 0.8 0.8 0.45 DUT C=150pF Input/Output waveform for AC tests TIMING WAVEFORM SERIAL INTERFACE TIMING DCL tBCD BCL tFSD FSC tSSD SDS1/2 tIOD DD/DU(O) tIIS tIIH DD/DU(I) GCI TIMING PARAMETER GCI output data delay GCI input data setup GCI input data hold FSC strobe delay SDS strobe delay Bit clock delay SYMBOL tIOD tIIS tIIH tFSD tSDD tBCD MIN. 20ns 20ns 20ns -20ns MAX. 100ns 20ns 120ns 20ns -20ns P/N:PM0564 REV. 1.0, FEB. 23, 1999 7 MX97103 PCI SHARED SIGNALS A.C. TIMING WAVEFORM 1.5V CLK t2 t1 OUTPUT 1.5V Valid t4 t3 Valid INPUT t5 t6 PARAMETER CLK signal valid delay CLK to signal invalid delay Hi-Z to active delay from CLK Active to Hi-Z delay from CLK Input signal valid setup time before CLK Input signal hold time from CLK SYMBOL t1 t2 t3 t4 t5 t6 MIN. MAX. 11ns NOTES CL=50pF 2ns 2ns 28ns 7ns 0ns PCI SIDEBAND SIGNALS A.C. TIMING WAVEFORM 1.5V CLK t2 t1 OUTPUT 1.5V Valid t4 t3 Valid INPUT t5 t6 PARAMETER CLK to sideband signal valid delay CLK to signal invalid delay Hi-Z to active delay from CLK Active to Hi-Z delay from CLK Sideband signal valid setup time before CLK Input signal hold time from CLK SYMBOL t1 t2 t3 t4 t5 t6 P/N:PM0564 MIN. MAX. 12ns NOTES CL=50pF 2ns 2ns 28ns 12ns 0ns REV. 1.0, FEB. 23, 1999 8 MX97103 APPLICATION ISDN ACCESS ARCHITECTURE ISDN User Area ISDN central office TE(1) U T S TE(8) LT-S TE(1) LT-S TE(1) LT-S LT-T NT1 LT telephone line PBX(NT2) NT1 TE(8) LT Direct Subscriber Access PCI bus = MX97103 where - TE is an ISDN terminal - LT-S is a subscriber line termination - LT-T is a trunk line termination - LT is a trunk line termination in the central office GCI CONNECTION GCI Data Encryption DSP-COFI EEPROM Speech Processing MX97103 S interface PCI BUS P/N:PM0564 REV. 1.0, FEB. 23, 1999 9 MX97103 VDD C3 C4 18pf VDD OSC 18pf 7.68MHz XTAL1 XTAL2 VDD 10uF R7 3.3K DO DI EEPROM SK (6 bit) CS EEDO EEDI EECK EECS DCL FSC DD DU DCLK FS CODEC DR DX VSS R9 3.3K R10 3.3K AVSS VDD D1 D2 D3 MX97103 R1 SX1 +5V 2:1 33 D5 D4 D6 D7 R3 SX2 DC point 33 R5 8.2K R4 SR1 1.8K 47pF INTAN RSTN FRAMEN R6 1.8K SR2 47pF 2:1 Overvoltage Protection circuits RJ45 D8 D9 D11 D10 D12 D13 D14 R8 8.2K +5V DC point CLK STOPN PAR PERRN TARDYN IDSELN IRDYN IDSEL CBEN[3:0] AD[31:0] PCI BUS P/N:PM0564 REV. 1.0, FEB. 23, 1999 10 MX97103 TEST CIRCUIT To test digital function separately, DTMC[TMODE] can be set to enable the stimulus inputs from test1~4 pins. PIN DTMC SP2 SP1 SP0 I/O SIGNAL DESCRIPTION TEST1 1 X X X I XRAMI1 test RAMI1 input signal TEST2 1 X X X I XRAMI2 test RAMI2 input signal TEST3 1 X X X I XZC test ZC input signal TEST4 1 X X X I XI0N test I0N input signal TEST1 0 0 0 0 O ARAMI1 RAMI1 from analog module TEST2 0 0 0 0 O ARAMI2 RAMI2 from analog module TEST3 0 0 0 0 O AZC ZC from analog module TEST4 0 0 0 0 O SAMP SAMP from analog module TEST1 TEST2 TEST3 TEST4 TEST1 TEST2 TEST3 TEST4 TEST1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 0 0 0 0 1 O O O O O O O O O S[0] S[1] S[2] S[3] MBAS1 MBAS2 CLS AI0N RFN activation/deactivation state code TIC bus arbitration state code D channel collision I0N from analog module layer sync. For normal operation, DTMC should be set to 0. Test1~4 pins can be programmed to output internal signals for monitoring purpose. P/N:PM0564 REV. 1.0, FEB. 23, 1999 11 MX97103 PACKAGE INFORMATION 100-PIN PLASTIC QUAD FLAT PACKAGE (PQFP) A ITEM MILLIMETERS INCHES A 24.80±.40 .967±.016 B 20.00±.13 .787±.005 C 14.00±.13 .551±.005 D 18.80±.40 .740±.016 E 12.35 [REF] .486 [REF] F .83 [REF] .033 [REF] G .58 [REF] .023 [REF] H .30 [Typ.] .012 [Typ.] I .65 [Typ.] .026 [Typ.] J 2.40 [Typ.] .094 [Typ.] K 1.20 [Typ.] .047 [Typ.] L .15 [Typ.] .006 [Typ.] M .10 max. .004 max. N 2.75±.15 .018±.006 O .10 min. .004 min. P 3.30 max. .103 max. B 80 81 51 50 E F 31 30 100 1 C D P O G H I J N L M NOTE: Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. K ORDERING INFORMATION PART NO. MX97103FC PACKAGE 100-PIN PQFP P/N:PM0564 REV. 1.0, FEB. 23, 1999 12 MX97103 MACRONIX INTERNATIONAL CO., LTD. HEADQUARTERS: TEL:+886-3-578-6688 FAX:+886-3-563-2888 EUROPE OFFICE: TEL:+32-2-456-8020 FAX:+32-2-456-8021 JAPAN OFFICE: TEL:+81-44-246-9100 FAX:+81-44-246-9105 SINGAPORE OFFICE: TEL:+65-348-8385 FAX:+65-348-8096 TAIPEI OFFICE: TEL:+886-2-2509-3300 FAX:+886-2-2509-2200 MACRONIX AMERICA, INC. TEL:+1-408-453-8088 FAX:+1-408-453-8488 CHICAGO OFFICE: TEL:+1-847-963-1900 FAX:+1-847-963-1909 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. 13