TI SN74LVCZ16244ADL

SN74LVCZ16244A
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES277B – JUNE 1999 – REVISED MARCH 2000
D
D
D
D
D
D
D
D
D
DGG OR DL PACKAGE
(TOP VIEW)
Member of the Texas Instruments
Widebus  Family
EPIC  (Enhanced-Performance Implanted
CMOS) Submicron Process
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
Ioff and Power-Up 3-State Support Hot
Insertion
Supports Mixed-Mode Signal Operation on
All Ports (5-V Input/Output Voltage With
3.3-V VCC)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
Package Options Include Plastic Shrink
Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages
1OE
1Y1
1Y2
GND
1Y3
1Y4
VCC
2Y1
2Y2
GND
2Y3
2Y4
3Y1
3Y2
GND
3Y3
3Y4
VCC
4Y1
4Y2
GND
4Y3
4Y4
4OE
description
This 16-bit buffer/driver is designed for 3-V to
3.6-V VCC operation.
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
2OE
1A1
1A2
GND
1A3
1A4
VCC
2A1
2A2
GND
2A3
2A4
3A1
3A2
GND
3A3
3A4
VCC
4A1
4A2
GND
4A3
4A4
3OE
The SN74LVCZ16244A is designed specifically to improve the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. It provides true outputs and
symmetrical active-low output-enable (OE) inputs.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators
in a mixed 3.3-V/5-V system environment.
When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
The SN74LVCZ16244A is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC and Widebus are trademarks of Texas Instruments.
Copyright  2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74LVCZ16244A
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES277B – JUNE 1999 – REVISED MARCH 2000
FUNCTION TABLE
(each 4-bit buffer)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
logic symbol†
1OE
2OE
1
EN1
48
25
3OE
4OE
1A1
1A2
1A3
1A4
2A1
2A2
2A3
2A4
3A1
3A2
3A3
3A4
4A1
4A2
4A3
4A4
24
EN2
EN3
EN4
47
1
1
46
3
44
5
43
6
41
40
1
2
8
9
38
11
37
12
36
13
35
1
3
14
33
16
32
17
30
1
4
19
29
20
27
22
26
23
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
2
2
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• DALLAS, TEXAS 75265
1Y1
1Y2
1Y3
1Y4
2Y1
2Y2
2Y3
2Y4
3Y1
3Y2
3Y3
3Y4
4Y1
4Y2
4Y3
4Y4
SN74LVCZ16244A
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES277B – JUNE 1999 – REVISED MARCH 2000
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
2OE
2A1
2A2
2A3
2A4
1
3OE
47
2
46
3
44
5
43
6
1Y1
3A1
1Y2
3A2
1Y3
3A3
1Y4
3A4
48
4OE
41
8
40
9
38
11
37
12
2Y1
4A1
2Y2
4A2
2Y3
4A3
2Y4
4A4
25
36
13
35
14
33
16
32
17
3Y1
3Y2
3Y3
3Y4
24
30
19
29
20
27
22
26
23
4Y1
4Y2
4Y3
4Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6.5 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6.5 V
Voltage range applied to any output in the high-impedance or power-off state, VO
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6.5 V
Voltage range applied to any output in the high or low state, VO
(see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through each VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 3): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The value of VCC is provided in the recommended operating conditions table.
3. The package thermal impedance is calculated in accordance with JESD 51.
POST OFFICE BOX 655303
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3
SN74LVCZ16244A
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES277B – JUNE 1999 – REVISED MARCH 2000
recommended operating conditions (see Note 4)
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
High-level input voltage
VCC = 3 V to 3.6 V
VCC = 3 V to 3.6 V
Input voltage
MIN
MAX
3
3.6
2
V
V
0.8
V
0
5.5
V
High or low state
0
3-state
0
VCC
5.5
V
–24
mA
24
mA
VO
Output voltage
IOH
IOL
High-level output current
∆t/∆v
Input transition rise or fall rate
∆t/∆VCC
TA
Power-up ramp rate
150
Operating free-air temperature
–40
VCC = 3 V
VCC = 3 V
Low-level output current
UNIT
10
ns/V
µs/V
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
3 V to 3.6 V
IOH = –100 µA
IOH = –12 mA
VOH
IOH = –24 mA
IOL = 100 µA
VOL
MIN
3V
VCC–0.2
2.4
3V
2.2
TYP†
UNIT
V
3 V to 3.6 V
IOL = 12 mA
IOL = 24 mA
MAX
0.2
V
3V
0.4
3V
0.55
±5
µA
II
Ioff
VI = 0 to 5.5 V
VI or VO = 5.5 V
3.6 V
0
±5
µA
IOZ
VO = 0 to 5.5 V
3.6 V
±5
µA
IOZPU
VO = 0.5 to 2.5 V,
OE = don’t care
0 to 1.5 V
±5
µA
IOZPD
VO = 0.5 to 2.5 V,
VI = VCC or GND
3.6 V ≤ VI ≤ 5.5 V‡
OE = don’t care
1.5 V to 0
±5
µA
One input at VCC – 0.6 V,
Other inputs at VCC or GND
ICC
∆ICC
Ci
IO = 0
100
36V
3.6
100
3 V to 3.6 V
VI = VCC or GND
Co
VO = VCC or GND
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ This applies in the disabled state only.
100
µA
µA
3.3 V
4.5
pF
3.3 V
6
pF
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A or B
B or A
ten
OE
OE
PARAMETER
tdis
4
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VCC = 3.3 V
± 0.3 V
UNIT
MIN
MAX
1.1
4.1
ns
A or B
1
4.6
ns
A or B
1.8
5.8
ns
SN74LVCZ16244A
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES277B – JUNE 1999 – REVISED MARCH 2000
operating characteristics, TA = 25°C
TEST
CONDITIONS
PARAMETER
Cpd
Power dissipation capacitance per buffer/driver
POST OFFICE BOX 655303
Outputs enabled
Outputs disabled
• DALLAS, TEXAS 75265
f = 10 MHz
TYP
32
5.5
UNIT
pF
5
SN74LVCZ16244A
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES277B – JUNE 1999 – REVISED MARCH 2000
PARAMETER MEASUREMENT INFORMATION
VCC = 3.3 V ± 0.3 V
2 × VCC
S1
500 Ω
From Output
Under Test
GND
CL = 30 pF
(see Note A)
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
Open
500 Ω
tw
LOAD CIRCUIT
VCC
VCC
Timing
Input
Input
VCC/2
VCC/2
0V
VCC/2
0V
tsu
VOLTAGE WAVEFORMS
PULSE DURATION
th
VCC
Data
Input
VCC/2
VCC/2
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
Output
Control
(low-level
enabling)
VCC/2
VCC/2
0V
tPLZ
tPZL
VCC
Input
VCC/2
VCC/2
0V
tPLH
VCC/2
VCC
VCC/2
VOL + 0.3 V
VOL
tPHZ
tPZH
tPHL
VOH
Output
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
VCC/2
VOL
Output
Waveform 2
S1 at GND
(see Note B)
VCC/2
VOH
VOH – 0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
6
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any product or service without notice, and advise customers to obtain the latest version of relevant information
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subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
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Copyright  2000, Texas Instruments Incorporated