DATA SHEET MOS INTEGRATED CIRCUIT µPD16901 FLASH MEMORY VOLTAGE STEPUP DC/DC CONVERTER IC The µPD16901 is a DC/DC converter IC which produces a 12 V output from a 5 V input source. The integration of a control circuit and power MOSFET in the output stage on a single-chip allows a power supply for flash memory write and erasure to be configured with a reduced number of external components. FEATURES • With an on-chip output stage power MOSFET, fewer external components are needed. • The ALLMOS structure achieves low power consumption. • Internally set output voltage eliminates the need for adjustment. • Output can be turned ON/OFF via an external signal. • A timer latch type overcurrent protection circuit on chip ORDERING INFORMATION Part Number µPD16901GS Package 14-pin plastic SOP (300 mil) BLOCK DIAGRAM ON/OFF Reference voltage circuit VIN Startup circuit CDLY Timer latch short-circuit protection circuit C1H C1L C2 Charge pump circuit VSW F/F SW β Oscillation circuit FB RT Overcurrent detection circuit C.S. GND The information in this document is subject to change without notice. Document No. S10643EJ2V0DS00 (2nd edition) Date Published May 1997 N Printed in Japan © 1997 µPD16901 ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C unless specified otherwise) Item Symbol Condition Rating Unit Supply voltage VIN 7.0 V Output voltage VSW 20 V Total power dissipation PT 0.9 W Operating ambient temperature TA –20 to 85 ˚C Storage temperature range Tstg –55 to +150 ˚C Note Note When 90 mm × 90 mm × 1.6 mm thick glass epoxy board is mounted RECOMMENDED OPERATING RANGE Item Symbol Supply voltage VDD Charge pump capacitor C1, C2 Operating ambient temperature TA ELECTRICAL SPECIFICATIONS Item MIN. TYP. MAX. Unit 4.5 5.0 5.5 V 0.033 0.1 0.47 µF 70 ˚C 0 (TA = 25 ˚C, VIN = 5 V unless specified otherwise) Symbol Condition MIN. TYP. MAX. Unit 153 167 181 kHz (Oscillation block) Oscillation frequency fOSC On duty DUTY RT = 68 kΩ 67 % (Low voltage misoperation preventive circuit) Operation start voltage VIN(start-up) 3.3 3.7 4.3 V Operation stop voltage VIN(stop) 2.7 3.2 3.8 V Hysteresis width VHYS 0.3 0.5 0.7 V VDET 270 300 330 mV (Overcurrent detection block) Overcurrent detection voltage (On/off control block) VIH 4.5 V ≤ VIN ≤ 5.5 V VIL 4.5 V ≤ VIN ≤ 5.5 V IIL ON/OFF pin voltage = 0 –20 VCHG 4.5 V ≤ VIN ≤ 5.5 V 0 ˚C ≤ TA ≤ 70 ˚C 8.0 Timer latch pin output current ISCP RT = 68 kΩ 2.0 Timer latch detection voltage VDETT 0.85 ON/OFF pin input voltage ON/OFF pin input current VIN*0.7 V VIN*0.3 V –1 µA 11 V 3.3 4.5 µA 1.0 1.15 V 0.3 0.5 Ω 1.0 µA –5 (Charge pump circuit) Output voltage (Short-circuit protection circuit) (Output block) 2 Output stage on resistance RDS(ON) IPK = 0.5 A Output stage leakage current IDSOFF VDS = 20 V µPD16901 PIN CONFIGURATION (Top View) C2 VSW NC NC NC CS FB 14 13 12 11 10 9 8 1 2 3 4 5 6 7 C1H C1L VCC CDLY GND ON/OFF RT CONTROL 3 µPD16901 PACKAGE DRAWINGS 14 PIN PLASTIC SOP (300 mil) 14 8 P detail of lead end 1 7 A H J E K F G I B C D M L N M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 10.46 MAX. 0.412 MAX. B 1.42 MAX. 0.056 MAX. C 1.27 (T.P.) 0.050 (T.P.) D 0.40 +0.10 –0.05 0.016 +0.004 –0.003 E 0.1±0.1 0.004±0.004 F 1.8 MAX. 0.071 MAX. G 1.55 0.061 H 7.7±0.3 0.303±0.012 I 5.6 0.220 J 1.1 0.043 K 0.20 +0.10 –0.05 0.008 +0.004 –0.002 L 0.6±0.2 0.024 +0.008 –0.009 M 0.12 0.005 N 0.10 0.004 P 3° +7° –3° 3° +7° –3° P14GM-50-300B-4 4 µPD16901 STANDARD CHARACTERISTIC CURVES fOSC -VIN characteristic PT - TA characteristic 180 When mounted on 90 mm × 90 mm × 1.6 mm glass epoxy board 1.2 1.0 0.9 W 0.8 139 ˚C/W 0.6 0.4 0.2 Oscillation frequency fOSC (kHz) Total Power dissipation PT (W) 1.4 TA = 25 ˚C 175 170 165 160 85 ˚C 0 –20 155 0 20 40 60 80 100 Ambient temperature TA (˚C) 3.5 4.0 6.5 180 VIN = 5 V TA = 85 ˚C 3.0 Oscillation frequency fOSC (kHz) Operating circuit current ICC (ON) (mA) 6.0 fOSC - TA characteristic ICC (ON) - VIN characteristic 3.5 2.5 TA = 0 ˚C TA = 25 ˚C 2.0 1.5 1.0 0.5 3.5 4.0 4.5 5.0 5.5 Input voltage VIN (V) 6.0 175 170 165 160 155 150 145 –20 0 6.5 0 1.12 VIN = 5 V 330 320 310 300 290 280 0 20 40 60 80 100 Ambient temperature