DATA SHEET MOS INTEGRATED CIRCUIT µPD16326 32-BIT FLUORESCENT DISPLAY TUBE DRIVER The µPD16326 is a fluorescent display tube driver using a high breakdown voltage CMOS process. It consists of 32-bit bidirectional shift registers, a latch circuit, and a high breakdown voltage CMOS driver block. The logic block operates on a 5 V power supply designed to be connected directly to a microcontroller (CMOS level input). The driver block has a 130 V and 20 mA high breakdown voltage output, and both the logic block and driver block consist of CMOS, allowing operation with low power consumption. FEATURES • High breakdown voltage CMOS structure • High breakdown voltage, high current output (130 V, 20 mA) • 32-bit bidirectional shift registers on chip • Data control by transfer clock (external) and latch • High-speed data transfer capability (fmax = 8.0 MHz MIN) • Wide operating temperature range (TA = –40 to 85 ˚C) ORDERING INFORMATION Part Number µPD16326GB-3B4 Package 44-pin plastic QFP (4-direction leads) The information contained in this document is being issued in advance of the production cycle for the device. The parameters for the device may change before final production or NEC Corporation, at its own discretion, may withdraw the device prior to its production. Document No. S10948EJ1V0DS00 (1st edition) Date Published July 1996 P Printed in Japan © 1996 µPD16326 BLOCK DIAGRAM CLK 32-bit bidirectional shift registers A B R/L STB 32-bit latch BLK O2 O1 O32 O1 O2 O3 O4 O5 O6 O7 O8 O9 O10 O11 44 43 42 41 40 39 38 37 36 35 34 PIN CONFIGURATION (Top View) VDD2 1 33 O12 VSS2 2 32 O13 O21 23 O22 22 24 11 O23 10 21 B VSS2 20 O20 O24 25 O25 9 19 VDD1 18 O19 O26 O18 26 O27 27 8 17 7 R/L 16 VSS1 O28 O17 O29 O16 28 15 29 6 14 5 CLK O30 STB O31 O15 13 O14 30 O32 31 4 12 3 VDD2 A BLK Remark Be sure to enter the power to VDD1, logic signal, and VDD2, in that order, and turn off the power in the reverse order. 2 µPD16326 PIN DESCRIPTION Pin Symbol Pin Name Pin Number Description STB Latch strobe input 5 H: Data through L: Data retention A RIGHT data input 3 When R/L = H, A: Input B: Output B LEFT data input 10 When R/L = L, A: Output B: Input CLK Clock input 6 Shift is executed on a fall. BLK Blanking input 4 H: O1 to O32: ALL “L” R/L Shift control input 8 H: Right shift mode A → O1 ... O32 → B L: Left shift mode B → O32 ... O1 → A O1 to O32 High breakdown voltage output VDD1 Logic block power supply 9 5 V ±10 % VDD2 Driver block power supply 1, 12 30 to 125 V VSS1 Logic ground 5 Connected to system GND VSS2 Driver ground 2, 11 Connected to system GND 13 - 44 130 V, 20 mA MAX TRUTH TABLE 1 (SHIFT REGISTER BLOCK) Input Output Shift Register R/L CLK H ↓ H H or L L ↓ L H or L A Input OutputNote 2 B OutputNote 1 Execution of right shift Output Retained Input Execution of left shift Output Retained Notes 1. On a clock fall, the data items of S31 are shifted to S32, and output from B. 2. On a clock fall, the data items of S2 are shifted to S1, and output from A. TRUTH TABLE 2 (LATCH BLOCK) STB Operation L Retains Sn data immediately before STB becomes L. H Outputs shift register data. TRUTH TABLE 3 (DRIVER BLOCK) LnNote STB BLK × × H L (all driver outputs: L) × L L Outputs Sn data on STB fall. L H L L H H L H Driver output state Note Ln: Latch output Remark × = H or L, H = high level, L = Low level 3 µPD16326 ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C, VSS = 0 V) Item Symbol Rating Unit Logic block supply voltage VDD1 –0.5 to +7.0 V Driver block supply voltage VDD2 –0.5 to +130 V Logic block input voltage VI –0.5 to VDD1 + 0.5 V Driver block output current IO 20 mA Package allowable power dissipation PD 800Note mW Operating ambient temperature TA –40 to +85 ˚C Storage temperature Tstg –65 to +150 ˚C Note When TA ≥ 25 °C, load should be alleviated at a rate of –8.0 mW/°C. (Tj = 125 °C (MAX.)) RECOMMENDED OPERATING RANGE (TA = –40 to +85 ˚C, VSS = 0 V) Item Symbol MIN. TYP. MAX. Unit Logic block supply voltage VDD1 4.5 5.0 5.5 V Driver block supply voltage VDD2 30 125 V Input voltage high VIH 0.7·VDD1 