DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC667 10-BIT D/A CONVERTER The µPC667 is high-speed and high-precision 10-bit D/A converter. Clock rate of the µPC667 is 60 Msps. Conversion precision of the µPC667 is ±1.0 LSB. FEATURES • Resolution 10-bit • Clock rate 60 Msps • Technology Bi-CMOS • Power supply +5 V • D/A conversion method R-2R ladder resistance and segment summing system • Analog output form Voltage output type • Built-in reference voltage generating circuit ORDERING INFORMATION Part Number Package µPC667CT 30-pin plastic shrink DIP (400 mil) The information in this document is subject to change without notice. Document No. S11099EJ2V0DS00 (2nd edition) (Previous No. IC-3250) Date Published February 1996 P Printed in Japan The mark ★ shows major revised points. © 1993, 1996 µPC667 BLOCK DIAGRAM CLK 10 D1 to D10 Input buffer Master-slave F.F. Current switch R-2R ladder Amp. Reference current source Reference resistor Reference voltage generator VRSET VROUT 2 VREF COMP AVCC DVCC AGND DGND AOUT µPC667 PIN CONFIGURATION (Top View) 1 30 DVCC D2 2 29 AGND D3 3 28 AVCC D4 4 27 COMP D5 5 26 AOUT D6 6 25 VREF D7 7 24 AVCC D8 8 23 AGND D9 9 22 DGND D10 10 21 VROUT DGND 11 20 VRSET CLK 12 19 NC NC 13 18 NC DGND 14 17 NC NC 15 16 NC µPC667CT D1 AGND : Ground for Analog Circuit AOUT : Analog Output AVCC : Power Supply for Analog Circuit CLK : Clock COMP : Phase Compensation D1 to D10 : Digital Signal DGND : Ground for Digital Circuit DVCC : Power Supply for Digital Circuit NC : No Connection VREF : Reference Voltage VROUT : Reference Voltage Output VRSET : Reference Voltage Adjustment 3 µPC667 PIN FUNCTIONS Pin Name D1 to D10 Pin No. 1 to 10 Input/ Output Input Function Equivalent Circuit Digital signal D1 is MSB, D10 is LSB. DVCC DVCC 500 Ω DGND DGND CLK 12 Input Clock The rising edge of signal input to this pin triggers analog output. DVCC DVCC 500 Ω DGND DVCC 30 — Power supply for digital circuit DGND 11, 14, 22 — Ground for digital circuit DGND DVCC DGND VRSET VROUT 4 20 21 — Output Reference voltage adjustment Voltage adjusting pin for the incorporated reference voltage generating circuit. The output voltage of VROUT pin varies according to the voltage applied to this pin. When no adjustment is necessary, connect approx. 0.1 µF capacitance between this pin and GND pin. Reference voltage output Voltage output pin of the incorporated reference voltage generating circuit. This pin has high output impedance, and must be connected with a high impedance element. AVCC AVCC AVCC 7.5 kΩ VROUT 3 kΩ 2 kΩ VRSET AGND Reference voltage generator AGND µPC667 Pin Name VREF Pin No. 25 Input/ Output Input Function Equivalent Circuit Reference voltage The output full-scale range is set according to the voltage applied to this pin. Apply standard 4.0 V. When no adjustment is necessary, connect the output from VROUT pin directly to this pin. AVCC 5 kΩ 20 µA AGND AGND AOUT 26 Output Analog signal Analog signal output pin. AVCC AVCC 112.5 Ω 225 Ω 112.5 Ω R-2R Ladder resistance 112.5 Ω AGND AGND AGND COMP 27 — Phase compensation Phase compensating capacitor connection pin for full-scale amplifier. Approx. 