E2E0059-19-81 ¡ Semiconductor MSM63184A ¡ Semiconductor This version:MSM63184A Aug. 1999 4-Bit Microcontroller with Built-in 640-Dot Matrix LCD Drivers, Operating at 0.9 V (Min.) GENERAL DESCRIPTION The MSM63184A is an enhanced version of the MSM63184B in which supply currents have been improved. The MSM63184A is a CMOS 4-bit microcontroller with built-in 640-dot matrix LCD drivers and operates at 0.9 V (min.). The MSM63184A is suitable for applications such as games, toys, watches, etc. which are provided with an LCD display. The MSM63184A is an M6318x series mask ROM-version product of OLMS-63K family, which employs Oki's original CPU core nX-4/250. The MSM63P180 is the one-time-programmable ROM version of MSM63188A, having one-time PROM (OTP) as internal program memory. The MSM63P180 is used to evaluate the software development. FEATURES • Rich instruction set 439 instructions Transfer, rotate, increment/decrement, arithmetic operations, comparison, logic operations, mask operations, bit operations, ROM table reference, external memory transfer, stack operations, flag operations, branch, conditional branch, call/return, control. • Rich selection of addressing modes Indirect addressing of four data memory types, with current bank register, extra bank register, HL register and XY register. Data memory bank internal direct addressing mode. • Processing speed Two clocks per machine cycle, with most instructions executed in one machine cycle. Minimum instruction execution time : 61 ms (@ 32.768 kHz system clock) 1 ms (@ 2 MHz system clock) • Clock generation circuit Low-speed clock High-speed clock : 32.768 kHz crystal oscillator : 2 MHz (Max.) RC or ceramic oscillator select • Program memory space 8K words Basic instruction length is 16 bits/1 word • Data memory space 640 nibbles • External data memory space Expandable beyond 64 Kbytes by using I/O port. 1/29 ¡ Semiconductor • Stack level Call stack level Register stack level MSM63184A : 8 levels : 16 levels • I/O ports Input ports: Selectable as input with pull-up resistance/input with pull-down resistance/ high-impedance input Output ports: Selectable as P-channel open drain output/N-channel open drain output/ CMOS output/high-impedance output Input-output ports: Selectable as input with pull-up resistance/input with pull-down resistance/high-impedance input Selectable as P-channel open drain output/N-channel open drain output/CMOS output/high-impedance output Can be interfaced with external peripherals that use a different power supply than this device uses. Number of ports: Input port : 2 ports ¥ 4 bits Output port : 4 ports ¥ 4 bits Input-output port : 5 ports ¥ 4 bits • Buzzer function Buzzer output Buzzer output modes : 0.946 to 5.461 kHz (adjustable in 15 steps) : Intermittent sound 1, 2; simple sound; continuous sound • LCD driver Number of segments : 640 Max. (40 SEG ¥ 16 COM) 1/1 to 1/16 duty 1/4 or 1/5 bias (regulator built-in) Selectable as all-on mode/all-off mode/power down mode/normal display mode Adjustable contrast • Reset function Reset through RESET pin Power-on reset Reset by low-speed oscillation halt • Battery check Low-voltage supply check Criterion voltage : Can be selected as 1.05 ±0.10 V, 1.30 ±0.15 V, 2.20 ±0.20 V or 2.80 ±0.30 V • Power supply backup Backup circuit (voltage multiplier) enables operation at 0.9 V minimum 2/29 ¡ Semiconductor MSM63184A • Timers and counter Watchdog timer ¥ 1 Overflows in 2 sec. 100 Hz timer ¥ 1 Measurable in steps of 1/100 sec. 15-bit time base counter ¥ 1 1, 2, 4, 8, 16, 32, 64, and 128 Hz signals can be read • Shift register Shift clock Data length • Interrupt sources External interrupt Internal interrupt • Operating voltage When backup used When backup not used • Package: 128-pin plastic QFP (QFP128-P-1420-0.50-K) Chip : 1x or 1/2x system clock; external clock : 8 bits : 3 : 7 (watchdog timer interrupt is a nonmaskable interrupt) : 0.9 to 2.7 V (Low-speed clock operating) 1.2 to 2.7 V (Operating frequency: 300 to 500 kHz) 1.5 to 2.7 V (Operating frequency: 200 kHz to 1 MHz) : 1.8 to 5.5 V (Operating frequency: 300 to 500 kHz) 2.2 to 5.5 V (Operating frequency: 300 kHz to 1 MHz) 2.7 to 