TA (˚C) Timer latch detection voltage VDETT (V) 340 270 –20 20 40 60 80 100 Ambient temperature TA (˚C) VDETT - TA characteristic VDET - TA characteristic Overcurrent detection voltage VDET (mV) 5.5 4.5 5.0 Input voltage VIN (V) VIN = 5 V 1.1 1.08 1.06 1.04 1.02 1.0 0.98 –20 0 20 40 60 80 100 Ambient temperature TA (˚C) 5 µPD16901 ISCP - TA characteristic ICC (OFF) - TA characteristic VIN = 5 V VIN = 5 V 4 3 2 1 120 100 80 60 40 20 0 –20 6 140 Standby current ICC (OFF) ( µ A) Timer latch pin output current ISCP ( µ A) 5 0 40 60 20 80 100 Ambient temperature TA (˚C) 0 –20 0 20 40 60 80 100 Ambient temperature TA (˚C) µPD16901 STANDARD CONNECTION DIAGRAM 4.5 V to 5.5 V CIN + 33 µ F CT 0.1 µ F 0.1 µ F C2 C1 0.1 µ F ON/OFF VIN Reference voltage circuit Startup circuit CDLY Timer latch short-circuit protection circuit C1H C1L L 33 µ H C2 Charge pump circuit D VSW F/F SW 15 µF + COUT β Oscillation circuit C.S. Overcurrent detection circuit RCS FB RT 0.3 Ω GND 68 kΩ Remark The circuit constants and circuit configuration in this connection diagram are shown for illustrative purposes and not intended for volume production design. ELECTRICAL SPECIFICATIONS (as per standard connection diagram. TA = 25 ˚C, VIN = 5 V, IOUT = 140 mA unless specified otherwise) Item Symbol Condition MIN. TYP. MAX. Unit 11.52 12.00 12.48 V Output voltage VOUT 4.5 V ≤ VIN ≤ 5.5 V 0 mA ≤ IO ≤ 140 mA 0 ˚C ≤TA ≤ 60 ˚C Input stability REGIN 4.5 V ≤ VIN < 5.5 V 0.5 %/V Load stability REGL 0 mA ≤ IO < 140 mA 0.004 %/mA Conversion efficiency η 83 % Operating circuit current ICC IO = 0 3.0 mA Standby circuit current ICC(OFF) ON/OFF pin voltage = 0 100 µA Startup voltage VIN(start-up) 4.3 V 3.7 Remark These specifications are reference values confirmed with the standard connection diagram (without taking account of variations) and are not intended to guarantee the characteristics of the product as a DC/DC converter. 7 µPD16901 STANDARD CHARACTERISTIC CURVES (as per standard connection diagram) η - IO characteristic IO (MAX) - VIN characteristic 100 Conversion efficiency η (%) VIN = 5.5 V 80 VIN = 5 V VIN = 4.5 V 60 40 20 Maximum output current IO (MAX) (mA) 350 0 TA = 85 °C 300 TA = 25 °C 250 TA = 0 °C 200 150 100 50 0 0 25 50 75 100 125 Output current IO (mA) 150 3.5 VO - IO characteristic 4.0 4.5 5.0 5.5 6.0 Input voltage VIN (V) VO -TA characteristic 13 VIN = 5V IO = 140 mA 12.5 Output voltage VO (V) Output voltage VO (V) 12.5 12 11.5 11 0 8 25 50 75 100 125 Output current IO (mA) 150 VIN = 5.5 V VIN = 5 V 12 VIN = 4.5 V 11.5 11 –20 0 20 40 60 80 100 Ambient temperature TA (°C) 6.5 µPD16901 RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the conditions recommended below. For soldering methods and conditions other than those recommended, please contact your NEC sales representative. For details of recommended soldering conditions, refer to the information document "Semiconductor Device Mounting Technology Manual." Soldering Method Recommended Condition Symbol Soldering Conditions Infrared reflow Package peak temperature: 235 ˚C; Duration: 30 sec. max. (210 ˚C or above): Number of times: Max. 3; Time limit: NoneNote Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less) is recommended. IR35-00-3 VPS Package peak temperature: 215 ˚C; Duration: 40 sec. max. (200 ˚C or above): Number of times: 1; Time limit: NoneNote Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less) is recommended. VP15-00-1 Wave soldering Package peak temperature: 260 ˚C or less, Duration: 10 sec. max., Preparatory heating temperature: 120 ˚C or less; Number of times: 1 Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less) is recommended. WS60-00-1 Note For the storage period after unpacking from the dry-pack, storage conditions are max. 25 ˚C, 65% RH. Caution Use of more than one soldering method should be avoided. REFERENCE DOCUMENTS NEC Semiconductor Device Reliability/Quality Control System 10983E Semiconductor Device Quality Guarantee Guide MEI-1202 Semiconductor Device Mounting Technology Manual C10535E 9 µPD16901 [MEMO] 10 µPD16901 [MEMO] 11 µPD16901 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5