PREPARED
I SPEC.
DATE:
BY:
SHA
APPROVED
BY:
DATE:
ED-9466
1B
October
29. 1999
ELECTRONIC
COMPO
GROUP SHARP CORPORATION
SPECIFICATION
DEVICE
SPECIFICATION
FOR
PHOTOCOUPLER
I
No.
MODEL
I
Business
I
OF’TO-ELECT=
dealing
name
I
No.
PC354
1. These speciilcation sheets include materials protected under copyright of Sharp Corporation
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
(‘Sharp”).
2. When using this product, please observe the absolute maximum ratings and the instructions
for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions
included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This product is designed for use in the following application areas :
Audio visual equipment
OA equipment
* Home appliances
. Telecommunication
equipment (Terminal)
* Measuring equipment
Computers
1 Tooling machines
If the use of the product in the above application areas is for equipment listed in paragraphs
(21 or (31, please be sure to observe the precautions given in those respective paragraphs.
1
l
l
l
l
(21 Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation
control and safety equipment (aircraft, train, automobile etc.)
* Tram signals
* Gas leakage sensor breakers
* Rescue and security equipment
Other
safety
equipment
[
l
(31 Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as :
* Space equipment
* Telecommunication
equipment (for trunk lines)
*
Nuclear
power
control
equipment
*
Medical
equipment
[
1
1
(4) Please contact and consult with a Sharp sales representative
regarding interpretation
of the above three paragraphs.
3. Please contact and consult with a Sharp sales
CUSTOMERS
DATE
BY
APPROVAL
representative
if there are any questions
for any questions
DATE
PRESENTED
BY
about this product.
;(i
4
K. Hachimura.
Department
General Manager
Engineering
Dept. ,I1
Opto-Electronic
Devices Div.
ELECOM Group
SHARP CORPORATION
of
SHARP CORPORATION
ED-94(
1. Application
This specification
applies
Model No. PC354.
to the outline
and characteristics
of p
2. Outline
Refer to the attached
3. Ratings
drawing
No. CY6488KO2.
and characteristics
Refer to the attached
sheet,
page 4 to 6.
sheet,
page 7.
sheet,
page 8.
4. Reliability
Refer to the attached
5.
Incoming
inspection
Refer to the attached
6. Supplement
6.1
Isolation
voltage
shall be measured
in the following
(1) Short between anode and cathode on the primary
collector and emitter on the secondary
side.
(2) The dielectric
withstand
(3) The wave form of applied
6.2
Packaging
specifications
tester
voltage
with
zero-cross
method.
side and between
circuit
shall be a sine wave.
shall be used.
SHARPCORPORATION
6.3 Collector current (Ic) Delivery rank table
(“0” mark : indicates business dealing name of ordered
product)
Rank at
delivery
Business
dealing name
Rank mark
Ic b-M
8
PC354NT
A or no mark
0.2 to 4.0
A
0.5 to 1.5
PC354N
6.4 This Model is approved
Approved
Model
1T
Test
conditions
I,=+ 1mA
V ca=5v
Ta=25C
by UL.
No. : PC354
UL file No. : E64380
6.5 This product
is AC input
type.
6.6 This product
is not designed
against
This product
is operated
with electrical
This product
incorporates
non-coherent
irradiation.
input
and output.
light emitting
diode.
6.7 ODS materials
This product shall not contain the following materials.
Also, the following materials shall not be used in the production
for this product.
Materials
6.8 Brominated
for ODS
: CFC,, Halon. Carbon
1.1.1 -Trichloroethane
process
tetrachloride.
(Methylchloroform)
flame retardants
Speciiic brominated
flame retardants
in this device at all.
7. Notes
Refer to the attached
sheet- 1- 1, 2.
such as the PBBO,
and PBB,
are not used
SHARP CORPORATION
2. Outline
i
3.6kO. 3
c
.
;
Pin Nos. and internal
connection diagram
0
@
2.54kO.25
i
/
Sharp mark
“S”,
d
1
Model No.
Primary side mark
\
.
3Collector
0
Anode
(Cathode)
\,
\
Date code
.
3
Emitter
0
Cathode
(Anode)
\*
&nk mark
mark
Epoxy resin
+q=,
g
4-L
6”
*l) 2-digit number shall be marked according to DIN standard.
*2) Factory identification
mark shall be or shall not be marked.
*3) Rank mark : “A” or no mark
UNIT:
l 4) Marking is laser marking
Product mass : Approx.
L
0. lg
l/l
mm
Name
PC354
Outline Dimensions
(Business dealing
name : PC354NT)
Drawing
No.