5.5 V (Operating frequency: 200 kHz to 2 MHz) : (Product name: MSM63184A-xxxGS-K) : (Product name: MSM63184A-xxx) xxx indicates a code number. Differences Between the MSM63184B and the MSM63184A The MSM63184A has the following improved characteristics. • Supply currents (IDD1, IDD2, IDD3) in DC characteristics • The VDDL voltage during a halt of high-speed clock oscillation 3/29 ¡ Semiconductor MSM63184A BLOCK DIAGRAM An asterisk (*) indicates the port secondary function. indicates that the power is supplied to the circuits corresponding to the signal names inside from VDDI (power supply for interface). nX-4/250 TIMING CONTROL CBR H L RA EBR X Y A SP C ALU RSP G MIE INSTRUCTION DECODER STACK CAL: 8-level REG: 16-level PC Z ROM 8KW BUS CONTROL D0-7* EXTMEM A0-15* RD* WR* IR RAM 640N INT 1 SFT INT184 TST1 TST2 RST INT 4 BUZZER TBC TST DATA BUS RESET OSC INT 1 INT 1 INPUT PORT CB1 OUTPUT PORT P6.0-P6.3 P8.0-P8.3 BACKUP P9.0-P9.3 I/O PORT INT 2 VDD2 PA.0-PA.3 PD.0-PD.3 VDD3 PE.0-PE.3 BIAS VDD5 C1 VDDL P5.0-P5.3 P7.0-P7.3 WDT CB2 C2 P1.0-P1.3 P4.0-P4.3 VDD1 VDD4 P0.0-P0.3 100HzTC VDDH VDD BD BDB INT 1 BLD XT0 XT1 OSC0 OSC1 TBCCLK* HSCLK* SIN* SOUT* SCLK* LCLK* FRAME* LCD & DSPR COM1-16 SEG0-39 VDDI VSS 4/29 ¡ Semiconductor MSM63184A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 (NC) P6.0 P6.1 P6.2 P6.3 P1.0 P1.1 P1.2 P1.3 PA.0 PA.1 PA.2 PA.3 P9.0 P9.1 P9.2 P9.3 P8.0 P8.1 P8.2 P8.3 PE.0 PE.1 PE.2 PE.3 PD.0 PD.1 PD.2 PD.3 P0.0 P0.1 P0.2 P0.3 P4.0 P4.1 P4.2 P4.3 P5.0 (NC) VSS VDD1 VDD2 VDD3 VDD4 VDD5 C1 C2 VDDH CB1 CB2 (NC) VDD VDDL OSC1 OSC0 RESET XT1 XT0 TST2 TST1 P5.3 P5.2 P5.1 (NC) 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 SEG37 SEG36 SEG35 SEG34 SEG33 SEG32 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 SEG0 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 SEG38 SEG39 COM16 COM15 COM14 COM13 COM12 COM11 COM10 COM9 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 VDDI BDB BD P7.0 P7.1 P7.2 P7.3 (NC) PIN CONFIGURATION (TOP VIEW) 128-Pin Plastic QFP Note: Pins marked as (NC) are no-connection pins which are left open. 5/29 ¡ Semiconductor MSM63184A PAD CONFIGURATION 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 P6.0 P6.1 P6.2 P6.3 P1.0 P1.1 P1.2 P1.3 PA.0 PA.1 PA.2 PA.3 P9.0 P9.1 P9.2 P9.3 P8.0 P8.1 P8.2 P8.3 PE.0 PE.1 PE.2 PE.3 PD.0 PD.1 PD.2 PD.3 P0.0 P0.1 P0.2 P0.3 P4.0 P4.1 P4.2 P4.3 P5.0 Pad Layout 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 P5.1 P5.2 P5.3 TST1 TST2 XT0 XT1 RESET OSC0 OSC1 VDDL VDD CB2 CB1 VDDH C2 C1 VDD5 VDD4 VDD3 VDD2 VDD1 VSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 Y SEG36 SEG35 SEG34 SEG33 SEG32 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 SEG0 P7.3 P7.2 P7.1 P7.0 BD BDB VDDI COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 SEG39 SEG38 SEG37 Chip Size Chip Thickness Coordinate Origin Pad Hole Size Pad Size Minimum Pad Pitch : : : : : : X 5.35 mm ¥ 4.66 mm 350 mm (typ.) Chip center 100 mm ¥ 100 mm 110 mm ¥ 110 mm 140 mm Note: The chip substrate voltage is VSS. 6/29 ¡ Semiconductor MSM63184A Pad Coordinates Pad No. Pad Pad Pad X (µm) Y (µm) Pad No. X (µm) Y (µm) Pad No. X (µm) Y (µm) Name Name Name 1 SEG36 –2520 –2135 42 VDD4 2530 –1065 83 P9.2 –560 2135 2 SEG35 –2380 –2135 43 VDD5 2530 –915 84 P9.1 –700 2135 3 SEG34 –2240 –2135 44 C1 2530 –765 85 P9.0 –840 2135 4 SEG33 –2100 –2135 45 C2 2530 –615 86 PA.3 –980 2135 5 SEG32 –1960 –2135 46 VDDH 2530 –465 87 PA.2 –1120 2135 6 SEG31 –1820 –2135 47 CB1 2530 –315 88 PA.1 –1260 2135 7 SEG30 –1680 –2135 48 CB2 2530 –165 89 PA.0 –1400 2135 8 SEG29 –1540 –2135 49 VDD 2530 –15 90 P1.3 –1540 2135 9 SEG28 –1400 –2135 50 VDDL 2530 135 91 P1.2 –1680 2135 10 SEG27 –1260 –2135 51 OSC1 2530 285 92 P1.1 –1820 2135 11 SEG26 –1120 –2135 52 OSC0 2530 435 93 P1.0 –1960 2135 12 SEG25 –980 –2135 53 RESET 2530 585 94 P6.3 –2100 2135 13 SEG24 –840 –2135 54 XT1 2530 735 95 P6.2 –2240 2135 14 SEG23 –700 –2135 55 XT0 2530 885 96 P6.1 –2380 2135 15 SEG22 –560 –2135 56 TST2 2530 1030 97 P6.0 –2520 2135 16 SEG21 –420 –2135 57 TST1 2530 1170 98 P7.3 –2530 1607 17 SEG20 –280 –2135 58 P5.3 2530 1328 99 P7.2 –2530 1467 18 SEG19 –140 –2135 59 P5.2 2530 1468 100 P7.1 –2530 1327 19 SEG18 