PRELIMINARY DATA SHEET BIPOLAR DIGITAL INTEGRATED CIRCUIT µPB1511TB 800 MHz INPUT DIVIDE BY 2, 4 PRESCALER IC FOR PORTABLE SYSTEMS The µPB1511TB is a silicon monolithic integrated circuit designed as a divide by 2, 4 prescaler IC for portable radio systems. This IC is manufactured using NEC’s 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. Consequently, this IC is lower circuit current and smaller package than conventional µPB1509GV. FEATURES • Operating frequency : fin = 50 to 700 MHz @ ÷ 2, 50 to 800 MHz @ ÷ 4 • Low current consumption : 3.5 mA @ VCC = 3.0 V • High-density surface mounting : 6-pin super minimold • Supply voltage : VCC = 2.4 to 3.3 V • Selectable division : ÷ 2, ÷ 4 APPLICATIONS • Portable radio systems • Cellular/cordless telephone 2nd local prescaler ORDERING INFORMATION Part Number µPB1511TB-E3 Package 6-pin super minimold Supplying Form Marking C2Z Embossed tape 8 mm wide. Pin 1, 2, 3 face the tape perforation side. Qty 3 kpcs/reel. Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPB1511TB) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P14731EJ1V0DS00 (1st edition) Date Published June 2000 N CP(K) Printed in Japan © 2000 µPB1511TB PIN CONNECTIONS 3 2 1 Pin Name 1 OUT (Bottom View) C2Z (Top View) Pin No. 2 GND 4 4 3 3 SW 5 5 2 4 IN 6 6 1 5 IN 6 VCC PRODUCT LINE-UP Part Number ICC (mA) ÷2 fin (MHz) VCC (V) ÷4 fin (MHz) ÷8 fin (MHz) Package µPB1509 GV 5.0 2.2 to 5.5 50 to 700 50 to 800 50 to 1 000 8-pin SSOP µPB1511TB 3.5 2.4 to 3.3 50 to 700 50 to 800 − 6-pin super minimold Remark This table shows the TYP. values of main parameters. Please refer to ELECTRICAL CHARACTERISTICS. INTERNAL BLOCK DIAGRAM D IN IN Q CLK D Q CLK Q OUT Q SW 2 Preliminary Data Sheet P14731EJ1V0DS00 µPB1511TB SYSTEM APPLICATION EXAMPLE One of the example for usage Low Noise Tr. RX DEMOD. I Q VCO VCO ÷N PLL PLL SW ÷N 0° TX µ PB1511TB I Phase Shifter PA 90° Q Quadulator Modulator This block diagram schematically shows the µPB1511TB’s location in one of the example application system. The other applications are also acceptable for divider use. Preliminary Data Sheet P14731EJ1V0DS00 3 µPB1511TB PIN EXPLANATIONS Pin No. Symbol Applied Voltage (V) 1 OUT Divided frequency output pin. This pin is designed as emitter follower output. This pin can output 0.2 VP-P MIN. with 200 Ω load. This pin should be coupled to load device with capacitor (example: 1 000 pF) for DC cut. 2 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 3 SW H/L Divide ratio control pin. Divide ratio can be determined by following applied level to these pins. Functions and Explanation SW Divide ratio H L 1/2 1/4 These pins must be each equipped with bypass capacitor to minimize their impedance. 4 4 IN Signal input pin. This pin should be coupled to signal source with capacitor (example: 1 000 pF) for DC cut. 5 IN Signal input bypass pin. This pin must be equipped with bypass capacitor (example: 1 000 pF) to minimize ground impedance. 6 VCC 2.4 to 3.3 Power supply pin. This pin must be equipped with bypass capacitor (example: 1 000 pF) to minimize ground impedance. Preliminary Data Sheet P14731EJ1V0DS00 µPB1511TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25°C 3.6 V Input Voltage Vin TA = +25°C, SW pin 3.6 V Total Power Dissipation PD Mounted on double sided copper clad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85°C) 200 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 2.4 3.0 3.3 V Operating Ambient Temperature TA −40 +25 +85 °C ELECTRICAL CHARACTERISTICS (TA = +25°°C, VCC = 3.0 V) Parameter Circuit Current Symbol ICC Test Conditions MIN. TYP. MAX. Unit No signals 3.1 3.5 4.1 mA Upper Limit Operating Frequency 1 fin(U)1 Pin = −20 to 0 dBm 500 MHz Upper Limit Operating Frequency 2 fin(U)2 Pin = −20 to −5 dBm @ ÷ 2 @÷4 700 800 MHz Lower Limit Operating Frequency 1 fin(L)1 Pin = −20 to 0 dBm 50 MHz Lower Limit Operating Frequency 2 fin(L)2 Pin = −20 to −5 dBm 500 MHz Input Power 1 Pin1 fin = 50 to 800 MHz −20 −5 dBm Input Power 2 Pin2 fin = 50 to 500 MHz −20 0 dBm Output Voltage Vout RL = 200 Ω 0.2 0.3 VP-P Divide Ratio Control Input High VIH 0.7 × VCC VCC + 0.5 V Divide Ratio Control Input Low VIL −0.5 VCC × 0.3 V Preliminary Data Sheet P14731EJ1V0DS00 5 µPB1511TB TEST CIRCUIT 1 000 pF IN 3 SW 4 50 Ω 1 000 pF High Impedance Oscilloscope 2 GND IN 1 OUT VCC 1 000 pF 150 Ω Signal Generator 5 1 000 pF 6 1 000 pF 50 Ω Power Supply Counter (or Spectrum Analyzer) Divide Ratio Setting SW H 1/2 L 1/4 PACKAGE DIMENSIONS 6-pin super minimold (Unit: mm) 2.1±0.1 0.2+0.1 –0.05 0.65 0.65 1.3 2.0±0.2 1.25±0.1 6 Preliminary Data Sheet P14731EJ1V0DS00 0.15+0.1 –0 0 to 0.1 0.7 0.9±0.1 0.1 MIN. µPB1511TB NOTE ON CORRECT USE (1) Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). Keep the track length of the ground pins as short as possible. (3) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Note Count: 3, Exposure limit: None IR35-00-3 VPS Package peak temperature: 215°C or below Time: 40 seconds or less (at 200°C) Note Count: 3, Exposure limit: None VP15-00-3 Wave Soldering Soldering bath temperature: 260°C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None WS60-00-1 Partial Heating Pin temperature: 300°C Time: 3 seconds or less (per side of device) Note Exposure limit: None – Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Preliminary Data Sheet P14731EJ1V0DS00 7 µPB1511TB ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. • The information in this document is current as of June, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. 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