NEC UPB1511TB

PRELIMINARY DATA SHEET
BIPOLAR DIGITAL INTEGRATED CIRCUIT
µPB1511TB
800 MHz INPUT DIVIDE BY 2, 4 PRESCALER IC
FOR PORTABLE SYSTEMS
The µPB1511TB is a silicon monolithic integrated circuit designed as a divide by 2, 4 prescaler IC for portable
radio systems. This IC is manufactured using NEC’s 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar
process.
Consequently, this IC is lower circuit current and smaller package than conventional µPB1509GV.
FEATURES
• Operating frequency
: fin = 50 to 700 MHz @ ÷ 2,
50 to 800 MHz @ ÷ 4
• Low current consumption
: 3.5 mA @ VCC = 3.0 V
• High-density surface mounting
: 6-pin super minimold
• Supply voltage
: VCC = 2.4 to 3.3 V
• Selectable division
: ÷ 2, ÷ 4
APPLICATIONS
• Portable radio systems
• Cellular/cordless telephone 2nd local prescaler
ORDERING INFORMATION
Part Number
µPB1511TB-E3
Package
6-pin super minimold
Supplying Form
Marking
C2Z
Embossed tape 8 mm wide.
Pin 1, 2, 3 face the tape perforation side.
Qty 3 kpcs/reel.
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:
µPB1511TB)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P14731EJ1V0DS00 (1st edition)
Date Published June 2000 N CP(K)
Printed in Japan
©
2000
µPB1511TB
PIN CONNECTIONS
3
2
1
Pin Name
1
OUT
(Bottom View)
C2Z
(Top View)
Pin No.
2
GND
4
4
3
3
SW
5
5
2
4
IN
6
6
1
5
IN
6
VCC
PRODUCT LINE-UP
Part Number
ICC
(mA)
÷2
fin
(MHz)
VCC
(V)
÷4
fin
(MHz)
÷8
fin
(MHz)
Package
µPB1509 GV
5.0
2.2 to 5.5
50 to 700
50 to 800
50 to 1 000
8-pin SSOP
µPB1511TB
3.5
2.4 to 3.3
50 to 700
50 to 800
−
6-pin super minimold
Remark
This table shows the TYP. values of main parameters. Please refer to ELECTRICAL CHARACTERISTICS.
INTERNAL BLOCK DIAGRAM
D
IN
IN
Q
CLK
D
Q
CLK
Q
OUT
Q
SW
2
Preliminary Data Sheet P14731EJ1V0DS00
µPB1511TB
SYSTEM APPLICATION EXAMPLE
One of the example for usage
Low Noise Tr.
RX
DEMOD.
I
Q
VCO
VCO
÷N
PLL
PLL
SW
÷N
0°
TX
µ PB1511TB
I
Phase
Shifter
PA
90°
Q
Quadulator Modulator
This block diagram schematically shows the µPB1511TB’s location in one of the example application system. The
other applications are also acceptable for divider use.
Preliminary Data Sheet P14731EJ1V0DS00
3
µPB1511TB
PIN EXPLANATIONS
Pin No.
Symbol
Applied
Voltage
(V)
1
OUT

Divided frequency output pin. This pin is designed as emitter follower output. This
pin can output 0.2 VP-P MIN. with 200 Ω load.
This pin should be coupled to load device with capacitor (example: 1 000 pF) for
DC cut.
2
GND
0
Ground pin. Ground pattern on the board should be formed as widely as possible
to minimize ground impedance.
3
SW
H/L
Divide ratio control pin. Divide ratio can be determined by following applied level
to these pins.
Functions and Explanation
SW
Divide ratio
H
L
1/2
1/4
These pins must be each equipped with bypass capacitor to minimize their
impedance.
4
4
IN

Signal input pin. This pin should be coupled to signal source with capacitor
(example: 1 000 pF) for DC cut.
5
IN

Signal input bypass pin. This pin must be equipped with bypass capacitor
(example: 1 000 pF) to minimize ground impedance.
6
VCC
2.4 to 3.3
Power supply pin. This pin must be equipped with bypass capacitor (example:
1 000 pF) to minimize ground impedance.
Preliminary Data Sheet P14731EJ1V0DS00
µPB1511TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25°C
3.6
V
Input Voltage
Vin
TA = +25°C, SW pin
3.6
V
Total Power Dissipation
PD
Mounted on double sided copper clad 50 ×
50 × 1.6 mm epoxy glass PWB (TA =
+85°C)
200
mW
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
2.4
3.0
3.3
V
Operating Ambient Temperature
TA
−40
+25
+85
°C
ELECTRICAL CHARACTERISTICS (TA = +25°°C, VCC = 3.0 V)
Parameter
Circuit Current
Symbol
ICC
Test Conditions
MIN.
TYP.
MAX.
Unit
No signals
3.1
3.5
4.1
mA
Upper Limit Operating Frequency 1
fin(U)1
Pin = −20 to 0 dBm
500


MHz
Upper Limit Operating Frequency 2
fin(U)2
Pin = −20 to −5 dBm @ ÷ 2
@÷4
700
800




MHz
Lower Limit Operating Frequency 1
fin(L)1
Pin = −20 to 0 dBm


50
MHz
Lower Limit Operating Frequency 2
fin(L)2
Pin = −20 to −5 dBm


500
MHz
Input Power 1
Pin1
fin = 50 to 800 MHz
−20

−5
dBm
Input Power 2
Pin2
fin = 50 to 500 MHz
−20

0
dBm
Output Voltage
Vout
RL = 200 Ω
0.2
0.3

VP-P
Divide Ratio Control Input High
VIH
0.7 × VCC

VCC + 0.5
V
Divide Ratio Control Input Low
VIL
−0.5

VCC × 0.3
V
Preliminary Data Sheet P14731EJ1V0DS00
5
µPB1511TB
TEST CIRCUIT
1 000 pF
IN
3 SW
4
50 Ω
1 000 pF
High Impedance
Oscilloscope
2 GND
IN
1 OUT
VCC
1 000 pF
150 Ω
Signal Generator
5
1 000 pF
6
1 000 pF
50 Ω
Power Supply
Counter
(or Spectrum Analyzer)
Divide Ratio Setting
SW
H
1/2
L
1/4
PACKAGE DIMENSIONS
6-pin super minimold (Unit: mm)
2.1±0.1
0.2+0.1
–0.05
0.65
0.65
1.3
2.0±0.2
1.25±0.1
6
Preliminary Data Sheet P14731EJ1V0DS00
0.15+0.1
–0
0 to 0.1
0.7
0.9±0.1
0.1 MIN.
µPB1511TB
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
Keep the track length of the ground pins as short as possible.
(3) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions.
For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Note
Count: 3, Exposure limit: None
IR35-00-3
VPS
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Note
Count: 3, Exposure limit: None
VP15-00-3
Wave Soldering
Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Note
Count: 1, Exposure limit: None
WS60-00-1
Partial Heating
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Note
Exposure limit: None
–
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Preliminary Data Sheet P14731EJ1V0DS00
7
µPB1511TB
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
SENSITIVE
DEVICES
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
• The information in this document is current as of June, 2000. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
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third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
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redundancy, fire-containment, and anti-failure features.
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"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
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(Note)
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(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
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M8E 00. 4