MOSEL V62C3801024L-55T

V62C3801024L(L)
Ultra Low Power
128K x 8 CMOS SRAM
Features
Functional Description
• Ultra Low-power consumption
- Active: 30mA at 55ns
- Stand-by: 5 µA (CMOS input/output)
1 µA CMOS input/output, L version
The V62C3801024L is a low power CMOS Static RAM organized as 131,072 words by 8 bits. Easy memory expansion is
provided by an active LOW CE1 , an active HIGH CE2, an active LOW OE , and Tri-state I/O’s. This device has an automatic power-down mode feature when deselected.
• Single +2.7V to 3.3V Power Supply
Writing to the device is accomplished by taking Chip Enable 1 (CE1 ) with Write Enable (WE) LOW, and Chip Enable 2 (CE2) HIGH. Reading from the device is performed
by taking Chip Enable 1 (CE1) with Output Enable
(OE) LOW while Write Enable (WE) and Chip Enable 2
(CE2) is HIGH. The I/O pins are placed in a high-impedance state when the device is deselected: the outputs are disabled during a write cycle.
• Equal access and cycle time
• 55/70/85/100 ns access time
• Easy memory expansion with CE1, CE2
and OE inputs
• 2.0V data retention mode
The V62C3801024LL comes with a 2V data retention feature
and Lower Standby Power. TheV62C3801024L is available in
a 32-pin 8 x 20 mm TSOP1 / STSOP / 48-fpBGA packages.
• TTL compatible, Tri-state input/output
• Automatic power-down when deselected
32-Pin TSOP1 / STSOP (See next page)
Logic Block Diagram
ROW
DECODER
ROW
DECODER
A1
A
A21
AA32
AA43
AA54
A6
A5
A7
A6
A8
A9
A7
SENSEAMP
AMP
SENSE
INPUT BUFFER
BUFFER
A
A00
1024
1024
X
X
1024
1024
I/O8
I/O 7
COLUMN DECODER
A9
A11
A12
A13
A14
A15
A16
A10
A11
A12
A13
A14
A15
A16
OE
31
A10
A8
3
30
CE1
A13
4
29
I/O8
WE
5
28
I/O7
CE2
6
27
I/O6
A15
7
26
I/O5
Vcc
8
25
I/O4
NC
9
24
GND
A16
10
23
I/O3
A14
11
22
I/O2
A12
12
21
I/O1
A7
13
20
A0
14
19
A1
A5
15
18
A2
I/O 0
A4
16
17
A3
CONTROL
CIRCUIT
OE
WE
OE
CE1
WE
CE2
CE1
CE2
1
REV. 1.1 April 2001 V62C3801024L(L)
32
2
A6
CONTROL
CIRCUIT
A10
1
A9
I/O1
A8
COLUMN DECODER
A11
V62C3801024L(L)
MOSEL VITELIC V62C3801024L(L)B
6
5
4
3
2
1
A
B
C
D
E
F
G
H
TOP VIEW
Top View
48-CSP Ball-Grid Array package (shading indicates no ball)
A
B
C
D
E
F
G
H
1
A0
I/O4
I/O5
VSS
VDD
I/O6
I/O7
A9
2
A1
A2
NC
NC
NC
NC
OE
A10
3
CE2
WE
NC
NC
NC
NC
CE1
A11
4
A3
A4
A5
NC
NC
NC
A16
A12
2
REV. 1.1 April 2001 V62C3801024L(L)
5
A6
A7
NC
NC
NC
NC
A15
A13
6
A8
I/O0
I/O1
VDD
VSS
I/O2
I/O3
A14
V62C3801024L(L)
Absolute Maximum Ratings *
Parameter
Symbol
Minimum
Maximum
Unit
Voltage on Any Pin Relative to Gnd
Vt
-0.5
4.6
V
Power Dissipation
PT
−
1.0
W
Storage Temperature (Plastic)
Tstg
-55
+150
0C
Temperature Under Bias
Tbias
-40
+85
0
C
* Note: Stresses greater than those listed above Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions outside those indicated in the operational sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect reliability.
Truth Table
CE1
CE2
WE
OE
Data
Mode
H
X
X
X
High-Z
Standby
X
L
X
X
High-Z
Standby
L
H
H
L
Data Out
L
H
H
H
High-Z
Active, Output Disable
L
H
L
X
Data In
Active, Write
Active, Read
* Key: X = Don’t Care, L = Low, H = High
Recommended Operating Conditions (TA = 00C to +700C / -400C to 850C**)
Parameter
Supply Voltage
Input Voltage
Symbol
Min
Typ
Max
Unit
VCC
2.7
3.0
3.3
V
Gnd
0.0
0.0
0.0
V
VIH
2.2
-
VCC + 0.5
V
VIL
-0.5*
-
0.6
V
* VIL min = -1.0V for pulse width less than tRC/2.
