MICROCHIP TC1427COA

M
TC1426/TC1427/TC1428
1.2A Dual High-Speed MOSFET Drivers
Package Type
Features
• Low Cost
• Latch-Up Protected: Will Withstand 500mA
Reverse Output Current
• ESD Protected ±2kV
• High Peak Output Current: 1.2A
• Wide Operating Range
- 4.5V to 16V
• High Capacitive Load Drive Capability: 1000pF in
38nsec
• Low Delay Time: 75nsec Max
• Logic Input Threshold Independent of Supply
Voltage
• Output Voltage Swing to Within 25mV of Ground
or VDD
• Low Output Impedance: 8Ω
8 NC
NC 1
TC1426CPA
6 VDD
IN B 4
GND 3
NC 1
8 NC
TC1426COA
IN B 4
7, 5
Inverting
GND 3
7, 5
NC 1
8 NC
7 OUT A IN A 2
6 VDD
TC1427COA
GND 3
7 OUT A
6 VDD
5 OUT B
2
7
4
5
NC 1
7 OUT A
8 NC
TC1428COA
6 VDD
5 OUT B IN B 4
2, 4
6 VDD
Noninverting
Inverting
IN A 2
8 NC
TC1428CPA
5 OUT B IN B 4
2, 4
7, 5
NC 1
7 OUT A IN A 2
TC1427CPA
5 OUT B IN B 4
2, 4
GND 3
8 NC
7 OUT A IN A 2
IN A 2
GND 3
5 OUT B IN B 4
2, 4
7, 5
7 OUT A
6 VDD
5 OUT B
2
7
4
5
Noninverting
NC = No connection
General Description
The TC1426/TC1427/TC1428 are a family of 1.2A dual
high-speed drivers. CMOS fabrication is used for low
power consumption and high efficiency.
Applications
•
•
•
•
•
8-Pin PDIP/SOIC
NC 1
Power MOSFET Drivers
Switched Mode Power Supplies
Pulse Transformer Drive
Small Motor Controls
Print Head Drive
These devices are fabricated using an epitaxial layer to
effectively short out the intrinsic parasitic transistor
responsible for CMOS latch-up. They incorporate a
number of other design and process refinements to
increase their long-term reliability.
Device Selection Table
Part Number
Package
Temp. Range
TC1426COA
8-Pin SOIC
0°C to +70°C
TC1426CPA
8-Pin PDIP
0°C to +70°C
TC1427COA
8-Pin SOIC
0°C to +70°C
TC1427CPA
8-Pin PDIP
0°C to +70°C
TC1428COA
8-Pin SOIC
0°C to +70°C
TC1428CPA
8-Pin PDIP
0°C to +70°C
The TC1426 is compatible with the bipolar DS0026, but
only draws 1/5 of the quiescent current. The TC1426/
TC1427/TC1428 are also compatible with the TC426/
TC427/TC428, but with 1.2A peak output current rather
than the 1.5A of the TC426/TC427/TC428 devices.
Other compatible drivers are the TC4426/TC4427/
TC4428 and the TC4426A/TC4427A/TC4428A. The
TC4426/TC4427/TC4428 have the added feature that
the inputs can withstand negative voltage up to 5V with
diode protection circuits. The TC4426A/TC4427A/
TC4428A have matched input to output leading edge
and falling edge delays, tD1 and tD2, for processing
short duration pulses in the 25 nanoseconds range. All
of the above drivers are pin compatible.
The high-input impedance TC1426/TC1427/TC1428
drivers are CMOS/TTL input-compatible, do not require
the speed-up needed by the bipolar devices, and can
be directly driven by most PWM ICs.
This family of devices is available in inverting and noninverting versions. Specifications have been optimized
to achieve low-cost and high-performance devices,
well-suited for the high-volume manufacturer.