0.1 µF capacitor must be connected between this pin and AVCC pin. AVCC AGND AVCC 9.7 kΩ AVCC 9.7 kΩ AVCC COMP AGND AGND AVCC 24, 28 — Power supply for analog circuit AGND 23, 29 — Ground for analog circuit AVCC AGND NC 13, 15 to 19 — No Connection 5 µPC667 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings (TA = 25 ˚C) Parameter ★ Symbol Ratings Unit Supply voltage for digital circuit DVCC –0.3 to +6.0 V Input voltage VI –0.3 to VCC +0.3 V Operating ambient temperature TA –20 to +70 ˚C Storage temperature Tstg –40 to +125 ˚C Power dissipation PD 0.8 (TA = +60 ˚C) W Supply voltage for analog circuit AVCC DVCC –0.3 to DVCC +0.3 V Caution Exposure to Absolute Maximum Rating for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently. Recommended Operating Conditions Parameter 6 Symbol Conditions MIN. TYP. MAX. Unit Supply voltage for digital circuit DVCC 4.75 5.0 5.25 V Supply voltage for analog circuit AVCC 4.75 5.0 5.25 V Reference voltage input pin voltage VREF 3.8 4.0 4.2 V High-level voltage of digital input VIH 2.0 Low-level voltage of digital input VIL 0.8 V Conversion clock frequency fCLK 60 MHz Phase compensation capacitance CCOMP V 1.0 µF µPC667 DC Characteristics and AC Characteristics (TA = –10 to +70 ˚C, DVCC = AVCC = +5 ±0.25 V) Parameter Symbol Conditions MIN. TYP. MAX. Resolution RSL Integral linearity error ILE TA = 0 to 60 ˚C, VREF = 4.0 V –1.0 +1.0 LSB Differential linearity error DLE TA = 0 to 60 ˚C, VREF = 4.0 V –1.0 +1.0 LSB Supply current ICC 50 71 mA Set-up time ts 3 7 ns Hold time th 1.5 7 ns Settling time tSET TA = 25 ˚C, R L = 375 Ω, VREF = 4.0 V 13 Output delay time td VREF = 4.0 V 9 Full-scale voltage output Vofs VREF = 4.0 V, RL > 100 kΩ 4.95 Zero-scale voltage output Vozs VREF = 4.0 V, RL > 100 kΩ 3.95 Output resistance Zout VREF = 4.0 V Internal reference voltage output voltage VROUT AVCC = 5.0 V Cautions 1. 10 Unit Bit ns 13 ns 5.0 V 4 4.05 V 70 85 100 Ω 3.8 4.0 4.2 V As for the phase compensation capacitance, capacitor of 1 µF should be connected between the phase compensation capacitance pin (COMP) and the power supply pin for analog circuit (AVCC). 2. The internal reference voltage output pin (VROUT) and the reference voltage input pin (VREF) 3. The power supply and GND lines for analog circuit (AVCC and AGND) and those for digital should be shorted. circuit (DVCC and DGND) should be located as separately as possible. 7 µPC667 ★ Timing Chart tPWH tPWL CLK ts D1 to D10 th Dn Dn+1 tD AOUT tSET An-1 An An+1 Final value ± 1/2 LSB tSET ± 1/2 LSB 8 µPC667 APPLICATION CIRCUIT EXAMPLE Analog output 1000 pF + 4.7 µ F Power supply for analog circuit AGND 1 µF + 1000 pF + 4.7 µF DGND VROUT VRSET NC NC NC NC D10 (LSB) DGND CLK NC DGND NC DGND AGND AVCC VREF AOUT COMP AVCC AGND DVCC Power supply for digital circuit D9 D8 D7 D6 D5 D4 D3 D2 D1 (MSB) µ PC667CT Conversion clock 10-bit digital input 9 µPC667 PACKAGE DRAWING 30PIN PLASTIC SHRINK DIP (400 mil) 30 16 1 15 A K L I J H F D G C N M NOTES 1) Each lead centerline is located within 0.17 mm (0.007 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" to center of leads when formed parallel. M R B ITEM MILLIMETERS INCHES A B 28.46 MAX. 1.78 MAX. 1.121 MAX. 0.070 MAX. C 1.778 (T.P.) 0.070 (T.P.) D 0.50±0.10 0.020 +0.004 –0.005 F 0.85 MIN. 0.033 MIN. G H 3.2±0.3 0.51 MIN. 0.126±0.012 0.020 MIN. I J 4.31 MAX. 5.08 MAX. 0.170 MAX. 0.200 MAX. K 10.16 (T.P.) 0.400 (T.P.) L 8.6 0.339 M 0.25 +0.10 –0.05 0.010 +0.004 –0.003 N 0.17 0.007 R 0~15° 0~15° S30C-70-400B-1 10 µPC667 RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207). Through-hole device µPC667CT: 30-pin plastic Shrink DIP (400 mil) Process Conditions Wave soldering (only to leads) Solder temperature: 260 ˚C or below, Flow time: 10 seconds or less. Partial heating method Terminal temperature: 300 ˚C or below, Heat time: 3 seconds or less (Per each lead). ★ Caution For through-hole devices, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 11 µPC667 [MEMO] The application circuits and their parameters are for references only and are not intended for use in actual design-in's. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: “Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11