** For Industrial Temperature
3
REV. 1.1 April 2001 V62C3801024L(L)
V62C3801024L(L)
DC Operating Characteristics (Vcc = 3V+10%, Gnd = 0V, TA = 00C to +700C / -400C to 850C)
Parameter
Sym
Input Leakage Current
IILI
Output Leakage
Current
IILO
Operating Power
Supply Current
Average Operating
Current
Test Conditions
-55
-70
-85
-100
Min Max Min Max Min Max Min Max
Unit
-
1
-
1
-
1
-
1
µA
CE1 = VIH or CE2 = VIL
Vcc= Max, VOUT = Gnd to Vcc
-
1
-
1
-
1
-
1
µA
ICC
CE1 = VIL , CE2 = VIH
VIN = VIH or VIL , IOUT = 0 mA
-
3
-
3
-
3
-
3
mA
ICC1
CE1 = VIL , CE2 = VIH
IOUT = 0mA,
Min Cycle, 100% Duty
-
30
-
25
-
20
-
15
mA
ICC2
CE1 = 0.2V,
CE2 = Vcc - 0.2V
IOUT = 0mA,
-
3
-
3
-
3
-
3
mA
-
0.5
-
0.5
-
0.5
-
0.5
mA
L
-
5
-
5
-
5
-
5
µA
LL
-
1
-
1
-
1
-
1
µA
Vcc = Max,
Vin = Gnd to Vcc
Cycle Time=1µs, 100% Duty
Standby Power Supply
Current (TTL Level)
ISB
CE1 = VIH or CE2 = VIL
Standby Power Supply
Current (CMOS Level)
ISB1
CE1 > Vcc - 0.2V or
CE2 < 0.2V, f = 0
VIN < 0.2V or
VIN > Vcc- 0.2V
Output Low Voltage
VOL
IOL = 2 mA
-
0.4
-
0.4
-
0.4
-
0.4
V
Output High Voltage
VOH
IOH = -2 mA
2.4
-
2.4
-
2.4
-
2.4
-
V
Capacitance (f = 1MHz, TA = 250C)
Parameter*
Symbol
Test Condition
Max
Unit
Input Capacitance
Cin
Vin = 0V
7
pF
I/O Capacitance
CI/O
Vin = Vout = 0V
8
pF
* This parameter is guaranteed by device characterization and is not production tested.
AC Test Conditions
Input Pulse Level
Input Rise and Fall Time
Input and Output Timing
Reference Level
0.6V to 2.2V
5ns
TTL
CL *
1.4V
Output Load Condition
70ns/85 ns
CL = 30pf + 1TTL Load
Load 100ns/120 ns
CL = 100pf + 1TTL Load
4
REV. 1.1 April 2001 V62C3801024L(L)
Figure A.
* Including Scope and Jig Capacitance
V62C3801024L(L)
Read Cycle (3,9) (Vcc = 3.0V+0.3V, Gnd = 0V, TA = 00C to +700C / -400C to +850C)
Parameter
Symbol
-55
-70
-85
Unit
-100
Note
Min Max Min Max Min Max Min Max
Read Cycle Time
t RC
55
-
70
-
85
-
100
-
ns
Address Access Time
t AA
-
55
-
70
-
85
-
100
ns
Chip Enable Access Time
t ACE
-
55
-
70
-
85
-
100
ns
Output Enable Access Time
t OE
-
35
-
40
-
40
-
50
ns
Output Hold from Address Change
t OH
10
-
10
-
10
-
10
-
ns
Chip Enable to Output in Low-Z
t CLZ
10
-
10
-
10
-
10
-
ns
4,5
Chip Disable to Output in High-Z
t CHZ
-
25
-
30
-
35
-
40
ns
4,5
Output Enable to Output in Low-Z
t OLZ
5
-
5
-
5
-
5
-
ns
4,5
Output Disable to Output in High-Z
t OHZ
-
25
-
25
-
30
-
35
ns
4,5
Power-Up Time
t PU
0
-
0
-
0
-
0
-
ns
5
Power-Down Time
t PD
-
55
-
70
-
85
-
100
ns
5
Unit
Note
Write Cycle (3,11) (Vcc = 3.0V+0.3V, Gnd = 0V, TA = 00C to +700C / -400C to +850C)
Parameter
Symbol
-55
-70
-85
-100
Min Max Min Max Min Max Min Max
Write Cycle Time
t WC
55
-
70
-
85
-
100
-
ns
Chip Enable to Write End
t CW
45
-
60
-
70
-
80
-
ns
Address Setup to Write End
t AW
45
-
60
-
70
-
80
-
ns
Address Setup Time
t AS
0
-
0
-
0
-
0
-
ns
Write Pulse Width
t WP
45
-
50
-
60
-
70
-
ns
Write Recovering Time
t WR
0
-
0
-
0
-
0
-
ns
Data Valid to Write End
t DW
25
-
30
-
35
-
40
-
ns
Data Hold Time
t DH
0
-
0
-
0
-
0
-
ns
Write Enable to Output in High-Z
t WZ
-
25
-
30
-
35
-
40
ns
4,5
Output Active from Write End
t OW
5
-
5
-
5
-
5
-
ns
4,5
5
REV. 1.1 April 2001 V62C3801024L(L)
V62C3801024L(L)
Timing Waveform of Read Cycle 1 (3,6,7,9) (Address Controlled)
tRC
Address
tAA
tOH
DOUT
Data Valid
Timing Waveform of Read Cycle 2 (5,6,8,9) (CE1 Controlled)
tRC
CE1
tOE
OE
tOLZ
tOHZ
tCHZ
tACE
DOUT
Data Valid
tPD
tCLZ
Supply Current
ICC
tPU
50%
50%
ISB
Timing Waveform of Read Cycle 3 (3,6,8,9) (CE2 Controlled)
tRC
CE2
tOE
OE
tOHZ
tCHZ
tOLZ
tACE
DOUT
Data Valid
tPD
tCLZ
Supply Current
ICC
tPU
50%
50%
6
REV. 1.1 April 2001 V62C3801024L(L)
