DATA SHEET MOS INTEGRATED CIRCUIT µ PD16341 96-BIT AC-PDP DRIVER • DESCRIPTION The µ PD16341 is high withstand voltage CMOS driver designed for flat display panels such as PDPs, VFDs and ELs. It consists of a 96-bit bi-directional shift register, 96-bit latch and high withstand voltage CMOS driver. The logic block is designed to operate using a 5-V power supply interface enabling direct connection to a gate array or a microcontroller. In addition, the µ PD16341 achieves low power dissipation by employing the CMOS structure while having a high withstand voltage output (120 V, +15/−25 mA MAX.). FEATURES • 2-/3-/4-/6-ch input port switching is possible using IBS1 and IBS2 pins • Data control with transfer clock (external) and latch • High-speed data transfer (fMAX. = 40 MHz MIN. at data latch) (fMAX. = 25 MHz MIN. at cascade connection) • • High withstand output voltage: 120 V, +15/–25 mA MAX. • 5-V CMOS input interface • High withstand voltage CMOS structure • ORDERING INFORMATION Part Number Package µ PD16341 Module Remark Consult an NEC sales representative regarding the module. Since the module characteristics is based on the module specifications, there may be differences between the contents written in this document and real characteristics. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. S14076EJ2V0DS00 (2nd edition) Date Published March 2000 NS CP (K) Printed in Japan The mark • shows major revised points. © 1999, 2000 µ PD16341 1. BLOCK DIAGRAM (1) (IBS1 = H, IBS2 = H, 2-BIT INPUT, 48-BIT LENGTH SHIFT REGISTER) HZ /LBLK /HBLK VDD2 /LE A1 SR1Note S1 A1 S3 CLK CLK R,/L R,/L LE S1 S2 /L1 O1 VSS2 B1 B1 CLR S95 /CLR A2 SR2Note S2 A2 S4 CLK R,/L B2 B2 CLRS96 VDD2 S95 S96 /L96 O96 VSS2 Note SRn: 48-bit shift register Remark /xxx indicates active low signal. 2 Data Sheet S14076EJ2V0DS00 µ PD16341 1. BLOCK DIAGRAM (2) (IBS1 = H, IBS2 = L, 3-BIT INPUT, 32-BIT LENGTH SHIFT REGISTER) HZ /LBLK /HBLK VDD2 /LE A1 SR1Note S1 A1 S4 CLK CLK R,/L R,/L LE S1 S2 S3 /L1 O1 VSS2 B1 B1 CLR S94 /CLR A2 SR2Note S2 A2 S5 CLK R,/L B2 A3 B2 CLRS95 SR3Note S3 A3 S6 VDD2 CLK R,/L B3 B3 CLRS96 S94 S95 S96 /L96 O96 VSS2 Note SRn: 32-bit shift register Data Sheet S14076EJ2V0DS00 3 µ PD16341 1. BLOCK DIAGRAM (3) (IBS1 = L, IBS2 = H, 4-BIT INPUT, 24-BIT LENGTH SHIFT REGISTER) HZ /LBLK /HBLK VDD2 /LE A1 CLK R,/L B1 /CLR A2 B2 A3 B3 A4 B4 SR1Note S1 A1 S5 CLK R,/L S93 B1 CLR LE S1 S2 S3 S4 /L1 O1 SR2Note S2 A2 S6 CLK R,/L S94 B2 CLR VSS2 SR3Note S3 A3 S7 CLK R,/L B3 CLRS95 SR4Note S4 A4 S8 CLK R,/L B4 CLRS96 VDD2 S93 S94 S95 S96 /L96 O96 VSS2 Note SRn: 24-bit shift register 4 Data Sheet S14076EJ2V0DS00 µ PD16341 1. BLOCK DIAGRAM (4) (IBS1 = L, IBS2 = L, 6-BIT INPUT, 16-BIT LENGTH SHIFT REGISTER) HZ /LBLK /HBLK VDD2 /LE A1 CLK R,/L B1 /CLR A2 B2 A3 B3 A4 B4 A5 B5 A6 B6 SR1Note S1 A1 S7 CLK R,/L S91 B1 CLR SR2Note S2 A2 S8 CLK R,/L S92 B2 CLR S1 S2 S3 S4 S5 S6 LE /L1 O1 VSS2 SR3Note S3 A3 S9 CLK R,/L B3 CLRS93 