0 –2135 60 P5.1 2530 1608 101 P7.0 –2530 1187 20 SEG17 140 –2135 61 P5.0 2520 2135 102 BD –2530 1029 21 SEG16 280 –2135 62 P4.3 2380 2135 103 BDB –2530 889 22 SEG15 420 –2135 63 P4.2 2240 2135 104 VDDI –2530 749 23 SEG14 560 –2135 64 P4.1 2100 2135 105 COM1 –2530 609 24 SEG13 700 –2135 65 P4.0 1960 2135 106 COM2 –2530 469 25 SEG12 840 –2135 66 P0.3 1820 2135 107 COM3 –2530 329 26 SEG11 980 –2135 67 P0.2 1680 2135 108 COM4 –2530 189 27 SEG10 1120 –2135 68 P0.1 1540 2135 109 COM5 –2530 49 28 SEG9 1260 –2135 69 P0.0 1400 2135 110 COM6 –2530 –91 29 SEG8 1400 –2135 70 PD.3 1260 2135 111 COM7 –2530 –231 30 SEG7 1540 –2135 71 PD.2 1120 2135 112 COM8 –2530 –371 31 SEG6 1680 –2135 72 PD.1 980 2135 113 COM9 –2530 –511 32 SEG5 1820 –2135 73 PD.0 840 2135 114 COM10 –2530 –651 33 SEG4 1960 –2135 74 PE.3 700 2135 115 COM11 –2530 –791 34 SEG3 2100 –2135 75 PE.2 560 2135 116 COM12 –2530 –931 35 SEG2 2240 –2135 76 PE.1 420 2135 117 COM13 –2530 –1071 36 SEG1 2380 –2135 77 PE.0 280 2135 118 COM14 –2530 –1211 37 SEG0 2520 –2135 78 P8.3 140 2135 119 COM15 –2530 –1351 38 VSS 2530 –1665 79 P8.2 0 2135 120 COM16 –2530 –1491 39 VDD1 2530 –1515 80 P8.1 –140 2135 121 SEG39 –2530 –1631 40 VDD2 2530 –1365 81 P8.0 –280 2135 122 SEG38 –2530 –1771 41 VDD3 2530 –1215 82 P9.3 –420 2135 123 SEG37 –2530 –1970 7/29 ¡ Semiconductor MSM63184A PIN DESCRIPTIONS The basic functions of each pin of the MSM63184A are described in Table 1. A symbol with a slash (/) denotes a pin that has a secondary function. Refer to Table 2 for secondary functions. For type, "—" denotes a power supply pin, "I" an input pin, "O" an output pin, and "I/O" an inputoutput pin. Table 1 Pin Descriptions (Basic Functions) Function Symbol Power Supply Pin Type VDD 52 — Positive power supply VSS 40 — Negative power supply Description VDD1 41 Power supply pins for LCD bias (internally generated). VDD2 42 Capacitors (0.1 mF) should be connected between these pins and VDD3 43 VDD4 44 VDD5 45 C1 C2 — VSS. 46 — Capacitor connection pins for LCD bias generation. 47 — A capacitor (0.1 mF) should be connected between C1 and C2. VDDI 110 — VDDL 53 — VDDH 48 — CB1 49 — Pins to connect a capacitor for voltage multiplier. CB2 50 — A capacitor (1.0 mF) should be connected between CB1 and CB2. XT0 58 I XT1 57 O and CG (5 to 25 pF) should be connected between XT0 and VSS. OSC0 55 I High-speed clock oscillation pins. OSC1 54 O oscillation resistor (ROS) should be connected to these pins. TST1 60 I Input pins for testing. TST2 59 I Positive power supply pin for external interface (power supply for input, output, and input-output ports) Positive power supply pin for internal logic (internally generated). A capacitor (0.1 mF) should be connected between this pin and VSS. Voltage multiplier pin for power supply backup (internally generated) A capacitor (1.0 mF) should be connected between this pin and VSS. Low-speed clock oscillation pins. A 32.768 kHz crystal should be connected between XT0 and XT1, Oscillation A ceramic resonator and capacitors (CL0, CL1) or external A pull-down resistor is internally connected to these pins. Test The user cannot use these pins. Reset input pin. Setting this pin to "H" level puts this device into a reset state. Reset RESET 56 I Then, setting this pin to "L" level starts executing an instruction from address 0000H. A pull-down resistor is internally connected to this pin. Buzzer BD 108 O Buzzer output pin (non-inverted output) BDB 109 O Buzzer output pin (inverted output) 8/29 ¡ Semiconductor MSM63184A Table 1 Pin Descriptions (Basic Functions) (continued) Function Port Symbol Pin P0.0/INT5 73 P0.1/INT5 72 P0.2/INT5 71 P0.3/INT5 70 P1.0/INT5 97 P1.1/INT5 96 P1.2/INT5 95 P1.3/INT5 94 P4.0/A0 69 P4.1/A1 68 P4.2/A2 67 P4.3/A3 66 P5.0/A4 65 P5.1/A5 63 P5.2/A6 62 P5.3/A7 61 P6.0/A8 101 P6.1/A9 100 P6.2/A10 99 P6.3/A11 98 P7.0/A12 107 P7.1/A13 106 P7.2/A14 105 P7.3/A15 104 Type Description 4-bit input ports. I Pull-up resistor input, pull-down resistor input, or high-impedance input is selectable for each bit. I 4-bit output ports. O P-channel open drain output, N-channel open drain output, CMOS output, or high-impedance output is selectable for each bit. O