GL610T GL610T Ultra-compact Chip Part Type Infrared Emitting Diodes ■ Features ■ Outline Dimensions 1. Ultra-compact type (1.6 x 0.8 x 0.8 mm) 2. Thin type (thickness : 0.8 mm) 0.8 0.3 1.6 (0.2) 0.8 3. Taped-packed type (4,000 pieces/reel) 4. Leadless type (Unit : mm) 2 Chip position 1 ■ Applications 1.2 1. Compact and thin remote controllers 2. Tape end detection of VCRs and VCR cameras 3. Power source for car navigator touch panels 4. Other portable equipment 0.3 0.5 1.0 (0.3) (0.3) * Plating area * Terminal connection 1 Anode 2 Cathode 1 Chip side mark ■ Absolute Maximum Ratings Parameter Forward current *1 Peak forward current Reverse voltage Power dissipation Operating temperature Storage temperature *2 Soldering temperature Symbol Rating IF 50 500 I FM VR 6 150 P - 25 to + 85 Topr - 25 to + 100 Tstg 260 Tsol 2 * Tolerance : ± 0.1mm (Ta=25˚C) Unit mA mA V mW ˚C ˚C ˚C *1 Pulse width <= 100µ s, Duty ratio=0.01 *2 Hand soldering temperature, for MAX. 3 seconds ■ Electro-optical Characteristics Parameter Forward voltage *1 Peak forward voltage Reverse current Radiant flux Peak emission wavelength (Ta=25 ˚C) Symbol VF V FM IR Φe λp Conditions I F = 50mA I FM = 0.5A V R = 3V I F = 20mA I F = 20mA MIN. 0.7 - TYP. 1.3 2.2 2.0 950 MAX. 1.5 3.5 10 - Unit V V µA mW nm Half intensity wavelength ∆λ I F = 20mA - 40 - nm Response frequency fc ∆θ I F = 20mA - 300 ± 60 - kH Z ˚ Half intensity angle “ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”