SR4Note S4 A4 S10 CLK R,/L B4 CLRS94 SR5Note S5 A5 S11 CLK R,/L B5 CLRS95 SR6Note S6 A6 S12 CLK R,/L B6 CLRS96 S91 S92 S93 S94 S95 S96 VDD2 O96 /L96 VSS2 Note SRn: 16-bit shift register Data Sheet S14076EJ2V0DS00 5 µ PD16341 2. PIN FUNCTIONS Symbol Pin Name Description /LBLK Low blanking input /LBLK = L : All output = L /HBLK High blanking input /HBLK = L : All output = H /LE Latch enable input Latch executed on fall HZ Output high impedance Make all output high impedance by input H /CLR Register clear input Inputting the low level of this signal clears the entire contents of the shift register to low level. RIGHT data input/output An Note Note When R,/L = H, An : input Bn : output When R,/L = L, An : output Bn : input Bn LEFT data input/output CLK Clock input Shift executed on rise R,/L Shift control input Right shift mode when R,/L = H (In the case of 3-ch input) SR1 : A1 → S1.......S94 → B1 (Same direction for SR2 and SR3) Left shift mode when R,/L = L (In the case of 3-ch input) SR1 : B1 → S94.......S1 → A1 (Same direction for SR2 and SR3) The shift direction is the same in the case of 2-/4-/6-ch input. IBS1,IBS2 Input mode switch IBS1 IBS2 Input mode H L 3-bit input, 32-bit length shift register L L 6-bit input, 16-bit length shift register H H 2-bit input, 48-bit length shift register L H 4-bit input, 24-bit length shift register O1 to O96 High withstand voltage output 120 V VDD1 Logic power supply 5 V ± 10 % VDD2 Driver power supply 20 to 110 V VSS1 Logic ground Connect to system ground VSS2 Driver ground Connect to system ground Note When input mode is 2-/3-/4-bit, set unused input and output pins “L” level. To use for module, the back side of IC chip must be held at the VSS (GND) level. 6 Data Sheet S14076EJ2V0DS00 µ PD16341 3. TRUTH TABLE Shift Register Block Input Output Shift Register R,/L CLK H ↑ H A B Output H or L ↑ L L H or L Note1 Right shift execution Input Output Output Note2 Hold Left shift execution Input Output Hold Notes 1. The data of S91 to S93 (in the case of 3-ch input) is shifted to S94 to S96 at the rising of the clock and then output from B1 to B3, respectively. This “shift → output” operation is the same in the case of 2-/4-/6-ch input. 2. The data of S4 to S6 (in the case of 3-ch input) is shifted to S1 to S3 at the rising of the clock and then output from A1 to A3, respectively. This “shift → output” operation is the same in the case of 2-/4-/6-ch input. Latch Block /LE Output State of Latch Block (/Ln) ↓ Latch Sn data H or L Hold latch (output) data Driver Block A (B) /HBLK /LBLK HZ Output State of Driver Block x L H L All driver output : H x x L L All driver output : L x x x H All driver output : High Impedance L H H L L H H H L H Remark x : H or L, H : High level, L : Low level Data Sheet S14076EJ2V0DS00 7 µ PD16341 4. TIMING CHART (1) (IBS1 = H, IBS2 = H: 2-BIT INPUT, RIGHT SHIFT) /CLR CLK A1(B2) A2(B1) S1(S96) S2(S95) S3(S94) S4(S93) /LE Latch