O O 9/29 ¡ Semiconductor MSM63184A Table 1 Pin Descriptions (Basic Functions) (continued) Function Port Symbol Pin P8.0/RD 85 P8.1/WR 84 P8.2 83 or high-impedance input is selectable for each bit. P8.3/INT4 82 In output mode, P-channel open drain output, N-channel open P9.0/D0 89 drain output, CMOS output, or high-impedance output is P9.1/D1 88 P9.2/D2 87 P9.3/D3 86 PA.0/D4 93 PA.1/D5 92 PA.2/D6 91 PA.3/D7 90 PD.0/FRAME 77 PD.1/LCLK 76 PD.2/TBCCLK 75 PD.3/HSCLK 74 PE.0/SIN 81 PE.1/SOUT 80 PE.2/SCLK 79 PE.3/INT2 78 Type Description 4-bit input-output ports. I/O In input mode, pull-up resistor input, pull-down resistor input, selectable for each bit. I/O I/O I/O I/O 10/29 ¡ Semiconductor MSM63184A Table 1 Pin Descriptions (Basic Functions) (continued) Function LCD Symbol Pin COM1 111 COM2 112 COM3 113 COM4 114 COM5 115 COM6 116 COM7 117 COM8 118 COM9 119 COM10 120 COM11 121 COM12 122 COM13 123 COM14 124 COM15 125 COM16 126 SEG0 38 SEG1 37 SEG2 36 SEG3 35 SEG4 34 SEG5 33 SEG6 32 SEG7 31 SEG8 30 SEG9 29 SEG10 28 SEG11 27 SEG12 26 SEG13 25 SEG14 24 SEG15 23 SEG16 22 SEG17 21 SEG18 20 SEG19 19 SEG20 18 SEG21 17 SEG22 16 SEG23 15 SEG24 14 Type Description LCD common signal output pins O LCD segment signal output pins O 11/29 ¡ Semiconductor MSM63184A Table 1 Pin Descriptions (Basic Functions) (continued) Function LCD Symbol Pin SEG25 13 SEG26 12 SEG27 11 SEG28 10 SEG29 9 SEG30 8 SEG31 7 SEG32 6 SEG33 5 SEG34 4 SEG35 3 SEG36 2 SEG37 1 SEG38 128 SEG39 127 Type Description LCD segment signal output pins O 12/29 ¡ Semiconductor MSM63184A Table 2 shows the secondary functions of each pin of the MSM63184A. Table 2 Pin Descriptions (Secondary Functions) Function Symbol Pin Type PE.3/INT2 78 I P8.3/INT4 82 I Description External 2 interrupt input pins. The change of input signal level causes an interrupt to occur. External 4 interrupt input pins. The change of input signal level causes an interrupt to occur. P0.0/INT5 73 External 5 interrupt input pins. External P0.1/INT5 72 The change of input signal level causes an interrupt to occur. Interrupt P0.2/INT5 71 The Port 0 Interrupt Enable register (P0IE) and Port 1 Interrupt P0.3/INT5 70 P1.0/INT5 97 P1.1/INT5 96 P1.2/INT5 95 P1.3/INT5 94 PD.0/FRAME 77 O Frame output pin for LCD driver expansion Expansion PD.1/LCLK 76 O Clock output pin for LCD driver expansion Oscillation PD.2/TBCCLK 75 O Low-speed oscillation clock output pin Output PD.3/HSCLK 74 O High-speed oscillation clock output pin LCD Enable register (P1IE) enable or disable an interrupt for each bit. I External Shift Register PE.0/SIN 81 I Shift register receive data input pin PE.1/SOUT 80 O Shift register transmit data output pin PE.2/SCLK 79 O Shift register clock input-output pin. Clock output when this device is used as a master processor. Clock input when this device is used as a slave processor. 13/29 ¡ Semiconductor MSM63184A Table 2 Pin Descriptions (Secondary Functions) (continued) Function External Memory Symbol Pin P4.0/A0 69 P4.1/A1 68 P4.2/A2 67 P4.3/A3 66 P5.0/A4 65 P5.1/A5 63 P5.2/A6 62 P5.3/A7 61 P6.0/A8 101 P6.1/A9 100 P6.2/A10 99 P6.3/A11 98 P7.0/A12 107 P7.1/A13 106 P7.2/A14 105 P7.3/A15 104 P9.0/D0 89 P9.1/D1 88 P9.2/D2 87 Type Description Address output bus for external memory O Data bus for external memory P9.3/D3 86 PA.0/D4 93 PA.1/D5 92 PA.2/D6 91 PA.3/D7 90 P8.0/RD 85 O Read signal output pin for external memory (negative logic) P8.1/WR 84 O Write signal output pin for external memory (negative logic) I/O 14/29 ¡ Semiconductor MSM63184A ABSOLUTE MAXIMUM RATINGS (VSS = 0 V) Parameter Symbol Condition Rating Unit Power Supply Voltage 1 VDD1 Ta = 25°C –0.3 to +1.6 V Power Supply Voltage 2 VDD2 Ta = 25°C –0.3 to +2.9 V Power Supply Voltage 3 VDD3 Ta = 25°C –0.3 to +4.2 V Power Supply Voltage 4 VDD4 Ta = 25°C –0.3 to +5.5 V Power Supply Voltage 5 VDD5 Ta = 25°C –0.3 to +6.8 V Power Supply Voltage 6 VDD Ta = 25°C –0.3 to +6.0 V Power Supply Voltage 7 VDDI Ta = 25°C –0.3 to +6.0 V Power Supply Voltage 8 VDDH Ta = 25°C –0.3 to +6.0 V Power Supply Voltage 9 VDDL Ta = 25°C –0.3 to +6.0 V Input Voltage 1 VIN1 VDD Input, Ta = 25°C –0.3 to VDD + 0.3 V Input Voltage 2 VIN2 VDDI Input, Ta = 