SN74ACT16374Q-EP
16-BIT D-TYPE EDGE-TRIGGERED FLIP-FLOP
WITH 3-STATE OUTPUTS
SCAS679B – MAY 2002 – REVISED JULY 2002
D
D
D
D
D
D
D
D
D
D
DL PACKAGE
(TOP VIEW)
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
Extended Temperature Performance of
–40°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product Change Notification
Qualification Pedigree†
Member of the Texas Instruments
Widebus Family
Inputs Are TTL-Voltage Compatible
3-State Bus Driving True Outputs
Flow-Through Architecture Optimizes
PCB Layout
Distributed VCC and GND Pins Minimize
High-Speed Switching Noise
1OE
1Q1
1Q2
GND
1Q3
1Q4
VCC
1Q5
1Q6
GND
1Q7
1Q8
2Q1
2Q2
GND
2Q3
2Q4
VCC
2Q5
2Q6
GND
2Q7
2Q8
2OE
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, highly
accelerated stress test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life.
description
The
SN74ACT16374Q-EP
is
a
16-bit
edge-triggered D-type flip-flop with 3-state
outputs, designed specifically for driving highly
capacitive or relatively low-impedance loads. It is
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1CLK
1D1
1D2
GND
1D3
1D4
VCC
1D5
1D6
GND
1D7
1D8
2D1
2D2
GND
2D3
2D4
VCC
2D5
2D6
GND
2D7
2D8
2CLK
This device can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK)
input, the Q outputs of the flip-flop take on the logic levels set up at the data (D) inputs.
An output-enable (OE) input can be used to place the outputs in either a normal logic state (high or low logic
levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines
significantly. The high-impedance state provides the capability to drive bus lines in a bus-organized system,
without need for interface or pullup components. OE does not affect the internal operations of the flip-flop. Old
data can be retained or new data can be entered while the outputs are in the high-impedance state.
ORDERING INFORMATION
TA
PACKAGE‡
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
–40°C to 125°C
SSOP – DL
Tape and reel
SN74ACT16374QDLREP
ACT16374QEP
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74ACT16374Q-EP
16-BIT D-TYPE EDGE-TRIGGERED FLIP-FLOP
WITH 3-STATE OUTPUTS
SCAS679B – MAY 2002 – REVISED JULY 2002
FUNCTION TABLE
(each section)
INPUTS
OE
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
H or L
X
Q0
H
X
X
Z
logic diagram (positive logic)
1OE
1CLK
1
2OE
48
2CLK
C1
1D1
47
2
1D
24
25
C1
1Q1
2D1
36
1D
13
2Q1
To Seven Other Channels
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±24 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±24 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±260 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DL package . . . . . . . . . . . . . . . . . . . 1.2 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74ACT16374Q-EP
16-BIT D-TYPE EDGE-TRIGGERED FLIP-FLOP
WITH 3-STATE OUTPUTS
SCAS679B – MAY 2002 – REVISED JULY 2002
recommended operating conditions (see Note 3)
MIN
NOM
MAX
4.5
5
5.5
VCC
VIH
Supply voltage (see Note 4)
VIL
VI
Low-level input voltage
Input voltage
0
VO
IOH
Output voltage
0
IOL
Dt/Dv
Low-level output current
High-level input voltage
2
V
V
High-level output current
Input transition rise or fall rate
UNIT
0
0.8
V
VCC
VCC
V
–16
mA
V
16
mA
10
ns/V
TA
Operating free-air temperature
–40
125
°C
NOTES: 3. All unused inputs of the device must be at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4. All VCC and GND pins must be connected to the proper-voltage power supply.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
50 mA
IOH = –50
VOH
IOH = –16
16 mA
IOH = –24 mA{
IOL = 16 mA
MIN
4.5 V
4.4
4.4
5.5 V
5.4
5.4
4.5 V
3.94
3.7
5.5 V
4.94
4.7
MAX
VI = VCC or GND
VO = VCC or GND
ICC
VI = VCC or GND,
IO = 0
DICC‡
One input at 3.4 V,
Other inputs at GND or VCC
Ci
VI = VCC or GND
VO = VCC or GND
V
0.1
0.1
5.5 V
0.1
0.1
4.5 V
0.36
0.5
5.5 V
0.36
0.5
5.5 V
II
IOZ
UNIT
3.85
4.5 V
IOL = 24 mA{
Co
TA = 25°C
TYP
MAX
5.5 V
IOL = 50 mA
VOL
MIN
V
0.5
5.5 V
±0.1
±1
5.5 V
±0.5
±10
5.5 V
8
160
mA
mA
mA
5.5 V
0.9
1
mA
5V
4.5
pF
5V
12
pF
† Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
‡ This is the increase in supply current for each input that is at one of the specified TTL-voltage levels rather than 0 V to VCC.
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3
SN74ACT16374Q-EP
16-BIT D-TYPE EDGE-TRIGGERED FLIP-FLOP
WITH 3-STATE OUTPUTS
SCAS679B – MAY 2002 – REVISED JULY 2002
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
fclock
Clock frequency
0
tw
Pulse duration
tsu
th
Setup time, data before CLK↑
MIN
MAX
UNIT
0
65
MHz
65
CLK low
7.5
7.5
CLK high
4.5
4.5
6.5
6.5
ns
1
1
ns
Hold time, data after CLK↑
ns
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
PARAMETER
fmax
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
FROM
(INPUT)
TO
(OUTPUT)
MIN
TA = 25°C
TYP
MAX
MIN
65
CLK
Q
OE
Q
OE
Q
MAX
65
UNIT
MHz
5.1
8.8
10.9
5.1
13.2
5.3
8.8
10.9
5.3
13.1
3.7
8.4
10.5
3.7
12.7
4.4
9.7
11.9
4.4
14.3
5.4
7.9
9.8
5.4
10.9
4.9
7.2
9.1
4.9
10.2
ns
ns
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
d
4
Power dissipation capacitance per flip-flop
flip flop
POST OFFICE BOX 655303
TEST CONDITIONS
Outputs enabled
Outputs disabled
• DALLAS, TEXAS 75265
CL = 50 pF,
pF
f = 1 MHz
TYP
52
38
UNIT
pF
SN74ACT16374Q-EP
16-BIT D-TYPE EDGE-TRIGGERED FLIP-FLOP
WITH 3-STATE OUTPUTS
SCAS679B – MAY 2002 – REVISED JULY 2002
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH /tPHL
tPLZ /tPZL
tPHZ /tPZH
Open
2 × VCC
GND
LOAD CIRCUIT
3V
Timing Input
(see Note B)
1.5 V
0V
tw
tsu
3V
Input
1.5 V
th
1.5 V
3V
1.5 V
1.5 V
Data Input
0V
0V
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
Output
Control
(low-level
enabling)
3V
1.5 V
Input
1.5 V
0V
tPLH
In-Phase
Output
tPHL
50% VCC
tPZL
50% VCC
VOH
50% VCC
VOL
1.5 V
0V
tPLZ
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLH
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
3V
1.5 V
50% VCC
tPZH
20% VCC
VOL
tPHZ
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
≈VCC
50% VCC
80% VCC
VOH
≈0 V
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
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5
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74ACT16374QDLREP
ACTIVE
SSOP
DL
48
1000
TBD
Call TI
Level-1-235C-UNLIM
V62/03603-01XE
ACTIVE
SSOP
DL
48
1000
TBD
Call TI
Level-1-235C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
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