at falling edge /HBLK /LBLK HZ High Impedance O1(O96) High Impedance O2(O95) High Impedance O3(O94) High Impedance O4(O93) Remark 8 Values in parentheses are when R,/L = L. Data Sheet S14076EJ2V0DS00 µ PD16341 4. TIMING CHART (2) (IBS1 = H, IBS2 = L: 3-BIT INPUT, RIGHT SHIFT) /CLR CLK A1(B3) A2(B2) A3(B1) S1(S96) S2(S95) S3(S94) S4(S93) S5(S92) S6(S91) /LE Latch at falling edge /HBLK /LBLK HZ High Impedance O1(O96) High Impedance O2(O95) High Impedance O3(O94) High Impedance O4(O93) High Impedance O5(O92) High Impedance O6(O91) Remark Values in parentheses are when R,/L = L. Data Sheet S14076EJ2V0DS00 9 µ PD16341 4. TIMING CHART (3) (IBS1 = L, IBS2 = H: 4-BIT INPUT, RIGHT SHIFT) /CLR CLK A1(B4) A2(B3) A3(B2) A4(B1) S1(S96) S2(S95) S3(S94) S4(S93) S5(S92) S6(S91) /LE Latch at falling edge /HBLK /LBLK HZ High Impedance O1(O96) High Impedance O2(O95) High Impedance O3(O94) High Impedance O4(O93) High Impedance O5(O92) High Impedance O6(O91) Remark 10 Values in parentheses are when R,/L = L. Data Sheet S14076EJ2V0DS00 µ PD16341 4. TIMING CHART (4) (IBS1 = L, IBS2 = L: 6-BIT INPUT, RIGHT SHIFT) /CLR CLK A1(B6) A2(B5) A3(B4) A4(B3) A5(B2) A6(B1) S1(S96) S2(S95) S3(S94) S4(S93) S5(S92) S6(S91) S7(S90) /LE Latch at falling edge /HBLK /LBLK HZ High Impedance O1(O96) High Impedance O2(O95) High Impedance O3(O94) High Impedance O4(O93) High Impedance O5(O92) High Impedance O6(O91) High Impedance O7(O90) Remark Values in parentheses are when R,/L = L. Data Sheet S14076EJ2V0DS00 11 µ PD16341 5. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings (TA = 25 °C, VSS1 = VSS2 = 0 V) Parameter • Symbol Conditions Ratings Unit Logic Supply Voltage VDD1 –0.5 to +6.0 V Driver Supply Voltage VDD2 –0.5 to +120 V Logic Input Voltage VI –0.5 to VDD1 + 0.5 V Driver Output Current IO2 +15 / –25 mA Operating Junction Temperature TJ +125 °C Storage Temperature Tstg –65 to +150 °C Caution If the absolute maximum rating of even one of the above parameters is exceeded even momentarily, the quality of the product may be degraded. Absolute maximum ratings, therefore, specify the values exceeding which the product may be physically damaged. Be sure to use the product within the range of the absolute maximum ratings. Recommended Operating Range (TA = −40 to +85 °C, VSS1 = VSS2 = 0 V) Parameter • Symbol Conditions MIN. TYP. MAX. Unit 5.0 5.5 V Logic Supply Voltage VDD1 4.5 Driver Supply Voltage VDD2 20 110 V High-Level Input Voltage VIH 0.7 VDD1 VDD1 V Low-Level Input Voltage VIL 0 0.2 VDD1 V Driver Output Current IOH2 –20 mA IOL2 13 mA Electrical Characteristics (TA = 25 °C, VDD1 = 5.0 V, VDD2 = 110 V, VSS1 = VSS2 = 0 V) Parameter Symbol Conditions High-Level Output Voltage VOH1 Logic, IOH1 = –1.0 mA Low-Level Output Voltage VOL1 Logic, IOL1 = 1.0 mA • High-Level Output Voltage VOH21 O1 to O96 • Low-Level Output Voltage TYP. MAX. Unit 0.9 VDD1 VDD1 V 0 0.1 VDD1 V IOH2 = –0.4 mA 109 VOH22 IOH2 = –4.3 mA 105 VOL21 