25°C –0.3 to VDDI + 0.3 V Output Voltage 1 VOUT1 VDD1 Output, Ta = 25°C –0.3 to VDD1 + 0.3 V Output Voltage 2 VOUT2 VDD2 Output, Ta = 25°C –0.3 to VDD2 + 0.3 V Output Voltage 3 VOUT3 VDD3 Output, Ta = 25°C –0.3 to VDD3 + 0.3 V Output Voltage 4 VOUT4 VDD4 Output, Ta = 25°C –0.3 to VDD4 + 0.3 V Output Voltage 5 VOUT5 VDD5 Output, Ta = 25°C –0.3 to VDD5 + 0.3 V Output Voltage 6 VOUT6 VDD Output, Ta = 25°C –0.3 to VDD + 0.3 V Output Voltage 7 VOUT7 VDDI Output, Ta = 25°C –0.3 to VDDI + 0.3 V Output Voltage 8 VOUT8 VDDH Output, Ta = 25°C –0.3 to VDDH + 0.3 V Storage Temperature TSTG — –55 to +150 °C 15/29 ¡ Semiconductor MSM63184A RECOMMENDED OPERATING CONDITIONS • When backup is used (VSS = 0 V) Parameter Operating Temperature Operating Voltage Crystal Oscillation Frequency Ceramic Oscillation Frequency External RC Oscillator Resistance Symbol Condition Range Unit Top — –20 to +70 °C VDD — 0.9 to 2.7 V VDDI — 0.9 to 5.5 V kHz fXT fCM — 30 to 35 VDD = 1.2 to 2.7 V 300k to 500k VDD = 1.5 to 2.7 V 200k to 1M Hz VDD = 1.2 to 2.7 V 100 to 300 VDD = 1.5 to 2.7 V 50 to 300 Symbol Condition Range Unit ROS kW • When backup is not used (VSS = 0 V) Parameter Operating Temperature Operating Voltage Crystal Oscillation Frequency Ceramic Oscillation Frequency External RC Oscillator Resistance Top — –20 to +70 °C VDD — 1.8 to 5.5 V VDDI — 1.8 to 5.5 V fXT — 30 to 35 kHz VDD = 1.8 to 5.5 V 300k to 500k VDD = 2.2 to 5.5 V 300k to 1M VDD = 2.7 to 5.5 V 200k to 2M fCM ROS VDD = 1.8 to 5.5 V 100 to 300 VDD = 2.2 to 5.5 V 50 to 300 VDD = 2.7 to 5.5 V 30 to 300 Hz kW 16/29 ¡ Semiconductor MSM63184A ELECTRICAL CHARACTERISTICS DC Characteristics Parameter VDD2 Voltage VDD2 Voltage Temperature Deviation VDD1 Voltage VDD3 Voltage (VDD = VDDI = 0.9 to 5.5 V, VSS = 0 V, Ta = –20 to +70°C unless otherwise specified) MeaMin. Typ. Max. Unit suring Symbol Condition Circuit 1/5 bias, 1/4 bias VDD2 1.7 1.8 1.9 V (Ta = 25°C) DVDD2 — VDD1 1/5 bias, 1/4 bias Typ.– 0.2 1/2 ¥ VDD2 Typ.+ 0.2 1/5 bias Typ.– 0.3 3/2 ¥ VDD2 Typ.+ 0.3 VDD3 1/4 bias (connect VDD3 and VDD2) VDD4 Voltage VDD4 VDD5 Voltage VDD5 VDDH Voltage (Backup used) VDDL Voltage VDDH VDDL Crystal Oscillation Start Voltage VSTA Crystal Oscillation Hold Voltage VHOLD — Typ.– 0.2 –4 VDD2 — Typ.+ 0.2 1/5 bias Typ.– 0.4 2 ¥ VDD2 Typ.+ 0.4 1/4 bias Typ.– 0.3 3/2 ¥ VDD2 Typ.+ 0.3 1/5 bias Typ.– 0.5 5/2 ¥ VDD2 Typ.+ 0.5 1/4 bias Typ.– 0.4 2 ¥ VDD2 Typ.+ 0.4 High-speed clock oscillation stopped VDD = 1.5 V High-speed clock oscillation (Ceramic oscillation, 1 MHz) VDD = 1.5 V High-speed clock oscillation stopped mV/°C V V V V 2.8 — 3.0 V 2.0 — 2.7 V 1 0.8 1.3 1.8 V High-speed clock oscillation (VDD = 1.2 to 5.5 V) 1.2 — 5.5 V Oscillation start time: within 5 seconds 1.0 — — V Backup 0.9 — — V Backup not used 1.7 — — V Crystal Oscillation Stop Detect Time TSTOP — 0.1 — 5.0 ms External Crystal Oscillator Capacitance CG — 5 — 25 pF Internal Crystal Oscillator Capacitance CD — 20 25 30 pF — 30 — pF External Ceramic Oscillator Capacitance Internal RC Oscillator Capacitance CL0, 1 COS POR Voltage VPOR1 Non-POR Voltage VPOR2 CSA2.00MG (Murata MFG.-make) used VDD = 3.0 V — 8 12 16 pF VDD = 1.5 V 0.0 — 0.4 V VDD = 3.0 V 0.0 — 0.7 V VDD = 1.5 V 1.2 — 1.5 V VDD = 3.0 V 2.0 — 3.0 V Notes: 1. "TSTOP" indicates that if the crystal oscillator stops over the value of TSTOP, the system reset occurs. 2. "POR" denotes Power On Reset. 3. "VPOR1" indicates that POR occurs when VDD falls from VDD to VPOR1 and again rises up to VDD. 4. "VPOR2" indicates that POR does not occur when VDD falls from VDD to VPOR2 and again rises up to VDD. 17/29 ¡ Semiconductor MSM63184A DC Characteristics (continued) • When backup is used (VDD = VDDI = 1.5 V, VSS = 0 V, 1/5 bias, Ta = –20 to +70°C unless otherwise specified) MeaParameter Symbol Condition Min. Typ. Max. Unit suring Circuit CPU is in HALT state. 5.3 6.5 Ta = –20 to +50°C — mA Supply Current 1 IDD1 (High-speed clock oscillation 5.3 8.0 Ta = –20 to +70°C — stopped) Supply Current 2 IDD2 CPU is in HALT state. Ta = –20 to +50°C LCD is in Power Down mode. (High-speed clock oscillation Ta = –20 to +70°C stopped) — 4.2 5.0 — 4.2 6.5 mA 1 Supply Current 3 IDD3 CPU is in operation at low-speed oscillation. (High-speed clock oscillation stopped) — 15 20 mA Supply Current 4 IDD4 CPU is in operation at high-speed oscillation (RC oscillation, f = approx. 