CY6488KO2
SHARP CORPORATION
3. Ratings
and characteristics
3.1 Absolute
maximum
ratings
Input
output
Collector
current
* 1 Total power dissipation
Operating
Topr
-30 to +lOO
‘C
Tstg
-40 to +125
“C
Viso(rms)
3.75
kV
Tsol
260
%
temperature
Storage temperature
*3 Isolation
*4 Soldering
voltage
temperature
* 1 The derating factors of absolute
are shown in Fig. 1 to 4.
*2 Pulse widths
ratings
due to ambient
100 /1 s. Duty ratio : 0.00 1 (Refer to Fig. 51
*3 AC for 1 min. 40 to 6O%RH,
*4 For 10s
maximum
f=GOHz
temperature
SHARP CORPORATION
3.2 Electra-optical
characteristics
Parameter
Symbol
Conditions
MIN.
m.
MAX.
uni;
Forward voltage
VF
1,=+2omA
1.2
1.4
v
Terminal
Ct
v=o, f=lkHz
30
250
pF
100
nA
Input
capacitance
Dark current
output
I,
Collector-emitter
breakdown voltage
BvCEO
Emitter-collector
breakdown voltage
BVECO
Collector
current
IC
Collector-emitter
saturation
voltage
Transfer
characteristics
EO
‘CE(sat)
vc,=2ov,
IF0
Ic=O. 1mA
I,=0
35
-
-
V
I,= 10 rA, I,=0
6
-
-
V
0.2
-
4.0
mA
0.1
0.2
v
10”
-
Q
0.6
1.0
pF
4
18
ps
3
18
ps
1,=+1mA,
vc,=5v
1,=+2omA
Ic=lmA
Isolation
resistance
Riso
DCSOOV
40 to 6O%RH
Floating
capacitance
Cf
V=O, f= 1MHz
Response
time
Rise
tr
Response
time
Fall
tf
VcE=2V
’ Ic=2mA
Iq=lOOQ
5XlO’O
SHARP CORPORATION
(Fig. 1) Forward
ambient
current
vs.
temperature
c
-30
0
Ambient
25
55
75
temperature
100
80
3
g
z
;ij
70
60
b
3
40
g
3
.2
n
20
125
O
-30
Ambient
25
50
75
temperature
100
125
F
170
150
100
-30
3
a”
Duty ratio
0
25
50
75
Ambient temperature
Ta ("C)
(Fig. 5) Peak forward
current
vs. duty ratio
Ta (“C)
(Fig. 4) Total power dissipation
vs. ambient temperature
g
s
.9
2
;ij
0
100 125
25
Ambient temperature
Ta (“C)
(Fig. 3) Collector power dissipation
vs. ambient temperature
-30
0
Pulse widths
Ta=25”C
100 p s
100 125
Ta ("C)
SHARP CORPOMTION
4. Reliability
The reliability
of products
items listed below.
shall satisfl
Confidence level : 90%
LTPD : 100/o/20%
Test Conditions
Test Items
Failure
*1
Solderability
Soldering
*2
heat
*3
Judgement
Criteria
23O’C. 5 s
n=ll.
C=O
26O’C. 10s
n=ll,
C=O
n=ll.
C=O
n=ll.
C=O
n=ll.
C=O
Terminal
strength
(Bending) *4
Weight : 1N
1 time/each
terminal
Mechanical
150OOm/s*,
3 times/+X,
v,>ux
1.2
kEO>UX2
Variable
vibration
shock
frequency
0.5ms
+Y. +Z direction
100 to 2000 to lOOHz/4min
200m/s*
4 times/ X, Y. 2 direction
Temperature
cycling
1 cycle -40°C to + 125’C
(30min) (30min)
20 cycles test
High temp. and high
humidity
storage *5
+85-C. 85%RH.
High temp. storage
+125-C.
Low temp.
storage
-4O’C. lOOOh
Operation
life
1,=+5OmA.
Ptot= 170mW
Ta=25’C, lOOOh
* 1 Test method,
Ic<LX0.7
conforms
V CE(sat)>ux 1.2
‘I
n=22.C=0
U : Upper
specification
limit
500h
lOOOh
n=22.C=0
L : Lower
specification
limit
n=22,C=O
n=22.C=0
n=22,C=O
H
to EIAJ ED 470 1.
*2 Solder shall adhere at the area of 95% or more of immersed portion of
lead, and pin hole or other holes shall not be concentrated
on one portion.
l 3 The lead pin depth
dipped
root of lead pins.
*4 Terminal
‘5
bending
It in ~vall~at~rl
direction
after
washing
into solder shall be 0.2mm
is shown
away from the
below.
hv specified
solvent
in attach
sheet-
l- 1. 2.
0.2mm
+
Weight : 1N
Soldering a~
or more
SHARP CORPORATION
5. Incoming
inspection
5.1 Inspection
items
(1) Electrical
characteristics
V,, I,,,,
V,,(,,).