IOL2 = 1.6 mA 1.0 V VOL22 IOL2 = 13 mA 10 V ±1.0 µA Input Leakage Current IIL High-Level Intput Voltage VIH Low-Level Input Voltage VIL Static Current Dissipation IDD1 IDD2 12 MIN. V1 = VDD1 or VSS1 V V 0.7 VDD1 V 0.2 VDD1 V Logic, TA = –40 to +85 °C 500 µA Logic, TA = 25 °C 300 µA Driver, TA = –40 to +85 °C 1000 µA Driver, TA = 25 °C 100 µA Data Sheet S14076EJ2V0DS00 µ PD16341 Switching Characteristics (TA = +25 °C, VDD1 = 5.0 V, VDD2 = 110 V, VSS1 = VSS2 = 0 V, Logic CL = 15 pF, Driver CL = 50 pF, tr = tf = 6.0 ns) Parameter Propagation Delay Time Symbol tPHL1 Conditions MIN. TYP. CLK ↑ → A/B tPLH1 tPHL2 /LE ↓ → O1 to O96 tPLH2 tPHL3 /HBLK → O1 to O96 tPLH3 tPHL4 /LBLK → O1 to O96 tPLH4 • Rise Time • Fall Time Maximum Clock Frequency MAX. Unit 34 ns 34 ns 180 ns 180 ns 165 ns 165 ns 160 ns 160 ns tPHZ HZ → O1 to O96 300 ns tPZH RL = 10 kΩ 180 ns tPLZ 300 ns tPZL 180 ns 360 ns tTLH O1 to O96 tTLZ O1 to O96 3 µs tTZH RL = 10 kΩ 360 ns tTHL O1 to O96 450 ns tTHZ O1 to O96 3 µs tTZL RL = 10 kΩ 450 ns fMAX. When data is read, duty = 50 % 40 MHz Cascade connection : 25 MHz Duty = 50 % Input Capacitance CI 15 pF Timing Requirement (TA = –40 to +85 °C, VDD1 = 4.5 to 5.5 V, VSS1 = VSS2 = 0 V, tr = tf = 6.0 ns) Parameter Clock Pulse Width Symbol Conditions PWCLK(H) MIN. TYP. MAX. Unit 12 ns 12 ns PWCLK(L) • Latch Enable Pulse Width PW/LE Blank Pulse Width PW/BLK /HBLK, /LBLK 600 ns HZ Pulse Width PWHZ RL = 10 kΩ 3.3 µs /CLR Pulse Width PW/CLR 12 ns Data Setup Time tSETUP 4 ns Data Hold Time tHOLD 6 ns Latch Enable Time t/LE1 12 ns t/LE2 12 ns t/CLR 6 ns /CLR Timing Data Sheet S14076EJ2V0DS00 13 µ PD16341 6. Switching Characteristics Waveform (1/3) 1/fMAX. PWCLK (H) PWCLK (L) VDD1 50 % CLK 50 % 50 % VSS1 tHOLD tSETUP VDD1 An/Bn (Input) 50 % 50 % VSS1 tPHL1 tPLH1 VOH1 Bn /An (Output) 50 % 50 % VOL1 VDD1 /LE 50 % 50 % VSS1 PW/LE(H) PW/LE(L) t/LE1 t/LE2 VDD1 CLK 50 % 50 % VSS1 tPHL2 tTHL VOH2 90 % On 10 % VOL2 tPLH2 VOH2 90 % On 10 % tTLH 14 Data Sheet S14076EJ2V0DS00 VOL2 µ PD16341 6. Switching Characteristics Waveform (2/3) PW/BLK VDD1 /LBLK 50 % 50 % VSS1 tPLH4 tPHL4 VOH2 90 % On 10 % VOL2 PW/BLK VDD1 /HBLK 50 % 50 % VSS1 tPHL3 tPLH3 VOH2 90 % On 10 % VOL2 PW/CLR VDD1 /CLR 50 % 50 % VSS1 t/CLR VOH2 CLK 50 % VOL2 Rising edge of clock when data is valid. Data Sheet S14076EJ2V0DS00 15 µ PD16341 6. Switching Characteristics Waveform (3/3) PWHZ VDD1 HZ 50 % 50 % VSS1 tPLZ tPZL tTLZ tTZL VO (H) 90 % 90 % On 10 % 10 % VOL2 VOH2 90 % 90 % On 10 % tPHZ 16 tTHZ Data Sheet S14076EJ2V0DS00 10 % tPZH tTZH VO (L) µ PD16341 [MEMO] Data Sheet S14076EJ2V0DS00 17 µ PD16341 [MEMO] 18 Data Sheet S14076EJ2V0DS00 µ PD16341 NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. Data Sheet S14076EJ2V0DS00 19 µ PD16341 Reference Documents NEC Semiconductor Device Reliability/Quality Control System(C10983E) Quality Grades to NEC’s Semiconductor Devices(C11531E) • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8