 2002 Microchip Technology Inc.
DS21393B-page 1
TC1426/TC1427/TC1428
Functional Block Diagram
V+
≈500µA
≈2.5mA
TC1426 Inverting
TC1427 Noninverting
TC1428 Inverting/Noninverting
Noninverting
Output
Inverting
Output
(TC1427)
(TC1426)
Input
GND
NOTE: TC1428 has one inverting and one noninverting driver.
Ground any unused driver input.
DS21393B-page 2
 2002 Microchip Technology Inc.
TC1426/TC1427/TC1428
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Absolute Maximum Ratings*
Supply Voltage..................................................... +18V
Input Voltage, Any Terminal
................................... VDD + 0.3V to GND – 0.3V
Power Dissipation (TA ≤ 70°C)
PDIP ........................................................ 730mW
SOIC........................................................ 470mW
Derating Factor
PDIP ........................................................8mW/°C
SOIC........................................................4mW/°C
Operating Temperature Range
C Version .........................................0°C to +70°C
Storage Temperature Range ............. -65°C to +150°C
TC1426/TC1427/TC1428 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = +25°C, with 4.5V ≤ VDD ≤ 16V, unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
Input
VIH
Logic 1, High Input Voltage
3
—
—
V
VIL
Logic 0, Low Input Voltage
—
—
0.8
V
IIN
Input Current
-1
—
1
µA
0V ≤ VIN ≤ VDD
Output
VOH
High Output Voltage
VDD – 0.025
—
—
V
Figure 3-1, Figure 3-2
VOL
Low Output Voltage
—
—
0.025
V
Figure 3-1, Figure 3-2
RO
Output Resistance
—
—
12
8
18
12
Ω
IOUT = 10mA, VDD = 16V
IPK
Peak Output Current
—
1.2
—
A
IREV
Latch-Up Current
Withstand Reverse Current
—
>500
—
mA
Switching Time (Note 1)
tR
Rise Time
—
—
35
nsec
tF
Fall Time
—
—
25
nsec
Figure 3-1, Figure 3-2
tD1
Delay Time
—
—
75
nsec
Figure 3-1, Figure 3-2
tD2
Delay Time
—
—
75
nsec
Figure 3-1, Figure 3-2
—
—
—
—
9
0.5
mA
VIN = 3V (Both Inputs)
VIN = 0V (Both Inputs)
Figure 3-1, Figure 3-2
Power Supply
Power Supply Current
IS
Note
1:
Switching times ensured by design.
 2002 Microchip Technology Inc.
DS21393B-page 3
TC1426/TC1427/TC1428
TC1426/TC1427/TC1428 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Over operating temperature range with 4.5V ≤ VDD ≤ 16V, unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Units
V
Test Conditions
Input
VIH
Logic 1, High Input Voltage
3
—
—
VIL
Logic 0, Low Input Voltage
—
—
0.8
V
IIN
Input Current
-10
—
10
µA
0V ≤ VIN ≤ VDD
Output
VOH
High Output Voltage
VDD – 0.025
—
—
V
Figure 3-1, Figure 3-2
VOL
Low Output Voltage
—
—
0.025
V
Figure 3-1, Figure 3-2
RO
Output Resistance
—
—
15
10
23
18
Ω
IOUT = 10mA, VDD = 16V
IREV
Latch-Up Current
Withstand Reverse Current
—
>500
—
mA
Switching Time (Note 1)
tR
Rise Time
—
—
60
nsec
Figure 3-1, Figure 3-2
tF
Fall Time
—
—
40
nsec
Figure 3-1, Figure 3-2
tD1
Delay Time
—
—
125
nsec
Figure 3-1, Figure 3-2
tD2
Delay Time
—
—
125
nsec
Figure 3-1, Figure 3-2
—
—
—
—
13
0.7
mA
VIN = 3V (Both Inputs)
VIN = 0V (Both Inputs)
Power Supply
Power Supply Current
IS
Note
1:
Switching times ensured by design.
DS21393B-page 4
 2002 Microchip Technology Inc.
TC1426/TC1427/TC1428
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No.
