DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC339 LOW POWER QUAD COMPARATOR DESCRIPTION FEATURES The µPC339 is a quad comparator which is designed to operate from a single power supply over a wide range • Common-mode input voltage range includes V– • Wide supply voltage range of voltage. Operation from split power supplies, is also 2 V to 32 V (Single) possible and the power supply current drain is very low. ±1 V to ±16 V (Split) Further advantage, the input common-mode voltage in- • Low supply current cludes ground, even though operated from a single power • Open collector output supply voltage. EQUIVALENT CIRCUIT (1/4 Circuit) PIN CONFIGURATION (Top View) V+ 100 µ A µ PC339C, 339G2 100 µ A OUT2 1 IN + Q1 Q2 Q3 OUT1 2 OUT Q4 + V Q8 II – Q7 Q5 14 OUT3 3 13 OUT4 1 4 – + – + II1 4 11 IN4 IN1 5 10 II4 II2 6 Q6 2 – + 3 – + IN2 7 V– 12 V– 9 IN3 8 II3 ORDERING INFORAMTION Part Number Package µPC339C 14-pin plastic DIP (300 mil) µPC339G2 14-pin plastic SOP (225 mil) The information in this document is subject to change without notice. Document No. G11764EJ3V0DS00 (3rd edition) (Previous No. IC-1986) Date Published February 1997 N Printed in Japan The mark shows major revised points. © 1997 µPC339 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C) Parameter Voltage between V+ and V– Note 1 Differential Input Voltage Symbol Ratings Unit V+ –V– –0.3 to +36 V VID ±36 V Input Voltage Note 2 VI V– –0.3 to V– +36 V Output Voltage Note 3 VO V– –0.3 to V– +36 V Note 4 PT 570 mW 550 mW Indefinite sec Power Dissipation C Package G2 Package Note 5 Output Short Circuit Duration Note 6 Operating Ambient Temperature TA –20 to +80 °C Storage Temperature Tstg –55 to + 125 °C Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction independent of the magnitude of V+. Either input signal should not be allowed to go negative by more than 0.3 V. The normal operation will establish when any input is within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destruction independent of the magnitude of V+. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. 4. Thermal derating factor is –7.6 mW/°C when operating ambient temperature is higher than 55 °C. 5. Thermal derating factor is –5.5 mW/°C when operating ambient temperature is higher than 25 °C. 6. Short circuits from the output to V+ can cause destruction. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage (Split) – Supply Voltage (V = GND) 2 Symbol V V ± + MIN. TYP. MAX. Unit ±1 ±16 V +2 +32 V µPC339 ELECTRICAL CHARACTERISTICS (TA = 25 °C, V+ = 5 V, V– = GND) Parameter Symbol Conditions MIN. TYP. MAX. Unit Input Offset Voltage VIO VO = 1.4 V, VREF = 1.4 V, RS = 0 Ω ±2 ±5 mV Input Offset Current IIO ±5 ±50 nA Input Bias Current IB VO ·=· 1.4 V VO ·=· 1.4 V 25 250 nA Voltage Gain AV RL = 15 kΩ 200 Supply Current ICC RL = ∞, IO = 0 A, All Comparators 0.8 Common Mode lnput Voltage Range VICM Output Saturation Voltage VOL VIN (–) = 1 V, VIN (+) = 0 V, IO SINK = 4 mA Output Sink Current IO SINK VIN (–) = 1 V, VIN (+) = 0 V, VO ≤ 1.5 V Output Leakage Current IO LEAK Response Time 0 0.2 6 V/mV 2 mA + V –1.5 V 0.4 V 16 mA VIN (+) = 1 V, VIN (–) = 0 V, VO = 5 V 0.1 nA RL = 5.1 kΩ, VRL = 5 V 1.3 µs 3 µPC339 APPLICATION CIRCUIT EXAMPLE V+ VIN 4, 6, 8, 10 RL – 3 OUT 5, 7, 9, 11 1, 2 13, 14 12 + VREF VREF: V– to V+ –1.5 (V) COMPARATOR with HYSTERESIS CIRCUIT V+ VRL RL – VIN OUT + R2 R1 VREF • Threshold voltage · VREF + VTH (High) = · R1 (VRL – VREF) RL + R2 + R1 · VREF – VTH (Low) = · R1 (VREF – VOL) R1 + R2 (VRL > VREF > VOL) 4 µPC339 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25 °C, TYP.) POWER DISSIPATION SUPPLY CURRENT 1,000 RL = ∞ 800 ICC - Supply