ISB
V62C3801024L(L)
Timing Waveform of Write Cycle 1
(10,11)
(WE Controlled)
tAW
tWC
tWR
Address
tWP
WE
tAS
tDW
DIN
tDH
Data Valid
tWZ
tOW
DOUT
Timing Waveform of Write Cycle 2
(10,11)
(CE1 Controlled)
tWC
tAW
tWR
Address
tAS
tCW
CE1
tWP
WE
tWZ
tDW
DIN
tDH
Data Valid
DOUT
Timing Waveform of Write Cycle 3
(10,11)
(CE2 Controlled)
tWC
tAW
tWR
Address
tAS
tCW
CE2
tWP
WE
tWZ
tDW
DIN
Data Valid
DOUT
REV. 1.1 April 2001 V62C3801024L(L)
tDH
7
V62C3801024L(L)
Data Retention Characteristics (L Version Only)(1)
Parameter
Symbol
Test Condition
Min
Max
Unit
1.0
-
V
VCC for Data Retention
VDR
CE1 > VCC - 0.2V or
Data Retention Current
ICCDR
CE2 < + 0.2V
-
5
µA
Chip Deselect to Data Retention Time
t CDR
VIN > VCC - 0.2V or
0
-
ns
Operation Recovery Time(2)
tR
V IN < 0.2V
tRC
-
ns
Data Retention Waveform (L Version Only) (TA = 00C to +700C / -400C to +850C)
Data Retention Mode
VCC
2.7V
VDR > 1.0V
tCDR
CE
2.7V
tR
V DR
V IH
V IH
Notes
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
L-version includes this feature.
This Parameter is sampled and not 100% tested.
For test conditions, see AC Test Condition, Figure A.
This parameter is tested with CL = 5pF as shown in Figure B. Transition is measured + 500mV from steady-state voltage.
This parameter is guaranteed, but is not tested.
WE is HIGH for read cycle.
CE1 and OE are LOW and CE2 is HIGH for read cycle.
Address valid prior to or coincident with CE1 transition LOW or CE2 transition HIGH.
All read cycle timings are referenced from the last valid address to the first transtion address.
CE1 or WE must be HIGH or CE2 must be LOW during address transition.
All write cycle timings are referenced from the last valid address to the first transition address.
8
REV. 1.1 April 2001 V62C3801024L(L)
V62C3801024L(L)
Ordering Information
Device Type*
Speed
V62C3801024L-55T
V62C3801024L-70T
V62C3801024L-85T
V62C3801024L-100T
55 ns
70 ns
85 ns
100 ns
V62C3801024LL-55T
V62C3801024LL-70T
V62C3801024LL-85T
V62C3801024LL-100T
55 ns
70 ns
85 ns
100 ns
V62C3801024L-55V
V62C3801024L-70V
V62C3801024L-85V
V62C3801024L-100V
55 ns
70 ns
85 ns
100 ns
V62C3801024LL-55V
V62C3801024LL-70V
V62C3801024LL-85V
V62C3801024LL-100V
55 ns
70 ns
85 ns
100 ns
V62C3801024L(L)-55B
V62C3801024L(L)-70B
V62C3801024L(L)-85B
V62C3801024L(L)-100B
55 ns
70 ns
85 ns
100 ns
Package
8 x 20 mm 32-pin Plastic TSOP1
8 x 13.4 mm 32-pin Plastic STSOP
48-fpBGA
* For Industrial Temperature tested devices, an “I” designator will be added to the end of the device number.
9
REV. 1.1 April 2001 V62C3801024L(L)
MOSEL VITELIC
V62C3801024L(L)
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© Copyright 2001, MOSEL VITELIC Inc.
The information in this document is subject to change without
notice.
MOSEL VITELIC makes no commitment to update or keep current the information contained in this document. No part of this
document may be copied or reproduced in any form or by any
means without the prior written consent of MOSEL-VITELIC.
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PHONE: 214-826-6176
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4/01
Printed in U.S.A.
MOSEL VITELIC subjects its products to normal quality control
sampling techniques which are intended to provide an assurance
of high quality products suitable for usual commercial applications. MOSEL VITELIC does not do testing appropriate to provide
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personal injury might occur from failure, purchaser must do its
own quality assurance testing appropriate to such applications.
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