720 kHz, ROS = 51 kW) — 600 800 mA Supply Current 5 IDD5 CPU is in operation at high-speed oscillation (Ceramic oscillation, 1 MHz) — 700 900 mA • When backup is not used (VDD = VDDI = 3.0 V, VSS = 0 V, 1/5 bias, Ta = –20 to +70°C unless otherwise specified) MeaParameter Symbol Condition Min. Typ. Max. Unit suring Circuit CPU is in HALT state. 2.4 2.9 Ta = –20 to +50°C — mA Supply Current 1 IDD1 (High-speed clock oscillation Ta = –20 to +70°C — 2.4 3.4 stopped) Supply Current 2 Supply Current 3 Supply Current 4 Supply Current 5 IDD2 IDD3 IDD4 IDD5 CPU is in HALT state. Ta = –20 to +50°C LCD is in Power Down mode. (High-speed clock oscillation Ta = –20 to +70°C stopped) — 1.8 2.2 — 1.8 2.8 — 7.2 9.0 f = approx. 800 kHz, ROS = 51 kW — 450 600 f = approx. 500 kHz, ROS = 100 kW — 350 450 — 850 1000 CPU is in operation at low-speed oscillation. (High-speed clock oscillation stopped) CPU is in operation at high-speed oscillation (RC oscillation) CPU is in operation at high-speed oscillation (Ceramic oscillation, 2 MHz) mA mA 1 mA mA 18/29 ¡ Semiconductor MSM63184A DC Characteristics (continued) Parameter IOH1 VDDI = 1.5 V –2.0 –1.2 –0.2 mA VOH1 = VDDI – 0.5 V VDDI = 3.0 V –5.0 –3.0 –1.0 mA ··· Output Current 1 (P4.0 to P4.3) (P5.0 to P5.3) (P6.0 to P6.3) Symbol (VDD = VDDI = VDDH = 3.0 V, VSS = 0 V, VDD1 = 1.1 V, VDD2 = 2.2 V, VDD3 = 3.3 V, VDD4 = 4.4 V, VDD5 = 5.5 V, Ta = –20 to +70°C unless otherwise specified) MeaCondition Min. Typ. Max. Unit suring Circuit (PD.0 to PD.3) (PE.0 to PE.3) IOL1 VOL1 = 0.5 V Output Current 2 (BD, BDB) Output Current 3 (SEG0 to SEG39) (COM1 to COM16) IOH2 (OSC1) –1.5 mA 1.2 2.0 mA VDDI = 3.0 V 1.0 3.0 5.0 mA VDDI = 5.0 V 1.5 4.0 8.0 mA VDD = 1.5 V –2.5 –1.3 –0.4 mA VDD = 3.0 V –6.0 –4.0 –2.0 mA VDD = VDDH = 5.0 V –9.0 –5.5 –3.0 mA VDD = 1.5 V 0.4 1.3 2.5 mA VDD = 3.0 V 2.0 4.0 6.0 mA VDD = VDDH = 5.0 V 3.0 5.5 9.0 mA — — –4 mA IOH3 VOH3 = VDD5 – 0.2 V (VDD5 level) IOHM3 VOHM3 = VDD4 + 0.2 V (VDD4 level) 4 — — mA IOHM3S VOHM3S = VDD4 – 0.2 V (VDD4 level) — — –4 mA IOMH3 VOMH3 = VDD3 + 0.2 V (VDD3 level) 4 — — mA IOMH3S VOMH3S = VDD3 – 0.2 V (VDD3 level) — — –4 mA IOML3 VOML3 = VDD2 + 0.2 V (VDD2 level) 4 — — mA IOML3S VOML3S = VDD2 – 0.2 V (VDD2 level) — — –4 mA IOLM3 VOLM3 = VDD1 + 0.2 V (VDD1 level) 4 — — mA IOLM3S VOLM3S = VDD1 – 0.2 V (VDD1 level) — — –4 mA VOL3 = VSS + 0.2 V (VSS level) 4 — — mA IOH4R IOH4C IOL4C ··· –4.0 0.2 VOL2 = 0.7 V IOL4R Output Leakage (P4.0 to P4.3) (P5.0 to P5.3) (P6.0 to P6.3) –8.0 IOL2 IOL3 Output Current 4 VOH2 = VDD – 0.7 V VDDI = 5.0 V VDDI = 1.5 V VOH4R = VDDH – 0.5 V VDD = VDDH = 3.0 V –2.5 –1.5 –0.75 mA (RC oscillation) VDD = VDDH = 5.0 V –3.5 –2.0 –1.0 mA VOL4R = 0.5 V VDD = VDDH = 3.0 V 0.75 1.5 2.5 mA (RC oscillation) VDD = VDDH = 5.0 V 1.0 2.0 3.5 mA mA VOH4C = VDDH – 0.5 V VDD = VDDH = 3.0 V –300 –180 –60 (ceramic oscillation) VDD = VDDH = 5.0 V –450 –280 –100 mA VOL4C = 0.5 V VDD = VDDH = 3.0 V 60 120 300 mA (ceramic oscillation) VDD = VDDH = 5.0 V 100 200 450 mA IOOH VOH = VDDI — — 0.3 mA IOOL VOL = VSS –0.3 — — mA 2 (PE.0 to PE.3) 19/29 ¡ Semiconductor MSM63184A DC Characteristics (continued) Parameter ··· Input Current 1 (P0.0 to P0.3) (P1.0 to P1.3) (P8.0 to P8.3) (P9.0 to P9.3) Symbol IIH1 IIL1 (PE.0 to PE.3) VIH1 = VDDI (when pulled down) VIL1 = VSS (when pulled up) 2 10 30 mA 30 90 180 mA VDDI = 5.0 V 70 250 600 mA VDDI = 1.5 V –30 –10 –2 mA VDDI = 3.0 V –180 –90 –30 mA VDDI = 5.0 V –600 –250 –70 mA 0.0 — 1.0 mA VIH1 = VDDI (in a high impedance state) IIL1Z VIL1 = VSS (in a high impedance state) IIL2 –1.0 — 0.0 mA VIL2 = VSS VDD = VDDH = 3.0 V –200 –110 –30 mA (when pulled up) VDD = VDDH = 5.0 V –600 –350 –150 mA IIH2R VIH2R = VDDH (RC oscillation) 0.0 — 1.0 mA IIL2R VIL2R = VSS (RC oscillation) –1.0 — 0.0 mA VDD = VDDH = 3.0 V 0.1 0.5 1.0 mA (ceramic oscillation) VDD = VDDH = 5.0 V 0.75 1.5 3.0 mA VDD = VDDH = 3.0 V –1.0 –0.5 –0.1 mA (ceramic oscillation) VDD = VDDH = 5.0 V –3.0 –1.5 –0.75 mA IIH2C IIL2C VIH2C = VDDH VIL2C = VSS Input Current 3 (RESET) VDDI = 1.5 V VDDI = 3.0 V IIH1Z Input Current 2 (OSC0) (VDD = VDDI = VDDH = 3.0 V, VSS = 0 V, VDD1 = 1.1 V, VDD2 = 2.2 V, VDD3 = 3.3 V, VDD4 = 4.4 V, VDD5 = 5.5 V, Ta = –20 to +70°C unless otherwise specified) MeaCondition Min. Typ. Max. Unit suring Circuit IIH3 VIH3 = VDD IIL3 VIL3 = VSS IIH4 VIH4 = VDD IIL4 VIL4 = VSS VDD = 1.5 V 10 50 80 mA VDD = 3.0 V 150 350 600 mA VDD = VDDH = 5.0 V Input Current 4 (TST1, TST2) 0.5 1.0 2.0 mA –1.0 — 0.0 mA VDD = 1.5 V 50 150 300 mA VDD = 3.0 V 0.5 1.0 1.5 mA VDD = VDDH = 5.0 V 1.25 2.5 4.0 mA –1.0 — 0.0 mA 3 20/29 ¡ Semiconductor MSM63184A DC Characteristics (continued) Parameter Input Voltage 1 (P0.0 to P0.3) (P1.0 to P1.3) (P8.0 to P8.3) (P9.0 to P9.3) (VDD = VDDI = VDDH = 3.0 V, VSS = 0 V, VDD1 = 1.1 V, VDD2 = 2.2 V, VDD3 = 3.3 V, VDD4 = 4.4 V, VDD5 = 5.5 V, Ta = –20 to +70°C unless otherwise specified) MeaSymbol Condition Min. Typ. Max. Unit suring Circuit VIH1 VDDI = 1.5 V 1.2 — 1.5 V VDDI = 3.0 V 2.4 — 3.0 V VDDI = 5.0 V 4.0 — 5.0 V VDDI = 1.5 V 0.0 — 0.3 V 0.0 — 0.6 V VDDI = 5.0 V 0.0 — 1.0 V Input Voltage 2 VDD = VDDH = 3.0 V 2.4 — 3.0 V VDD = VDDH = 5.0 V 4.0 — 5.0 V VDD = VDDH = 3.0 V 0.0 — 0.6 V VDD = VDDH = 5.0 V 0.0 — 1.0 V VDD = 1.5 V 1.35 — 1.5 V ··· VDDI = 3.0 V (PE.0 to PE.3) (OSC0) VIL1 VIH2 VIL2 Input Voltage 3 (RESET, TST1, TST2) VDD = 3.0 V 2.4 — 3.0 V VDD = VDDH = 5.0 V 4.0 — 5.0 V VDD = 1.5 V 0.0 — 0.15 V VDD = 3.0 V 0.0 — 0.6 V VDD = VDDH = 5.0 V 0.0 — 1.0 V VDDI = 1.5 V 0.05 0.1 0.3 V VDDI = 3.0 V 0.2 0.5 1.0 V (PE.0 to PE.3) VDDI = 5.0 V 0.25 1.0 1.5 V Hysteresis Width 2 VDD = 1.5 V 0.05 0.1 0.3 V VIH3 VIL3 DVT1 ··· Hysteresis Width 1 (P0.0 to P0.3) (P1.0 to P1.3) (P8.0 to P8.3) 4 (RESET, TST1, TST2) CIN VDD = 3.0 V 0.2 0.5 1.0 V VDD = VDDH = 5.0 V 0.25 1.0 1.5 V — — — 5 pF 1 ··· Input Pin Capacitance (P0.0 to P0.3) (P1.0 to P1.3) (P8.0 to P8.3) (P9.0 to P9.3) DVT2 (PD.0 to PD.3) (PE.0 to PE.3) 21/29 ¡ Semiconductor MSM63184A Measuring circuit 1 CB1 CG Cb12 XT0 CB2 C1 32.768 kHz Crystal XT1 C12 C2 q *1 w OSC0 OSC1 VSS VDD VDDI VDD1 A Ca V Ca, Cb, Cc, Cd, Ce, Cl, C12 Cb12, Ch CG CL0 CL1 Ceramic Resonator VDD2 VDD3 VDD4 VDD5 VDDH VDDL Cb Cc Cd Ce Ch V : 0.1 mF : 1 mF : 15 pF : 30 pF : 30 pF : CSA2.00MG (2 MHz) CSB1000J (1 MHz) (Murata MFG.-make) V V V Cl V V *1 RC Oscillator q ROS w Ceramic Oscillator q CL0 Ceramic Resonator w CL1 Measuring circuit 2 *3 VIH A *2 INPUT VIL VSS OUTPUT VDD VDDI VDD1 VDD2 VDD3 VDD4 VDD5 VDDH VDDL *2 Input logic circuit to determine the specified measuring conditions. *3 Measured at the specified output pins. 22/29 ¡ Semiconductor MSM63184A Measuring circuit 3 *4 A INPUT OUTPUT VSS VDD VDDI VDD1 VDD2 VDD3 VDD4 VDD5 VDDH VDDL Measuring circuit 4 VIH Waveform Monitoring *4 INPUT VIL VSS OUTPUT VDD VDDI VDD1 VDD2 VDD3 VDD4 VDD5 VDDH VDDL *4 Measured at the specified input pins. 23/29 ¡ Semiconductor MSM63184A AC Characteristics (Serial Interface, Shift Register) (VDD = 0.9 to 5.5 V, VDDH = 1.8 to 5.5 V, VSS = 0 V, VDDI = 5.0 V, Ta = –20 to +70°C unless otherwise specified) Parameter Symbol Condition Min. Typ. Max. Unit SCLK Input Fall Time tf — — — 1.0 ms SCLK Input Rise Time tr — — — 1.0 ms SCLK Input "L" Level Pulse Width tCWL — 0.8 — — ms SCLK Input "H" Level Pulse Width tCWH — 0.8 — — ms tCYC VDDI = 5 V to VDD 1.8 — — ms tCYC1(O) CPU in operation state at 32 kHz — 30.5 — ms — 0.5 — ms SCLK Input Cycle Time SCLK Output Cycle Time CPU in operation at 2 MHz tCYC2(O) VDD = VDDH = 2.7 V to 5.5 V SOUT Output Delay Time tDDR Cl = 10 pF — — 0.4 ms SIN Input Setup Time tDS — 0.5 — — ms SIN Input Hold Time tDH — 0.8 — — ms AC characteristics timing ("H" level = 4.0 V, "L" level = 1.0 V) tCYC SCLK (PE.2) 5 V (VDDI) 0 V (VSS) tr tf tCWH tCWL tDDR tDDR 5 V (VDDI) SOUT (PE.1) 0 V (VSS) tDS SIN (PE.0) tDH tDS 5 V (VDDI) 0 V (VSS) 24/29 ¡ Semiconductor MSM63184A AC Characteristics (External Memory Interface) (VDD = 0.9 to 5.5 V, VDDH = 1.8 to 5.5 V, VSS = 0 V, VDDI = 5.0 V, Ta = –20 to +70°C unless otherwise specified) (1) Reading from External Memory (a) When CPU operates at 32.768 kHz Symbol Condition Min. Typ. Read Cycle Time Parameter Max. Unit tRC — — RD Output Delay Time tOE — — 61.0 — ms — 5.0 ms Output