NEC MC-7847-KC

NEC's 870 MHz GaAs CATV
MC-7847-KC
25 dB POWER DOUBLER AMPLIFIER
OUTLINE DIMENSIONS (Units in mm)
FEATURES
• GaAs ACTIVE DEVICES
PACKAGE OUTLINE H02
• LOW DISTORTION
• HIGH LINEAR GAIN:
MC-7847-KC - GL = 25 dB MIN at f = 870 MHz
• LOW RETURN LOSS
• LOW GAIN CHANGE OVER TEMPERATURE
• SPECIFIED FOR 79, 110, and 132 CHANNELS
PERFORMANCE
• HIGH RELIABILITY AND RUGGEDNESS:
Withstands environmental extremes as well as Silicon
devices (Surge, ESD, Etc.)
45.08 MAX
38.1±0.25
27.5 MAX
3.2 MAX
4.25
+ 0.25
- 0.35
VDD
5
14.85 MAX
4.0±0.25
8.1 MAX
19.05±0.38
1
9
In
Out
6-32 unc 2B
25.4±0.25
2 3 7 8
2.54±0.25
0.51±0.05
Gnd
DESCRIPTION
NEC's MC-7847-KC is a GaAs Multi-Chip Modules designed
for use as output stages in CATV applications up to 870 MHz.
This is a high gain device offering 25 dB minimum gain at
870 MHz. Because this unit is a GaAs device it has low distortion, low noise figure, and low return loss across the entire
frequency band.
The MC-7847-KC is similar to NEC's standard push-pull
devices, but the higher current allows for better distortion
performance, especially X-mod.
Like the previous generation of products, these devices survive such hazards as surge and ESD as well as their silicon
competitors, but deliver superior performance with low DC
current required. All devices are assembled and tested using
fully automated equipment to maximize consistency in part to
part performance, and reliability is assured by NEC's stringent
quality and process control procedures. These parts come in
industry compatible hybrid packages.
4.19±0.13
2.62±0.35
7 8 9
12.9 MAX
21.5 MAX
1 2 3 5
10.75 ±0.25
2.54 ±0.38
A
6.3
0.38.. A
0.51±0.05
2.5
±0.05
APPLICATIONS
• CATV HEADEND SYSTEMS
• CATV OPTICAL NODES
• CATV DISTRIBUTION AMPS
ELECTRICAL CHARACTERISTICS (TA = 30±5 °C, VDD = 24 V, ZS = ZL = 75 Ω)
PART NUMBER
SYMBOLS
BW
GL
S
Gf
NF
RLi
RLO
IDD
CTB
XMod
CSO
CHARACTERISTICS
MC-7847-KC
UNITS
MIN
TYP
MAX
Frequency Range
Linear Gain
Gain Slope
Gain Flatness
Noise Figure 1
Noise Figure 2
MHz
dB
dB
dB
dB
Input Return Loss
dB
Output Return Loss
Operating Current
Composite Triple Beat
Cross Modulation1
Composite Second Order
mA
mA
dBc
dBc
dBc
50
25.0
1.0
–
–
–
20.0
20.0
19.5
17.0
20.0
350
–
–
–
–
–
1.4
–
–
–
–
–
–
–
–
–
–
–
–
870
26.0
1.8
0.6
5.5
6.0
–
–
–
–
–
420
-60
-55
-63
TEST CONDITIONS
f = 870 MHz
f = 40 to 870 MHz
40 to 870 MHz; Peak to Valley
f = 50 MHz
f = 870 MHz
40 to 160MHz
160 to 320 MHz
320 to 640 MHz
640 to 870 MHz
40 to 160MHz
RF OFF
110 Channels
VOUT = 50 dBmV at 745.25 MHz, 10 dB
tilted across the band
1. Measured per US standard methods and procedures (using selective level meter).
California Eastern Laboratories
MC-7847-KC
ABSOLUTE
MAXIMUM RATINGS1 (TCASE= 30 °C)
SYMBOLS
VDD
PARAMETERS
Supply Voltage
RECOMMENDED
OPERATING CONDITIONS (Zs = ZL = 75Ω)
UNITS
RATINGS
SYMBOLS
V
30
VDD
Vi
VI
Input Voltage (Single Tone)2
dBmV
65
TC
Operating Case Temperature
°C
-30 to +100
Storage Temperature
°C
-40 to +100
TSTG
Note:
1. Operation in excess of any one of these parameters may result
in permanent damage.
2. Maximum single channel power applied to the input for 1 minute
with no measurable degradation in performance.
PARAMETERS
Supply VoltageV
TYP MAX
23.5
24.0
24.5
dBmV
–
32.0
35.0
°C
-30
+25
+85
Input Voltage1,
MC-7847-KC
TC
UNITS MIN
Operating Case
Temperature
Note:
1. Test Conditions: 110 Channels, 10 dB tilted across the band.
ORDERING INFORMATION
PART NUMBER
PACKAGE
QUANTITY
MC-7847-KC
7-pin special with heatsink
50pcs max/ Tray
NOTES ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
1. The space between PC board and root of the lead should be kept
more than 1 mm to prevent undesired stress on the lead and also
should be kept less than 4 mm to prevent undesired parasitic
inductance.
This product should be soldered in the following recommended
conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives.
Recommended space is 2.0 to 3.0 mm typical.
2. Recommended torque strength of the screw is 59 to 78 Ncm.
3. Form the ground pattern as wide as possible to minimize ground
impedance. (to prevent undesired oscillation)
All the ground pins must be connected together with wide ground
pattern to decrease impedance difference.
Soldering
Method
Soldering
Conditions
Condition
Symbol
Pin Part Heating
Pin area temperature: less
than 260°C1
Hour: Within 2 sec./pin
–
Note.
1. The point of pin part heating must be kept at a distance of more
than 1.2 mm from the root of lead.
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
01/28/2004