VDD1 V Input voltage low VIL 0 0.2·VDD1 V Driver output current IOH –10 mA IOL +2.5 mA ELECTRICAL SPECIFICATIONS (TA = 25 ˚C, VDD1 = 4.5 to 5.5 V, VDD2 = 125 V, VSS = 0 V) Item Condition MIN. TYP. MAX. Unit 0.9·VDD1 VDD1 V 0 0.1·VDD1 V Output voltage high VOH1 Logic, IOH = –1.0 mA Output voltage low VOL1 Logic, IOL = 1.0 mA Output voltage high VOH21 O1 to O40, IOH = –0.5 mA 121 V VOH22 O1 to O40, IOH = –5.0 mA 115 V VOL2 O1 to O40, IOL = 0.5 mA 2.5 V VI = VDD1 or VSS1 ±1.0 µA Output voltage low 4 Symbol Input leakage current IIL Input voltage high VIH 0.7·VDD1 VDD1 V Input voltage low VIL 0 0.2·VDD1 V Static consumption current IDD1 Logic, TA = –40 to +85 ˚C 1 000 µA IDD1 Logic, TA = 25 ˚C 100 µA IDD2 Driver, TA = –40 to +85 ˚C 1 000 µA IDD2 Driver, TA = 25 ˚C 100 µA µPD16326 SWITCHING CHARACTERISTICS (TA = 25 ˚C, VDD1 = 5.0 V, VDD2 = 125 V, VSS = 0 V, logic CL = 15 pF, driver CL = 50 pF, driver RL = 220 kΩ, tr = tf = 10 ns) Item Transmission delay time Symbol tPHL1 Condition MIN. TYP. CLK ↓→ A/B tPLH1 tPHL2 BLK ↓→ O1 to O32 tPLH2 MAX. Unit 110 ns 110 ns 300 ns 300 ns Fall time tTHL O1 to O32 600 ns Rise time tTLH O1 to O32 500 ns Maximum clock frequency fmax With cascading, Duty = 50 % Input capacitance 8.0 MHz 15 CI pF TIMING REQUIREMENTS (TA = – 40 to +85 ˚C, VDD1 = 4.5 to 5.5 V, VSS = 0 V, tr = tf = 10 ns) Item Symbol Condition MIN. TYP. MAX. Unit Clock pulse width PWCLK 40 ns Strobe pulse width PWSTB 80 ns Blank pulse width PWBLK 1 500 ns Data setup time tsetup 15 ns Data hold time thold 30 ns Clock-strobe time tCLK-STB CLK ↓→ STB ↑ 45 ns Strobe-clock time tSTB-CLK STB ↓→ CLK ↓ 45 ns Strobe-blank time tSTB-BLK STB ↑→ BLK ↓ 80 ns 5 µPD16326 SWITCHING CHARACTERISTIC WAVEFORM (R/L = H) 1/fmax. PWCLK (L) PWCLK (H) VDD1 CLK 50 % 50 % 50 % VSS tsetup thold VDD1 A/B (Input) 50 % 50 % VSS tPHL1 tPLH 1 VOH1 B/A (Output) 50 % 50 % VOL1 tCLK-STB PWSTB tSTB-CLK VDD1 50 % STB 50 % VSS tSTB-BLK PWBLK VDD1 BLK 50 % 50 % VSS tPLH2 tTLH 90 % tPHL2 tTHL 90 % VOH2 On 10 % 6 10 % VOL2 µPD16326 PACKAGE DRAWINGS 44 PIN PLASTIC QFP (Unit: mm) A B 23 22 33 34 detail of lead end C D S R Q 12 11 44 1 F G J H I M K M P N L NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 13.6±0.4 0.535 +0.017 –0.016 B 10.0±0.2 0.394 +0.008 –0.009 C 10.0±0.2 0.394 +0.008 –0.009 D 13.6±0.4 0.535 +0.017 –0.016 F 1.0 0.039 G 1.0 0.039 H 0.35±0.10 0.014 +0.004 –0.005 I 0.15 0.006 J 0.8 (T.P.) 0.031 (T.P) K 1.8±0.2 0.071 +0.008 –0.009 L 0.8±0.2 0.031 +0.009 –0.008 M 0.15 +0.10 –0.05 0.006 +0.004 –0.003 N P Q R S 0.10 2.7 0.1±0.1 5°±5° 3.0 MAX. 0.004 0.106 0.004±0.004 5°±5° 0.119 MAX. P44GB-80-3B4-3 7 µPD16326 RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the conditions recommended below. For soldering methods and conditions other than those recommended, please contact your NEC sales representative. SURFACE MOUNT TYPE For details of recommended soldering conditions, refer to the information document “Semiconductor Device Mounting Technology Manual” (C10535E). µPD16326GB-3B4 Soldering Method Soldering Conditions Recommended Condition Symbol Infrared reflow Package peak temperature: 235 ˚C, Duration: 30 sec. MAX. (at 210 ˚C or above), Number of times: Twice, Time limit: None Note IR35-00-2 VPS Package peak temperature: 215 ˚C, Duration: 40 sec. MAX. (at 200 ˚C or above), Number of times: Twice, Time limit: None Note VP15-00-2 Wave soldering Solder bath temperature: 260 ˚C MAX., Duration: 10 sec. MAX., Number of times: Once, Time limit: NoneNote WS60-00-1 Pin partial heating Pin partial temperature: 300 ˚C MAX., Duration: 10 sec. MAX., Time limit: NoneNote Note For the storage period after dry-pack decapsulation, storage conditions are max. 25 ˚C, 65 % RH. Caution Use of more than one soldering method should be avoided (except in the case of pin partial heating). REFERENCES NEC Semiconductor Device Reliability/Quality Control System (IEI-1212) Quality Grade on NEC Semiconductor Devices (IEI-1209) 8 µPD16326 [MEMO] 9 µPD16326 [MEMO] 10 µPD16326 [MEMO] 11 µPD16326 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 2