Valid Time tOHA — External Memory Output Delay Time tDO — — — 5.0 ms — — 5.0 ms Symbol Condition Min. Typ. Max. Unit Read Cycle Time RD Output Delay Time tRC — 1.0 — — ms tOE — — — 100 ns Output Valid Time tOHA — — — 100 ns External Memory Output Delay Time tDO — — — 150 ns (b) When CPU operates at 2 MHz (VDDH = 2.7 to 5.5 V) Parameter AC characteristics timing ("H" level = 4.0 V, "L" level = 1.0 V) MOVXB obj, xadr16 MOVXB obj, [RA] S1 S2 S1 S2 S1 S2 System clock tRC P7 - P4 (A15 - A0) Port setup value Address output Port setup value 5 V (VDDI) 0 V (VSS) P8.0 (RD) tOE PA, P9 (D7 - D0) 5 V (VDDI) 0 V (VSS) Port setup value Input data tOHA Port setup value 5 V (VDDI) 0 V (VSS) tDO 25/29 ¡ Semiconductor MSM63184A (2) Writing to External Memory (a) When CPU operates at 32.768 kHz Parameter Symbol Condition Min. Typ. Max. Unit Write Cycle Time tWC — — 61.0 — ms Address Setup Time tAS — — 30.5 — ms Write Time tW — — 15.3 — ms Write Recovery Time tWR — — 15.3 — ms Data Setup Time tDS — — 45.8 — ms Data Hold Time tDH — — 15.3 — ms (b) When CPU operates at 2 MHz (VDDH = 2.7 to 5.5 V) Parameter Symbol Condition Min. Typ. Max. Unit Write Cycle Time tWC — 1.0 — — ms Address Setup Time tAS — 0.4 — — ms Write Time tW — 0.2 — — ms Write Recovery Time tWR — 0.2 — — ms Data Setup Time tDS — 0.7 — — ms Data Hold Time tDH — 0.2 — — ms AC characteristics timing ("H" level = 4.0 V, "L" level = 1.0 V) MOVXB [RA], obj or MOVXB xadr16, obj S1 S2 S1 S2 S1 S2 System clock tWC P7 - P4 (A15 - A0) PA, P9 (D7 - D0) Port setup value Address output Port setup value Output data tDS tDH Port setup value Port setup value 5 V (VDDI) 0 V (VSS) 5 V (VDDI) 0 V (VSS) 5 V (VDDI) 0 V (VSS) P8.1 (WR) tAS tW tWR 26/29 ¡ Semiconductor MSM63184A APPLICATION CIRCUITS •RC oscillation is selected as high-speed oscillation. •Ports are powered from external memory power source. •Cv is an IC power supply bypass capacitor. •Values of Ca, Cb, Cc, Cd, Ce, Cl, Cb12, C12, Ch, and CG, are for reference only. LCD Crystal 32.768 kHz COM1-16 SEG0-39 XT0 OSC0 ROS CG 5 to 25 pF Ch 1.0 mF 1.5 V Cv 0.1 mF 1.0 mF Cb12 Cl 0.1 mF Ce 0.1 mF Cd 0.1 mF Cc 0.1 mF Cb 0.1 mF Ca 0.1 mF C12 OSC1 VDD P8.3 P8.2 CB1 Open PE.3 PE.2 PE.1 PE.0 PD.3 PD.2 PD.1 PD.0 CB2 VDDL VDD5 VDD4 VDD3 VDD2 VDD1 C1 0.1 mF Push SW Buzzer XT1 VDDH C2 MSM63184A SW Matrix (8 ¥ 8) P1.3 P1.2 P1.1 P1.0 P0.3 P0.2 P0.1 P0.0 RESET TST1 TST2 BD VDDI BDB P4-7 VDD VSS P9, PA P8.0 P8.1 A15-0 External D7-0 Memory RD (64K ¥ 8 bits) WR VSS 5.0 V Note: VDDI is the power supply pin for the input, output, and input-output ports. Be sure to connect the VDDI pin either to the positive power supply pin (VDD) of this device or to the positive power supply pin of the external memory. Application Circuit Example with Power Supply Backup 27/29 ¡ Semiconductor MSM63184A APPLICATION CIRCUITS (continued) •Ceramic oscillation is selected as high-speed oscillation. •Ports, external memory, and IC share their power supply. •Cv is an IC power supply bypass capacitor. •Values of Ca, Cb, Cc, Cd, Ce, Cl, C12, CG, CL0, and CL1 are for reference only. LCD Crystal 32.768 kHz COM1-16 CL0 30 pF SEG0-39 XT0 OSC0 XT1 VDDH OSC1 VDD P8.3 P8.2 Ceramic Resonator (Example: 1 MHz) CG 5 to 25 pF VDD CL1 30 pF 5.0 V Cv 0.1 mF Open Cl 0.1 mF Ce 0.1 mF Cd 0.1 mF Cc 0.1 mF Cb 0.1 mF Ca 0.1 mF CB1 CB2 VDDL VDD5 VDD4 VDD3 VDD2 VDD1 C1 C12 0.1 mF Push SW Open Buzzer PE.3 PE.2 PE.1 PE.0 PD.3 PD.2 PD.1 PD.0 C2 MSM63184A SW Matrix (8 ¥ 8) P1.3 P1.2 P1.1 P1.0 P0.3 P0.2 P0.1 P0.0 RESET TST1 TST2 BD VDDI BDB P4-7 VDD VDD VSS P9, PA P8.0 P8.1 A15-0 External D7-0 Memory RD (64K ¥ 8 bits) WR VSS Note: VDDI is the power supply pin for the input, output, and input-output ports. Be sure to connect the VDDI pin either to the positive power supply pin (VDD) of this device or to the positive power supply pin of the external memory. Application Circuit Example with No Power Supply Backup 28/29 ¡ Semiconductor MSM63184A PACKAGE DIMENSIONS (Unit : mm) QFP128-P-1420-0.50-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.19 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 29/29 E2Y0002-29-62 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. Printed in Japan