(8-Pin PDIP,
SOIC)
PIN FUNCTION TABLE
Symbol
Description
1
NC
No connection.
2
IN A
Control input A, TTL/CMOS compatible logic input.
3
GND
Ground.
4
IN B
Control input B, TTL/CMOS compatible logic input.
5
OUT B
6
VDD
7
OUT A
8
NC
 2002 Microchip Technology Inc.
Output B, CMOS totem-pole output.
Supply input, 4.5V to 16V.
Output A, CMOS totem-pole output.
No connection.
DS21393B-page 5
TC1426/TC1427/TC1428
3.0
APPLICATIONS INFORMATION
3.3
3.1
SUPPLY BYPASSING
The input voltage level changes the no-load or
quiescent supply current. The N-channel MOSFET
input stage transistor drives a 2.5mA current source
load. With a logic "1" input, the maximum quiescent
supply current is 9mA. Logic "0" input level signals
reduce quiescent current to 500µA maximum. Unused
driver inputs must be connected to VDD or GND.
Minimum power dissipation occurs for logic "0" inputs
for the TC1426/TC1427/TC1428.
Large currents are required to charge and discharge
capacitive loads quickly. For example, charging a
1000pF load to 16V in 25nsec requires a 0.8A current
from the device’s power supply.
To guarantee low supply impedance over a wide
frequency range, a parallel capacitor combination is
recommended for supply bypassing. Low-inductance
ceramic MLC capacitors with short lead lengths
(<0.5-in.) should be used. A 1.0µF film capacitor in
parallel with one or two 0.1µF ceramic MLC capacitors
normally provides adequate bypassing.
3.2
GROUNDING
INPUT STAGE
The drivers are designed with 100mV of hysteresis.
This provides clean transitions and minimizes output
stage current spiking when changing states. Input
voltage thresholds are approximately 1.5V, making a
logic "1" input any voltage greater than 1.5V up to VDD.
Input current is less than 1µA over this range.
The TC1426 and TC1428 contain inverting drivers.
Individual ground returns for the input and output
circuits or a ground plane should be used. This will
reduce negative feedback that causes degradation in
switching speed characteristics.
The TC1426/TC1427/TC1428 may be directly driven
by the TL494, SG1526/27, TC38C42, TC170 and
similar switch-mode power supply integrated circuits.
FIGURE 3-1:
FIGURE 3-2:
INVERTING DRIVER
SWITCHING TIME
VDD = 16V
Test Circuit
NONINVERTING DRIVER
SWITCHING TIME
VDD = 16V
Test Circuit
1µF
1µF
WIMA
MKS-2
0.1µF MLC
MKS-2
Input
Input
Output
1
0.1µF MLC
Output
1
CL = 1000pF
CL = 1000pF
2
2
TC1427
(1/2 TC1428)
TC1426
(1/2 TC1428)