Current - mA PT - Total Power Dissipation - mW 1.2 600 339C 339G2 400 TA = 0 °C 1.0 TA = 25 °C 0.8 TA = 70 °C 200 0.6 0 20 40 60 80 0 100 10 20 30 40 V+ - Supply Voltage - V (V– = GND) TA - Operating Ambient Temperature - °C INPUT BIAS CURRENT INPUT OFFSET VOLTAGE 50 3 2 IB - Input Bias Current - nA VIO - Input Offset Voltage - mV V+ = +5 V V– = GND 1 0 –1 TA = 0 °C 40 30 TA = 25 °C 20 TA = 70 °C –2 –3 –40 –20 0 20 40 60 80 10 0 10 V+ TA - Operating Ambient Temperature - °C 20 - Supply Voltage - V 30 (V– 40 = GND) OUTPUT SATURATION VOLTAGE VOL - Output Saturation Voltage - V 10 1 0.1 TA = 70 °C 0.01 TA = 25 °C TA = 0 °C 0.001 0.01 0.1 1 10 100 IO SINK - Output Sink Current - mA 5 µPC339 20 mV +5 V 3 2 VIN VO + 1 0 0 TA = 25 °C –50 –100 0 0.5 1.0 t - Time - µ s 6 5.1 kΩ – 100 mV 1.5 2.0 100 mV Input Overdrive 5 4 5 mV 3 2 20 mV 1 +5 V 5.1 kΩ 4 VO - Output Voltage - V 5.0 mV Input Overdrive 5 RESPONSE TIME FOR VARIOUS INPUT OVERDRIVES II VIN - Input Voltage - mV VIN - Input Voltage - mV VO - Output Voltage - V RESPONSE TIME FOR VARIOUS INPUT OVERDRIVES I 0 VIN – 100 TA = 25 °C + 50 VO 0 0 0.5 1.0 t - Time - µ s 1.5 2.0 µPC339 PACKAGE DRAWINGS 14PIN PLASTIC DIP (300 mil) 14 8 1 7 A K L I J H C G B M R F D N M NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" to center of leads when formed parallel. ITEM MILLIMETERS INCHES A B 20.32 MAX. 2.54 MAX. 0.800 MAX. 0.100 MAX. C 2.54 (T.P.) 0.100 (T.P.) D 0.50±0.10 0.020 +0.004 –0.005 F 1.2 MIN. 0.047 MIN. G H 3.6±0.3 0.51 MIN. 0.142±0.012 0.020 MIN. I J 4.31 MAX. 5.08 MAX. 0.170 MAX. 0.200 MAX. K 7.62 (T.P.) 0.300 (T.P.) L 6.4 0.252 M 0.25 +0.10 –0.05 0.010 +0.004 –0.003 N 0.25 0.01 R 0~15° 0~15° P14C-100-300B1-1 7 µPC339 14 PIN PLASTIC SOP (225 mil) 14 8 P detail of lead end 1 7 A H I E K F G J N C D M L B M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 10.46 MAX. 0.412 MAX. B 1.42 MAX. 0.056 MAX. C 1.27 (T.P.) 0.050 (T.P.) D 0.40 +0.10 –0.05 0.016 +0.004 –0.003 E 0.1±0.1 0.004±0.004 F 1.8 MAX. 0.071 MAX. G 1.49 0.059 H 6.5±0.3 0.256±0.012 I 4.4 0.173 J 1.1 0.043 K 0.15 +0.10 –0.05 0.006 +0.004 –0.002 L 0.6±0.2 0.024 +0.008 –0.009 M 0.12 0.005 N 0.10 0.004 P 3° +7° –3° 3° +7° –3° S14GM-50-225B, C-4 8 µPC339 RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E). Surface mount device µPC339G2: 14-pin plastic SOP (225 mil) Process Conditions Symbol Infrared ray reflow Peak temperature: 230 °C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 °C or higher), Maximum number of reflow processes: 1 time. IR30-00-1 Vapor Phase Soldering Peak temperature: 215 °C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 1 time. VP15-00-1 Wave Soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). WS60-00-1 Partial heating method Pin temperature: 300 °C or below, Heat time: 3 seconds or less (Per each side of the device). – Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the device will be damaged by heat stress. Through-hold device µPC339C: 14-pin plastic DIP (300 mil) Process Conditions Wave soldering (only to leads) Solder temperature: 260 °C or below, Flow time: 10 seconds or less. Partial heating method Pin temperature: 300 °C or below, Heat time: 3 seconds or less (per each lead.) Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 9 µPC339 REFERENCE DOCUMENTS QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL C10535E IC PACKAGE MANUAL C10943X GUIDE TO QUALITY ASSUARANCE FOR SEMICONDUCTOR DEVICES MEI-1202 SEMICONDUCTORS SELECTION GUIDE X10679E NEC SEMICONDUCTOR DEVICE RELIABILITY/ IEI-1212 QUALITY CONTROL SYSTEM - STANDARD LINEAR IC 10 C11531E µPC339 [MEMO] 11 µPC339 [MEMO] The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 2