DATA SHEET BIPOLAR DIGITAL INTEGRATED CIRCUIT µPB1508GV 3 GHz INPUT DIVIDE BY 2 PRESCALER IC FOR DBS TUNERS µPB1508GV is a 3.0 GHz input divide by 2 prescaler IC for DBS tuner applications. µPB1508GV can make VHF/UHF band PLL frequency synthesizer apply to DBS/ECS tuners. µPB1508GV is a shrink package version of µPB584G so that this small package contributes to reduce the mounting space. µPB1508GV is manufactured using NEC’s high fT NESAT™ IV silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES • High toggle frequency • High-density surface mounting : 8 pin plastic SSOP (175 mil) : fin = 0.5 GHz to 3.0 GHz • Low current consumption : 5 V, 12 mA • Fixed division : ÷2 APPLICATION • Prescaler between local oscillator and PLL frequency synthesizer included modulus prescaler • DBS tuners with kit use of VHF/UHF band PLL frequency synthesizer ORDERING INFORMATION PART NUMBER µPB1508GV-E1 PACKAGE 8 pin plastic SSOP (175 mil) MARKING 1508 SUPPLYING FORM Embossed tape 8 mm wide. Pin 1 is in tape pull-out direction. 1 000 p/reel. Remarks To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPB1508GV) Caution: Electro-static sensitive devices Document No. P10768EJ2V0DS00 (2nd edition) Date Published September 1997 N Printed in Japan © 1996 µPB1508GV PIN CONNECTION (Top View) Pin No. 1 8 2 7 3 6 4 5 Pin name 1 VCC 2 IN 3 IN 4 GND 5 GND 6 NC 7 OUT 8 NC PRODUCT LINE-UP Product No. ICC (mA) fin (GHz) VCC (V) Package Pin Connection µPB581A 30 0.5 to 2.8 4.5 to 5.5 8 pins CAN µPB581C 30 0.5 to 2.2 4.5 to 5.5 8 pins DIP (300 mil) NEC Original µPB584G 18 0.5 to 2.5 4.5 to 5.5 8 pins SOP (225 mil) NEC Original µPB1508GV 12 0.5 to 3.0 4.5 to 5.5 8 pins SSOP (175 mil) – Remarks This table shows the TYP values of main parameters. Please refer to ELECTRICAL CHARACTERISTICS. µPB581A, µPB581C and µPB584G are discontinued. INTERNAL BLOCK DIAGRAM IN D CLK IN CLK Q OUT Q AMP SYSTEM APPLICATION EXAMPLE RF unit block of DBS tuners 1stIF input from DBS converter Baseband output MIX BPF SAW AGC amp. µ PB1508GV ÷2 Prescaler OSC LPF 2 FM demo. PLLsynth. for VHF/UHF band µPB1508GV PIN EXPLANATION Pin No. Symbol Applied voltage PIN voltage Functions and explanation 1 VCC 4.5 to 5.5 Power supply pin. This pin must be equipped with bypass capacitor (eg 1 000 pF) to minimize ground impedance. 2 IN 1.7 to 4.95 Signal input pin. This pin should be coupled to signal source with capacitor (eg 1 000 pF) for DC cut. 3 IN 1.7 to 4.95 Signal input bypass pin. This pin must be equipped with bypass capacitor (eg 1 000 pF) to minimize ground impedance. 4, 5 GND 0 Ground pin. Ground pattern on the board should be formed as wide as possible to minimize ground impedance. 6, 8 NC Non connection pins. These pins should be opened. OUT 1.0 to 4.7 7 Divided frequency output pin. This pin is designed as emitter follower output. This pin can be connected to input of prescaler within PLL synthesizer through DC cut capacitor. 