Ic, Rise. Viso
(2) Appearance
5.2 Sampling
method
and Inspection
level
A single sampling plan, normal inspection level II based on
IS0 2859 is applied. The AQL according to the inspection
items are shown below.
Defect
Inspection
item
AQL (O/o)
Major
defect
Electrical characteristics
Unreadable
marking
0.1
Minor
defect
Appearance defect except
the above mentioned.
0.4
SHARP CORPORATION
6.2
Package
6.2.1
specifications
Taping
conditions
(1) Tape structure
and Dimensions
(Refer to the attached
sheet,
Page 10)
The tape shall have a structure
in which a cover tape is sealed heat-pressed
the carrier tape of protect against static electricity.
(2) Reel structure
and Dimensions
(Refer to the attached
The taping reel shall be of plastic with
as shown in the attached drawing.
(3) Direction
of product
insertion
Product direction
in carrier
hole side on the tape.
(4) Joint
Page 11)
its dimensions
(Refer to the attached
tape shall direct
sheet,
Page 11)
to the anode mark
at the
of tape
The cover tape and carrier
(5) The way to repair
tape in one reel shall be jointless.
taped failure
The way to repair taped failure
after replacing to good devices,
6.2.2
sheet,
on
Adhesiveness
devices
devices cut a bottom of carrier tape with a cutter, and
the cut portion shall be sealed with adhesive tape.
of cover tape
. The exfoliation
force between carrier tape and cover tape shall be
0.2N to 0.7N for the angle from 160’ to 180’ .
6.2.3
Rolling
l
6.2.4
method
Wind the tape back on the reel so that the cover tape will be outside the tape.
Attach more than 20cm of blank tape to the trailer and the leader of the tape
and fur the both ends with adhesive tape. One reel shall contain 750~~s.
Marking
. The outer
l
6.2.5
* Number
case shall be marked
of pieces delivered
with
l
following
Production
information.
date
condition
Taped products
shall be stored at the temperature
5 and 30°C and the humidities
lower than 7O%RH.
Safety
l
packaging
Model No.
Storage
l
6.2.6
and quantity
protection
during
between
shipping
There shall be no deformation
of component
characteristics
due to shipping.
or degradation
of electrical
SHARP CORPORATION
Carrier
tape structure
t
F
and Dimensions
I.-E
I-
D
I_
-I-
i
5” max
Symbol
B
A
C
D
\unit
~
f0.3
mm
12.0
+o. 1
f0.05
1.75
5.5
Symbol
F
H
G
\ Unit
mm
kO.1
4.0
+o. 1
-0.0
$J3
1.5
kO.1
7.4
kO.1
8.0
-1
E
kO.05
2.0
-II
J
-Lo.05
0.3
K
-to.1
3.1
kO.1
4.0
SHARP CORPORATION
Reel structure
and Dimensions
.
e
3
C
f
’
a
b
Check word
a
I
mm
Direction
1
180
of product
b
113.5S.51
C
8Okl.O
I
d
1 13f0.5
I
e
1 21fl.O
I
f
1 2.OkO.5
insertion
Pull-out
direction
g
I
12.0f0.5
1
SHARP CORPORATION
Precautions
for Photocouplers
1 For cleaning
(1) Solvent
cleaning
45C or less
: Solvent temperature
Immersion
for 3 min or less
(2) Ultrasonic
cleaning
(3) Applicable
solvent
: The effect to device by ultrasonic
cleaning differs
by cleaning bath size, ultrasonic
power
output, cleaning time, PCB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
: Ethyl alcohol,
Methyl
alcohol,
Isopropyl
alcohol
In case when the other solvent is used, there are cases that
the packaging resin is eroded. Please use the other solvent
aiter thorough confirmation
is performed in actual using condition.
2. The LED used in the Photocoupler
generally decreases the light emission power
by operation.
In case of long operation time, please design the circuit with considering
the degradation
of the light emission power of the LED. (50%/5years)
3. There are cases that the deviation of the CTR and the degradation
of the LED become big at IF is less than l.OmA.
Please design the circuit with considering
this point.
of the light emission
power
SHARP CORPORATION
h-9406
11
4. Precautions for Soldering Photocouplers
(1) If solder reflow :
It is recommended that only one soldering be done at the temperature
and the time within the temperature profile as shown in the figure below.
25°C
+I+
30 s
amin
<
lmin
<
lmin
>
1.5 min
Since, influence to the device is different according to reflow equipment
and its condition, please use the device after confirming no damage
in the actual using condition.
(2) Other precautions
An infrared lamp used to heat up for soldering may cause a localized
temperature rise in the resin. So keep the package temperature within
that specified in Item (1). Also avoid immersing the resin part in the solder.