+5V
+5V
90%
Input
Input
0V
90%
10%
VDD
0V
tD1
tF
tD2
90%
90%
Output
0V
DS21393B-page 6
VDD
tR
tD1
90%
tD2
90%
tR
Output
0V
10%
10%
10%
tF
10%
10%
 2002 Microchip Technology Inc.
TC1426/TC1427/TC1428
4.0
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Rise Time vs. Supply Voltage
550
Fall Time vs. Supply Voltage
330
TA = +25°C
TA = +25°C
264
220
4700pF
110
CL = 1000pF
TA = +25°C
70
198
TIME (nsec)
10,000pF
330
TIME (nsec)
TIME (nsec)
440
Delay Time vs. Supply Voltage
80
10,000pF
132
60
50
tD1
4700pF
66
2200pF
40
2200pF
tD2
0
5
7
9
11
VDD (V)
13
0
15
Rise and Fall Times vs. Temperature
13
15
8
tD2
48
tD1
42
36
125
25
Rise Time vs. Capacitive Load
1000
45
65
85
105
TEMPERATURE (°C)
CL = 1000pF
VDD = +15V
TA = +25°C
24
200kHz
12
20kHz
6
100
Fall Time vs. Capacitive Load
5 VDD
100
10 VDD
15VDD
15 VDD
2200
Supply Current vs. Frequency
SUPPLY CURRENT (mA)
TIME (nsec)
10 VDD
520
940 1360 1780
CAPACITIVE LOAD (pF)
100
CL = 1000pF
TA = +25°C
TA = +25°C
TA = +25°C
5 VDD
500kHz
18
125
1000
100
15
0
0
45
65
85
105
TEMPERATURE (°C)
13
Supply Current vs. Capacitive Load
SUPPLY CURRENT (mA)
16
11
9
VDD (V)
7
30
54
tFALL
0
25
5
CL = 1000pF
VDD = +15V
CL = 1000pF
VDD = +15V tRISE
24
TIME (nsec)
9
11
VDD (V)
60
TIME (nsec)
TIME (nsec)
7
Delay Time vs. Temperature
40
32
5
30
80
VDD = 15V
VDD = 10V
60
40
20
VDD = 5V
10
100
1000
CAPACITIVE LOAD (pF)
 2002 Microchip Technology Inc.
10,000
10
100
10,000
1000
CAPACITIVE LOAD (pF)
0
10
100
1000
FREQUENCY (kHz)
10,000
DS21393B-page 7
TC1426/TC1427/TC1428
TYPICAL CHARACTERISTICS (CONTINUED)
Low-State Output Resistance
High-State Output Resistance
15
50
42
13
50mA
11
R OUT (Ω)
ROUT (Ω )
TA = +25°C
9
100mA
34
26
A (sec)
TA = +25°C
100mA
Crossover Energy Loss
10-8
50mA
10-9
10mA
18
7
10mA
10
5
5
7
9
11
VDD (V)
13
15
5
7
Quiescent Power Supply
Current vs. Supply Voltage
20
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
BOTH INPUTS LOGIC "0"
10
5
13
15
10-10
4
6
8
10 12
VDD (V)
14
16
18
Quiescent Power Supply
Current vs. Supply Voltage
20
15
9
11
VDD (V)
0
BOTH INPUTS LOGIC "1"
15
10
5
0
0
50
100
150
200
300
1
400
SUPPLY CURRENT (µA)
2
3
4
5
6
SUPPLY CURRENT (mA)
Thermal Derating Curves
1600
MAX. POWER (mW)
1400
8 Pin DIP
1200
1000
800
8 Pin SOIC
600
400
200
0
0
10
20
30
40
50
60
70
80
90
100
110
120
AMBIENT TEMPERATURE (°C)
DS21393B-page 8
 2002 Microchip Technology Inc.
TC1426/TC1427/TC1428
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Package marking data not available at this time.
5.2
Package Dimensions
8-Pin Plastic DIP
PIN 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.150 (3.81)
.115 (2.92)
.110 (2.79)
.090 (2.29)
.015 (0.38)
.008 (0.20)
3° MIN.
.400 (10.16)
.310 (7.87)
.022 (0.56)
.015 (0.38)
Dimensions: inches (mm)
8-Pin SOIC
PIN 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) TYP.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.020 (0.51) .010 (0.25)
.013 (0.33) .004 (0.10)
.010 (0.25)
.007 (0.18)
8° MAX..
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
 2002 Microchip Technology Inc.
DS21393B-page 9
TC1426/TC1427/TC1428
NOTES:
DS21393B-page 10
 2002 Microchip Technology Inc.
TC1426/TC1427/TC1428
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002 Microchip Technology Inc.
DS21393B-page11
TC1426/TC1427/TC1428
NOTES:
DS21393B-page12
 2002 Microchip Technology Inc.
TC1426/TC1427/TC1428
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
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© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
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 2002 Microchip Technology Inc.
DS21393B-page 13
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Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
03/01/02
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DS21393B-page 14
 2002 Microchip Technology Inc.