3 µPB1508GV ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL CONDITION RATINGS UNIT Supply voltage VCC TA = +25 °C 6.0 V Input voltage Vin TA = +25 °C 6.0 V Total power dissipation PD Mounted on double sided copper clad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85 °C) 250 mW Operating ambient temperature TA −40 to +85 °C Storage temperature Tstg −55 to +150 °C RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply voltage VCC 4.5 5.0 5.5 V Operating ambient temperature TA −40 +25 +85 °C REMARKS ELECTRICAL CHARACTERISTICS (TA = −40 to +85 °C, VCC = 4.5 to 5.5 V, ZS = ZL = 50 Ω ) PARAMETER 4 SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT Circuit current ICC No signals 7.6 12 14.5 mA Upper limit operating frequency 1 fin(U)1 Pin = −10 to +6 dBm 3.0 GHz Upper limit operating frequency 2 fin(U)2 Pin = −15 to +6 dBm 2.7 GHz Lower limit operating frequency fin(L) Pin = −15 to +6 dBm 0.5 GHz Input power 1 Pin1 fin = 2.7 to 3.0 GHz −10 +6 dBm Input power 2 Pin2 fin = 0.5 to 2.7 GHz −15 +6 dBm Output power Pout Pin = 0 dBm, fin = 2 GHz −12 −7 dBm µPB1508GV TYPICAL CHARACTERISTICS (unless otherwise specified TA = +25°C) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 15 No signals ICC - Circuit Current - mA TA = +85 ˚C 10 TA = +25 ˚C TA = –40 ˚C 5 0 0 1 2 3 4 VCC - Supply Voltage - V 5 6 INPUT POWER vs. INPUT FREQUENCY INPUT POWER vs. INPUT FREQUENCY +20 +20 TA = +25 ˚C 0 +10 VCC = 4.5 to 5.5 V –10 Pin - Input Power - dBm Pin - Input Power - dBm +10 Guaranteed Operating Window –20 VCC = 4.5 to 5.5 V –30 TA = +85 ˚C –10 TA = +85 ˚C –30 –50 –50 OUTPUT POWER vs. INPUT FREQUENCY TA = +25 ˚C TA = –40 ˚C TA = +85 ˚C TA = –40 ˚C TA = +85 ˚C TA = +25 ˚C –12 –14 –16 100 Pout - Output Power - dBm Pout - Output Power - dBm TA = +25 ˚C Pin = 0 dBm –2 ZL = 50 Ω –8 –10 4000 0 –4 –6 1000 fin -Input Frequency - MHz OUTPUT POWER vs. INPUT FREQUENCY 0 VCC = 5.0 V Pin = 0 dBm –2 ZL = 50 Ω TA = +25 ˚C TA = –40 ˚C –60 100 4000 Guaranteed Operating Window –20 –40 1000 fin - Input Frequency - MHz TA = +25 ˚C TA = –40 ˚C 0 –40 –60 100 VCC = 4.5 to 5.5 V VCC = 5.5 V –4 –6 VCC = 5.0 V VCC = 4.5 V –8 –10 –12 –14 1000 fin - Input Frequency - MHz 4000 –16 100 1000 fin -Input Frequency - MHz 4000 5 µPB1508GV OUTPUT POWER vs. INPUT FREQUENCY OUTPUT POWER vs. INPUT FREQUENCY 0 0 TA = +85 ˚C Pin = 0 dBm –2 ZL = 50 Ω VCC = 5.5 V –4 Pout - Output Power - dBm Pout - Output Power - dBm TA = –40 ˚C Pin = 0 dBm –2 ZL = 50 Ω –6 VCC = 5.0 V –8 VCC = 4.5 V –10 –12 –14 –16 100 VCC = 5.5 V –4 –6 VCC = 5.0 V –8 VCC = 4.5 V –10 –12 –14 1000 fin - Input Frequency - MHz 4000 –16 100 1000 fin - Input Frequency - MHz 4000 S11 vs. INPUT FREQUENCY VCC = 5.0 V S11 Z REF 1.0 Units 200.0 mUnits/ 4 34.604 Ω –26.496 Ω hp C MARKER 4 3.0 GHz D 1 : 500 MHz 2 : 1000 MHz 3 : 2000 MHz 4 : 3000 MHz 4 1 3 2 START 0.500000000 GHz STOP 3.000000000 GHz 6 FREQUENCY MHz MAG S11 ANG 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 .850 .796 .790 .754 .766 .701 .660 .606 .571 .521 .495 .441 .479 .602 .595 .608 .603 .599 .588 .532 .396 .325 .270 .232 .258 .351 –30.2 –37.8 –39.2 –45.2 –53.7 –57.6 –62.3 –67.2 –70.3 –70.6 –68.3 –60.6 –45.1 –62.3 –74.2 –82.9 –89.8 –97.3 –107.7 –122.0 –132.0 –127.1 –123.6 –122.7 –105.8 –103.7 µPB1508GV S22 vs. OUTPUT FREQUENCY VCC = 5.0 V, fin = 498 MHz S22 Z REF 1.0 Units 200.0 mUnits/ 4 87.789 Ω –13.633 Ω hp C MARKER 4 1.5 GHz 1 D 2 3 4 1 : 250 MHz 2 : 500 MHz 3 : 1000 MHz 4 : 1500 MHz START 0.250000000 GHz STOP 1.500000000 GHz FREQUENCY MHz MAG S22 ANG 250.0000 300.0000 350.0000 400.0000 450.0000 500.0000 550.0000 600.0000 650.0000 700.0000 750.0000 800.0000 850.0000 900.0000 950.0000 1000.0000 1050.0000 1100.0000 1150.0000 1200.0000 1250.0000 1300.0000 1350.0000 1400.0000 1450.0000 1500.0000 .526 .463 .466 .460 .441 .456 .353 .438 .444 .436 .435 .431 .431 .431 .408 .445 .428 .429 .355 .418 .403 .392 .368 .343 .319 .289 118.9 131.2 124.7 117.1 110.2 103.0 94.8 91.1 83.9 78.3 71.8 65.9 60.3 53.7 49.2 44.9 41.0 33.7 42.7 20.0 17.1 9.6 3.3 –3.4 –9.2 –14.1 FREQUENCY MHz MAG ANG 250.0000 300.0000 350.0000 400.0000 450.0000 500.0000 550.0000 600.0000 650.0000 700.0000 750.0000 800.0000 850.0000 900.0000 950.0000 1000.0000 1050.0000 1100.0000 1150.0000 1200.0000 1250.0000 1300.0000 1350.0000 1400.0000 1450.0000 1500.0000 .555 .545 .571 .529 .521 .515 .510 .492 .487 .482 .473 .461 .454 .449 .430 .443 .444 .440 .438 .501 .408 .388 .359 .335 .304 .285 146.6 139.9 136.1 127.9 122.4 116.9 104.5 106.6 100.9 95.3 89.9 83.8 78.4 72.3 69.6 64.3 58.8 52.3 46.0 37.5 32.9 25.1 16.3 9.7 3.1 4.6 S22 vs. OUTPUT FREQUENCY VCC = 5.0 V, fin = 3002 MHz S22 Z REF 1.0 Units 200.0 mUnits/ 4 91.109 Ω 2.6523 Ω hp C MARKER 4 1.5 GHz D 2 3 1 4 START 0.250000000 GHz STOP 1.500000000 GHz 1 : 250 MHz 2 : 500 MHz 3 : 1000 MHz 4 : 1500 MHz S22 7 µPB1508GV TEST CIRCUIT Power Supply 1000 pF 5 V±0.5 V 1000 pF Signal Generator 50 Ω 1 8 2 7 C1 1000 pF OPEN 1000 pF C4 C2 HP8665A 1000 pF 8 3 6 4 5 C3 OPEN Counter HP5350B (Spectrum Analyzer) 50 Ω µPB1508GV ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD 1P VCC C4 ,,,,,,, ,,,,,,,,,, , ,, , , , C2 IN OUT C1 C3 IN OUT µ PB1506/08/09GV COMPONENT LIST EVALUATION BOARD CHARACTERS (1) 35 µm thick double-sided copper clad 50 × 50 × 0.4 mm SYMBOL C1 to C4 polyimide board VALUE 1000 pF (2) Back side: GND pattern (3) Solder plated patterns : Through holes ,,,,,,,, (4) ° (5) of pin 3 : partern should be removed. (6) of pin 5 : short chip must be attached to be grounded. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 9 µPB1508GV PACKAGE DIMENSIONS 8 pin PLASTIC SSOP (175 mil) (unit : mm) 5 1 4 3° –3° +7° 8 4.94±0.2 3.2±0.1 0.1±0.1 0.15–0.05 0.65 10 0.87±0.2 +0.10 1.5±0.1 1.8 MAX. 3.0 MAX. 0.5±0.2 0.575 MAX. +0.10 0.3 –0.05 0.10 M 0.15 µPB1508GV NOTE CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation). (3) Keep the wiring length of the ground pins as short as possible. (4) Connect a bypass capacitor (e.g. 1 000 pF) to the VCC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. µPB1508GV Soldering method Soldering conditions Recommended condition symbol Infrared ray reflow Package peak temperature: 235 °C, Hour: within 30 s. (more than 210 °C), Time: 3 times, Limited days: no.* IR35-00-3 VPS Package peak temperature: 215 °C, Hour: within 40 s. (more than 200 °C), Time: 3 times, Limited days: no.* VP15-00-3 Wave soldering Soldering tub temperature: less than 260 °C, Hour: within 10 s., Time: 1 time, Limited days: no. WS60-00-1 Pin part heating Pin area temperature: less than 300 °C, Hour: within 3 s./pin, Limited days: no.* * It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 11 µPB1508GV ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5